DSC1101/21 Low-Jitter Precision CMOS Oscillator Features General Description * Low RMS Phase Jitter: <1 ps (typ.) * High Stability: 10 ppm, 20 ppm, 25 ppm, 50 ppm * Wide Temperature Range: - Automotive: -55C to +125C - Ext. Industrial: -40C to +105C - Industrial: -40C to +85C - Commercial: -20C to +70C * High Supply Noise Rejection: -50 dBc * Wide Freq. Range: 2.3 MHz to 170 MHz * Small Industry Standard Footprints - 2.5 mm x 2.0 mm, 3.2 mm x 2.5 mm, 5.0 mm x 3.2 mm, and 7.0 mm x 5.0 mm * Excellent Shock and Vibration Immunity - Qualified to MIL-STD-883 * High Reliability - 20x Better MTF than Quartz Oscillators * Low Current Consumption * Supply Range of 2.25 to 3.6V * Standby and Output Enable Function * Lead-Free and RoHS Compliant The DSC1101 and DSC1121 series of high performance oscillators utilize a proven silicon MEMS technology to provide excellent jitter and stability over a wide range of supply voltages and temperatures. By eliminating the need for quartz or SAW technology, MEMS oscillators significantly enhance reliability and accelerate product development, while meeting stringent clock performance criteria for a variety of communications, storage, and networking applications. DSC1101 has a standby feature that allows it to completely power-down when EN pin is pulled low; whereas for DSC1121, only the outputs are disabled when EN is low. Both oscillators are available in industry standard packages, including the small 2.5 mm x 2.0 mm, and are "drop-in" replacements for standard 4-pin CMOS quartz crystal oscillators. Functional Block Diagram Applications * Storage Area Networks - SATA, SAS, Fibre Channel * Passive Optical Networks - EPON, 10G-EPON,V GPON, 10G-PON * Ethernet - 1G, 10GBASE-T/KR/LR/SR, and FCoE * HD/SD/SDI Video and Surveillance * PCI Express * Display Port 2017 Microchip Technology Inc. DS20005613B-page 1 DSC1101/21 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Input Voltage, VIN ..............................................................................................................................-0.3V to VDD + 0.3V Supply Voltage .......................................................................................................................................... -0.3V to +4.0V ESD Protection On All Pins ........................................................................................... 4000V HBM, 1500V CDM (max.) Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Note: 1000+ years of data retention on internal memory. TABLE 1-1: DC CHARACTERISTICS Electrical Characteristics Parameters Supply Voltage (Note 1) Supply Current Sym. Min. Typ. Max. Units VDD 2.25 -- 3.6 V -- -- 0.095 -- 20 22 -- 31 35 Output enabled, CL = 15 pF, F0 = 100 MHz -- -- 10 Ext Comm. & Ind. only IDD Frequency Stability (Including frequency variations due to initial tolerance, temp. and power supply voltage.) f Aging 20 Conditions -- DSC1101, EN pin low, output is disabled mA ppm DSC1121, EN pin low, output is disabled All temp ranges -- -- 25 All temp ranges -- -- 50 f -- -- 5 ppm Startup Time (Note 2) tSU -- -- 5 ms Input Logic Levels Input Logic High Input Logic Low VIH 0.75VDD -- -- VIL -- -- 0.1VDD V -- Output Disable Time (Note 3) tDS -- -- 5 ns -- Output Enable Time tEN -- -- 5 ms DSC1101 -- -- 20 ns DSC1121 Enable Pull-up Resistor (Note 4) -- -- 40 -- k Pull-up Resistor Exist VOH 0.9VDD -- -- VOL -- -- 0.1VDD All temp ranges 1 year @ 25C T = 25C CMOS Output Output Logic Levels Output Logic High Output Logic Low Note 1: 2: 3: 4: V I = 6 mA Pin 6 VDD should be filtered with 0.1 F capacitor. tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled. Output Waveform and Test Circuit figures define the parameters. Output is enabled if pad is floated or not connected. DS20005613B-page 2 2017 Microchip Technology Inc. DSC1101/21 TABLE 1-1: DC CHARACTERISTICS (CONTINUED) Electrical Characteristics Parameters Output Transition Time Rise Time Fall Time Frequency Sym. Min. Typ. Max. tR -- 1.1 2 tF -- 1.3 2 2.3 -- 170 f0 Units ns MHz 3.3 -- 170 Output Duty Cycle SYM 45 -- 55 % Period Jitter JPER -- 3 -- psRMS -- 0.3 -- -- 0.38 -- -- 1.7 2 Integrated Phase Noise Note 1: 2: 3: 4: JPH Conditions 20% to 80% CL = 15 pF CL = 15 pF, -20C to +70C and -40C to +85C CL = 15 pF, -40C to +105C and -55C to +125C -- FOUT = 125 MHz 200 kHz to 20 MHz @ 125 MHz psRMS 100 kHz to 20 MHz @ 125 MHz 12 kHz to 20 MHz @ 125 MHz Pin 6 VDD should be filtered with 0.1 F capacitor. tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled. Output Waveform and Test Circuit figures define the parameters. Output is enabled if pad is floated or not connected. 2017 Microchip Technology Inc. DS20005613B-page 3 DSC1101/21 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions TA -20 -- +70 C Ordering Option E TA -40 -- +85 C Ordering Option I TA -40 -- +105 C Ordering Option L TA -55 -- +125 C Ordering Option M TJ -- -- +150 C -- Storage Temperature Range TA -40 -- +150 C -- Soldering Temperature Range TS -- -- +260 C 40 sec. max Temperature Ranges Operating Temperature Range (T) Junction Operating Temperature Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125C rating. Sustained junction temperatures above +125C can impact the device reliability. DS20005613B-page 4 2017 Microchip Technology Inc. DSC1101/21 2.0 Note: NOMINAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: Phase Noise). Phase Jitter (Integrated FIGURE 2-2: Ratio. Power Supply Rejection 2017 Microchip Technology Inc. DS20005613B-page 5 DSC1101/21 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. Pin order and descriptions apply across all package types. TABLE 3-1: PIN FUNCTION TABLE Pin Number 7x5 w/ Pad Pin Number 7x5 w/o Pad Pin Number 5x3.2 Pin Number 3.2x2.5 Pin Number 2x2.5 1 1 1 1 1 EN Enable. 2 2 2 2 2 NC Do not connect. 3 3 3 3 3 GND Ground. 4 4 4 4 4 OUT Output. 5 5 5 5 5 NC Do not connect. 6 6 6 6 6 VDD Supply voltage. PAD -- -- -- -- PAD Tie to ground. TABLE 3-2: Pin Name Description OUTPUT ENABLE MODES EN Pin DSC1101 DSC1121 High Output Active Output Active NC Output Active Output Active Low Standby Output Disabled DS20005613B-page 6 2017 Microchip Technology Inc. DSC1101/21 4.0 OUTPUT WAVEFORM tR tF VOH OUTPUT VOL tEN 1/fo tDA VIH ENABLE FIGURE 4-1: VIL DSC1101/21 Output Waveform. 2017 Microchip Technology Inc. DS20005613B-page 7 DSC1101/21 5.0 TYPICAL TERMINATION SCHEME FIGURE 5-1: DS20005613B-page 8 Typical Termination Scheme for DSC1101/21. 2017 Microchip Technology Inc. DSC1101/21 6.0 BOARD LAYOUT (RECOMMENDED) Via to GND layer 1 6 Supply bypass capacitor 2 3 5 4 Via to GND layer FIGURE 6-1: DSC1101/21 Recommended Board Layout. 2017 Microchip Technology Inc. DS20005613B-page 9 DSC1101/21 7.0 SOLDER REFLOW PROFILE MSL 1 @ 260C refer to JSTD-020C Ramp-Up Rate (200C to Peak Temp) 3C/Sec. Max. Preheat Time 150C to 200C 60-180 Sec. Time Maintained Above 217C 60-150 Sec. Peak Temperature 255-260C Time within 5C of Actual Peak 20-40 Sec. Ramp-Down Rate 6C/Sec. Max. Time 25C to Peak Temperature 8 minute Max. DS20005613B-page 10 2017 Microchip Technology Inc. DSC1101/21 8.0 PACKAGING INFORMATION 8.1 Package Marking Information 6-Pin CDFN/VDFN* XXXXXXX DCPYYWW 0SSS Legend: XX...X Y YY WW SSS e3 * Example 0750000 DCP1723 0421 Product code, customer-specific information, or frequency in MHz without printed decimal point Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. , , Pin one index is identified by a dot, delta up, or delta down (triangle Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar () symbol may not be to scale. 2017 Microchip Technology Inc. DS20005613B-page 11 DSC1101/21 6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.05 C 1 2X 0.05 C 2 TOP VIEW 0.10 C C A A1 SEATING PLANE 6X 0.08 C SIDE VIEW 1 2 2X b2 L2 5X L1 N 4X b1 0.10 0.05 e C A B C BOTTOM VIEW Microchip Technology Drawing C04-1005A Sheet 1 of 2 DS20005613B-page 12 2017 Microchip Technology Inc. DSC1101/21 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Notes: Units Dimension Limits Number of Terminals N e Pitch Overall Height A Standoff A1 Overall Length D Overall Width E b1 Terminal Width Terminal Width b2 Terminal Length L1 Terminal Length L2 MILLIMETERS MAX NOM 6 0.825 BSC 0.80 0.90 0.85 0.05 0.02 0.00 2.50 BSC 2.00 BSC 0.60 0.70 0.65 0.20 0.25 0.30 0.60 0.70 0.80 0.665 0.865 0.765 MIN 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1005A Sheet 2 of 2 2017 Microchip Technology Inc. DS20005613B-page 13 DSC1101/21 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X1 X2 2 1 Y G2 C 6 G1 SILK SCREEN E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch X1 Contact Pad Width (X4) Contact Pad Width (X2) X2 Contact Pad Length (X6) Y Contact Pad Spacing C Space Between Contacts (X4) G1 Space Between Contacts (X3) G2 MIN MILLIMETERS NOM 0.825 BSC MAX 0.65 0.25 0.85 1.45 0.38 0.60 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-3005A DS20005613B-page 14 2017 Microchip Technology Inc. DSC1101/21 6-Lead VDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N (DATUM A) B (DATUM B) E NOTE 1 2X 0.05 C 1 2X 2 TOP VIEW 0.05 C 0.10 C C SEATING PLANE A1 A 6X 0.08 C SIDE VIEW 2X b2 1 2 NOTE 1 L N L1 4X b1 e BOTTOM VIEW 0.07 0.05 C A B C Microchip Technology Drawing C04-1007A Sheet 1 of 2 2017 Microchip Technology Inc. DS20005613B-page 15 DSC1101/21 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits N Number of Terminals e Pitch A Overall Height Standoff A1 Overall Length D E Overall Width b1 Terminal Width b2 Terminal Width L Terminal Length Terminal Pullback L1 MIN 0.80 0.00 0.85 0.45 0.65 MILLIMETERS NOM 6 1.05 BSC 0.85 0.02 3.20 BSC 2.50 BSC 0.90 0.50 0.70 0.10 REF MAX 0.90 0.05 0.95 0.55 0.75 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1007A Sheet 2 of 2 DS20005613B-page 16 2017 Microchip Technology Inc. DSC1101/21 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 G 6 C Y 1 2 X1 SILK SCREEN E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Contact Pad Spacing C Contact Pad Width (X4) X1 Contact Pad Width (X2) X2 Contact Pad Length (X6) Y Space Between Contacts (X4) G1 MIN MILLIMETERS NOM 1.05 BSC 1.60 MAX 1.00 0.60 0.85 0.25 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-3007A 2017 Microchip Technology Inc. DS20005613B-page 17 DSC1101/21 6-Lead CDFN 5.0 mm x 3.2 mm Package Outline and Recommended Land Pattern DS20005613B-page 18 2017 Microchip Technology Inc. DSC1101/21 6-Lead VDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern 6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV 6 C Y2 OV EV G Y1 1 2 X1 SILK SCREEN E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C Contact Pad Width (X6) X1 Contact Pad Length (X6) Y1 Contact Pad to Center Pad (X2) G Thermal Via Diameter (X6) V Thermal Via Pitch EV MIN MILLIMETERS NOM 2.54 BSC MAX 2.90 1.90 3.70 1.50 1.35 0.20 0.33 1.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-3010A 2017 Microchip Technology Inc. DS20005613B-page 19 DSC1101/21 6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.20 C 1 2X 0.20 C C SEATING PLANE 2 TOP VIEW A1 0.10 C A 6X 0.08 C SIDE VIEW 0.10 D2 1 C A B 2 0.10 NOTE 1 C A B E2 6X L (K) N 6X b 0.10 0.05 e C A B C BOTTOM VIEW Microchip Technology Drawing C04-1010A Sheet 1 of 2 DS20005613B-page 20 2017 Microchip Technology Inc. DSC1101/21 6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Notes: Units Dimension Limits N Number of Terminals e Pitch A Overall Height Standoff A1 Overall Length D Exposed Pad Length D2 Overall Width E E2 Exposed Pad Width b Terminal Width L Terminal Length K Terminal-to-Exposed-Pad MIN 0.80 0.00 2.70 1.70 1.35 1.00 MILLIMETERS NOM 6 2.54 0.85 0.02 7.00 BSC 2.80 5.00 BSC 1.80 1.40 1.10 0.20 REF MAX 0.90 0.05 2.90 1.90 1.45 1.20 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1010A Sheet 2 of 2 2017 Microchip Technology Inc. DS20005613B-page 21 DSC1101/21 6-Lead CDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern DS20005613B-page 22 2017 Microchip Technology Inc. DSC1101/21 NOTES: 2017 Microchip Technology Inc. DS20005613B-page 23 DSC1101/21 DS20005613B-page 24 2017 Microchip Technology Inc. DSC1101/1121 APPENDIX A: REVISION HISTORY Revision A (August 2017) * Initial creation of document DSC1101/21 to Microchip data sheet template DS20005613A. * Minor text changes throughout. Revision B (December 2017) * Military temperature range changed to Automotive in Features and Product Identification System. * Supply Current values updated in Table 1-1. * Test Circuit section removed. * Updated Figure 6-1, Recommended Board Layout. 2017 Microchip Technology Inc. DS20005613B-page 25 DSC1101/21 NOTES: DS20005613B-page 26 2017 Microchip Technology Inc. DSC1101/21 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device Device: X X X -XXX.XXXX X a) DSC1101AM1-010.0000T: Package Temperature Stability Frequency Packaging Range Option DSC1101: DSC1121: Low-Power Precision CMOS Oscillator with Standby, 6-LD 7.0X5.0 VDFN, Automotive Temperature Range, 50 ppm, Low-Power Precision CMOS Oscillator with Standby Low-Power Precision CMOS Oscillator Package: A B C D N = = = = = 6-Lead 7.0 mm x 5.0 mm VDFN 6-Lead 5.0 mm x 3.2 mm CDFN 6-Lead 3.2 mm x 2.5 mm VDFN 6-Lead 2.5 mm x 2.0 mm VDFN 6-Lead 7.0 mm x 5.0 mm CDFN (no center pad) Temperature Range: E I L M = = = = -20C to +70C (Extended Commercial) -40C to +85C (Industrial) -40C to +105C (Extended Industrial) -55C to +125C (Automotive) 1 2 3 5 = = = = 50 ppm 25 ppm 20 ppm 10 ppm Stability: Examples: 10 MHz Output quency, 1,000/Reel b) Fre- DSC1101BL2-030.0000: Low-Power Precision CMOS Oscillator with Standby, 6-LD 5.0X3.2 CDFN, Extended Industrial Temperature Range, 25 ppm, 30 MHz Output Frequency, 110/Tube c) DSC1101DE5-150.0000: Low-Power Precision CMOS Oscillator with Standby, 6-LD 2.5X2.0 VDFN, Extended Commercial Temperature Range, 10 ppm, 150 MHz Output Frequency, 110/Tube Frequency: Packing Option: xxx.xxxx = T = = 2.3 MHz to 170 MHz (user-defined) d) DSC1101AI2-075.0000T: Low-Power Precision CMOS Oscillator with Standby, 6-LD 7.0X5.0 VDFN, Industrial Temperature Range, 25 ppm, 110/Tube 1,000/Reel 75 MHz Output Frequency, 1,000/Reel Note 1: 2017 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005613B-page 27 DSC1101/21 NOTES: DS20005613B-page 28 2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2480-2 == ISO/TS 16949 == 2017 Microchip Technology Inc. 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