© 2000 California Micro Devices Corp. All rights reserved.
9/26/2000 1
CSPRC032
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
Chip Scale Package (CSP) EMI Filter Network
Features
• Minimal Cross-Talk
• 4 Filter lines per device
• Ultra small foot print
• Silicon substrate
• 0.35mm Eutectic Solder Bumps
Product Description
Many portable applications frequently demand filtering
of signals in the 800-2,700 MHz band. California Micro
Devices’ unique thin film Flip Chip filters provide a
minimum of –30 dB of attenuation over this frequency
band. The bump size and pitch of these filters are
selected such that the device can be placed directly on
a FR4 printed circuit board using conventional assembly
Applications
• Cellular Phones
• Cordless Phones
• Internet Appliances
•PDAs
• Laptop Computers
C1450800
SCHEMATIC DIAGRAM
techniques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal signal routing.
Ground-bounce and cross-talk are minimized via a die
design that provides two solder bump contacts to the
common supply connection. The solder bump contacts
are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in
diameter.
R 50ΩR 50Ω
C
43pF
GND
A1 B1
GND
B3
R 50ΩR 50Ω
C
43pF
GND
A2 B2
R 50ΩR 50Ω
C
43pF
GND
A4 B4
R 50ΩR 50Ω
C
43pF
GND
A5 B5
* Note 1: Calculated with 0Ω Source impedance and infinite Load
impedance.
* Note 2: Calculated with 50Ω Source impedance and 50Ω Load
impedance.
SEULAVDRADNATS
rotsiseR05Ω
RecnareloTetulosbA%01±
roticapaCFp34
CecnareloTetulosbA%02±
srotsiseRfoRCTmpp001±
egnaRerutarepmeTgnitarepOC°58otC°04–
V6±@tnerruCegakaeLAµ1<
rotsiseR/gnitaRrewoPWm52
SCITSIRETCARAHCLACIRTCELE
retliF(RΩΩ
Ω
ΩΩ))Fp(C)1etoN(cF)2etoN(cF
CR0534zHM47zHM47
©2000 California Micro Devices Corp. All rights reserved.
9/26/2000215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
2
CSPRC032
CALIFORNIA MICRO DEVICES
Figure 2. CSPRC032 Package Diagram
CSPRC032 FILTER TYPICAL MEASURED FREQUENCY RESPONSE (S21) MEASUREMENT
The measurement is done with 50Ω-source & 50Ω-load impedance using a HP 8753C Network Analyzer with a
HP85047A S-parameter Test Set.
1
A
B
2345
0.5
mm
0.5mm
0.985mm
0.381mm
0.643mm
0.2425
mm
0.35mm Dia.
Bumps
0.2425
mm
2.485mm
SNOITADNEMMOCERDRAOBTIUCRICDETNIRP
BCPnoeziSdaPmm003.0
epahSdaPdnuoR
noitinifeDdaP )DMSN(sdaPdeniveDksaMredloSnoN
gninepOksaMredloSmm053.0
ssenkcihTlicnetSredloSmm251.0
gninepOerutrepAlicnetSredloS).qs(mm063.0
oitaRxulFredloS05/05
etsaPredloSnaelCoN
hsiniFecarTdnoB )A601sulPuCketnE(PSO
START
CH1 S21 1og MAG 5 dB/ REF 0 dB
Cor
H1d
.300 000 MHz STOP 3 000.000 000 MHz
1
3
4
1: –5.8017 dB
1.000 000 MHz
2: –8.8028 dB
82.026 MHz
3: –37.303 dB
1.82 GHz
4: –32.903 dB
3GHZ
2
CSPRC032 Filter A2-B2 to GND (A3)
© 2000 California Micro Devices Corp. All rights reserved.
9/26/2000 3
CSPRC032
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
EGAKCAP NOITAMROFNIGNIREDROTRAPDRADNATS-NON
seireStraP)XXX(eulaVrotsiseR)YYY(eulaVroticapaC
)230CRPSC(elpmaxE05=(005 ΩΩ
Ω
ΩΩ))FP34=(034
tigiddrihT.eulavtnacifingiserastigid2tsriF
.wollofotsorezforebmunstneserper
tigiddrihT.eulavtnacifingiserastigid2tsriF
.wollofotsorezforebmunstneserper
PART NUMBER KEY
PACKAGE TYPE APPLICATION Capacitor Value
CSP = Chip Scale
Package
Resistor
Capacitor
Filter
First 2 digits
are significant
value. 3rd digit
represents number
of zeros.
Resistor Value
First 2 digits
are significant
value. 3rd digit
represents number
of zeros.
CSP RC032 XXX YYY
250
225
200
175
150
125
100
75
50
25
0 48 97 145
Time (s)
Temperature (
o
C)
194 242 290 339 387 435
EXHRFZ5
Z4EXH PH Z2 Z3 CD
Typical Solder Reflow Thermal Profile (No Clean Flux)
