TM Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50 HXG-122+ 0.5 to 1.2 GHz The Big Deal Ceramic Package * Industry leading High IP3, 47 dBm typ. * Integrated optimization circuits * Linearity with low current consumption LTE Performance Product Overview The HXG-122+ (RoHS compliant) is an advanced amplifier module combining high dynamic range MMIC technology and optimization circuits to provide industry leading linearity over a focused frequency range. It is packaged in a Mini-Circuits System in Package (MSiP) module (6.4mm x 7.0mm x 2.4mm) using a sealed ceramic cover and having gold over Ni for excellent solderability. Key Features Feature Optimized Frequency Range: 500 to 1200 MHz Extremely High IP3: 47 dBm typ at 700 MHz versus DC Power Consumption of 146mA Advantages Covering primary wireless communications bands: LTE, cellular and GSM The HXG-122+ offers industry leading IP3 performance relative to device size and power consumption. The combination of the design and E-PHEMT provides enhanced linearity over a broad frequency range as evidence in the IP3. This feature makes this amplifier ideal for use in: * Driver amplifiers for complex waveform up converter paths * Drivers in linearized transmit systems * Secondary amplifiers in ultra High Dynamic range receivers No External Matching Components Required Unlike competing products, Mini-Circuits HXG-122+ provides Input and Output Return Loss of 10 dB up to 0.9 GHz without the need for any external matching components Low Noise Figure: 2.2dB typ. A unique feature of the HXG-122+ which separates this design from all competitors is the low noise figure performance in combination with the high dynamic range. Mini-Circuits (R) ISO 9001 ISO 14001 AS 9100 CERTIFIED P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine For detailed performance specs & shopping online see web site (R) Provides ACTUAL Data Instantly at minicircuits.com IF/RF MICROWAVE COMPONENTS Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit's applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, "Standard Terms"); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Page 1 Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits' website at www.minicircuits.com/MCLStore/terms.jsp. TM Mini-Circuits System In Package Ultra High IP3 Amplifier Module 0.5-1.2GHz Product Features * Ultra High IP3, +47 dBm typ. * Gain, 15.3 dB typ. at 900 MHz * High Pout, P1dB +23 dBm typ. at 900 MHz * Low noise figure, 2.2 dB at 900 MHz * Internally matched for optimized IP3 performance * No external matching components required HXG-122+ CASE STYLE: LZ1671 PRICE: $3.41ea. QTY. (50) Typical Applications +RoHS Compliant * LTE * Base station infrastructure * Portable Wireless The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications LTE Performance General Description The HXG-122+ (RoHS compliant) is an advanced amplifier module in a Mini-Circuits System in Package (MSiP) which includes internal matching networks to offer extremely high dynamic range module. It is housed in a ceramic package 6.4mm x 7.0mm x 2.4mm. simplified schematic and pin description RF-OUT and DC-IN RF-IN GND Function Pin Number RF IN 2 RF input pin. This pin requires the use of an external DC blocking capacitor chosen for the frequency of operation. RF-OUT and DC-IN 5 RF output and bias pin. DC voltage is present on this pin; therefore a DC blocking capacitor is necessary for proper operation. An RF choke is needed to feed DC bias without loss of RF signal due to the bias connection, as shown in "Recommended Application Circuit", Fig. 2 GND 1,3,4,6, Paddle Description Connections to ground. Use via holes as shown in "Suggested Layout for PCB Design" to reduce ground path inductance for best performance. Mini-Circuits (R) ISO 9001 ISO 14001 AS 9100 CERTIFIED P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine For detailed performance specs & shopping online see web site (R) Provides ACTUAL Data Instantly at minicircuits.com IF/RF MICROWAVE COMPONENTS Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit's applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, "Standard Terms"); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits' website at www.minicircuits.com/MCLStore/terms.jsp. REV. B M134423 HXG-122+ TH/RS/CP 130516 Page 2 HXG-122+ Ultra High IP3 Amplifier Module Electrical Specifications(1) at 25C and 5V, unless noted Parameter Min. Condition (GHz) Frequency Range Typ. Max. Units 1.2 GHz 0.5 Gain 0.5 16.0 0.7 15.7 0.9 Input Return Loss Output Return Loss Reverse Isolation Output Power @1 dB compression Output IP3 13.9 Noise Figure 15.3 1.2 14.5 0.5 18.7 0.7 15.9 0.9 13.2 1.2 9.4 0.5 14.2 0.7 12.1 0.9 10.3 1.2 8.0 0.9 21.0 0.5 22.9 0.7 23.0 0.9 23.3 1.2 23.0 0.5 43.8 0.7 47.0 0.9 dB 42.0 17.0 dB dB dB dBm dBm 46.0 1.2 40.8 0.5 2.1 0.7 2.2 0.9 2.2 1.2 dB 2.2 Device Operating Voltage (Vd) 4.8 5.0 5.2 V Device Operating Current 110 146 180 mA Device Current Variation vs. Temperature(2) +14 A/C Device Current Variation vs Voltage 0.05 mA/mV 85 C/W Thermal Resistance, junction-to-ground lead (1) Measured on Mini-Circuits Characterization test board TB-640+. See Characterization Test Circuit (Fig. 1) (2) Current at 85C -- Current at -45C)/130 Absolute Maximum Ratings Parameter LSL Ratings Operating Temperature (ground lead) -40C to 85C Storage Temperature -65C to 150C Operating Current at 5V 210 mA Power Dissipation 1W Input Power (CW) 24 dBm 175 170 165 160 155 150 145 140 135 130 125 120 115 6V 110 DC Voltage on Pin 3 USL DC Current Histogram DC Current (mA) Note: Permanent damage may occur if any of these limits are exceeded. Electrical maximum ratings are not intended for continuous normal operation. LSL=Lower Spec Limit USL=Upper Spec Limit Mini-Circuits (R) ISO 9001 ISO 14001 AS 9100 CERTIFIED P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine For detailed performance specs & shopping online see web site (R) Provides ACTUAL Data Instantly at minicircuits.com IF/RF MICROWAVE COMPONENTS Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit's applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, "Standard Terms"); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Page 3 Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits' website at www.minicircuits.com/MCLStore/terms.jsp. HXG-122+ Ultra High IP3 Amplifier Module Characterization Test Circuit Vcc (Supply voltage) +5V (Vd) 5 2 RF-IN 1,3,4,6 paddle BLK-18+ RF-OUT Bias-Tee ZX85-12G-S+ Fig 1. Block Diagram of Test Circuit used for characterization. (DUT soldered on Mini-Circuits Characterization test board TB-640+) Gain, Return loss, Output power at 1dB compression (P1 dB) , output IP3 (OIP3) and noise figure measured using Agilent's N5242A PNA-X microwave network analyzer. Conditions: 1. Gain and Return loss: Pin= -25dBm 2. Output IP3 (OIP3): Two tones, spaced 1 MHz apart, 5 dBm/tone at output. Recommended Application Circuit Vcc Cbypass Ibias Cblock IN 2 5 1,3,4,6 paddle RFC (TCCH-80+) Vd OUT Cblock Fig 2. Test Board includes case, connectors, and components soldered to PCB Product Marking MCL HXG-122+ Markings in addition to model number designation may appear for internal quality control purposes. Mini-Circuits (R) ISO 9001 ISO 14001 AS 9100 CERTIFIED P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine For detailed performance specs & shopping online see web site (R) Provides ACTUAL Data Instantly at minicircuits.com IF/RF MICROWAVE COMPONENTS Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit's applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, "Standard Terms"); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Page 4 Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits' website at www.minicircuits.com/MCLStore/terms.jsp. HXG-122+ Ultra High IP3 Amplifier Module Additional Detailed Technical Information additional information is available on our dash board. To access this information click here Data Table Performance Data Swept Graphs S-Parameter (S2P Files) Data Set (.zip file) Case Style LZ1671 Ceramic package, exposed paddle, lead finish: Tape & Reel F78 Suggested Layout for PCB Design PL-350 Evaluation Board TB-641-122+ Environmental Ratings ENV-59 Standard quantities available on reel gold plating over nickel 7" reels with 20, 50, 100, 200 and 13" with 500, or 1K devices. ESD Rating Human Body Model (HBM): Class 1A (250 to <500V) in accordance with ANSI/ESD STM 5.1-2001 Machine Model (MM): Class M1 (<100V) in accordance with ANSI/ESD STM 5.2-1999 passes 25V Mini-Circuits (R) ISO 9001 ISO 14001 AS 9100 CERTIFIED P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine For detailed performance specs & shopping online see web site (R) Provides ACTUAL Data Instantly at minicircuits.com IF/RF MICROWAVE COMPONENTS Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit's applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, "Standard Terms"); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Page 5 Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits' website at www.minicircuits.com/MCLStore/terms.jsp.