PS-A (ADP5)
1
PS-A PRESSURE SENSOR
AKCT1B64E ’03.9
http://www.nais-e.com/
New
PS-A PRESSURE
SENSOR
(b uilt-in amplification and
temperature compensating circuit)
Pressure sensor with
built-in amplification
and temperature
compensation circuit
FEATURES
1. Contains built-in amplification and
temperature compensation circuit.
Circuit design and adjustment of
characteristics are not required by
users.
2. High-level precision and high
reliability realized. (Overall accuracy is
±1.25% FS.)
3. Compact pressure sensor unit that
saves space.
Same size and footprint (7.0 mm (W) x 7.2
mm (D)) as pre vious PS pressure sensor.
Example of pressure characteristics
(ADP5140)
Drive voltage: 5V DC rated voltage;
ambient temperature: 25°C 77°F
TYPICAL APPLICATIONS
• Gas equipment: Microprocessor gas
meter, gas leakage detector
• Industrial equipment: Absorption
device, etc.
5
1
2
4
3
00 50 100
Pressure (gauge pressure), (kPa {kgf/cm2})
Output voltage, mV
ORDERING INFORMATION
Part No.
ADP5:
PS-A pressure sensor
Terminal profile
1:
2:
DIP terminal
SMD terminal
Rated pressure
0:
1:
2:
3:
4:
5:
6:
7:
±100 kPa
–100 kPa
25 kPa
50 kPa
100 kPa
200 kPa
500 kPa
1,000 kPa
Pressure inlet hole length
0: 3 mm .118 inch
1: 5 mm .197 inch
Ex. ADP 5
PRODUCT TYPES
Pressure inlet
hole length Part No. Part No.
3mm 5mm 3mm 5mm
Pressure
Terminal DIP terminal DIP terminal SMD terminal SMD terminal
±100kPa ADP5100 ADP5101 ADP5200 ADP5201
–100kPa ADP5110 ADP5111 ADP5210 ADP5211
25kPa ADP5120 ADP5121 ADP5220 ADP5221
50kPa ADP5130 ADP5131 ADP5230 ADP5231
100kPa ADP5140 ADP5141 ADP5240 ADP5241
200kPa ADP5150 ADP5151 ADP5250 ADP5251
500kPa ADP5160 ADP5161 ADP5260 ADP5261
1,000kPa ADP5170 ADP5171 ADP5270 ADP5271
PS-A (ADP5)
2
SPECIFICATIONS
Notes) 1. Please consult us for pressure media other than air.
2. Indicates output when drive voltage is 5 V. Although output fluctuates due to fluctuations in the drive voltage, this is not included.
3. Overall accuracy indicates the accuracy of the offset voltage and rated output voltage at temperatures between 0 and 50°C. (FS=4V)
4. Where no particular temperature is indicated, the specification is for use at 25°C
Type Specifications Remarks
Type of pressure Gauge pressure
Pressure medium Air Note*
1
Rated pressure Unit: kPa ±100 –100 25 50 100 200 500 1,000
Drive voltage 5±0.25V DC
Temperature compensation range 0 to 50°C
Offset voltage 2.5±0.05 0.5±0.05V Note*
2
Rated output voltage 4.5±0.05
(when
+100kPa) 4.5±0.05V Note*
2
Overall accuracy ±1.25%FS Note*
2
Note*
3
Current consumption Max. 10mA
Output impedance Approx. 50
Ω
Source current Max. 0.2mA
Sink current Max. 2mA
DATA
1-(1) Output voltage
ADP5170
Drive voltage: 5V DC;
temperature: 25°C 77°F
Applied pressure: 0 to +1,000kPa
1-(2) Overall accuracy (Offset voltage)
ADP5170
Drive voltage: 5V DC;
temperature: 0 to 50°C 32 to 122°F
Applied pressure: 0kPa
1-(3) Overall accuracy (Rated output voltage)
ADP5170
Drive voltage: 5V DC;
temperature: 0 to 50°C 32 to 122°F
Applied pressure: +1,000kPa
Pressure (kPa)
Output voltage, V
0
0
1
2
3
4
5
500 1000
Temperature, °C °F
Accuracy, %FS
0
+32
-1.25
-1.00
-0.75
-0.50
-0.25
0.00
0.25
0.50
0.75
1.00
1.25
25
+77 50
+122
-1.25
-1.00
-0.75
-0.50
-0.25
0.00
0.25
0.50
0.75
1.00
1.25
Temperature, °C °F
0
+32 25
+77 50
+122
Accuracy, %FS
2-(1) Output voltage
ADP5100
Drive voltage: 5V DC;
temperature: 25°C 77°F
Applied pressure: –100 to +100kPa
2-(2) Overall accuracy (Offset voltage)
ADP5100
Drive voltage: 5V DC;
temperature: 0 to 50°C 32 to 122°F
Applied pressure: 0kPa
2-(3) Overall accuracy (Rated output voltage)
ADP5100
Drive voltage: 5V DC;
temperature: 0 to 50°C 32 to 122°F
Applied pressure: +100kPa
Pressure, kPa
-100
0
1
2
3
4
5
0 100
Output voltage, V
-1.25
-1.00
-0.75
-0.50
-0.25
0.00
0.25
0.50
0.75
1.00
1.25
Temperature, °C °F
Accuracy, %FS
0
+32 25
+77 50
+122
-1.25
-1.00
-0.75
-0.50
-0.25
0.00
0.25
0.50
0.75
1.00
1.25
Temperature, °C °F
Accuracy, %FS
0
+32 25
+77 50
+122
PS-A (ADP5)
3
3. Evaluation test
Note: For details other than listed above, please consult us.
Tested item Tested condition Result
Environmental
characteristics
Storage at high temperature Temperature: Left in a 85°C 185°F constant temperature bath
Time: 100 hrs. Passed
Storage at low temperature Temperature: Left in a –20°C –4°F constant temperature bath
Time: 100 hrs. Passed
Humidity Temperature/humidity: Left at 40°C 104°F, 90% RH
Time: 100 hrs. Passed
Temperature cycle Temperature: –20°C to 85°C –4°F to 185°F
1 cycle: 30 min.
Times of cycle: 100 Passed
Endurance
characteristics High temperature/high humidity
operation Temperature/humidity: 40°C 104°F, 90% RH
Operation times: 10
6
, rated voltage applied Passed
Mechanical
characteristics
Vibration resistance Double amplitude: 1.5 mm .059 inch
Vibration: 10 to 55 Hz
Applied vibration direction: X, Y, Z 3 directions
Times: 2 hrs each Passed
Dropping resistance Dropping height: 75 cm 29.528 inch
Times: 2 times Passed
Terminal strength Pulling strength: 9.8 N {1 kgf}, 10 sec.
Bending strength: 4.9 N {0.5 kgf}, left and right 90° 1 time Passed
Soldering
Resistance
Soldered in DIP soldering bath Temperature: 230°C 446°F
Time: 5 sec. Passed
Temperature (DIP) Temperature: 260°C 500°F
Time: 10 sec. Passed
DIMENSIONS
1. DIP terminal (Pressure inlet hole: 3mm) ADP51*0
2.5±0.25
.098±.010 .098±.010
2.5±0.25 9.5±1.5
.374±.059
0.25
±0.1
.010
±.004
NC
GND NC
Vcc NC Vout
NC
GND NC
T
YR
W
QE
Vout
NC
Vcc
Atmospheric
pressure
inlet hole
Pressure
inlet hole
2.2 dia.
.087 dia.
R0.2
R.008
3.0 dia.
4-R0.7
4-R.028
0.5±0.1
.020±.004
JAPAN
0
–0.1
.118 dia.
0
–.004
7.2
.283
7.0
.276
1.8
.071
6.5
.256
3.0
.118
7.2
.283
7.0
.276
Recommended PC board pattern
(T OP VIEW 2:1)
Terminal connection diagram
Terminal No. Name
1 Vcc (Power supply [+])
2 NC (No connection)
3 Vout (Output)
4 NC (No connection)
5 NC (No connection)
6 GND (Ground)
2.5
.098
2.5
.098
6-0.9 dia.
6-.35 dia.
7.5
.295
Vcc (5V DC) Vout
C (0.1µF)
GND
mm inch
General tolerance: ±0.3 ±.012
PS-A (ADP5)
4
2. DIP terminal (Pressure inlet hole: 5mm) ADP51*1
2.5±0.25
.098±.010 .098±.010
2.5±0.25 9.5±1.5
.374±.059
0.25
±0.1
.010
±.004
NC
GND NC
Vcc NC Vout
NC
GND NC
T
YR
W
QE
Vout
NC
Vcc
Atmospheric
pressure
inlet hole
Pressure
inlet hole
2.2 dia.
.087 dia.
R0.2
R.008
3.0 dia.
4-R0.7
4-R.028
0.5±0.1
.020±.004
JAPAN
0
–0.1
.118 dia.
0
–.004
7.2
.283
7.0
.276
1.8
.071
8.5
.335
5.0
.197
7.2
.283
7.0
.276
Recommended PC board pattern
(T OP VIEW 2:1)
Terminal connection diagram
Terminal No. Name
1 Vcc (Power supply [+])
2 NC (No connection)
3 Vout (Output)
4 NC (No connection)
5 NC (No connection)
6 GND (Ground)
2.5
.098
2.5
.098
6-0.9 dia.
6-.35 dia.
7.5
.295
Vcc (5V DC) Vout
C (0.1µF)
GND
mm inch
General tolerance: ±0.3 ±.012
3. SMD terminal (Pressure inlet hole: 3mm) ADP52*0
NC
GND NC
Vcc NC Vout
Vcc NC Vout
10.0±0.3
.394±.012
0.5
.020
JAPAN
2.5±0.25
.098±.010 .098±.010
2.5±0.25
0.25
±0.1
.010
±.004
NC
GND NC
T
YR
W
QE
Atmospheric
pressure
inlet hole
Pressure
inlet hole
2.2 dia.
.087 dia.
R0.2
R.008
3.0 dia.
4-R0.7
4-R.028
0.5±0.1
.020±.004
0
–0.1
.118 dia.
0
–.004
7.2
.283
7.0
.276
1.8
.071
6.5
.256
3.0
.118
7.2
.283
7.0
.276
0.15±0.1
.006±.004
Recommended PC board pattern
(T OP VIEW 2:1)
Terminal connection diagram
Terminal No. Name
1 Vcc (Power supply [+])
2 NC (No connection)
3 Vout (Output)
4 NC (No connection)
5 NC (No connection)
6 GND (Ground)
2.5
.098
2.5
.098
1.1
.043
9.5
.374
1.9
.075
Vcc (5V DC) Vout
C (0.1µF)
GND
PS-A (ADP5)
5
4. SMD terminal (Pressure inlet hole: 5mm) ADP52*1
NC
GND NC
Vcc NC Vout
Vcc NC Vout
10.0±0.3
.394±.012
0.5
.020
JAPAN
.098±.010
2.5±0.25 .098±.010
2.5±0.25
0.25
±0.1
.010
±.004
NC
GND NC
T
YR
W
QE
Atmospheric
pressure
inlet hole
Pressure
inlet hole
2.2 dia.
.087 dia.
R0.2
R.008
3.0 dia.
4-R0.7
4-R.028
0.5±0.1
.020±.004
0
–0.1
.118 dia.
0
–.004
7.2
.283
7.0
.276
1.8
.071
7.2
.283
7.0
.276
0.15±0.1
.006±.004
8.5
.335
5.0
.197
Recommended PC board pattern
(T OP VIEW 2:1)
Terminal connection diagram
Terminal No. Name
1 Vcc (Power supply [+])
2 NC (No connection)
3 Vout (Output)
4 NC (No connection)
5 NC (No connection)
6 GND (Ground)
2.5
.098
2.5
.098
1.1
.043
9.5
.374
1.9
.075
Vcc (5V DC) Vout
C (0.1µF)
GND
mm inch
General tolerance: ±0.3 ±.012
NOTES
1. Mounting
Use lands on the printed-circuit boards to
which the sensor can be securely fixed.
2. Soldering
Due to its small size , the thermal capacity
of the pressure sensor DIP type is low.
Therefore, take steps to minimize the
effects of external heat.
Damage and changes to characteristics
may occur due to heat deformation.
Use a non-corrosive resin type of flux.
Since the pressure sensor DIP type is
exposed to the atmosphere, do not allow
flux to enter inside.
1) Manual soldering
• Set the soldering tip from 260 to 300°C
(30W), and solder for no more than 5
seconds.
• Please note that output may change if
the pressure is applied on the terminals
when the soldering.
• Thoroughly clean the soldering iron.
2) DIP soldering (DIP terminal type)
• Please keep the DIP solder bath
temperature no higher than 260°C . When
soldering, heat should be applied no
longer than five seconds.
• When mounting onto a PCB of low
thermal capacity, please avoid DIP
soldering as this may cause heat
deformity.
3) Reflow soldering (SMD terminal type)
• The recommended reflow temperature
profile conditions are given below.
• We recommend the screen solder
printing method as the method for cream
solder printing.
• Please refer to the recommended PCB
specification diagram for the PCB foot
pattern.
• Self alignment may not always work as
expected; therefore, please carefully
adjust the position of the terminals and
pattern.
• The profile temperature is the value
measured on the PCB near the terminals.
• When doing reflow soldering on the back
of the PC board after performing sensor
reflow , please fix the sensor with adhesive
and so on.
4) Solder reworking
• Finish reworking in one operation.
• For reworking of the solder bridge, use a
soldering iron with a flat tip. Please do not
add more flux when reworking.
• Please use a soldering iron that is below
the temperature given in the
specifications in order to maintain the
correct temperature at the tip of the
soldering iron.
5) Too much force on the terminals will
cause deformation and loss in
effectiveness of the solder. Therefore,
please avoid dropping and careless
handling of the product.
6) Please control warping of the PCB
within 0.05 mm of the sensor width.
7) When cut folding the PCB after
mounting the sensor, take measures to
prevent stress to the soldered parts.
8) The sensor terminals are designed to
be exposed, so contact of the terminals
with metal shards and the like will cause
output errors. Therefore, please be
careful and prevent things such as metal
shards and hands from contacting the
terminals.
9) To prevent degradation of the PCB
insulation after soldering, please be
careful not to get chemicals on the sensor
when coating.
10) Please consult us regarding the use of
lead-free solder.
3. Connections
1) Please perform connections correctly
in accordance with the terminal
connection diagram. In particular, be
careful not to reverse wire the power
supply as this will cause damage or
degrade to the product.
2) Do not connect terminals that are not
used. This can cause malfunction of the
sensor.
With in
60 sec.
Preheating
Time
Temperature Peak temperature
150°C
302°F
230°C
446°F
(230°C
446°F max.
and 10 sec. max.)
PS-A (ADP5)
6
AKCT1B64E 200309-3YT
Please contact ..........
Specifications are subject to change without notice. Printed in Japan.
Automation Controls Company
Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan
Telephone: Japan (81) Osaka (06) 6908-1050
Facsimile: Japan (81) Osaka (06) 6908-5781
http://www.nais-e.com/
COPYRIGHT © 2003 All Rights Reserved
Matsushita Electric Works, Ltd.
These materials are printed on ECF pulp.
These materials are printed with earth-friendly vegetable-based (soybean oil) ink.
North America
Europe : http://www.aromat.com/
: http://www.mew-europe.com/ Asia & others
• (Japanese)
• (Chinese)
: http://www.nais-e.com/
: http://www.mac-j.co.jp/
: http://www.cmew.com.cn/
Internet Homepage
4. Cleaning
1) Since the pressure sensor chip is
exposed to the atmosphere, do not allow
cleaning fluid to enter inside.
2) Avoid ultrasonic cleaning since this
may cause breaks or disconnections in
the wiring.
5. Environment
1) Please avoid using or storing the
pressure sensor chip in a place exposed
to corrosive gases (such as the gases
given off by organic solvents, sulfurous
acid gas, hydrogen sulfides, etc.) which
will adversely affect the performance of
the pressure sensor chip.
2) To ensure resistance to power supply
superimposed noise, you must provide a
capacitor at the power supply input
terminal of the sensor in order to stabilize
the power supply voltage. We recommend
to provide 0.1 µF and 1,000 pF capacitor
in parallel. Please confirm the noise
resistance with the actual equipment and
choose adequate capacitor.
3) Since the internal circuitry may be
destro y ed if an external surge voltages is
supplied, provide an element which will
absorb the surges.
4) Malfunctioning may occur if the product
is in the vicinity of electrical noise such as
that from static electricity, lightning, a
broadcasting station, an amateur radio , or
a mobile phone.
5) Since this pressure sensor chip does
not have a water-proof construction,
please do not use the sensor in a location
where it may be sprayed with water, etc.
6) Avoid using the pressure sensors chip
in an environment where condensation
may form.
Furthermore, its output may fluctuate if
any moisture adhering to it freezes.
7) The pressure sensor chip is
constructed in such a way that its output
will fluctuate when it is exposed to light.
Especially when pressure is to be applied
by means of a transparent tube, take
steps to pre vent the pressure sensor chip
from being exposed to light.
8) Avoid using the pressure sensor chip
where it will be susceptible to ultrasonic or
other high-frequency vibration.
6. Quality check under actual loading
conditions
To assure reliability, check the sensor
under actual loading conditions. Avoid
any situation that ma y adv ersely aff ect its
performance.
7. Other handling precautions
1) That using the wrong pressure range or
mounting method ma y result in accidents.
2) The only direct pressure medium you
can use is dry air . The use of other media,
in particular, corrosive gases (organic
solvent based gases, sulfurous acid
based gases, and hydrogen sulfide based
gases, etc.) and media that contains
moisture or f oreign substances will cause
malfunction and damage. Please do not
use them.
3) The pressure sensor chip is positioned
inside the pressure inlet. Never poke
wires or other foreign matter through the
pressure inlet since they ma y damage the
chip or bloc k the inlet. Av oid use when the
atmospheric pressure inlet is blocked.
4) Use an operating pressure which is
within the rated pressure range. Using a
pressure beyond this range may cause
damage.
5) Since static charge can damage the
pressure sensor chip, bear in mind the
following handling precautions.
• When storing the pressure sensor chips,
use a conductive material to short the
pins or wrap the entire chip in aluminum
f oil. Plastic containers should not be used
to store or transport the chips since they
readily become charged.
• When using the pressure sensor chips,
all the charged articles on the bench
surface and the work personnel should be
grounded so that any ambient static will
be safely discharged.
6) Based on the pressure involved, give
due consideration to the securing of the
pressure sensor DIP type and to the
securing and selection of the inlet tube.
Consult us if you have any queries.
