BD3814FVE2 - ROHM SEMICONDUCTOR

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Sound Processors for Home Theater Systems

6ch

Electronic Volume

BD3814FV

●Description

BD3814FV is a 1-chip sound processor incorporating such functions as volume, bass, and treble, necessary for AV receivers,

home theater systems, and mini-audio systems. This IC adopts the Bi-CMOS process, and realizes low distortion, low noise,

and a wide dynamic range.

●Features

1) Dynamic range: 132dB (tone bypath, VOL = MUTE, IHF- A)

2) Master volume 6ch independent (0 to -95dB, MUTE 1dB/step)

3) Low current consumption design achieved by adopting the B iCMOS process

4) Maximum output voltage: 4.3Vrms (Vcc=7V, VEE=-7V, RL=10kΩ)

5) Built-in 2 OP amplifiers

6) 2-line serial control (for both 3.3V and 5V)

●Applications

AV receivers, home theater systems, mini-audio systems, TVs etc.

●Absolute maximum ratings (Ta=25℃)

Parameter Symbol Ratings Unit

Power supply voltage VCC 7.5*1 V

VEE -7.5

Input signal voltage VIN VCC+0.3 to VEE-0.3 V

Power dissipation Pd 900*2 mW

Operating temperature range Topr -20 to +75 ℃

Storage temperature range Tastg -55 to +125 ℃

*1 Even in the specified range of Power Supply Voltage, applying voltage only to the VCC side may cause an excessive current

to give a permanent damage to the IC.

When starting up power supplies, VEE and VCC should be powered on simultaneously or VEE first; then followed by VCC.

*2 Reduced by 9 mW/C over 25C, when installed on the standard board (size: 70x70x1.6mm).

●Operating conditions

Must function normally at Ta=25℃.

Parameter Symbol

Ratings Unit

Min. Typ. Max.

Operating source voltage VCC 5 7 7.3 V

VEE -7.3 -7 -5

No.10081EAT05

Technical Note

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BD3814FV

●Electrical characteristics

Ta=25℃, VCC=7V, VEE=-7V, f=1kHz, Vin=1Vrms, RL=10kΩ, Rg=600Ω, Master volume=0dB,

Bass and Treble=0dB unles s otherwise noted.

Parameter Symbol

Limits Unit. Conditions

Min. Typ. Max.

Total output

Circuit current VCC IQ ― 7 17

mA No signal

VEE -17 -7 ―

L input current(CL,DA) IIL ― 0.5 5 µA CL=DA=0V

H input current(CL,DA) IIH ― 0 5 µA CL=DA=5V

Output voltage gain 1 Gv1 -2 0 2 dB Measure: Pin27,28,29,30, 31,32

Output voltage gain 2 Gv2 -2 0 2 dB Measure: Pin3, 7

Total harmonic distortion

ratio 1 THD1 ― 0.001 0.03 % Measure: Pin2 7,28,29,30,31,32

BW=400 ~ 30kHz

Total harmonic distortion

ratio 2 THD2 ― 0.001 0.03 % Measure: Pin3, 7

BW=400 ~ 30KHz

Maximum output voltage 1 Vomax1 3.6 4.3 ― Vrms Measure: Pin27,28,29,30,31,32

THD=1%

Maximum output voltage 2 Vomax2 3.6 4.3 ― Vrms Measure: Pin 3,7

THD=1%

Output noise voltage 1 Vno1 ― 1.0 6.0 µVrms Measure: Pin 27, 28

Tone: By-pass, Rg=0Ω, BW=IHF-A

― 1.7 10 µVrms Measure: Pin 27, 28

Tone: ON, Rg=0Ω, BW=IHF-A

Output noise voltage 2 Vno2 ― 1.0 6.0 µVrms Measure: Pin3, 7, 29, 30, 31, 32

Rg=0Ω, BW=IHF-A

Cross talk between channels

Rch→Lch CTCRL ― -95 -80 dB

Measure: Pin27(OUTF L)

Rg=0Ω, BW=IHF-A

Reference: Pin28(OUTFR)=1Vrms

Cross talk between channels

Lch→Rch CTCLR ― -95 -80 dB

Measure: Pin28(OUTF R)

Rg=0Ω, BW=IHF-A

Reference: Pin27(OUTFL)=1Vrms

Cross talk between channels

SRch→SLch CTCSRL ― -95 -80 dB

Measure: Pin 30(OUTSL)

Rg=0Ω, BW=IHF-A

Reference: Pin31(OUTSR)=1Vrms

Cross talk between channels

SLch→SRch CTCSLR ― -95 -80 dB

Measure: Pin 31(OUTSR)

Rg=0Ω, BW=IHF-A

Reference: Pin30(OUTSL)=1Vrms

Cross talk between channels

Cch→SWch CTCCSW ― -95 -80 dB

Measure: Pin 32(OUTSW)

Rg=0Ω, BW=IHF-A

Reference: Pin29(OUTC) =1Vrms

Technical Note

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BD3814FV

Parameter Symbol

Limits Unit. Conditions

Min. Typ. Max.

Volume output

Input impedance V RinV 14 20 26 kΩ Measure: Pin27,28,29,30,31,32

Volume control range GVR -98 -95 -92 dB Measure: Pin27,28,29,30,31,32

Vin=3Vrms

Volume set error 1 VE1 -1.5 0 1.5 dB Measure: Pin27,28,29,30, 31, 32

0 to –53dB, Vin=3Vrms

Volume set error 2 VE2 -2.5 0 2.5 dB Measure: Pin27,28,29,30,31, 32

-54 to –95dB, Vin =3Vrms

Maximum attenuation

amount Vmin ― -115 -105 dB

Measure: Pin27,28,29,30,31,32

Vin =3Vrms, BW=IHF-A

Residual noise voltage 1 Vnom1 ― 1.0 6.0 µVrms Measure: Pin27, 28

Tone: By-Pass, Rg=0Ω, BW=IHF-A

Residual noise voltage 2 Vnom2 ― 1.0 6.0 µVrms Measure: Pin29, 30, 31, 32

Rg=0Ω, BW=IHF-A

Cross talk between channels

SWch→Cch CTCSWC ― -95 -80 dB

Measure: Pin 29(OUTC)

Rg=0Ω, BW=IHF-A

Reference: Pin32(OUTSW)=1Vrms

Treble

Treble maximum boost gain GTB 12 14 16 dB Measure: Pin 27, 28

f=15kHz, Vin =0.4Vrms

Treble maximum cut gain GTC -16 -14 -12 dB Measure: Pin 27, 28

f=15kHz, Vin =0.4Vrms

Treble step res olution TR ― 2 ― dB

Measure: Pin 27, 28

f=15kHz, Vin =0.4Vrms

Treble gain set error TE -2 0 2 dB Measure: Pin 27, 28

f=15kHz, Vin =0.4Vrms

Bass

Bass maximum boost gain GBB 12 14 16 dB Measure: Pin 27, 28

f=100Hz, Vin=0.4Vrms

Bass maximum cut gain GBC -16 -14 -12 dB

Measure: Pin 27, 28

f=100Hz, Vin =0.4Vrms

Bass step resolution BR ― 2 ― dB

Measure: Pin 27, 28

f=100Hz, Vin =0.4Vrms

Bass gain set error BE -2 0 2 dB Measure: Pin 27, 28

f=100Hz, Vin =0.4Vrms

* Note: This IC is not designed to be radiation-resistant.

Technical Note

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BD3814FV

●Timing chart

1. Signal timing conditions

・Data is read on the rising edge of the clock.

・Latch is read on the falling edge of the clock.

・Latch signal must terminate with the LOW state.

* To avoid malfunctions, clock and data signals must terminate with the LOW state.

Fig.1

Parameter Symbol Limits Unit

Min. Typ. Max.

Minimum clock width twc 2.0 －－ μs

Minimum data width twd 2.0 －－ μs

Minimum latch width twl 2.0 －－ μs

LOW hold width twh 2.0 －－ μs

Data setup time (DATA→CLK) tsd 1.0 －－ μs

Data hold time (CLK→DATA) thd 1.0 －－ μs

Latch setup time (CLK→LATCH) tsl 1.0 －－ μs

Latch hold time (DATA→LATCH) thl 1.0 －－ μs

Latch low setup time ts 1.0 －－ μs

Latch low hold time th 1.0 －－ μs

2. Voltage cond itions for control signal

Parameter Condition Limits Unit

Min. Typ. Max.(≦Vcc)

“H” input voltage Vcc=5 ~ 7.3V

VEE=-5 ~ -7.3V 2.2 － 5.5 V

“L” input voltage 0 － 1.0 V

(CLOCK)

DATA

LATCH

thd thdth ts tsl thl tsd

twc

twh

twd twl

DATA DATA

LATCH

90% 90% 90% 90%

10% 10% 10%

90% 90% 90% 90% 90%

10% 10% 10%

twc

Terminate

with Low.

Technical Note

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BD3814FV

3. Basic configuration of control data format

Data input direction

MSB LSB

Data D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Data Select Address

・Control data format

Data input direction Select Address

Data

①

D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Treble Bass Tone * * * * * 0 0 0

Data

②

D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Master Volume FRch Master Volume FLch 0 0 1

Data

③

D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Master Volume SRch Master Volume SLch 0 1 0

Data

④

D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Master Volume Cch Master Volume SWch 0 1 1

By changing select address, 4 control data formats can be selected.

Do not set the select address data to any format other than that specifie d above.

At power-on sequence, initiali ze all data.

* is 0 or 1.

Example:

Data input direction

MSB LSB MSB LSB MSB LSB MSB LSB

Data① L Data② L Data③ LData④ L

“L” shows latch.

After power-on, for the second and subsequent times, only the necessary data can be selected for setting

Example: When to change bu s,

Input direction

MSB LSB

Data① L

“L” shows latch.

Technical Note

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BD3814FV

●Applic at ion c ircuit

UNIT

RESISTOR: Ω

CAPACITOR: F

Fig.2

20 21

10µ

C0.1µ

0.1µ

MUTE

10K

MASTER

VOLUME

0～-95dB

1dB/step，MUTE

OUTSW

BASS

TREBLE

OUTSR

OUTSL

OUTC

OUTFR

OUTFL

0.1µ

4.7K

4700P

10µ

47K

4700P

Vcc

47µ

VEE

47µ

Ri=20K

Technical Note

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BD3814FV

-8

-6

-4

-2

0510

POWER SU PPLY (V)

CIRCUIT CURRENT (mA)

-20

-15

-10

-5

10 100 1000 10000 100000

FREQUENCY (Hz)

GAIN (dB)

-10

-8

-6

-4

-2

10 100 1000 10000 100000

FREQUENCY (Hz)

GAIN (dB)

0.001

0.01

0.1

0.001 0.01 0.1 1 10

I N PU T VOLTAGE (Vrm s )

OU T PU T VOLT AGE (Vrm s )

0.0001

0.001

0.01

0.1

0.001 0.01 0.1 1 10

INPUT VOLTAGE (Vrms)

THD+N (%)

-20

-15

-10

-5

10 100 1000 10000 100000

FREQUENCY (Hz)

GAIN (dB)

●Reference data

Fig.3 Circuit current - Power supply

Fig.4 Voltage gain - Frequency

Fig.5 Output voltage - Input voltage

Fig.6 THD+N - Input voltage

Fig.7 Bass gain - Frequency

Fig.8 Treble gain - Freque ncy

VCC

VEE

-14～+14dB

2dB/step

-14dB

+14dB

-14～+14dB

2dB/step

+14dB

-14dB

Technical Note

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BD3814FV

●Notes for use

1. Numbers and data in entries are representative design values and ar e not guaranteed values of the items.

2. Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure t o

verify circuit characteristics for your particular application. Modification of constants for other externally connected circ uits

may cause variations in both static and transient characteristics for external components as well as this Rohm IC. Allow for

sufficient margins when determining circuit constants.

3. Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings, such as the applied voltage or ope rating temperat ure range (Topr),

may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when

such damage is suffered. A physical safety measure, such as a fuse, should be implem ented when using the IC at times

where the absolute maximum ratings may be exceeded.

4. VEE potential

Make the VEE pin voltage such that it is the lowest voltage even when operating below it. Actually confirm that the

voltage of each pin does not become a lower voltage than the VEE pin, including transient phenomena.

5. Thermal design

Perform thermal design, in which th ere are adequate marg ins, by taking into account the power dissipation (Pd) in ac tual

states of use.

6. Short circuit between terminals and errone ous mounting

Pay attention to the assembly direction of the ICs. Wrong mounting direct ion or shorts between terminals, GND, or other

components on the circuits, can damage the IC.

7. Operation in strong electromagnetic field

Using the ICs in a strong electromagnetic field can cause operation malfunction.

8. Serial control

For the CL and DA terminals, the patterned and other wirings should be routed as not to cause interference with the

analog-signal-related lines.

9. Power ON/OFF

(a) At power ON/OFF, a shock sound will be generated. Therefore, use MUTE on the set.

(b) When turning on power supplies, VEE and V CC should be powered on simultaneously, or VEE first followed

by VCC. If the VCC side is started up first, an excessive current may flow from VCC to VEE.

10. Tone bypath switching

For tone bypath switching, use MUTE on the set.

Technical Note

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BD3814FV

●Thermal derating characteristic

Fig.9

BD3814FV

ROHM standard board packaging time value

Board size: 70 x 70 x 1.6mm Raw material : FR4 glass epoxy board (copper area 3% or below)

200

400

600

800

1000

0 25 50 75 100 125

Ta(℃)

Power Dissipation Pd （mW)

900mW

Technical Note

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www.rohm.com 2010.06 - Rev.A

BD3814FV

●Ordering p art number

B D 3 8 1 4 F V - E 2

Part No. Part No.

Package

FV: SSOP-B40 Packaging and forming specification

E2: Embossed tape and reel

(Unit : mm)

SSOP-B40

0.08

0.1 S

0.22 ± 0.1

0.65

0.15 ± 0.1

0.5 ± 0.2

7.8 ± 0.3

5.4 ± 0.2

1.8 ± 0.1

0.1

13.6 ± 0.2

(MAX 13.95 include BURR)

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2000pcs

()

Direction of feed

Reel 1pin

Datasheet

Notice - GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

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Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

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third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccur acy or errors of or

concerning such information.

Datasheet

Part Number bd3814fv

Package SSOP-B40

Unit Quantity 2000

Minimum Package Quantity 2000

Packing Type Taping

Constitution Materials List inquiry

RoHS Yes

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