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4x4mm -20 Lead QFN
The PE4302 is a high linearity, 6-bit RF Digital Step Attenuator
“DSA” covering a 31.5 dB attenuation range in 0.5 dB steps.
This 50-ohm RF DSA provides both parallel and serial CMOS
control interface operates on a single 3-volt supply and
maintains high attenuation accuracy over frequency and
temperature. It also has a unique control interface that allows
the user to select an initial attenuation state at power-up. The
PE4302 exhibits very low insertion loss and low power
consumption. This functionality is delivered in a 4x4mm QFN
footprint.
The PE4302 is manufactured in Peregrine’s patented Ultra
Thin Silicon (UTSi®) CMOS process, offering th e performance
of GaAs with the economy and integration of conventional
CMOS.
Product Specification
50 RF Digital Attenuator
6-bit, 31.5 dB, DC – 4.0 GHz
Product Description
Figure 1. Functional Schematic Diagram
PE4302
Features
Attenuation: 0.5 dB steps to 31.5 dB
Flexible parallel and serial progr amming
interfaces
Unique power-up state selection
Positive CMOS control logic
High attenuation accuracy and linearity
over temperature and frequency
Very low power consumption
Single-supply operation
50 impedance
Packaged in a 20 lead 4x4mm QFN
Control Logic Interface
Parallel Control
Power-Up Control
Serial Control
RF Input RF Output
Switched Attenuator Array
6
3
2
Figure 2. Package Type
Table 1. Electrical Specifications @ +25°C, VDD = 3.0 V
Parameter Test Conditions Frequency Minimum Typical Maximum Units
Operation Frequency DC 4000 MHz
Insert ion Loss2 DC - 2.2 GHz - 1.5 1.75 dB
Attenuation Accuracy Any Bit or Bit
Combination DC 1.0 GHz
1.0 < 2.2 GHz - -
±(0.10 + 3% of atten setting)
±(0.15 + 5% of atten setting) dB
dB
1 dB Compression3 1 MHz - 2.2 GHz 30 34 - dBm
Input IP31,2 Two-tone inputs
+18 dBm 1 MHz - 2.2 GHz - 52 - dBm
Return Loss DC - 2.2 GHz 15 20 - dB
Switching Speed 50% control to 0.5 dB
of final value - - 1 µs
Notes: 1. Device Linearity wil l begin t o degrade bel ow 1 Mhz
2. See Max input rating in Table 2 & Figures on Pages 2 to 4 for data across frequency.
3. Note Absolute Maximum in Table 3.
Product Specific ation
PE4302
Page 2 of 11
©2005 Peregrine Semic onduct or Corp. All ri ghts res erved. Document No. 70/0056~02D UltraCMOS™ RFIC Solutions
-50
-40
-30
-20
-10
0
0 500 1000 1500 2000 2500 3000 3500 4000
S22 (dB)
RF Frequency (MHz)
31.5dB
-50
-40
-30
-20
-10
0
0 500 1000 1500 2000 2500 3000 3500 4000
S11 (dB)
RF Frequency (MHz)
16dB
31.5dB
0
5
10
15
20
25
30
35
0 500 1000 1500 2000 2500 3000 3500 4000
Attenuation (dB)
Normalized to Insertion Loss
RF Frequency (MHz)
31.5dB
4dB
8dB
16dB
0.5dB
1dB
2dB
-6
-5
-4
-3
-2
-1
0
0 500 1000 1500 2000 2500 3000 3500 4000
Insertion Loss (dB)
RF Frequency (MHz)
25C
-40C
85C
Typical Performance Data (25°C, VDD=3.0 V)
Figure 4. Attenuation at Major steps
Figure 6. Output Return Loss at Major
Attenuation Steps
Figure 5. Input Return Loss at Major
Attenuation Steps
Figure 3. Insertion Loss
Product Specific ation
PE4302
Page 3 of 11
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-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0 5 10 15 20 25 30 35 40
Attenuation Error (dB)
Attenuation Setting (dB)
1000Mhz, -40C
1000Mhz, 85C
1000Mhz, 25C
1500Mhz, -40C
1490Mhz, 25C
1490Mhz, 85C
-1.5
-1
-0.5
0
0.5
0 5 10 15 20 25 30 35 40
Attenuation Error (dB)
Attenuation Setting (dB)
10Mhz
500Mhz
1000Mhz
1500Mhz
2000Mhz
2200Mhz
-10
-8
-6
-4
-2
0
2
0 500 1000 1500 2000 2500 3000 3500 4000
Attenuation Error (dB)
RF Frequency (MHz)
31.5 (dB)
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0 5 10 15 20 25 30 35 40
Attenuation Error (dB)
Attenuation Setting (dB)
10Mhz, -40C
500Mhz, -40C
10Mhz, 25C
500Mhz, 25C
10Mhz, 85C
500Mhz, 85C
Figure 8. Attenuation Error Vs. Attenuation
Setting
Figure 10. Attenuation Error Vs. Attenuation
Setting
Figure 9. Attenuation Error Vs. Attenuation
Setting
Figure 7. Attenuation Error Vs. Frequency
Typical Performance Data (25°C, VDD=3.0 V)
Product Specific ation
PE4302
Page 4 of 11
©2005 Peregrine Semic onduct or Corp. All ri ghts res erved. Document No. 70/0056~02D UltraCMOS™ RFIC Solutions
10
15
20
25
30
35
40
0 500 1000 1500 2000 2500 3000
0dB
0.5dB
1dB
2dB
4dB
8dB
16dB
31.5dB
RF Frequency (MHz)
1dB Compression (dBm)
20
25
30
35
40
45
50
55
60
0 500 1000 1500 2000 2500 3000
0dB
.5dB
1dB
2dB
4dB
8dB
16dB
31.5dB
Input IP3 (dBm)
RF Frequency (MHz)
-1.5
-1
-0.5
0
0.5
0 5 10 15 20 25 30 35 40
Attenuation Error (dB)
Attenuation Setting (dB)
2000Mhz, -40C
2200Mhz, -40C
2200Mhz, 25C
2000Mhz, 25C
2000Mhz, 85C
2200Mhz, 85C
Figure 12. Input IP3 Vs. Frequency
Figure 13. Input 1 dB Compression
Figure 11. Attenuation Error Vs. Frequency
Typical Performance Data (25°C, VDD=3.0 V)
Product Specific ation
PE4302
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Table 2. Pin Descriptions
Table 3. Absolute Maximum Ratings
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe
the same precautions that you would use with
other ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the rate specified in Table 3.
Exposed Solder Pad Connection
The exposed solder pad on the bottom of the
package must be grounded for proper device
operation.
Table 4. DC Electrical Specifications
Note 1: Both RF ports must be held at 0 VDC or DC blocked with an
external series capacitor.
2: Latch Enable (LE) has an internal 100 k resistor to VDD.
3: Connect pin 12 to GND to enable internal negative voltage
generator. Connect pin 12 to VSS (-VDD) to bypass and
disable internal negative voltage generator.
4. Place a 10 k resistor in series, as close to pin as possible
to avoid frequency resonance.
Figure 14. Pin Configuration (Top View)
V
DD
PUP1
PUP2
V
DD
GND
1
20
19
18
17
16
15
14
13
12
11
6
7
8
9
10
2
3
4
5
C16
RF1
Data
Clock
LE GND
Vss/GND
P/S
RF2
C8
C4
C2
GND
C1
C0.5
20-lead QFN
4x4mm
Exposed Solder Pad
Pin
No. Pin
Name Description
1 C16 Attenuation cont rol bit, 16dB (Not e 4).
2 RF1 RF port (Note 1).
3 Data Serial interf ace data input (Note 4).
4 Clock Serial interface clock input.
5 LE Latch Enable input (Not e 2).
6 VDD Power supply pin.
7 PUP1 Power-up selection bit, MSB.
8 PUP2 Power-up selection bit, LSB.
9 VDD Power supply pin.
10 GND Ground connection.
11 GND Ground connection.
12 Vss/GND Negative supply voltage or GND
connection(Not e 3)
13 P/S Parallel/Serial mode select.
14 RF2 RF port (Note 1).
15 C8 A ttenuation control bit, 8 dB.
16 C4 A ttenuation control bit, 4 dB.
17 C2 A ttenuation control bit, 2 dB.
18 GND Ground connection.
19 C1 A ttenuation control bit, 1 dB.
20 C0.5 Attenuation control bit, 0.5 dB.
Paddle GND Ground for proper operation
Symbol Parameter/Conditions Min Max Units
VDD Power supply voltage -0.3 4.0 V
VI Voltage on any input -0.3 VDD+
0.3 V
TST Storage temperature range -65 150 °C
TOP Operating temperat ure
range -40 85 °C
PIN Input power (50) 24 dBm
VESD ESD voltage (Human Body
Model) 500 V
Parameter Min Typ Max Units
VDD Power Supply
Voltage 2.7 3.0 3.3 V
IDD Power Supply
Current 100 µA
Digital Input High 0.7xVDD V
Digital Input Low 0.3xVDD V
Digital Input Leakage 1 µA
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMO S™
devices are immune to latch-up.
Switching Frequency
The PE4302 has a maximum 25kHz switching
rate.
Resistor on Pin 1 & 3
A 10 k resistor on the inputs to Pin 1 & 3 (see
Figure 16) will eliminate package resonance
between the RF input pin and the two digital
inputs. Specified attenuation error versus
frequency performance is dependent upon this
condition.
Product Specific ation
PE4302
Page 6 of 11
©2005 Peregrine Semic onduct or Corp. All ri ghts res erved. Document No. 70/0056~02D UltraCMOS™ RFIC Solutions
Programming Options
Parallel/ Serial S el ect ion
Either a parallel or serial i nt erf ace can be used t o
control the PE 4302. The P/S b it provi des this
selection, wit h P/S=LOW sele cting t he parallel
interface a nd P/S=HI GH s electing t he serial
interface.
Parallel Mo de I nt erf ace
The parallel interface consists of five CMOS-
compatibl e cont rol lines t hat select the d esired
attenuati on st at e, as show n in Table 5.
The parallel interf ace timing requirements are
defined by F igure 18 (Parallel Int erf ace Tim ing
Diagram), Table 9 (Parallel Interface AC
Characteristics), and switching speed (Table 1).
For latched paral le l programming t he Latch Enable
(LE) should be held LOW while cha nging attenuatio n
state control values, then pulse LE HI G H t o LO W
(per Figure 18) to lat ch new attenuation stat e into
device.
For direct parallel programming, the Latch Enable
(LE) line should be pul led HIGH. Changing
attenuati on st at e control values w ill change device
state to new at tenuat ion. Direct Mode is ideal for
manual cont rol of the device (using hard w ire,
switches, or jumpers).
P/S C16 C8 C4 C2 C1 C0.5
Attenuation
State
0 0 0 0 0 0 0
Reference Loss
0 0 0 0 0 0 1 0.5 dB
0 0 0 0 0 1 0 1 dB
0 0 0 0 1 0 0 2 dB
0 0 0 1 0 0 0 4 dB
0 0 1 0 0 0 0 8 dB
0 1 0 0 0 0 0 16 dB
0 1 1 1 1 1 1 31.5 dB
Table 5. Truth Table
Note: Not all 64 possible combi n ations of C0. 5-C16 are shown in table
Serial Interface
The serial interface is a 6-bit serial-in, parallel-out
shift register buffered by a transparent latch. It is
controlled by three CMOS-compatible signals: Data,
Clock, and Latch Enable (LE). The Data and Clock
inputs allow data to be serially entered into the shift
register, a process that is independent of the state of
the LE input.
The LE input controls the latch. When LE is HIGH,
the latch is transparent and the contents of the serial
shift register control the attenuator. When LE is
brought LOW, data in the shift regi st er is lat ched.
The shift register should be loaded while LE is held
LOW to prevent the attenuator value from changing
as data is entered. The LE input should then be
toggled HIGH and brought LOW again, latching the
new data. The timing for this operation is defined by
Figure 17 (Serial Interface Timing Diagram) and
Table 8 (Seria l I nt erf ace A C C haract eristics).
Power-up Co ntrol Sett ings
The PE4302 alway s assumes a specifiable
attenuati on set t in g on power-up. This f eature ex ists
for both the Serial and Parall el modes of operat ion,
and allo w s a known attenuatio n state to be
establis hed before an i nitial serial or pa ral le l control
word is provided.
When the atte nuat or powers up in Seri al mode (P/
S=1), the six control bit s are set t o what ever data is
present on the six parallel data input s (C0.5 to C16).
This allo ws any one of t he 64 attenuati on set t ings to
be specifi ed as t he power-up state.
When the atte nuat or powers up in Parallel mo de (P/
S=0) with LE=0, the control bits are automat ically s et
to one of four poss ible values. These four val ues
are selected by t he t wo po wer-up contro l bit s, PUP1
and PUP2, as shown in Table 6 (Po wer-Up Trut h
Table, Par al le l Mode).
P/S LE PUP2 PUP1 Attenuation State
0 0 0 0 Reference Loss
0 0 1 0 8 dB
0 0 0 1 16 dB
0 0 1 1 31 dB
0 1 X X Defined by C0.5-C16
Table 6. Parallel PUP Truth Table
Note: Power up with LE=1 provides normal parallel operat i on with
C0.5-C16, and PUP1 and PUP2 are not active.
Product Specific ation
PE4302
Page 7 of 11
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Evaluation Kit
The Digital Attenuator Evaluation Kit board was
designed to ease customer evaluation of the
PE4302 Digital Step Attenuator.
J9 is used in conjunction with the supplied DC
cable to supply VDD, GND, and –VDD. If use of
the internal negative voltage generator is desired,
then connect –VDD (Black banana plug) to
ground. If an external –VDD is desired, then apply
-3V.
J1 should be connected to the parallel port of a
PC with the supplied ribbon cable. The evaluation
software is written to operate the DSA in serial
mode, so Switch 7 (P/S) on the DIP switch SW1
should be ON with all other switches off. Using the
software, enable or disable each attenuation
setting to the desired combined attenuation. The
software automatically programs the DSA each
time an attenuation state is enabled or disabled.
To evaluate the Power Up options, first disconnect
the parallel ribbon cable from the evaluation
board. The parallel cable must be removed to
prevent the PC parallel port from biasing t he
control pins.
During power up with P/S=1 high and LE=0 or P/
S=0 low and LE=1, the default power-up signal
attenuation is set to the value present on the six
control bits on the six parallel data inputs (C0.5 to
C16). This allows any one of the 64 attenuation
settings to be specified as the power-up state.
During power up with P/S=0 high and LE=0, the
control bits are automatically set to one of four
possible values presented through the PUP
interface. These four values are selected by the
two power-up control bits, PUP1 and PUP2, as
shown in the Table 6.
Resistor on Pin 1 & 3
A 10 k resistor on the inputs to Pin 1 & 3 (Figure
16) will eliminate package resonance between the
RF input pin and the two digital inputs. Specified
attenuation error versus frequency performance is
dependent upon this condition.
Figure 15. Evaluation Board Layout
Figure 16. Evaluation Board Schematic
Z=50 Ohm
PUP2
J5
SMA
1
C2
C16
CLK
100 pF
DATA
C4C0.5
10k
10k
C8
Z=50 Ohm
PUP1
PS
C1
VDD
U1
MLPQ4X4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
C16
RFin
DATA
CLK
LE
VDD
PUP1
PUP2
VDD_D
GND
GND
Vss/GND
PS
RFout
C8
C4
C2
GND
C1
C5
LE
J4
SMA
1
Note: Resist ors on pi ns 1 and 3 are required to avoid package
resonance and meet error specificati ons over frequency.
Product Specific ation
PE4302
Page 8 of 11
©2005 Peregrine Semic onduct or Corp. All ri ghts res erved. Document No. 70/0056~02D UltraCMOS™ RFIC Solutions
Table 7. 6-Bit Attenuator Serial Programming
Register Map
Table 9. Parallel Interface AC Characteristics
Figure 18. Parallel Interface Timing Diagram
Table 8. Serial Interface AC Characteristics
Figure 17. Serial Interface Timing Diagram
LE
Clock
Data MSB LSB
t
LESUP
t
SDSUP
t
SDHLD
t
LEPW
B5 B4 B3 B2 B1 B0
C16C8C4C2C1C0.5
↑↑
LSB (last in)MSB (first in)
t
PDSUP
t
PDHLD
Parallel Data
C16:C0.5
LE
t
LEPW
Symbol Parameter Min Max Unit
fClk Serial dat a clock fre-
quency (Note 1) 10 MHz
tClkH Serial clock HIGH time 30 ns
tClkL Serial clock LOW time 30 ns
tLESUP LE set- u p time after last
clock fal ling edge 10 ns
tLEPW LE minimum pulse width 30 ns
tSDSUP Serial data set-up time
before clock rising edge 10 ns
tSDHLD Serial data hold time
after clock f al ling edge 10 ns
Note: fClk is verified during the functional pattern test. Serial
programming sections of the functional pat tern are clocked at
10 MHz to verify fclk specific ation.
Symbol Parameter Min Max Unit
tLEPW LE minimum pulse width 10 ns
tPDSUP Data set-up time before
rising edge of LE 10 ns
tPDHLD Data hold time after
falling edge of LE 10 ns
VDD = 3.0 V, -40° C < TA < 85° C, unless otherwise specified VDD = 3.0 V, -40° C < TA < 85° C, unless otherwise specified
Product Specific ation
PE4302
Page 9 of 11
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Figure 19. Package Drawing
1.00
1.00
2.00
2.00
0.23
0.10 C A B
EXPOSED PAD
4.00
DETAIL A
16
15
115
1
6
20
10
0.50
TYP
2.00
TYP
0.55
2
1
DETAIL A
0.18
0.18
0.435
0.435
SEATING
PLANE
0.08 C
0.10 C
0.020
0.20 REF
EXPOSED PAD &
TERMINAL PADS
0.80
- C -
2.00 X 2.00
2.00
2.00
4.00
4.00
- B -
- A -
INDEX AREA
0.25 C
1. Dimension applies to metallized terminal and is measured
between 0.25 and 0.30 from terminal tip.
2. Coplanarity applies to the exposed heat sink slug as well as
the terminals.
3. Dimensions are in millimeters.
Product Specific ation
PE4302
Page 10 of 11
©2005 Peregrine Semic onduct or Corp. All ri ghts res erved. Document No. 70/0056~02D UltraCMOS™ RFIC Solutions
Figure 20. Marking Specifications
Figure 21. Tape and Reel Drawing
4302
YYWW
ZZZZZ
YYWW = Date Code
ZZZZZ = Last five digits of PSC Lot Number
Table 10. Ordering Information
Order Code Part Marking Descri ption Package Shipping Method
4302-01 4302 PE4302-20MLP 4x4mm-75A 20-lead 4x4mm QFN 75 units / Tube
4302-02 4302 PE4302-20MLP 4x4mm-3000C 20-lead 4x4mm QFN 3000 units / T&R
4302-00 PE4302-EK PE4302-20MLP 4x4mm-EK Evaluation Kit 1 / Box
4302-51 4302 PE4302G-20MLP 4x4mm-75A Green 20-lead 4x4mm QFN 75 units / Tube
4302-52 4302 PE4302G-20MLP 4x4mm-3000C Green 20-lead 4x4mm QFN 3000 units / T&R
Product Specific ation
PE4302
Page 11 of 11
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Sales Offices
United States
Peregrine Semiconductor Corp.
9450 Carroll Park Drive
San Diego, CA 92121
Tel 1-858-731-9400
Fax 1-858-731-9499
Japan
Peregrine Semiconductor K.K.
5A-5, 5F Imperial Tower
1-1-1 Uchisaiwaicho, Chiyoda-ku
Tokyo 100-0011 Japan
Tel: 011-81-3-3502-5211
Fax: 011-81-3-3502-5213
Europe
Peregrine Semiconductor Europe
Bâtiment Maine
13-15 rue des Quatre Vents
F- 92380 Garches, France
Tel: 011- 33-1-47-41-91-73
Fax : 011-33-1-47-41-91-73
For a list of representatives in your area, please refer to our Web site at: www.psemi.com
Data Sheet Identification
Advance Information
The product is in a formative or design stage. The data
sheet contains design target specifications for product
development. Specifications and features may change in
any manner without notice.
Preliminary Specification
The data sheet contains preliminary data. Additional data
may be added at a later date. Peregrine reserves the right
to change specifications at any time without notice in order
to supply the best possible product.
Product Specification
The data sheet contains final data. In the event Peregrine
decides to change the specifications, Peregrine will notify
customers of the intended changes by issuing a DCN
(Document Change Notice).
The information in this data sheet is believed to be reliable.
However, Peregrine assumes no liability for the use of this
information. Use shall be entirely at the user’s own risk.
No patent rights or licenses to any circuits described in this
data sheet are implied or granted to any third party.
Peregrine’s products are not designed or in tended for use in
devices or systems intended for surgical implant, or in other
applications intended to support or sustain life, or in any
application in which the failure of the Peregrine product could
create a situation in which personal injury or death might occur.
Peregrine assumes no liability for damages, including
consequential or incidental damages, arising out of the use of
its products in such applications.
The Peregrine name, logo, and UTSi are regi stered trademarks
and UltraCMOS is a trademark of Peregrine Semiconductor
Corp.
China
Peregrine Semiconductor
28G, Times Square,
No. 500 Zhangyang Road,
Shanghai, 200122, P.R. China
Tel: 011-86-21-5836-8276
Fax: 011-86-21-5836-7652