Symbol
VDS
VGS
IDM
TJ, TSTG
Symbol Ty
p
Max
65 90
85 125
RθJL 43 60
W
Maximum Junction-to-Lead CSteady-State °C/W
Thermal Characteristics
Parameter Units
Maximum Junction-to-Ambient At ≤ 10s RθJA
°C/W
Maximum Junction-to-Ambient ASteady-State °C/W
±12Gate-Source Voltage
Drain-Source Voltage -20
Continuous Drain
Current A
Maximum UnitsParameter
TA=25°C
TA=70°C
Absolute Maximum Ratings TA=25°C unless otherwise noted
V
V
-2.8
-15
Pulsed Drain Current B
Power Dissipation A
TA=25°C
Junction and Storage Temperature Range
A
PD
°C
1.4
0.9
-55 to 150
TA=70°C
ID
-3.5
AO3419, AO3419L ( Green Product )
P-Channel Enhancement Mode Field Effect Transistor
Features
VDS (V) = -20V
ID = -3.5 A
RDS(ON) < 75mΩ (VGS = -10V)
RDS(ON) < 95mΩ (VGS = -4.5V)
RDS(ON) < 145mΩ (VGS = -2.5V)
ESD Rating: 2000V HBM
General Description
The AO3419 uses advanced trench technology to
provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 2.5V. This
device is suitable for use as a load switch or in PWM
applications. It is ESD protected. AO3419L
( Green Product ) is offered in a lead-free package.
D
S
G
S
GD
TO-236
(SOT-23)
Top View
Rev 1:Nov 2004
Alpha & Omega Semiconductor, Ltd.
AO3419, AO3419L
Symbol Min Typ Max Units
BVDSS -20 V
-0.5
TJ=55°C -2.5
±1
µ
A
±10
µ
A
VGS(th) -0.7 -0.9 -1.4 V
ID(ON) -15 A
59 75
TJ=125°C 83 105
76 95 m
Ω
111 145 m
Ω
gFS 6.8 S
VSD -0.65 -0.81 -0.95 V
IS-2 A
Ciss 512 620 pF
Coss 77 pF
Crss 62 pF
Rg9.2 13 Ω
Qg5.5 6.6 nC
Qgs 0.8 nC
Qgd 1.9 nC
tD(on) 5ns
tr6.7 ns
tD(off) 28 ns
tf13.5 ns
trr 9.8 12 ns
Qrr 2.7 nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Gate-Body leakage current
Gate resistance VGS=0V, VDS=0V, f=1MHz
RDS(ON) Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
Turn-Off Fall Time
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
IF=-3.5A, dI/dt=100A/µs
VGS=0V, VDS=-10V, f=1MHz
SWITCHING PARAMETERS
Total Gate Charge
VGS=-4.5V, VDS=-10V, ID=-3.5A
Gate Source Charge
Gate Drain Charge
Turn-On Rise Time
Turn-Off DelayTime
VGS=-10V, VDS=-10V, RL=2.8Ω,
RGEN=3Ω
mΩ
VGS=-4.5V, ID=-3A
IS=-1A,VGS=0V
VDS=-5V, ID=-3.5A
IDSS µΑ
Gate Threshold Voltage VDS=VGS ID=-250µA
VDS=-16V, VGS=0V
VDS=0V, VGS=±12V
Zero Gate Voltage Drain Current
VDS=0V, VGS=±10V
IGSS
Electrical Characteristics (TJ=25°C unless otherwise noted)
STATIC PARAMETERS Parameter Conditions
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=-3.5A, dI/dt=100A/µs
Drain-Source Breakdown Voltage
On state drain current
ID=-250µA, VGS=0V
VGS=-2.5V, ID=-1A
VGS=-4.5V, VDS=-5V
VGS=-10V, ID=-3.5A
Reverse Transfer Capacitance
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C.
The value in any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal
resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
SOA curve provides a single pulse rating.
Alpha & Omega Semiconductor, Ltd.
AO3419, AO3419L
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0
5
10
15
20
25
012345
-VDS (Volts)
Fig 1: On-Region Characteristics
-ID (A)
VGS=-1.5V
-2.0V
-2.5V
-4.0V
-5.0V
-3.0V
-6.0V
-7.0V
-8.0V
-9.0V -10.0V
0
2
4
6
8
10
0 0.5 1 1.5 2 2.5 3 3.5
-VGS(Volts)
Figure 2: Transfer Characteristics
-ID(A)
20
40
60
80
100
120
140
160
0246810
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
RDS(ON) (mΩ)
1E-06
1E-05
1E-04
1E-03
1E-02
1E-01
1E+00
1E+01
0.0 0.2 0.4 0.6 0.8 1.0 1.2
-VSD (Volts)
Figure 6: Body-Diode Characteristics
-IS (A)
25°C
125°C
0.8
1.0
1.2
1.4
1.6
0 25 50 75 100 125 150 175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
Normalized On-Resistance
ID=-3A, VGS=-4.5V
ID=-1A, VGS=-2.5V
ID=-3.5A, VGS=-10V
40
60
80
100
120
140
160
180
200
02468
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
RDS(ON) (mΩ)
ID=-3.5A
25°C
125°C
25°C
125°C
VDS=-5V
VGS=-2.5V
VGS=-4.5V
VGS=-10V
Alpha & Omega Semiconductor, Ltd.
AO3419, AO3419L
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTIC
S
0
1
2
3
4
5
0123456
-Qg (nC)
Figure 7: Gate-Charge Characteristics
-VGS (Volts)
ID=-3.5A
0
200
400
600
800
0 5 10 15 20
-VDS (Volts)
Figure 8: Capacitance Characteristics
Capacitan ce (p F )
Ciss
Coss
Crss
0
10
20
30
40
0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-to-
Ambient (Note E)
Power (W)
0.01
0.1
1
10
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
ZθJA Normalized Transient
Thermal R esi stan ce
Single Pulse
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=90°C/W
T
on
T
P
D
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
1.0
10.0
100.0
0.1 1 10 100
-VDS (Volts)
-ID (Amps)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
100µs
10ms
1ms
0.1s
1s
10s
DC
TJ(Max)=150°C
TA=25°C 10µs
RDS(ON)
limited
TJ(Max)=150°C
TA=25°C
Alpha & Omega Semiconductor, Ltd.
