HITAG
TM
2 Chip Module
August 1997Preliminary Specification
Revision 1.1
HT2 MOA3 S20
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 2 of 22
Table of Contents
1 Definitions.............................................................................................................................. 3
1.1 Objective of the Specifications..................................................................................................................... 3
1.2 Definition of the Chip Module..................................................................................................................... 3
1.3 Use of the Modules......................................................................................................................................3
2 Specifications.........................................................................................................................4
2.1 Mechanical Properties ................................................................................................................................. 4
2.2 Materials .....................................................................................................................................................4
2.3 Temperature Range .....................................................................................................................................4
2.4 Storage Conditions ......................................................................................................................................5
2.5 Delivery Conditions.....................................................................................................................................5
2.6 Electrical Specifications...............................................................................................................................6
3 Drawing of the Chip Module HT2 MOA3 S20.....................................................................7
3.1 Drawing of the Reel.....................................................................................................................................7
3.2 Module outline suggestion...........................................................................................................................8
3.3 Splicing Specification..................................................................................................................................9
4 Coil Specifications................................................................................................................ 10
5 Functional Description of HITAG 2 ................................................................................... 12
5.1 Memory Organization................................................................................................................................ 12
5.2 Operation Modes and Configuration.......................................................................................................... 13
5.2.1 Modes of Operation............................................................................................................................ 13
5.2.2 Status Flow ........................................................................................................................................ 14
5.2.3 Configuration..................................................................................................................................... 15
5.3 Configuration of Delivered HITAG 2 Transponders................................................................................... 16
5.4 Definition of Passwords and Keys.............................................................................................................. 17
6 Quality Inspection ............................................................................................................... 18
7 Characterisation and Test of the Final Transponder......................................................... 19
7.1 Characterisation of the Transponder.......................................................................................................... 19
7.2 Final Test of the Transponder.................................................................................................................... 19
8 Ordering Information.......................................................................................................... 20
HITAGTM is a trademark of Philips Electronics N.V.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 3 of 22
1 Definitions
1.1 Objective of the Specifications
This specification lists the parameters to be fulfilled by the HITAG 2 chip module
HT2 MOA3 S20 for contactless smart cards or similar transponders (as e.g. discs).
1.2 Definition of the Chip Module
A chip module is an electronically packaged chip covered with a globe top cap. The
HT2 MOA3 S20 is above all used as card module, i.e. for further lamination into contactless
smart cards according to ISO 10536.1.
So the HITAG 2 chip module HT2 MOA3 S20 is best suited for customers that do not want to
spend time with micro assembly and therefore start - e.g. ISO card production - with the
HITAG 2 chip module.
1.3 Use of the Modules
The HITAG 2 modules are designed t o be co nnected t o a coil and t hen to be furt her pro cessed by
packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing
information for the coil-module connection and packaging is given in the specification.
For production of contactless chip cards it is recommended to prepunch card foils to create a
recess for the chip module in the card body.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 4 of 22
2 Specifications
2.1 Mechanical Properties
Width
(Proposed Punching Outline) 7.55 mm
Length
(Proposed Punching Outline) 11.75 mm see also drawing in chapter 3
Overall Thickness 0.45 mm ± 0.03 mm
Film Thickness 0.16 mm ± 0.005 mm
Bondpad Size for
Transponder Coil / Module
Interconnection
1.9 x 3.5 mm Suitable for Welding/Soldering/
Conductive Gluing
2.2 Materials
Tape 110 µm Glass epoxy
Copper Plating 35 µm ED copper
Bond Plating Ni / Au Suitable for Al and Au wire
bonding
Backside Plating Ni / Au
Glob Top Filled Epoxy Thermal curing
2.3 Temperature Range
Operating -25°C to +85°C For packed transponder,
depending on type of package
Processing 150°C for 30 minutes at a standard lamination
pressure for contactless smart
card plastic materials (e.g. PVC,
PET, ...)
Welding Parameters max. 25 ms @ 500 °C on bond pads
Soldering Parameters max. 3 s @ 390 °C on bond pads
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 5 of 22
2.4 Storage Conditions
Temperature 15 - 30 °C
Relative Humidity 40 - 70 %
Duration 1 year
2.5 Delivery Conditions
Delivery Identification Date of ready for shipment, reel numbers, total quantity of good
modules with the detail of good modules per reel, order number,
product type, no supplier identification on reels, bags and boxes.
Types of Delivery Chip modules on reel
single chip modules (bulk goods)
approx. 15.000 to 20.000
pcs. per reel,
tape width super 35 mm,
pitch 9,5 mm, 2 rows
500 pcs . per bag
Packing and Transport According to documentation
"Packing Method Modules (reel)"
"Packing Method Modules (singulated)"
Order-No. 3322 845 04881
Bad Module Marking All bad modules (mechanical and
electrical faults) must be punched by
reject hole for customer
Bad positions (reel): <20%
see drawings chapter 3
Splicing Specifications Tape material: adhes. tape 15,5 +/- 0,7
mm, thermal resistance at
<190°C by < 100 cN tractive power and
< 30 sec. duration.
see drawings chapter 3
Labeling Identification label on the reel and on
carton bag:
- Product type
- Number of the reel
- Total number of positions
- Number of good positions
- Date of sealing (to be checked)
- Two batches per reel only
- Batch number indication (only coded,
to be checked)
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 6 of 22
2.6 Electrical Specifications
Symbol min typ max Comment / Conditions
Absolute Maximum Ratings
Junction Temperature TJ-55°C 140°C
Input Peak Current IINpeak 30 mA
Latch up Current 100 mA MIL-STD 883D, Method 3023
ESD 2 kV MIL-STD 883D, Method 3015.7,
Human Body
Operating Range
Temperature TA-40°C 85°C RThJunctionAmbient ≤ 30 K/W @
IINpeak = 30 mA
Input Read Only Threshold
Voltage 1) 3) VIN,RO 2,8 Vp3,9 Vpstart modulation in read only
modes
Input Threshold Voltage 1) 3) VIN,TH 3,1 Vp4,2 Vpstart modulation after SETCC
Input Read Voltage 1) 3) VIN,RD 3,5 Vp4,5 Vpread E²PROM
Input Write Voltage 1) 3) VIN,WR 3,7 Vp4,7 Vpwrite E²PROM
Demodulator
Range 3) VDEM_R 2,0 Vp4,0 VpVINHigh - VINLow @ VINHigh = 5,0 Vp
T0=8 µs, TMOD=6*T0 2)
Modulator
R_MOD linear 3) RMODL 4,5 kΩVINLow ≤ 2,0 Vp
R_MOD nonlinear 3) RMODNL 3,6 kΩVINLow ≥ 2,0 Vp
Resonance Capacitor 3)
CResInit 189 pF 210 pF 231 pF V IN = 4,0 Vp
EEPROM
Write Current 4) IW25 µA VDD = 2,8 V
Read Current 4) IR9 µA VDD = 2,8 V
Data Retention Years 10 @ 55°C
Write Endurance Cycles 100.000
1) VIN = VIN1 − VIN2 ... voltage between connection pads
2) VINHigh input voltage before modulation
VINLow input voltage during modulation
TMOD duration of the modulation
3) @ Ri = 10 kΩresistance of measurement equipment
4) tested on silicon level
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 7 of 22
3 Drawing of the Chip Module HT2 MOA3 S20
3.1 Drawing of the Reel
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 8 of 22
3.2 Module outline suggestion
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 9 of 22
3.3 Splicing Specification
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 10 of 22
4 Coil Specifications
The HITAG 2 chip module has to be connected to a coil whose parameters are briefly described
in the following.
Equivalent circuit of the transponder
Xpc Rpc Cp Uc Cchip Rchip
Uc... voltage at the connection pads
fres ... resonant frequency of the transponder
Xpc ... parallel reactance of the coil (f = 125 kHz)
Rpc ... parallel resistance of the coil (f = 125 kHz)
Cp... parasitic capacitance of the package
Cchip ... capacitance of the chip (Uc > 4 Vpp)
Rchip ... resistance of the chip
fresc ... self resonant frequency of the coil
Lpc =Xpc/2πf (f = 125 kHz)
Lpc =7.72 mH ± x % (Cp = 0, x depends on the coil production process)
Cchip = 210 pF ± 10 %
Rpc > 45 k
fresc > 750 kHz
Note: The parasitic capacitance of the package (Cp) must be considered.
()
()
f1
2(C C).L 125 kHz L = 1
2f C + C
res chip p pc pc
res chip p
=+=⇒
ππ
2
Typical values for Cp
hot laminated cards: Cp = 1.5 pF
moulded tags: Cp = 6.0 pF
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 11 of 22
For a rough estimation ( ± 10 %) of the number of coil windings following formula can be used.
I t is assumed that the winding is done in circular form.
NL
2Uln(u
d)
1,85
=
N ... number of windings
L ... inductance [nH]
U ... average coil circumference [cm]
d ... copper diameter [mm]
u ... average coil circumference [mm]
For fine tuning a measurement of the inductance and an according adjustment of the number of
windings is necessary. This process always needs some iterations.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 12 of 22
5 Functional Description of HITAG 2
5.1 Memory Organization
The memory of the transponder consists of 256 bits EEPROM memory and is organized in 8
pages with 32 bits each.
Depending on the operation mode the EEPROM is organized as described in the following.
Crypto Mode:
Page Content
0Serial Number
132 bit "KEY LOW"
216 bit " KEY HIGH", 16 bit reserved
3 8 bit Configuration, 24 Bit Password TAG
4read/write page
5read/write page
6read/write page
7read/write page
Password Mode:
Page Content
0Serial Number
1Password RWD
2reserved
38 bit Configuration, 24 bit Password TAG
4read/write page
5read/write page
6read/write page
7read/write page
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 13 of 22
5.2 Operation Modes and Configuration
With the Configuration Byte the operation mode and the access rights to the memory can be
selected. During Power-Up of the transponder the Configuration Byte is read from the
transponder’s EEPROM.
If you change the configuration, keys or passwords, you have to place the transponder
directly on the antenna or hold it directly to it (0-distance)! In order to avoid any errors
do not mov e the t ra ns ponder dur ing t his wr it e proc e ss a nd be s ur e t ha t y ou a re i n a s a fe
environment without electrical no ise.
5.2.1 Modes of Operation
The HITAG 2 can be operated in several modes.
Crypto Mode:
Mode for writing or reading the transponder with encrypted data transmission.
Password Mode:
Mode for writing or reading the transponder with plain data transmission.
A password check is performed.
Public Mode A (Manchester):
Read only mode emulating Philips Semiconductors´ MIRO transponders resp. µEM H400x
transponders.
The 64 bits of the user Pages 4 and 5 are cyclically transmitted to the read/write device.
Public Mode B (Biphase):
Read on ly m ode according to ISO standards 11784 and 11785 for animal identi fication.
The 128 bits of the user Pages 4 to 7 are cyclically transmitted to the read/write device.
Public Mode C (Biphase):
Read only mode emulating the read operation of the PCF793X (with a slightly different Program
Mode Check).
In the Public Mode C the 128 bits of the user Pages 4 to 7 are cyclically transmitted to the
read/write device.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 14 of 22
5.2.2 Status Flow
After entering the RF-field the transponder waits for a command to start the authentication.
After issuing this command the mutual authentication takes place, followed by read- and write
commands.
In password mode the data transfer occurs plain, in crypto mode data are encrypted.
The halt mode can be entered for muting a transponder.
If the transponder is configured in one of the public modes, these modes are entered automatically
after a certain waiting time and data pages are sent cyclically to the read/write device.
By issuing the command to start the authentication during the waiting time also public mode
transponders can be brought into the authorized state.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 15 of 22
5.2.3 Configuration
The Configuration Byte is represented by the first 8 bits of Page 3 of the transponder memory.
Configuration Byte:
765432100: Manchester Code
1: Biphase Code
B i t 2 B it 1 Version Coding C o di n g i n
HITAG 2-Operation
0 0 Public Mode
Bbiphase depending on bit 0
0 1 Public Mode
Amanchester depending on bit 0
1 0 Public Mode C biphase depending on bit 0
1 1 HITAG 2 depending on bit 0 depending on bit 0
0: password mode
1: crypto mode
0: PAGE 6 and 7 read/write
1: PAGE 6 and 7 read only
0: PAGE 4 and 5 read/write
1: PAGE 4 and 5 read only
THE SETTING OF THIS BIT IS OTP !
0: PAGE 3 read/write
1: PAGE 3 read only; Configuration Byte and Password TAG fixed
THE SETTING OF THIS BIT IS OTP !
0: PAGE 1 and 2 read/write
1: PAGE 1 no read/no write
PAGE 2 read only (when transponder is in password mode)
PAGE 2 no read/no write (when transponder is in crypto mode)
Configuration Byte / Bit 6:
Bit 6 = ‘0’: Page 3 is read/write.
Bit 6 = ‘1’: Page 3 can only be read. This process is irreversible !
ATTENTION: Do not set Bit 6 of the Configuration Byte to ‘1’ before having written the
final data into Page 3 (including the Configuration Byte and Password TAG) of the
transponder.
Configuration Byte / Bit 7:
Bit 7 = ‘0’: Pages 1 and 2 are read/write.
Bit 7 = ‘1’: Pages 1 and 2 are locked against writing. This process is irreversible !
ATTENTION: Do not set Bit 7 of the Configuration Byte to ‘1’ before having written the
final data into Pages 1 and 2 of the transponder.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 16 of 22
Standard values for the Configuration Byte:
Password Mode: 0x06
Crypto Mode: 0x0E
Public Mode A: 0x02
Public Mode B: 0x00
Public Mode C: 0x04
5.3 Configuration of Delivered HITAG 2 Transponders
HITAG 2 transponders are delivered with the following configuration by Philips Semiconductors:
Unique Serial Number:
Serial Number: Read Only - fixed
Configuration Byte:
0x06: Password Mode (Manchester Code) - can be changed
Page 6 and 7 read/write - can be changed
Page 4 and 5 read/write - can be changed
Page 3 read/write - can be changed
Page 1 and 2 read/write - can be changed
Values for Transport Passwords, Transport Keys:
Password RWD: 0x4D494B52 (= ″MIKR″)
Password TAG: 0xAA4854
Key Low: 0x4D494B52 (= ″MIKR″)
Key High: 0x4F4E (= ″ON″)
RECOMMENDATION:
Before delivering transponders to end users, Pages 1 to 3 should be locked (set Configuration
Byte / Bit 6 to ‘1’ for Page 3 and set Configuration Byte / Bit 7 to ‘1’ for Pages 1 and 2).
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 17 of 22
5.4 Definition of Passwords and Keys
Keys are cryptographic codes, which determine data encryption during data transfer between
read/write device and transponder. They are used to select a HITAG 2 transponder in Crypto
Mode. The 16 bit KEY HIGH and 32 bit KEY LOW form one 48 bit key which has to be
identical on both the transponder and the read/write device.
Passwords are needed to select a HITAG 2 transponder in Password Mode. There is one pair of
passwords (Password TAG, Password RWD) which has to be identical both on the transponder
and the read/write device.
Password TAG: Password that the transponder sends to the read/write device and which
may be verified by the latter (depending on the configuration of the
read/write device).
Password RWD: Password that the read/write device sends to the transponder and which is
checked for identity by the latter.
It is imp or t ant that t he fo llowing values ar e in acco rdance wit h each o t her, i.e. t he respect ive dat a
on the read/write device and on the transponder have to be identical pairs.
HITAG 2 in Password mode:
on the
read/write
device
on the
transponder
Password RWD ⇔Password RWD
as an option (depending on the configuration of the read/write device):
Password TAG ⇔Password TAG
HITAG 2 in Crypto mode:
on the
read/write
device
on the
transponder
KEY LOW ⇔KEY LOW
KEY HIGH ⇔KEY HIGH
as an option (depending on the configuration of the read/write device):
Password TAG ⇔Password TAG
T h e p as s wor d s and k e ys a re p re d e fin e d b y P h ilip s Se mic on d u c tors b y me a ns of d e fin e d Tra n s p ort
Passwords and a Transport Key. They can be written to, which means that they can be changed
(see also Chapter “Configuration of Delivered HITAG 2 Transponders“).
ATTENTION: Passwords and Keys only can be changed if their current values are known!
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 18 of 22
6 Quality Inspection
Quality inspection is performed with statistical quality control according to ISO 2859 part 1, with
AQL1.0.
Optical Properties scratches,
encapsulation failures,
gold discolouration,
delamination
according to the reference sample
catalogue
Geometrical Properies width measured with gauge
length measured with gauge
overall thickness measured with micrometer at the center of
the transfer mould cap
Electrical Properties operation basic read/write operations
Shipment Quantity
Packing and Labeling
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 19 of 22
7 Characterisation and Test of the Final Transponder
7.1 Characterisation of the Transponder
The parameters recommended to be characterised for the transponder are:
Parameter Comment
Resonant frequency fres Transponder does not modulate
Resonant frequency @ Tamb = 22°C, @ BTH
Threshold value BTH Start of modulation
Threshold value for READ BRD Command READ_PAGE OK
Threshold value for WRITE BWR Command WRITE_PAGE OK
For the measurement of these parameters we recommend to use the test equipment available from
SCEMTEC, Marienheide-Rodt, Germany (Transponder Measurement System STM-1).
This device also supports functional testing (besides parameter testing). Therefore it can also be
used as production test equipment for the final transponder test. For further information please
contact Scemtec GmbH.
7.2 Final Test of the Transponder
In addition to the equipment described in the previous chapter Philips Semiconductors offers a
device for a final functional test of transponders, the HITAGTM Test System HT OT490.
Parameter tests are not supportet by this device.
Basic flow for production and test:
1. Assembly of transponders
2. Functional test and final test of the EEPROM
Since the Keys and Logdata are changed during final test the Configuration and
personalization must take place after the final test. The final test is disabled (not reversible)
by setting the Tag-test mode bit to 0.
For the final test of transponders we recommend to use the
HITAGTM Test System HT OT490 of Philips Semiconductors or the
Transponder Measurement System STM-1 of Scemtec.
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 20 of 22
8 Ordering Information
Type Name Description Ordering Number
HT2 MOA3 S20/E/3 HITAG 2 S20 Chip Module, reel 9352 600 62118
HT2 MOA3 S20/E/1 HITAG 2 S20 Chip Module, bulk 9352 602 19122
Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc /HS Page 21 of 22
Definitions
Data sheet status
Objective specificationThis data sheet conta ins target or goal specifications for product deve lopment.
Preliminary specificationThis data sheet conta ins preliminary data; supp lementary data may be
published later.
Product spec ification This data sheet conta ins final product spec ifications.
Limiting values
Limiting values given are in acco rdance with the Abso lute Maximum Rating Syste m (IEC 134).
Stress above one o r more of the limiting values may cause pe rmanent da mage to the dev ice.
These are stress ratings on ly and ope ration of the device at thes e o r at any othe r conditions
above those g iven in the Characteristics s ect ion of the spec ification is not implied. Exposu re to
limiting values for extended pe riods may affect dev ice reliability.
Application information
Where application information is given, it is advisory and does not form part of the s pec ification.
Life support applications
These products are not designed for use in life support appliances, devices, or systems where
malfunction of these products can reasonably be expected to result in personal injury. Philips
Semiconductors´ customers using or selling these products for use in such applications do so on
their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from
such improper use or sale.
Philips Semiconductors - a worldwide company
Argentina: see South America Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Australia: 34 Waterloo Road, NORTHRYDE, NSW 2113, Tel. +3140 27 82785, Fax +3140 27 88399
Tel. +612 9805 4455, Fax. +612 9805 4466 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Austria: Computerstraße 6, A-1101 WIEN, P.O.Box 213, Tel. +649 849 4160, Fax. +649 849 7811
Tel. +431 60 101, Fax. +431 30 101 1210 Norway: Box 1, Manglerud 0612, OSLO,
Belarus: Hotel Minsk Business Centre, Bld. 3, r.1211, Volodarski Str. 6, Tel. +4722 74 8000, Fax. +4722 74 8341
220050 MINSK, Tel. +375172 200 733, Fax. +375172 200 773 Philippines: Philips Semiconductors Philippines Inc.,
Belgium: see The Netherlands 106 Valero St. Salcedo Village, P.O.Box 2108 MCC, MAKATI,
Brazil: see South America Metro MANILA, Tel. +632 816 6380, Fax. +632 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, Poland: Ul. Lukiska 10, PL 04-123 WARSZWA,
51 James Bourchier Blvd., 1407 SOFIA Tel. +4822 612 2831, Fax. +4822 612 2327
Tel. +3592 689 211, Fax. +3592 689 102 Portugal: see Spain
Canada: Philips Semiconductors/Components, Romania: see Italy
Tel. +1800 234 7381 Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, Tel. +7095 247 9145, Fax. +7095 247 9144
72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +85223 19 7888, Fax. +85223 19 7700 Tel. +65350 2538, Fax. +65251 6500
Colombia: see South America Slovakia: see Austria
Czech Republic: see Austria Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, South Africa: S.A. Philips Pty Ltd., 195-215 Main Road Martindale,
Tel. +4532 88 2636, Fax. +4531 57 1949 2092 JOHANNESBURG, P.O.Box 7430 Johannesburg 2000,
Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +2711 470 5911, Fax. +2711 470 5494
Tel. +3589 61 5800, Fax. +3589 61 580/xxx South America: Al. Vicente Pinzon, 173 - 6th floor,
France: 4 Rue du Port-aux-Vins, BP 317, 92156 SURESNES Cedex, 04547-130 Sao Paulo, SAO PAULO - SP, Brazil,
Tel. +331 40 99 6161, Fax. +331 40 99 6427 Tel. +5511 821 2333, Fax. +5511 829 1849
Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Spain: Balmes 22, 08007 BARCELONA,
Tel. +4940 23 53 60, Fax. +4940 23 536 300 Tel. +343 301 6312, Fax. +343 301 4107
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +301 4894 339/239, Fax. +301 4814 240 Tel. +468 632 2000, Fax. +468 632 2745
Hungary: see Austria Switzerland: Allmendstraße 140, CH-8027 ZÜRICH,
India: Philips INDIA Ltd., Shivsagar Estate, A Block, Dr. Annie Besant Rd. Tel. +411 488 2686, Fax. +411 481 7730
Worli, MUMBAI 400018, Tel. +9122 4938 541, Fax. +9122 4938 722 Taiwan: Philips Taiwan Ltd., 2330F, 66,
Indonesia: see Singapore Chung Hsiao West Road, Sec. 1, P.O.Box 22978,
Ireland: Newstead, Clonskeagh, DUBLIN 14, TAIPEI 100, Tel. +8862 382 4443, Fax. +8862 382 4444
Tel. +3531 7640 000, Fax. +3531 7640 200 Thailand: Philips Electronics (Thailand) Ltd.,
Israel: RAPAC Electronics, 7 Kehilat Saloniki St., TEL AVIV 61180, 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +9723 645 0444, Fax. +9723 649 1007 Tel. +662 745 4090, Fax. +662 398 0793
Italy: Philips Semiconductors, Piazza IV Novembre 3, Turkey: Talapasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
20124 MILANO, Tel. +392 6752 2531, Fax. +392 6752 2557 Tel. +90212 279 2770, Fax. +90212 282 6707
Japan: Philips Bldg. 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Ukraine: Philips Ukraine, 4 Patrice Lumumba Str., Building B, Floor 7,
Tel. +813 3740 5130,Fax. +813 3740 5077 252042 KIEV, Tel. +38044 264 2776, Fax. +38044 268 0461
Korea: Philips House, 260-199, Itaewon-dong, Yonsan-ku, SEOUL, United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
Tel. +822 709 1412, Fax. +822 709 1415 MIDDLESEX UM3 5BX, Tel. +44181 730 5000, Fax. +44181 754 8421
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, Selangor, United States: 811 Argues Avenue, SUNNYVALE, CA94088-3409,
Tel. +60 3750 5214, Fax. +603 757 4880 Tel. +1800 234 7381
Mexico: 5900 Gateway East, Suite 200, EL PASO, Texas 79905, Uruguay: see South America
Tel. +9 5800 234 7381 Vietnam: see Singapore
Middle East: see Italy Yugoslavia: Philips, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +38111 625 344, Fax. +38111 635 777
Philips Semiconductors, Mikron-Weg 1, A-8101 Gratkorn, Austria Fax: +43 / 3124 / 299 - 270
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Internet: http://www.semiconductors.philips.com
Building BE-p, P.O.Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax: +3140 27 24825
© Philips Electronics N.V. 1996 SCB52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without any
notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other
industrial or intellectual property rights.
