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IRHM7064, JANSR2N7431 Pre-Irradiation
Note: Corresponding Spice and Saber models are available on International Rectifier Website.
For footnotes refer to the last page
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units Test Conditions
ISContinuous Source Current (Body Diode) — — 35*
ISM Pulse Source Current (Body Diode) À— — 140
VSD Diode Forward Voltage — — 1.5 V Tj = 25°C, IS = 35A, VGS = 0V Ã
trr Reverse Recovery Time — — 360 ns Tj = 25°C, IF = 35A, di/dt ≤ 100A/µs
QRR Reverse Recovery Charge — — 3.1 µC VDD ≤ 50V Ã
ton Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
A
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
RthJC Junction-to-Case — — 0.50
RthJA Junction-to-Ambient — — 48 °C/W Typical socket mount
RthCS Case-to-Sink — 0.21 —
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BVDSS Drain-to-Source Breakdown Voltage 60 — — V VGS = 0V, ID = 1.0mA
∆BVDSS/∆TJTemperature Coefficient of Breakdown — 0.056 — V/°C Reference to 25°C, ID = 1.0mA
Voltage
RDS(on) Static Drain-to-Source On-State — — 0.021 ΩVGS = 12V, ID = 35A
Resistance
VGS(th) Gate Threshold Voltage 2.0 — 4.0 V VDS = VGS, ID = 1.0mA
gfs Forward Transconductance 18 — — S VDS 15V, IDS = 35A Ã
IDSS Zero Gate Voltage Drain Current — — 25 VDS = 48V ,VGS = 0V
— — 250 VDS = 48V,
VGS = 0V, TJ = 125°C
IGSS Gate-to-Source Leakage Forward — — 100 VGS = 20V
IGSS Gate-to-Source Leakage Reverse — — -100 VGS = -20V
QgTotal Gate Charge — — 270 VGS =12V, ID = 35A
Qgs Gate-to-Source Charge — — 60 nC VDS = 30V
Qgd Gate-to-Drain (‘Miller’) Charge — — 110
td(on) Turn-On Delay Time — — 27 VDD = 30V, ID = 35A
trRise Time — — 120 VGS =12V, RG = 2.35Ω
td(off) Turn-Off Delay Time — — 120
tfFall Time — — 100
LS + LDTotal Inductance — 6.8 — nH
Ciss Input Capacitance — 4900 — VGS = 0V, VDS = 25V
Coss Output Capacitance — 2800 — pF f = 1.0MHz
Crss Reverse Transfer Capacitance — 860 —
nA
Ã
ns
µA
*Current is limited by package
Measured from Drain lead (6mm /0.25in
from package) to Source lead (6mm /0.25in.
from package) with Source wires internally
bonded from Source Pin to Drain Pad
≥