EVERLIGHT ELECTRONICS CO.,LTD.
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 1 of 10
Device No:SZDSE-111-B02 Prepared date: 07-27-2005 Prepared by: DONG TIE
Technical Data Sheet
1206 Package Chip LED with Inner lens
11-21/BHC-AQ2S1M/2T
Features
Package in 8mm tape on 7diameter reel.
Compatible with automatic placement equipment.
Compatible with infrared and vapor phase reflow
solder process.
Mono-color type.
Pb Free.
The product itself will remain within RoHS compliant
version.
Descriptions
The 11-21 SMD Taping is much smaller than lead
frame type components, thus enable smaller board
size, higher packing density, reduced storage space
and finally smaller equipment to be obtained.
Besides, lightweight makes them ideal for
miniature applications. etc.
Applications
Automotive: backlighting in dashboard and switch.
Telecommunication: indicator and backlighting in
telephone and fax.
Flat backlight for LCD, switch and symbol.
General use.
Device Selection Guide Chip
Part No. Material Emitted Color
Lens Color
11-21/BHC-AQ2S1M/2T InGaN Blue Water Clear
EVERLIGHT ELECTRONICS CO.,LTD.
11-21/BHC-AQ2S1M/2T
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 2 of 10
Device No:SZDSE-111-B02 Prepared date: 07-27-2005 Prepared by: DONG TIE
Package Outline Dimensions
-+
Notes: Tolerances Unless Dimension ±0.1mm ,Unit = mm
EVERLIGHT ELECTRONICS CO.,LTD.
11-21/BHC-AQ2S1M/2T
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 3 of 10
Device No:SZDSE-111-B02 Prepared date: 07-27-2005 Prepared by: DONG TIE
Absolute Maximum Ratings (Ta=25)
Parameter Symbol Rating Unit
Reverse Voltage VR 5 V
Forward Current IF 25 mA
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +90
Soldering Temperature Tsol 260
(for 5 second)
Electrostatic Discharge ESD 150 V
Power Dissipation Pd 110 mW
Peak Forward Current
(Duty 1/10 @1KHz) IFP 100 mA
Electro-Optical Characteristics (Ta=25)
Parameter Symbol Min. Typ. Max. Unit Condition
Luminous Intensity Iv 90 ----- 225 mcd
Viewing Angle 2θ1/2 ----- 60 ----- deg
Peak Wavelength λp ----- 466 ----- nm
Dominant Wavelength λd 464.5 ----- 476.5 nm
Spectrum Radiation
Bandwidth △λ ----- 35 ----- nm
Forward Voltage VF 2.75 ----- 3.95
V
IF=20mA
Reverse Current IR ----- ----- 50 μA VR=5V
Notes:
1.Tolerance of Luminous Intensity ±10%
2.Tolerance of Dominant Wavelength ±1nm
3.Tolerance of Forward Voltage ±0.1V
EVERLIGHT ELECTRONICS CO.,LTD.
11-21/BHC-AQ2S1M/2T
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 4 of 10
Device No:SZDSE-111-B02 Prepared date: 07-27-2005 Prepared by: DONG TIE
Bin Rang Of Dom. Wavelength
Group Bin Min Max Unit Condition
A9 464.5 467.5
A10 467.5 470.5
A11 470.5 473.5
Z
A12 473.5 476.5
nm IF=20mA
Bin Rang Of Luminous Intensity
Bin Min Max Unit Condition
Q2 90 112
R1 112 140
R2 140 180
S1 180 250
nm IF=20mA
Bin Rang Of Luminous Voltage
Group Bin Min Max Unit Condition
5 2.75 3.05
6 3.05 3.35
7 3.35 3.65
M
8 3.65 3.95
V IF=20mA
Notes:
1.Tolerance of Luminous Intensity ±10%
2.Tolerance of Dominant Wavelength ±1nm
3.Tolerance of Forward Voltage ±0.1V
EVERLIGHT ELECTRONICS CO.,LTD.
11-21/BHC-AQ2S1M/2T
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 5 of 10
Device No:SZDSE-111-B02 Prepared date: 07-27-2005 Prepared by: DONG TIE
Typical Electro-Optical Characteristics Curves
EVERLIGHT ELECTRONICS CO.,LTD.
11-21/BHC-AQ2S1M/2T
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 6 of 10
Device No:SZDSE-111-B02 Prepared date: 07-27-2005 Prepared by: DONG TIE
xxxxxx
xxxxxx
xxxxxxxxxxxx
xxxx
xxxxxxxx
RoHS
Label explanation
CAT: Luminous Intensity Rank
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
EVERLIGHT ELECTRONICS CO.,LTD.
11-21/BHC-AQ2S1M/2T
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 7 of 10
Device No:SZDSE-111-B02 Prepared date: 07-27-2005 Prepared by: DONG TIE
Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm,Unit = mm
Moisture Resistant Packaging
Aluminum moistue-proof bag LabelDesiccant
Label
EVERLIGHT ELECTRONICS CO.,LTD.
11-21/BHC-AQ2S1M/2T
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 8 of 10
Device No:SZDSE-111-B02 Prepared date: 07-27-2005 Prepared by: DONG TIE
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level : 90 %
LTPD : 10 %
No. Items Test Condition
Test
Hours/Cycles Sample
Size Ac/Re
1 Reflow Soldering
Temp. : 260℃±5
Min. 5sec. 6 Min. 22 PCS. 0/1
2 Temperature Cycle
H : +100 15min
5 min
L : -40 15min
300 Cycles 22 PCS. 0/1
3 Thermal Shock
H : +100 5min
10 sec
L : -10 5min
300 Cycles 22 PCS. 0/1
4 High Temperature
Storage Temp. : 100 1000 Hrs. 22 PCS. 0/1
5 Low Temperature
Storage Temp. : -40 1000 Hrs. 22 PCS. 0/1
6 DC Operating Life IF = 20 mA 1000 Hrs. 22 PCS. 0/1
7 High Temperature /
High Humidity 85/ 85%RH 1000 Hrs. 22 PCS. 0/1
EVERLIGHT ELECTRONICS CO.,LTD.
11-21/BHC-AQ2S1M/2T
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 9 of 10
Device No:SZDSE-111-B02 Prepared date: 07-27-2005 Prepared by: DONG TIE
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection , otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package, the LEDs should be kept at 30 or less and 90%RH or less.
2.3 The LEDs should be used within a year.(To fit the MSL-2 .)
2.4 After opening the package, the LEDs should be kept at 30 or less and 70%RH or less.
2.5 The LEDs should be used within 168 hours (7 days) after opening the package.
2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5 for 24 hours.
3. Soldering Condition
3.1 Lead solder temperature profile
2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
EVERLIGHT ELECTRONICS CO.,LTD.
11-21/BHC-AQ2S1M/2T
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 10 of 10
Device No:SZDSE-111-B02 Prepared date: 07-27-2005 Prepared by: DONG TIE
4. Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 280 for 3 seconds
within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do
soldering of each terminal. Be careful because the damage of the product is often started at the time of
the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether
the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com