ALMD-EL3E-VX002 - AVAGO TECHNOLOGIES

ALMD-EL3E, ALMD-EG3E, ALMD-CM3E, ALMD-CB3E

High Brightness SMT Round

Red, Amber, Green and Blue LED Lamps

Data Sheet

Features

• Compact form factor

• High brightness material

• Available in Red, Amber, Green and Blue color

• Red AlInGaP 626 nm

• Amber AlInGaP 590 nm

• Green InGaN 525 nm

• Blue InGaN 470 nm

• JEDEC MSL 2A

• Compatible with reow soldering process

• Tinted lens

• Typical viewing angle: 30°

Applications

• Full color signs

• Mono color signs

Notes:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.20 mm, unless otherwise specied.

3. Mildsteel leadframe.

Description

The new Avago ALMD-xx3E LED series has the same or

just slightly less luminous intensity than conventional

high brightness, through-hole LEDs.

The new LED lamps can be assembled using common

SMT assembly processes and are compatible with indus-

trial reow soldering processes.

The LEDs are made with an advanced optical grade epoxy

for superior performance in outdoor sign applications.

For easy pick and place assembly, the LEDs are shipped in

tape and reel. Every reel is shipped from a single intensity

and color bin– except the red color–for better uniformity.

Package Dimensions

CAUTION: InGaN devices are Class 1C HBM ESD sensitive, AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard.

Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

CAUTION: Customer is advised to always keep the LED in the MBB with <5% RH when not in use as prolonged exposure to

environment might cause the silver-plated leads to tarnish or rust, which might cause diculties in soldering.

1.60 ± 0.50

2.50

3.40 ± 0.50

6.50 ± 0.50

1.4 (4×) 1.00

Package Marking

4.20

4.75 ± 0.50

A: Anode

C: Cathode

Device Selection Guide

Part Number Color and Dominant Wavelength

λd (nm) Typ. [3]

Luminous Intensity Iv (mcd) [1,2,5] Viewing Angle

Typ. (°) [4]

Min. Max.

ALMD-EG3E-VX002 Red 626 4200 9300 30°

ALMD-EL3E-VX002 Amber 590 4200 9300

ALMD-CM3E-Y1002 Green 525 9300 21000

ALMD-CB3E-SU002 Blue 470 1900 4200

Notes:

1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.

2. The optical axis is closely aligned with the package mechanical axis.

3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.

4. θ½ is the o-axis angle where the luminous intensity is half the on-axis intensity.

5. Tolerance for each bin limit is ± 15%.

Part Numbering System

A L M D - x1 x2 x3 x4 - x5 x6 x7 x8 x9

Code Description Option

x1 Package type E

Round AlInGaP

Round InGaN

x2 Color B

Blue

Red

Amber

Green

x3 Viewing angle 3 30°

x4 Product specic designation E

x5 Minimum intensity bin Refer to device selection guide

x6 Maximum intensity bin Refer to device selection guide

x7 Color bin selection 0 Full distribution

x8x9 Packaging option 02 Tested 20mA, 13inch carrier tape

Absolute Maximum Rating, TJ = 25 °C

Parameter Red and Amber Green Blue Unit

DC Forward Current [1] 50 30 20 mA

Peak Forward Current 100 [2] 100 [3] 100 [3] mA

Power Dissipation 120 114 76 mW

LED Junction Temperature 110 °C

Operating Temperature Range -40 to +85 °C

Storage Temperature Range -40 to +100 °C

Notes:

1. Derate linearly as shown in Figure 4 and Figure 9.

2. Duty Factor 30%, frequency 1 kHz.

3. Duty Factor 10%, frequency 1 kHz.

Electrical / Optical Characteristics, TJ = 25 °C

Parameter Symbol Min. Typ. Max. Units Test Conditions

Forward Voltage

Red

Amber

Green

Blue

1.8

2.8

2.1

3.2

2.4

3.8

V IF = 20 mA

Reverse Voltage [3]

Red & Amber

Green & Blue

V IR = 100 µA

IR = 10 µA

Dominant Wavelength [1]

Red

Amber

Green

Blue

λd

618.0

584.5

519.0

460.0

626.0

590.0

525.0

470.0

630.0

594.5

539.0

480.0

IF = 20 mA

Peak Wavelength

Red

Amber

Green

Blue

λPEAK

634

594

516

464

nm Peak of Wavelength of Spectral

Distribution at IF = 20 mA

Thermal Resistance

Red

Amber

Green

Blue

RθJ-PIN

270

480

°C/W LED Junction-to-Pin

Luminous Ecacy [2]

Red

Amber

Green

Blue

ηV

200

490

530

lm/W Emitted Luminous Power/Emitted

Radiant Power

Thermal coecient of λd

Red

Amber

Green

Blue

0.059

0.103

0.028

0.024

nm/°C IF = 20 mA ; +25 °C ≤ TJ ≤ +100 °C

Notes:

1. The dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp.

2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is

the luminous ecacy in lumens/watt.

3. Indicates product nal testing condition. Long-term reverse bias is not recommended.

AlInGaP

Figure 1. Relative Intensity vs. Wavelength Figure 2. Forward Current vs. Forward Voltage

Figure 3. Relative Intensity vs. Forward Current Figure 4. Maximum Forward Current vs. Ambient Temperature

Figure 5. Relative Dominant Wavelength Shift vs. Forward Current

0.0

0.2

0.4

0.6

0.8

1.0

500 550 600 650

Amber Red

0 0.5 1 1.5 2 2.5 3

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 10 20 30 40 50 60 0

0 20 40 60 80 100

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

1.2

0 10 20 30 40 50 60

WAVELENGTH - nm

RELATIVE INTENSITY

FORWARD VOLTAGE - V

FORWARD CURRENT - mA

RJA = 460 °C/W

RJA = 660 ° C/W

TA - AMBIENT TEMPERATURE - °C

MAXIMUM FORWARD CURRENT - mA

Red

Amber

FORWARD CURRENT - mA

RELATIVE LUMINOUS INTENSITY

(NORMALIZED AT 20 mA)

Red

Amber

FORWARD CURRENT - mA

RELATIVE DOMINANT WAVELENGTH SHIFT - nm

InGaN

Figure 6. Relative Intensity vs. Wavelength Figure 7. Forward Current vs. Forward Voltage

Figure 8. Relative Intensity vs. Forward Current Figure 9. Maximum Forward Current vs. Ambient Temperature

Figure 10. Dominant Wavelength Shift vs. Forward Current

0 20 40 60 80 100

-10

-5

0 20 40 60 80 100

Green

Blue

FORWARD CURRENT - mA

RELATIVE DOMINANT WAVELENGTH SHIFT

(NORMALIZED AT 20 mA)

TA - AMBIENT TEMPERATURE - °C

MAXIMUM FORWARD CURRENT - mA

Blue

Green

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

380 430 480 530 580 630

WAVELENGTH - nm

RELATIVE INTENSITY

GREEN

BLUE

01234

FORWARD VOLTAGE - V

FORWARD CURRENT - mA

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 5 10 15 20 25 30

DC FORWARD CURRENT - mA

RELATIVE LUMINOUS INTENSITY

(NORMALIZED AT 20 mA)

Figure 11a. Radiation Pattern for x-axis Figure 11b. Component Axis for Radiation Pattern

Figure 12. Relative Intensity Shift vs. Junction Temperature Figure 13. Forward Voltage Shift vs. Junction Temperature

Figure 14. Recommended Soldering Land Pattern

Note: Recommended stencil thickness

is 0.1524mm (6 mils) minimum and

above

5.2

2.1

4.0

0.7

0.2

0.4

0.6

0.8

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT-DEGREE

NORMALIZED INTENSITY

0.1

-40 -20 0 20 40 60 80 100 120

NORMALZIED INTENSITY (PHOTO)

TJ - JUNCTION TEMPERATURE (°C)

-0.4

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.4

-40 -20 0 20 40 60 80 100 120

FORWARD VOLTAGE SHIFT - V

TJ - JUNCTION TEMPERATURE (°C)

Green

Blue

Red

Amber

Green

Blue

Red

Amber

X X

Package Marking

Figure 16. Reel Dimension

Figure 17. Unit Orientation from reel

Figure 15. Carrier Tape Dimension

4.50±0.20

2.20±0.20

2.00±0.204.00±0.20

8.00±0.20

16.00±0.30

7.50±0.20

1.75±0.20

7.10±0.20

5.30±0.20

0.50±0.10

1.80±0.20

5.20±0.20

1.55±0.20

1.60±0.20

∅100 ± 0.50

∅330 MAX.

16.40 ± 0.20

13.00 ± 0.20

2 anode leads lead unreeling direction

Intensity Bin Limit Table (1.3:1 Iv bin ratio)

Bin

Intensity (mcd) at 20 mA

Min. Max.

S 1900 2500

T 2500 3200

U 3200 4200

V 4200 5500

W 5500 7200

X 7200 9300

Y 9300 12000

Z 12000 16000

1 16000 21000

Tolerance for each bin limit is ± 15%

VF Bin Table (V at 20 mA) for Red and Amber only

Bin ID Min. Max.

VD1.8 2.0

VA2.0 2.2

VB2.2 2.4

Tolerance for each bin limit is ± 0.05 V

Red Color Range

Min Dom Max Dom X min Y Min X max Y max

618.0 630.0 0.6872 0.3126 0.6890 0.2943

0.6690 0.3149 0.7080 0.2920

Tolerance for each bin limit is ± 0.5nm

Amber Color Range

Bin

Min

Dom

Max

Dom Xmin Ymin Xmax Ymax

1 584.5 587.0 0.5420 0.4580 0.5530 0.4400

0.5370 0.4550 0.5570 0.4420

2 587.0 589.5 0.5570 0.4420 0.5670 0.4250

0.5530 0.4400 0.5720 0.4270

4 589.5 592.0 0.5720 0.4270 0.5820 0.4110

0.5670 0.4250 0.5870 0.4130

6 592.0 594.5 0.5870 0.4130 0.5950 0.3980

0.5820 0.4110 0.6000 0.3990

Tolerance for each bin limit is ± 0.5nm

Green Color Range

Bin

Min

Dom

Max

Dom Xmin Ymin Xmax Ymax

1 519.0 523.0 0.0667 0.8323 0.1450 0.7319

0.1200 0.7375 0.0979 0.8316

2 523.0 527.0 0.0979 0.8316 0.1711 0.7218

0.1450 0.7319 0.1305 0.8189

3 527.0 531.0 0.1305 0.8189 0.1967 0.7077

0.1711 0.7218 0.1625 0.8012

4 531.0 535.0 0.1625 0.8012 0.2210 0.6920

0.1967 0.7077 0.1929 0.7816

5 535.0 539.0 0.1929 0.7816 0.2445 0.6747

0.2210 0.6920 0.2233 0.7600

Tolerance for each bin limit is ± 0.5nm

Blue Color Range

Bin

Min

Dom

Max

Dom Xmin Ymin Xmax Ymax

1 460.0 464.0 0.1440 0.0297 0.1766 0.0966

0.1818 0.0904 0.1374 0.0374

2 464.0 468.0 0.1374 0.0374 0.1699 0.1062

0.1766 0.0966 0.1291 0.0495

3 468.0 472.0 0.1291 0.0495 0.1616 0.1209

0.1699 0.1062 0.1187 0.0671

4 472.0 476.0 0.1187 0.0671 0.1517 0.1423

0.1616 0.1209 0.1063 0.0945

5 476.0 480.0 0.1063 0.0945 0.1397 0.1728

0.1517 0.1423 0.0913 0.1327

Tolerance for each bin limit is ± 0.5nm

Note: Acronyms and Denition:

BIN:

(i) Color bin only or VF bin only

(Applicable for part number with color bins but with-

out VF bin or part number with VF bins and no color bin)

(ii) Color bin incorporated with VF bin

Applicable for part number that have both color bin

and VF bin

Example:

a. Color bin only or VF bin only

BIN: 4 (represent color bin 4 only)

BIN: VA (represent VF bin “VA” only)

b. Color bin incorporate with VF bin

BIN: 4 VA

VA: VF bin “VA”

4: Color bin 4 only

Packing Label

(i) Mother Label (Available on MBB bag)

(ii) Baby Label (Available on Plastic Reel)

(1P) PART #: Part Number

(1T) Lot #: Lot Number

(9D)MFG Date: Manufacturing Date

C/0:

Country of Origin

(1T) TAPE DATE: Taping Date

(Q) QTY: Quantity

(9D) Date Code: Date Code

BABY LABEL COSBOO1B V0.0

CAT Intensity Bin

BIN Refer to Below information

(1P) Item: Part Number

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

DeptID: OEAT01 Made In: Country of Origin

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Refer to below information

(9D) Date Code: Date Code

STANDARD LABEL LS0002

RoHS Compliant

e4 Max Temp 260C MSL 2a

Soldering

Recommended reow soldering condition:

a. Reow soldering must not be done more than two

times. Do observe necessary precautions for handling

a moisture-sensitive device, as stated in the following

section.

b. Recommended board reow direction:

(i) Leaded reow soldering: (ii) Lead-free reow soldering:

c. Do not apply any pressure or force on the LED during

reow and after reow when the LED is still hot.

d. It is preferred that you use reow soldering to

solder the LED. Use hand soldering only for rework

if unavoidable but must be strictly controlled to the

following conditions:

- Soldering iron tip temperature = 320 °C max.

- Soldering duration = 3 sec max.

- Number of cycles = 1 only

- Power of soldering iron = 50 W max.

e. Do not touch the LED body with a hot soldering iron

except the soldering terminals as this may damage the

LED.

f. For de-soldering, it is recommended to use appropriate

double head soldering iron. User is advised to conrm

beforehand whether the functionality and performance

of the LED is aected by hand soldering.

240°C MAX.

20 SEC. MAX.

3°C/SEC.

MAX.

120 SEC. MAX.

TIME

TEMPERATURE

183°C

100-150°C

-6°C/SEC.

MAX.

60-150 SEC.

3°C/SEC. MAX.

217 °C

200 °C

60 - 120 SEC.

6 °C/SEC. MAX.

3 °C/SEC. MAX.

150 °C

255 - 260 °C

100 SEC. MAX.

10 to 30 SEC.

TIME

TEMPERATURE

PRECAUTIONARY NOTES

1. Handling precautions

For automated pick and place, Avago has tested nozzle

size below made with urethane material to be working

ne with this LED. However, due to the possibility of

variations in other parameters such as pick and place

machine maker/model and other settings of the ma-

chine, customer is recommended to verify the nozzle

selected.

d. Control of assembled boards

- If the PCB soldered with the LEDs is to be

subjected to other high temperature processes,

the PCB need to be stored in sealed MBB with

desiccant or desiccator at <5%RH to ensure that

all LEDs have not exceeded their oor life of 672

hours.

e. Baking is required if:

- The HIC indicator is not BROWN at 10% and is

AZURE at 5%.

- The LEDs are exposed to condition of >30°C /

60% RH at any time.

- The LED oor life exceeded 672hrs.

The recommended baking condition is: 60±5ºC

for 20hrs. Baking should only be done once.

f. Storage

- The soldering terminals of these Avago LEDs

are silver plated. If the LEDs are being exposed

in ambient environment for too long, the silver

plating might be oxidized and thus aecting its

solderability performance. As such, unused LEDs

must be kept in sealed MBB with desiccant or in

desiccator at <5%RH.

3. Application precautions

a. Drive current of the LED must not exceed the

maximum allowable limit across temperature as

stated in the datasheet. Constant current driving is

recommended to ensure consistent performance.

b. LED is not intended for reverse bias. Do use other

appropriate components for such purpose. When

driving the LED in matrix form, it is crucial to ensure

that the reverse bias voltage is not exceeding the

allowable limit of the LED.

c. Avoid rapid change in ambient temperature

especially in high humidity environment as this will

cause condensation on the LED.

d. If the LED is intended to be used in outdoor or harsh

environment, the LED leads must be protected

with suitable potting material against damages

caused by rain water, oil, corrosive gases etc. It is

recommended to have louver or shade to reduce

direct sunlight on the LEDs.

4. Eye safety precautions

LEDs may pose optical hazards when in operation. It is

not advisable to view directly at operating LEDs as it

may be harmful to the eyes. For safety reasons, use ap-

propriate shielding or personal protective equipments.

Note:

1. Nozzle tip should touch the LED ange during pick and place.

2. Outer dimensions of the nozzle should be able to t into the

carrier tape pocket.

2. Handling of moisture-sensitive device

This product has a Moisture Sensitive Level 2a rating

per JEDEC J-STD-020. Refer to Avago Application Note

AN5305, Handling of Moisture Sensitive Surface Mount

Devices, for additional details and a review of proper

handling procedures.

a. Before use

- An unopened moisture barrier bag (MBB) can

be stored at <40°C/90%RH for 12 months. If the

actual shelf life has exceeded 12 months and

the humidity Indicator Card (HIC) indicates that

baking is not required, then it is safe to reow the

LEDs per the original MSL rating.

- It is recommended that the MBB not be opened

prior to assembly (e.g. for IQC).

b. Control after opening the MBB

- The humidity indicator card (HIC) shall be read

immediately upon opening of MBB.

- The LEDs must be kept at <30°C / 60%RH at all

times and all high temperature related processes

including soldering, curing or rework need to be

completed within 672 hours.

c. Control for unnished reel

- Unused LEDs must be stored in a sealed MBB

with desiccant or desiccator at <5%RH.

4.8mm

4.4mm Φ3.9mm

Pick & Place nozzle

LED ange

>3.5mm

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-4540EN - April 27, 2015

DISCLAIMER: Avago’s products and software are not specically designed, manufactured or authorized for

sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a

nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to

make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.