1 of 20
FEATURES
Real-Time Clock Keeps Track of Hundredths
Of Seconds, Minutes, Hours, Days, Date of
the Month, Months, and Years
512K x 8 NV SRAM Directly Replaces
Volatile Static RAM or EEPROM
Embedded Lithium Energy Cell Maintains
Calendar Operation and Retains RAM Data
Watch Function is Transparent to RAM
Operation
Automatic Leap Year Compensation Valid
Up to 2100
Over 10 Years of Data Retention in the
Absence of Power
Full 10% Operating Range
Lithium Energy Source is Electrically
Disconnected to Retain Freshness Until
Power is Applied for the First Time
DIP Module Only
– Standard 32-Pin JEDEC Pinout
– Upward Compatible with the DS1248
PowerCap Module Board Only
− Surface Mountable Package for Direct
Connection to PowerCap Containing
Battery and Crystal
− Replaceable Battery (PowerCap)
− Pin-for-Pin Compatible with Other
Densities of DS124xP Phantom Clocks
Underwriters Laboratories (UL) Recognized
(www.maxim-ic.com/qa/info/ul/)
PIN CONFIGURATIONS
13
1
2
3
4
5
6
7
8
9
10
11
12
14
31
Encapsulated Package
740-Mil Flush
A14
A7
A5
A4
A3
A2
A1
A0
DQ1
DQ0
VCC
A15
A17
WE
A13
A8
A9
A11
OE
A10
CE
DQ7
DQ5
DQ6
32
30
29
28
27
26
25
24
23
22
21
19
20
A16
A12
A6
DQ2
GND
15
16
18
17
DQ4
DQ3
DS1251
1
RST
2
3
A15
A16
N.C.
VCC
WE
OE
CE
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
GND
4
5
6
7
8
9
10
11
12
13
14
15
16
17
A17
A14
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
34
A18
X1
GND
V
BAT
X2
PowerCap Module Board
(Uses DS9034PCX+ PowerCap)
DS1251P
TOP VIEW
DS1251/DS1251P
4096K NV SRAM with Phantom Clock
19-6079; Rev 11/11
DS1251/DS1251P
2 of 20
ORDERING INFORMATION
PART TEMP RANGE
VOLTAGE
RANGE (V)
PIN-PACKAGE
DS1251W-120+
0°C to +70°C
3.3
32 EDIP (0.740a)
DS1251W-120IND+
-40°C to +85°C
3.3
32 EDIP (0.740a)
DS1251WP-120+
0°C to +70°C
3.3
34 PowerCap*
DS1251WP-120IND+
-40°C to +85°C
3.3
34 PowerCap*
DS1251Y-70+
0°C to +70°C
5.0
32 EDIP (0.740a)
DS1251YP-70+
0°C to +70°C
5.0
34 PowerCap*
DS1251YP-70IND+
-40°C to +85°C
5.0
34 PowerCap*
+ Denotes a lead(Pb)-free/RoHS-compliant package.
*DS9034PCX+ or DS9034I-PCX+ (PowerCap) required. Must be ordered separately.
PIN DESCRIPTION
PIN
NAME FUNCTION
EDIP
PowerCap
1
1
RST
Active-Low Reset Input. This pin has an internal pullup resistor connected to V
CC
.
1
34
A18
Address Inputs
2
3
A16
3
32
A14
4
30
A12
5
25
A7
6
24
A6
7
23
A5
8
22
A4
9
21
A3
10
20
A2
11
19
A1
12
18
A0
23
28
A10
25
29
A11
26
27
A9
27
26
A8
28
31
A13
30
33
A17
31
2
A15
13
16
DQ0
Data In/Data Out
14
15
DQ1
15
14
DQ2
17
13
DQ3
18
12
DQ4
19
11
DQ5
20
10
DQ6
21
9
DQ7
DS1251/DS1251P
3 of 20
PIN DESCRIPTION (continued)
PIN
NAME FUNCTION
EDIP
PowerCap
22
8
CE
Active-Low Chip-Enable Input
24
7
OE
Active-Low Output-Enable Input
29
6
WE
Active-Low Write-Enable Input
32
5
VCC
Power-Supply Input
—
4
N.C.
No Connection
16
17
GND
Ground
DESCRIPTION
The DS1251 4096K NV SRAM with Phantom Clock is a fully static nonvolatile RAM (organized as
512K words by 8 bits) with a built-in real-time clock. The DS1251Y has a self-contained lithium energy
source and control circuitry, which constantly monitors VCC for an out-of-tolerance condition. When such
a condition occurs, the lithium energy source is automatically switched on and write protection is
unconditionally enabled to prevent garbled data in both the memory and real-time clock.
The phantom clock provides timekeeping information including hundredths of seconds, seconds, minutes,
hours, days, dates, months, and years. The date at the end of the month is automatically adjusted for
months with fewer than 31 days, including correction for leap years. The phantom clock operates in either
24-hour or 12-hour format with an AM/PM indicator.
PACKAGES
The DS1251 is available in two packages: 32-pin DIP and 34-pin PowerCap module. The 32-pin DIP
style module integrates the crystal, lithium energy source, and silicon in one package. The 34-pin
PowerCap module board is designed with contacts for connection to a separate PowerCap (DS9034PCX)
that contains the crystal and battery. This design allows the PowerCap to be mounted on top of the
DS1251P after the completion of the surface mount process. Mounting the PowerCap after the surface
mount process prevents damage to the crystal and battery because of the high temperatures required for
solder reflow. The PowerCap is keyed to prevent reverse insertion. The PowerCap Module Board and
PowerCap are ordered separately and shipped in separate containers.
RAM READ MODE
The DS1251 executes a read cycle whenever
WE
(write enable) is inactive (high) and
CE
(chip enable) is
active (low). The unique address specified by the 19 address inputs (A0–A18) defines which of the 512K
bytes of data is to be accessed. Valid data will be available to the eight data-output drivers within tACC
(access time) after the last address input signal is stable, providing that
CE
and
OE
(output enable) access
times and states are also satisfied. If
OE
and
CE
access times are not satisfied, then data access must be
measured from the later occurring signal (
CE
or
OE
) and the limiting parameter is either tCO for
CE
or
tOE for
OE
, rather than address access.
RAM WRITE MODE
The DS1251 is in the write mode whenever the
WE
and
CE
signals are in the active (low) state after
address inputs are stable. The latter occurring falling edge of
CE
or
WE
will determine the start of the
write cycle. The write cycle is terminated by the earlier rising edge of
CE
or
WE
. All address inputs must
DS1251/DS1251P
4 of 20
be kept valid throughout the write cycle.
WE
must return to the high state for a minimum recovery time
(tWR ) before another cycle can be initiated. The
OE
control signal should be kept inactive (high) during
write cycles to avoid bus contention. However, if the output bus has been enabled (
CE
and
OE
active)
then
WE
will disable the outputs in tODW from its falling edge.
DATA RETENTION MODE
The 5V device is fully accessible and data can be written or read only when VCC is greater than VPF.
However, when VCC is below the power-fail point, VPF (point at which write protection occurs), the
internal clock registers and SRAM are blocked from any access. When VCC falls below the battery switch
point, VSO (battery supply level), device power is switched from the VCC pin to the backup battery. RTC
operation and SRAM data are maintained from the battery until VCC is returned to nominal levels.
The 3.3V device is fully accessible and data can be written or read only when VCC is greater than VPF.
When VCC falls below the power-fail point, VPF , access to the device is inhibited. If VPF is less than VBAT,
the device power is switched from VCC to the backup supply (VBAT ) when VCC drops below VPF . If VPF is
greater than VBAT, the device power is switched from VCC to the backup supply (VBAT ) when VCC drops
below VBAT. RTC operation and SRAM data are maintained from the battery until VCC is returned to
nominal levels.
All control, data, and address signals must be powered down when VCC is powered down.
PHANTOM CLOCK OPERATION
Communication with the phantom clock is established by pattern recognition on a serial bit stream of
64 bits, which must be matched by executing 64 consecutive write cycles containing the proper data on
DQ0. All accesses that occur prior to recognition of the 64-bit pattern are directed to memory.
After recognition is established, the next 64 read or write cycles either extract or update data in the
phantom clock, and memory access is inhibited.
Data transfer to and from the timekeeping function is accomplished with a serial bit stream under control
of chip enable, output enable, and write enable. Initially, a read cycle to any memory location using the
CE
and
OE
control of the phantom clock starts the pattern recognition sequence by moving a pointer to
the first bit of the 64-bit comparison register. Next, 64 consecutive write cycles are executed using the
CE
and
WE
control of the SmartWatch. These 64 write cycles are used only to gain access to the
phantom clock. Therefore, any address to the memory in the socket is acceptable. However, the write
cycles generated to gain access to the phantom clock are also writing data to a location in the mated
RAM. The preferred way to manage this requirement is to set aside just one address location in RAM as a
phantom clock scratch pad. When the first write cycle is executed, it is compared to bit 0 of the 64-bit
comparison register. If a match is found, the pointer increments to the next location of the comparison
register and awaits the next write cycle. If a match is not found, the pointer does not advance and all
subsequent write cycles are ignored. If a read cycle occurs at any time during pattern recognition, the
present sequence is aborted and the comparison register pointer is reset. Pattern recognition continues for
a total of 64 write cycles as described above until all the bits in the comparison register have been
matched (Figure 1). With a correct match for 64 bits, the phantom clock is enabled and data transfer to or
DS1251/DS1251P
5 of 20
from the timekeeping registers can proceed. The next 64 cycles will cause the phantom clock to either
receive or transmit data on DQ0, depending on the level of the
OE
pin or the
WE
pin. Cycles to other
locations outside the memory block can be interleaved with
CE
cycles without interrupting the pattern
recognition sequence or data transfer sequence to the phantom clock.
PHANTOM CLOCK REGISTER INFORMATION
The phantom clock information is contained in eight registers of 8 bits, each of which is sequentially
accessed 1 bit at a time after the 64-bit pattern recognition sequence has been completed. When updating
the phantom clock registers, each register must be handled in groups of 8 bits. Writing and reading
individual bits within a register could produce erroneous results. These read/write registers are defined in
Figure 2.
Data contained in the phantom clock register is in binary-coded decimal format (BCD). Reading and
writing the registers is always accomplished by stepping through all eight registers, starting with bit 0 of
register 0 and ending with bit 7 of register 7.
PHANTOM CLOCK REGISTER DEFINITION Figure 1
NOTE: THE PATTERN RECOGNITION IN HEX IS C5, 3A, A3, 5C, C5, 3A, A3, 5C. THE ODDS OF THIS PATTERN BEING ACCIDENTALLY
DUPLICATED AND CAUSING INADVERTENT ENTRY TO THE PHANTOM CLOCK IS LESS THAN 1 IN 1019. THIS PATTERN IS SENT TO
THE PHANTOM CLOCK LSB TO MSB.
DS1251/DS1251P
6 of 20
PHANTOM CLOCK REGISTER DEFINITION Figure 2
AM/PM/12/24 MODE
Bit 7 of the hours register is defined as the 12-hour or 24-hour mode-select bit. When high, the 12-hour
mode is selected. In the 12-hour mode, bit 5 is the AM/PM bit with logic high being PM. In the 24-hour
mode, bit 5 is the 20-hour bit (20–23 hours).
OSCILLATOR AND RESET BITS
Bits 4 and 5 of the day register are used to control the
RST
and oscillator functions. Bit 4 controls the
RST
(pin 1). When the
RST
bit is set to logic 1, the
RST
input pin is ignored. When the
RST
bit is set to
logic 0, a low input on the
RST
pin will cause the phantom clock to abort data transfer without changing
data in the watch registers. Bit 5 controls the oscillator. When set to logic 1, the oscillator is off. When set
to logic 0, the oscillator turns on and the watch becomes operational. These bits are shipped from the
factory set to a logic 1.
ZERO BITS
Registers 1, 2, 3, 4, 5, and 6 contain one or more bits, which will always read logic 0. When writing these
locations, either a logic 1 or 0 is acceptable.
DS1251/DS1251P
7 of 20
BATTERY LONGEVITY
The DS1251 has a lithium power source that is designed to provide energy for clock activity, and clock
and RAM data retention when the VCC supply is not present. The capability of this internal power supply
is sufficient to power the DS1251 continuously for the life of the equipment in which it is installed. For
specification purposes, the life expectancy is 10 years at +25°C with the internal clock oscillator running
in the absence of VCC power. Each DS1251 is shipped from Maxim with its lithium energy source
disconnected, guaranteeing full energy capacity. When VCC is first applied at a level greater than VPF, the
lithium energy source is enabled for battery-backup operation. Actual life expectancy of the DS1251 will
be much longer than 10 years since no lithium battery energy is consumed when VCC is present.
CLOCK ACCURACY (DIP MODULE)
The DS1251 is guaranteed to keep time accuracy to within ±1 minute per month at +25°C. The clock is
calibrated at the factory by Maxim using special calibration nonvolatile tuning elements. The DS1251
does not require additional calibration and temperature deviations will have a negligible effect in most
applications. For this reason, methods of field clock calibration are not available and not necessary.
CLOCK ACCURACY (POWERCAP MODULE)
The DS1251P and DS9034PCX are each individually tested for accuracy. Once mounted together, the
module is guaranteed to keep time accuracy to within ±1.53 minutes per month (35ppm) at +25°C.
DS1251/DS1251P
8 of 20
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground (5V product) . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V
(3.3V product) . . . . . . . . . . . . . . . . . -0.3V to +4.6V
Storage Temperature Range
EDIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
PowerCap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +260°C
Note: EDIP is wave or hand-soldered only
Soldering Temperature (reflow, PowerCap) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+260°C
This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in
the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods of time can affect reliability.
OPERATING RANGE
RANGE
TEMP RANGE
(NONCONDENSING)
VCC (V)
Commercial
0°C to +70°C
3.3 ±10% or 5 ±10%
Industrial
-40°C to +85°C
3.3 ±10% or 5 ±10%
RECOMMENDED OPERATING CONDITIONS
(TA = Over the operating range.)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Logic 1 Voltage All
Inputs
VCC = 5V ±10%
VIH
2.2 VCC + 0.3
V 11
VCC = 3.3V ±10% 2.0 VCC + 0.3
Logic 0 Voltage All
Inputs
VCC = 5V ±10%
VIL
-0.3 +0.8
V 11
VCC = 3.3V ±10% -0.3 +0.6
DS1251/DS1251P
9 of 20
DC ELECTRICAL CHARACTERISTICS
(TA = Over the operating range.) (5V)
0BPARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Input Leakage Current IIL -1.0 +1.0 µA 12
I/O Leakage Current
CE
≥
VIH ≤ VCC
IIO -1.0 +1.0 µA
Output Current at 2.4V
IOH
-1.0
mA
Output Current at 0.4V
IOL
2.0
mA
Standby Current CE = 2.2V ICCS1 5 10 mA
Standby Current
CE = VCC - 0.5V ICCS2 3.0 5.0 mA
Operating Current tCYC = 70ns ICC01 85 mA
Write Protection Voltage VPF 4.25 4.37 4.50 V 11
Battery Switchover Voltage VSO VBAT 6BV 11
DC ELECTRICAL CHARACTERISTICS
(TA = Over the operating range.) (3.3V)
1BPARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Input Leakage Current IIL -1.0 +1.0 µA 12
I/O Leakage Current
CE
≥
VIH ≤ VCC
IIO -1.0 +1.0 µA
Output Current at 2.4V
IOH
-1.0
mA
Output Current at 0.4V
IOL
2.0
mA
Standby Current
CE
= 2.2V
ICCS1
5
7
mA
Standby Current
CE = V
CC
- 0.5V ICCS2 2.0 3.0 mA
Operating Current tCYC = 70ns
ICC01
50
mA
Write Protection Voltage
VPF
2.80
2.97
V
11
Battery Switchover Voltage VSO
V
BAT
or
V
PF
7BV 11
CAPACITANCE
(TA = +25°C)
2BPARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Input Capacitance
CIN
5
10
pF
Input/Output Capacitance
CI/O
5
10
pF
DS1251/DS1251P
10 of 20
MEMORY AC ELECTRICAL CHARACTERISTICS
(TA = Over the operating range.) (5V)
3BPARAMETER SYMBOL
DS1251Y-70
UNITS 8BNOTES
MIN
9B
MAX
Read Cycle Time tRC 70 ns
Access Time tACC 70 ns
OE to Output Valid tOE 35 ns
CE to Output Valid tCO 70 ns
OE or CE to Output Active tCOE 5 ns 5
Output High-Z from Deselection tOD 25 ns 5
Output Hold from Address Change tOH 5 ns
Write Cycle Time tWC 70 ns
Write Pulse Width tWP 50 ns 3
Address Setup Time tAW 0 ns
Write Recovery Time tWR 0 ns
Output High-Z from WE tODW 25 ns 5
Output Active from WE tOEW 5 ns 5
Data Setup Time tDS 30 ns 4
Data Hold Time from WE tDH 5 ns 4
DS1251/DS1251P
11 of 20
PHANTOM CLOCK AC ELECTRICAL CHARACTERISTICS
(TA = Over the operating range.) (5V)
10BPARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Read Cycle Time tRC 65 ns
CE Access Time tCO 55 ns
OE Access Time tOE 55 ns
CE to Output Low-Z tCOE 5 ns
OE to Output Low-Z tOEE 5 ns
CE to Output High-Z tOD 25 ns 5
OE to Output High-Z tODO 25 ns 5
Read Recovery tRR 10 ns
Write Cycle Time tWC 65 ns
Write Pulse Width tWP 55 ns 3
Write Recovery tWR 10 ns 10
Data Setup Time tDS 30 ns 4
Data Hold Time tDH 0 ns 4
CE Pulse Width tCW 60 ns
RST Pulse Width tRST 65 ns
POWER-DOWN/POWER-UP TIMING
(TA = Over the operating range.) (3.3V)
11BPARAMETER SYMBOL MIN TYP MAX UNITS NOTES
CE at VIH before Power-Down tPD 0 µs
VCC Slew from VPF(MAX) to
VPF(MIN)(CE at VPF) tF 300 µs
VCC Slew from VPF(MIN) to VSO tFB 10 µs
VCC Slew from VPF(MAX) to
VPF(MIN) (CE at VPF) tR 0 µs
CE at VIH after Power-Up tREC 1.5 2.5 ms
(TA = +25°C)
4BPARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Expected Data Retention Time tDR 10 years 9
Warning: Under no circumstances are negative undershoots of any amplitude allowed when device
is in battery-backup mode.
DS1251/DS1251P
12 of 20
MEMORY AC ELECTRICAL CHARACTERISTICS
(TA = Over the operating range.) (3.3V)
PARAMETER 12BSYMBOL
13B
DS1251W-120
14BUNITS 15BNOTES
MIN
16B
MAX
Read Cycle Time
tRC
120
ns
Access Time
tACC
120
ns
OE
to Output Valid
tOE
60
ns
CE
to Output Valid
tCO
120
ns
OE
or
CE
to Output Active
tCOE
5
ns
5
Output High-Z from Deselection
tOD
40
ns
5
Output Hold from Address Change
tOH
5
ns
Write Cycle Time
tWC
120
ns
Write Pulse Width
tWP
90
ns
3
Address Setup Time
tAW
0
ns
Write Recovery Time
tWR
20
ns
10
Output High-Z from
WE
tODW
40
ns
5
Output Active from
WE
tOEW
5
ns
5
Data Setup Time
tDS
50
ns
4
Data Hold Time from
WE
tDH
20
ns
4
PHANTOM CLOCK AC ELECTRICAL CHARACTERISTICS
(TA = Over the operating range.) (3.3V)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Read Cycle Time tRC 120 ns
CE Access Time tCO 100 ns
OE Access Time tOE 100 ns
CE
to Output Low-Z
t
COE
5
ns
OE to Output Low-Z tOEE 5 ns
CE to Output High-Z tOD 40 ns 5
OE to Output High-Z tODO 40 ns 5
Read Recovery tRR 20 ns
Write Cycle Time tWC 120 ns
Write Pulse Width tWP 100 ns 3
Write Recovery tWR 20 ns 10
Data Setup Time tDS 45 ns 4
Data Hold Time tDH 0 ns 4
CE Pulse Width tCW 105 ns
RST Pulse Width tRST 120 ns
DS1251/DS1251P
13 of 20
POWER-DOWN/POWER-UP TIMING
(TA = Over the operating range.) (3.3V)
17BPARAMETER SYMBOL MIN TYP MAX UNITS NOTES
CE at VIH before Power-Down tPD 0 µs
VCC Slew from VPF(MAX) to
VPF(MIN) (CE at VIH) tF 300 µs
VCC Slew from VPF(MAX) to
VPF(MIN) (CE at VIH) tR 0 µs
CE at VIH after Power-Up tREC 1.5 2.5 ms
(TA = +25°C)
5BPARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Expected Data Retention Time
t
DR
10
years
9
Warning: Under no circumstances are negative undershoots of any amplitude allowed when device
is in battery-backup mode.
DS1251/DS1251P
14 of 20
MEMORY READ CYCLE (Note 1)
MEMORY WRITE CYCLE 1 (Notes 2, 6, and 7)
DS1251/DS1251P
15 of 20
MEMORY WRITE CYCLE 2 (Notes 2 and 8)
RESET FOR PHANTOM CLOCK
READ CYCLE TO PHANTOM CLOCK
DS1251/DS1251P
16 of 20
WRITE CYCLE TO PHANTOM CLOCK
POWER-DOWN/POWER-UP CONDITION (5V)
DS1251/DS1251P
17 of 20
POWER-DOWN/POWER-UP CONDITION (3.3V)
DS1251/DS1251P
18 of 20
AC TEST CONDITIONS
Output Load: 50pF + 1TTL Gate
Input Pulse Levels: 0 to 3V
Timing Measurement Reference Levels
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) WE is high for a read cycle.
2) OE = VIH or VIL. If OE = VIH during write cycle, the output buffers remain in a high-impedance state.
3) tWP is specified as the logical AND of CE and WE. tWP is measured from the latter of CE or WE going
low to the earlier of CE or WE going high.
4) tDH, t DS are measured from the earlier of CE or WE going high.
5) These parameters are sampled with a 50pF load and are not 100% tested.
6) If the CE low transition occurs simultaneously with or later than the WE low transition in Write Cycle
1, the output buffers remain in a high-impedance state during this period.
7) If the CE high transition occurs prior to or simultaneously with the WE high transition, the output
buffers remain in a high-impedance state during this period.
8) If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition,
the output buffers remain in a high impedance state during this period.
9) The expected tDR is defined as cumulative time in the absence of VCC with the clock oscillator
running.
10) tWR is a function of the latter occurring edge of WE or CE.
11) Voltages are referenced to ground.
12) RST (Pin 1) has an internal pullup resistor.
13) Real-time clock modules can be successfully processed through conventional wave-soldering
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85°C. Post-solder cleaning with water-washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap:
1) Maxim recommends that PowerCap Module bases experience one pass through solder reflow oriented
with the label side up (“live-bug”).
2) Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than three
seconds.
− To solder, apply flux to the pad, heat the lead frame pad, and apply solder. To remove the part,
apply flux, heat the lead frame pad until the solder reflows, and use a solder wick to remove
solder.
DS1251/DS1251P
19 of 20
PACKAGE INFORMATION
For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages.
Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a
different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO.
32 EDIP MDT32+5 21-0245 —
34 PWRCP PC2+5 21-0246 —
DS1251/DS1251P
20 of 20
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim
reserves the right to change the circuitry and specifications without notice at any time.
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REVISION HISTORY
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
11/11
Updated the Features, Ordering Information, AM/PM/12/24-MODE, and
Absolute Maximum Ratings, and Package Information sections
1, 2, 6, 8, 19