5962H9654202QXX - Aeroflex / Colorado Springs

UT54ACS132E

Quadruple 2-Input NAND Schmitt Triggers

October 2008

www.aeroflex.com/Logic

FEATURES

•0.6μm CRH CMOS Process

- Latchup immune

• High speed

• Low power consumption

• Wide operating power supply from 3.0 V to 5.5V

• Available QML Q or V processes

• 14-lead flatpack

DESCRIPTION

The UT54ACS132 is a quadruple 2-input NAND gate with

Schmitt Trigger input levels. A high applied on both the inputs

forces the output to a low state.

The devices are characterized over full HiRel temperature range

of -55°C to +125°C.

LOGIC SYMB OL

FUNCTION TABLE

(3)

(6) Y2

(8)

(11) Y4

(1)

A1 (2)

B1 (4)

A2 (5)

B2 (9)

A3 (10)

B3 (12)

A4 (13)

Note:

1. Logic symbol in accordance with ANSI/IEEE standard 91-1984

and IEC Publication 617-12.

INPUTS OUTPUT

An Bn Yn

L L H

L H H

H L H

H H L

PINOUT 14-Lead Flatpack

Top View

LOGIC DIAGRAM

VDD

VSS

114

213

312

411

510

A4 Y4

A3 Y3

B1 Y1

B2 Y2

OPERATIONAL ENVIRONMENT1

Notes:

1. Logic will not latchup during radiation ex posure within the limits defined in the table.

2. Device storage elements are immune to SEU affects.

ABSOLUTE MAXIMUM RATINGS

Note:

1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only , functional operation of the device at these

or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended periods

may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

PARAMETER LIMIT UNITS

Total Dose 1.0E6 rads(Si)

SEU Thresh old 280 MeV-cm2/mg

SEL Threshold 120 MeV-cm2/mg

Neutron Fluence 1.0E14 n/cm2

SYMBOL PARAMETER LIMIT UNITS

VDD Supply voltage -0.3 to 7.0 V

VI/O Voltage any pin -.3 to VDD + .3 V

TSTG Storage Temperature range -65 to +150 °C

TJMaximum junction temperature +175 °C

TLS Lead temperature (soldering 5 seconds) +300 °C

ΘJC Thermal resistance junction to case 20 °C/W

IIDC input current ±10 mA

PDMaximum power dissipation 1 W

SYMBOL PARAMETER LIMIT UNITS

VDD Supply voltage 3.0 to 5.5 V

VIN Input voltage any pin 0 to VDD V

TCTemperature range -55 to +125 °C

DC ELECTRICAL CHARACTERIST IC S FO R TH E UT 54ACS132E7

( VDD = 3.0V to 5.5V; VSS = 0V6; -55°C < TC < +125°C)

Notes:

1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: VIH = VIH(min) + 20%, - 0%; VIL = VIL(max) + 0%, - 50%,

as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are guaranteed

to VIH(min) and VIL(max).

2. Supplied as a design limit but not guaranteed or tested.

3. Per MIL-PRF-385 35, for current density ≤5.0E5 amps/cm2, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765pF/

MHz.

4. Not more than one output may be shorted at a time for maximum duration of one second.

5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and VSS at

frequency of 1MHz and a signal amplitude of 50mV rms maximum.

6. Maximum allowable relative shift equals 50mV.

7. All specifications valid for radiation dose ≤ 1E6 rads(Si) per MIL-STD-883 Method 1019 Condition A and sectio n 3.11.2.

8. Power dissipation specified per switching output.

9. This value is guaranteed based on characterization data, but not tested.

SYMBOL Description CONDITION VDD MIN MAX UNIT

VT+ Schmitt trigger positive-going

threshold 13.0V 2.1 V

5.5V 3.85

VT- Schmitt trigger negative-going

threshold 13.0V 0.9 V

5.5V 1.65

VHHysteresis2

(VT+ - VT-)

3.0V 0.3 1.2 V

4.5V .6 1.5

IIN Input leakage current VIN = VDD or VSS 5.5V -1 1μA

VOL Low-level output voltage 3IOL = 100μA3.0V 0.25 V

4.5V 0.25

VOH High-level output voltage 3IOH = -100μA3.0V 2.75 V

4.5V 4.25

IOS Short-circuit output current 2 ,4 VO = VDD and VSS 3.0V -100 100 mA

5.5V -200 200

IOL Low level output current9VIN = VDD or VSS

VOL = 0.4V

3.0V 6mA

5.5V 8

IOH High level output current9VIN = VDD or VSS

VOH = VDD-0.4V

3.0V -6 mA

5.5V -8

Ptotal Power dissipation 2, 8 CL = 50pF 5.5V

3.0V

1.9

0.76 mW/

MHz

IDDQ Quiescent Supply Current VIN = VDD or VSS 5.5V 10 μA

CIN Input capacitance 5ƒ = 1MHz 0V 15 pF

COUT Output capacitance 5 ƒ = 1MHz 0V 15 pF

AC ELECTRICAL CHARACTERISTICS FOR THE UT54ACS132E2

(VDD = 3.0V to 5.5V; VSS = 0V 1, -55°C < TC < +125°C)

Notes:

1. Maximum allowable relative shift equals 50mV.

2. All specifications valid for radiation dose ≤ 1E6 rads(Si) per MIL-STD-883 Method 1019 Condition A and section 3.11.2.

SYMBOL PARAMETER VDD MINIMUM MAXIMUM UNIT

tPHL Input to Yn CL = 30pF 3.0V & 3.6V 2 12 ns

4.5V & 5.5V 2 8

CL = 50pF 3.0V & 3.6V 2 16 ns

4.5V & 5.5V 2 12

tPLH Input to Yn CL = 30pF 3.0V & 3.6V 2 15 ns

4.5V & 5.5V 211

CL = 50pF 3.0V & 3.6V 2 19 ns

4.5V & 5.5V 2 15

Packaging

Ordering Information: UT54ACS132E: SMD

Drawing Number:

96542 = UT54ACS132E

Device Type:

02 = 1 rad(Si)/sec

Package Type:

X = 14-lead ceramic bottom-brazed dual-in-line Flatpack

Lead Finish: (Notes 1 & 2)

A = Solder

C = Gold

X = Optional

5962 ***** ** * * **

Total Dose: (Note 3 & 4)

R = 1E5 rads(Si)

F = 3E5 rads(Si)

G = 5E5 rads(Si)

H = 1E6 rads(Si)

03 = 50 to 300 rads(Si/Sec)

Class Designator:

Q = QML Class Q

V = QML Class V

Notes:

1. Lead fini sh (A,C, or X) must be specified.

2. If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold).

3. Total dose radiation must be specified when ordering. QML Q and QML V not available without radiation hardening. For protot ype inquiries, contact

factory.

4. Device type 02 is only offered with a TID tolerance guarantee of 3E5 rads(Si) or 1E6 rads(Si) and is tested in accordance with MIL-STD-883 Test

Method 1019 Condition A and section 3.11.2. Device type 03 is only offered with a TID tolerance guarantee of 1E 5 rads(Si), 3E5 rads(S i), and 5E5

rads(Si), and is tested in accordance with MIL-STD-883 Test Method 1019 Condition A.

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make changes to any products and services herein at any time

without notice. Consult Aeroflex or an authorized sales

representative to verify that the information in this data sheet

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Aeroflex Colorado Springs - Datasheet Definition

Advanced Datasheet - Product In Development

Preliminary Datasheet - Shipping Prototype

Datasheet - Shipping QML & Reduced HiRel