SANYO Electric Co., Ltd.
Electronic Device Company
'04-10
12
The contents of this catalog are current as of September 2004, but
product names and specifications are subject to change for improvement
or discontinuation without notice. When ordering products, please be sure
to request a delivery specifications form and read it carefully.
Do not use the OS-CON for life-threatening applications (space
equipment, aerial equipment, nuclear equipment, life-threatening medical
equipment, vehicle control equipment, etc.).
However, since there may be cases where conductive polymer aluminum
solid electrolytic capacitors (SVP, SVQP, SVPD, SEP and SEQP) are
adaptable with our special levels, be sure to consult with us, and
exchange delivery specifications with us before use.
The performance, characteristics, and features of the products described
in this catalog are based on the products working alone under prescribed
conditions. Data listed here is not intended as a guarantee of performance
when working as part of any other product or device. In order to detect
problems and situations that cannot be predicted beforehand by
evaluation of supplied data, please always perform necessary
performance evaluations with these devices as part of the product that
they will be used in.
When using the products listed in this catalog, please always be sure to
try to prevent any possible accidents or injury by designing products in a
careful and safe manner. If you have any questions concerning the use of
these products, please contact any of our sales representatives.
For any products listed in this catalog that may constitute restricted trade
goods under overseas exchange or service trade laws, permission to
deliver according to law may be required before importing.
Unauthorized duplication of this catalog in part or in whole is forbidden.
Please understand that we cannot be held responsible for any damages
to the industrial properties of any third party that arise from the use or
application of the products listed in this catalog, with the exception of
those items directly related to method of construction.
About this catalog
1
Introduction of
Aluminum solid capacitors with Conductive polymer
Aluminum solid capacitors with Organic semiconductive electrolyte
For information on integration of OS-CON models and discontinued series, please see page 86
P24〜25
P32〜33 P34〜35
Large capacitance and low ESR
Guaranteed at 125°C
High voltage resistant Standard radial lead type
Guaranteed at 105°C for 3,000h
P26〜27
Guaranteed at 125°C
P28〜29
SMD standard product
P20〜21
Low ESR and large ripple current
P18〜19
Guaranteed at 125°C
85°Cx 85% guaranteed and rated 35V max.
P40〜41
P36〜37
P48〜49
P36〜37 P38〜39
P44〜45 P46〜47
P42〜43
Standard product
5 mm height (max.)
Miniaturization
Low ESL and low ESR
Large capacitance and low ESR
Low profile Long life span
Large capacitance and miniaturization
P30〜31
Large capacitance and low ESR
P22〜23
Low profile
2
Aluminum solid capacitors with Conductive polymer
Aluminum solid capacitors with Organic semiconductive electrolyte
Contents
Item Description Page
3. Series system
diagram
2.
Measures to Protect the
  Environment
4. Specifications for
each series
5. Specifications for
the radial lead
type
6. Specifications for
the SMD type
Serise system diagram, Sketch of Case Size
Size list,ESRMatrix
Conductive polymer type, Specifications for each series(Environmental product)
SVPD series : Vertical SMD, Guaranteed at 125
°C, Rated 35V max.
SVPC series : Vertical SMD, Large capacitance and low ESR
SVPB series : Vertical SMD, Low profile
SVPA series : Vertical SMD, Low ESR
SVQP series : Vertical SMD, Guaranteed at 125°C
SVP series : Vertical SMD
SEPC series : Radial lead type, Large capacitance and Low ESR
SEQP series : Radial lead type,
Guaranteed at 125°C
        and high voltage resistant
SEP series :
Radial Lead type, Guaranteed at 105°C for 3,000h
Organic semiconductor type, Specifications for each series
SF series : 5mm height (max.)
SPA series : Low ESL and low ESR
SP series :
Large capacitance, Low ESR and Suitable for audio
SC series : Standard product
SA series : Large capacitance and miniaturization
SL series : Low profile
SH series : Long life span
SS series : Miniaturization
Explanation of part number
Specification of Lead process
Specification of taping product
Minimum packaging quantity
Explanation of part number
Taping Specifications
Minimum packaging quantity
Recommended Reflow conditions
12, 13
14 to 17
18, 19
20, 21
22, 23
24, 25
26, 27
28, 29
30, 31
32, 33
34, 35
36, 37
36, 37
38, 39
40, 41
42, 43
44, 45
46, 47
48, 49
50
50
51
51
52
52, 53
53
54
1. Operating
Precautions
Cautions for circuit design
Cautions for installation
Others 4 to 10
11
3
Contents
Structure and Manufacturing method of OS-CON
Electric characteristics of OS-CON
Item Description Page
7. Construction and
Characteristics
8. Reliability
9. Features
0.
Precautions
when using
OS-CON in
circuits
-.
Application
=. Information and wish
.
Questionnaire
Reliability test
Presumption of life span
Summary of OS-CON features
Explanation of the rush current suppression methods.
Examples of rush current suppression methods.
Sudden discharge current suppression.
Precautions when connecting an OS-CON and an
aluminum electrolytic capacitor in parallel.
Ripple removal
capability of OS-CON
Evaluation of ripple current removal capability in
comparison with other capacitors when the ambient
temperature of a switching power supply is set at
25°C, -20°C and 70°C.
High-speed back-up
capability When current is consumed with large variation of
load at high-speed, capability of back-up capacitor is
compared with other electrolytic capacitors.
Necessity of OS-CON in low-pass filter circuit, and
comparison with aluminum electrolytic capacitors.
Mechanism and treatment method of abnormal
voltage oscillation of switching power supply.
Influence of output
ripples on images
Application of Switching
power supply to
smoothing capacitor
Application in low-
pass filter circuit
Comparative demonstration using OS-CON and
aluminum electrolytic capacitor showing noise from
switching power supply of CCD camera.
Sheet contained required information for the selection
of a Capacitor with switching power supply.
The data listed here is only representative of OS-CON, and does NOT show any guaranteed value.
Change in product specifications, dimensions, etc. may occur without prior notice. Be sure that when placing
order, please ask for specifications of each series in delivery, and read them well before use.
Integration of models and discontinued production
information.
55, 56
57 to 60
61 to 63
63, 64
65
66
67
68
69
70 to 75
76, 77
78, 79
80 to 84
85
86
87
OS-CON is uniquely structured solid aluminum electrolytic capacitor.
Please note the following points in order to take full advantages of the OS-CONs performance and to
ensure the most stable quality possible.
Crucial precautions [Important]
1. Polarity
OS-CON is a solid aluminum electrolytic capacitor with positive and negative electrodes.
Do not reverse the polarity when using. If it is used with the polarities reversed, increased leakage current or a
decreased life span may result.
2. Prohibited circuits
The OS-CON leakage current may become greater even if the soldering conditions adhere to the specification
requirements. The high temperature no-load test, high temperature and high humidity no-load test, rapidly
changing temperature test, etc may cause leakage current to become larger. Therefore, do not use the OS-CON in
the following circuits because trouble or failure may occur.
(a) High impedance voltage retention circuits
(b) Coupling circuits
(c) Time constant circuits
In addition to the leakage current fluctuation, capacitance may also fluctuate depending on operational
temperature and humidity. The fluctuation of the capacitance may cause problem if it is used as a time constant
capacitor, which is extremely sensitive to the fluctuation of the capacitance. Do not use it as a time constant
capacitor.
Do not use the OS-CON in circuits except those above if changes in the leakage current affects circuit operations.
If you plan to use 2 or more OS-CONs in a series connection, please contact us before use.
3. Compliance with rated performance
OS-CON must be used under rated performance prescribed in the specification. Operational and installation
condition must be carefully examined.
(a) Over-voltage exceeding the rated voltage should not be applied even for an instance since it may cause a short
circuit.
(b) Operating temperature (ambient of OS-CON) must be within the category temperature range of
specification.
(c) Do not apply current that exceeds the rated ripple current. When excessive ripple current is applied, the
OS-CON may result in shorter life due to the internal heat increase.
4. Applied voltage
(a) OS-CON can be applied with 100% of rated voltage except for 25V product.
In case of 25 V product, if the operating temperature is above 85 deg.C, derating voltage shown in the following
figure must be applied. If the temperature is below 85 deg.C, derating is not necessary. In any event, over
voltage exceeding the rated voltage must not be applied even for a moment.
(b) Sum of the DC voltage value and the ripple voltage peak values must not exceed the rated voltage.
(c) When DC voltage is low, negative ripple voltage peak value must not become a reverse voltage that exceeds
10 % of the rated voltage.
(d) Use the OS-CON within 20 % of the rated voltage for applications which may cause the reverse voltage during
the transient phenomena when the power is turned off or the source is switched.
4
Circuit designing
Instractionsfor
use
1. Operating Precautions
* Concerning SVPD series 25V
products, there are no problems
using them at 100% of the rated
voltage.
5
Instractionsfor
use
1. Operating Precautions
5. Sudden charge and discharge
Sudden charge and discharge may result in short circuits and the large Leakage current. Therefore, protection
circuits are recommended to design in when the following conditions are available.
(a) The rush current is over 10 A.
(b) The rush current is over 10 times of allowable ripple current of OS-CON.
A protection resistor (1 k) must be inserted to the circuit during the charge and discharge when measuring
the leakage current.
6. Failure and life-span
The OS-CON failure rate in use is based on the failure rate level in the specification requirements (Upper category
temperature and category voltage adhere to JIS C 5003. The confidence level is 60% and the failure rate is 0.5
%/1000h.) and this ratio is low, however, failures may occur.
It is possible to cause a failure circuit even if OS-CONs have a lowest failure rate. As the above reason, please
insert a protection circuit to prevent unlikely event by accident. Meanwhile, please design your circuit using
OS-CON which cause no damage to social or person directly, or use after checking that it causes no problem even
if it fails.
The failure modes mainly have two types (a) and (b) as follows.
(a) Contingency failure
The contingency failure mainly has short circuit. The phenomenon of after short is on following.
(1) Phenomenon of after short circuit mode
(a) Resin sealing type (SC, SA, SL, SH, SS, SP, SPA, and SF series)
In the event a short circuit causes the current to become relatively small (less than approximately 3A for
φ10 and less than approximately 1A for φ6.3), the OS-CON itself will generate a little heat, but its
appearance will not be affected even when electricity is supplied continuously.
  However, if the short circuit current value exceeds the mentioned values above, the temperature inside
the OS-CON will increase. When the temperature exceeds approximately 220°C, the impregnated
organic semiconductor melts and liquefies, the internal pressure is raised, and the liquefied organic
semiconductor and odorous gas are released from the space between the sealant and the aluminum
case and lead terminals. In this case, keep your face and hands away from the area.
(b) Rubber sealing type (SEP, SEQP, SEPC, SVP, SVQP, SVPA, SVPB, SVPC, and SVPD series)
In the event a short circuit causes the current to become relatively small (less than approximately 1A for
φ10, less than approximately 0.5A for φ8 and less than approximately 0.2A for φ6.3), the OS-CON itself
will generate a little heat, but its appearance will not be affected even when electricity is supplied
continuously.
However, if the short circuit current value exceeds the mentioned values above, the temperature inside
the OS-CON will increase, the internal pressure is raised, rubber sealing is turned over, and odorous gas
is released. In this case, keep your face and hands away from the area.
(2) If a short circuit occurs and odorous gas is released, either turn off the main power of the equipment or
unplug the power cord from the outlet.
(3) If a short circuit occurs, it may take from a few seconds to a few minutes before the organic semiconductor
liquefies and an odorous gas produces, depending on the conditions. It is recommended to set up a power
protection circuit to function during this time.
(4) If the gas comes in contact with eyes, rinse immediately. If the gas is inhaled, gargle immediately.
(5) Do not lick the OS-CONs electrolyte. If the electrolyte comes in contact with skin, wash it off with soap
immediately.
(6) The electrolyte, electrolytic paper, resin, sleeve, sealing rubber, and plastic spacer used in the OS-CON are
all combustible. When the current is extraordinarily large after a short circuit, in the worst case, the shorted-
out section in the lead terminal or inside the capacitor may ignite the resin and/or rubber. Pay attention to
the capacitor mounting method, mounting position, pattern design, etc.
(b) Performance characteristic and failure (life-span)
The OS-CONs characteristics can possibly change (Capacitance reduction and ESR increase) within the
specified range in specifications when it is used in the condition of Rated voltage, Electric and mechanical
performance.
When life span exceeded the specified guarantee time of Endurance and Damp heat, electric characteristic
might change and cause electrolyte insulation. This is called Open circuit mode.
(1) Please confirm the following item when select and design OS-CON.
1. Leakage current
Heat pressure from soldering and mechanical stress from transportation may cause the leakage current to become
large. In such a case, leakage current will gradually decrease by applying voltage less than or equal to the rated
voltage at a temperature within the upper category temperature. In close conditions to the upper category
temperature, the nearer the applied voltage is to the rated voltage, the faster the leakage current recovery speed is.
(Refer to below.)
2. Capacitor insulation
(a) Insulation in the marking sleeve and the laminate resin is not guaranteed. Be aware that the space between the
case and the negative electrode terminal is not insulated and has some resistance.
(b) Be sure to completely separate the case, negative lead terminal, positive lead terminal and PC board patterns
with each other.
3. Operating environmental restrictions
Do not use the OS-CON in the following environments.
(a) Places where water, salt water or oil can directly fall on it, and places where condensation may form.
(b) Places filled with noxious gas (hydrogen sulfide, sulfurous acid, nitrous acid, chlorine, ammonia, etc.).
(c) Places susceptible to ozone, ultraviolet rays and radiation.
6
Instractionsfor
use
1. Operating Precautions
Capacitance tolerance of rated capacitance.
Change rate in Capacitance to initial value after mounting.
Note: This item also applied to SMD type-reflow mounting of SANYO Recommended reflow
condition. Heat stress to OS-CON will be influenced by the different of reflow equipment,
board material, size, and numbers of mounting. Please check your reflow condition whether
it is within the above SANYO Recommendable Reflow Condition or not and confirm
OS-CON’s electric characteristic change before and after reflow.
The specification after mounting.
Leakage current less than or equal to the value of specification after voltage treatment.
Leakage current may increase and exceed the specification value after mounting. In such a
case, Leakage current will decrease and return back to specification after applying voltage.
(1) Change rate in Capacitance before and after Endurance test
(2) Change rate in Capacitance before and after Damp heat test
(1) The specification after Endurance test.
(2) The specification after Damp heat test.
(1) Leakage current is less than or equal to specification after Endurance test.
(2) Leakage current may increase and exceed the specification value after Damp heat test.
In such case, Leakage current will decrease and return back to specification after
applying voltage.
It is necessary to apply a frequency coefficient according to an usable frequency which is
beside 100kHz to 500kHz.
Capacitance
Capacitance
ESR
Leakage
current
Capacitance
ESR
Leakage
current
Ripple
current
Delivery
Mounting
SMD type:
Reflow soldering
Radial lead type
:
Flow soldering
In use
Others
Electric
performance Confirmation Item
Cautions
100
10
1
0.1
(Hrs.)
Leakage current (µA)
OS-CON leakage current restoration characteristics
10µF/16V (16V DC applied) OS-CON leakage current restoration characteristics
33µF/10V (Ambient temperature:65°C)
     (Measured voltage:10V)
1 10 100
1000
1000
100
1000
10
1
0.1
(Hrs.)
Leakage current (µA)
1 10 100 1000
5V applied
8V applied
10V applied
*A sample that had stress
intentionally applied to
make the leakage current
larger was used to make
leakage current recovery
easy to understand.
4. PCB (PC board) design
(a) Avoid locating heat-generating components around the OS-CON and on the underside of the PC board
(underneath the OS-CON).
(b) Follow the recommendations given in the specifications for land patterns for SMD type PC board when designing
circuits.
(c) The pitch and diameter of PCB holes to which radial lead type of OS-CON is mounted should be designed to
conform to the dimensional tolerance stipulated in the specifications.
5. Parallel connection
A large amount of ripple current may be applied to the OS-CON when it is used in parallel with another capacitor.
Carefully select the type of capacitor.
6. Others
Design circuits after checking the following items.
(a) Electric characteristics are affected by temperature and frequency fluctuations. Design circuits after checking the
following items.
(b) When mounting an OS-CON on a double-sided PC board, extra PC board holes and the through holes for
connecting the front and back of the PCB must not exist underneath the OS-CON.
1. Considerations when soldering
The soldering conditions are to be within the range prescribed in specifications. If the specifications are not
followed, there is a possibility of the cosmetic defection, the intensive increase of leakage current, and the
capacitance reduction.
2. Things to be noted before mounting
(a) Do not reuse OS-CONs that have been assembled in a set and energized. Excluding OS-CONs that have been
removed for measuring electrical characteristics during a periodic inspection, OS-CONs cannot be reused.
(b) Leakage current may increase when OS-CONs are stored for long periods of time. In this case, we recommend
that you apply the rated voltage for 1 hour at 60°C – 70°C with a resistor load of 1 k.
3. Mounting-1
(a) Mount after checking the capacitance and the rated voltage.
(b) Mount after checking the polarity.
(c) Do not drop the OS-CON on the floor. Do not use OS-CONs that have been dropped.
(d) Do not deform the OS-CON.
4. Mounting-2
(a) Mount after checking that SMD types of the OS-CONs terminal pitch and the PCB land pattern.
(b) Mount after checking that radial lead types of the OS-CONs terminal pitch and diameter of PCB holes. When an
automatic inserter is used to clinch the OS-CONs lead terminals, make sure it is not set too strong.
(c) Be careful to the shock force that can be produced by absorbers, product checkers, and centers on automatic
inserters and installers.
(d) Do not apply excessive external force to the lead terminal and the OS-CON itself.
Mounting precautions
7
Instractionsfor
use
1. Operating Precautions
5. Soldering with a soldering iron
(a) Set the soldering conditions (temperature, time) so that they fall within the stipulated range in the specifications.
(b) When the lead terminal for radial lead type must be processed because the lead pitch and the PCB holes in
spacing do not match, process it before soldering so that no stress is applied to the OS-CON itself.
(c) Do not subject the OS-CON itself to excessive stress when soldering.
(d) When a soldering iron is used to repair an OS-CON that has already been soldered once and needs to be
removed, remove it after the solder has been completely melted so that no stress is applied to the OS-CONs
lead terminal.
(e) Do not let the tip of the soldering iron touch the OS-CON itself.
(f) The leakage current value after soldering may increase a little (from a few µA to several hundred µA) depending
on the soldering conditions (preheating and solder temperature and time, PCB material and thickness, etc.). The
leakage current can be reduced through self-repair by applying voltage.
6. Flow soldering
(a) Do not use flow soldering for SMD type.
(b) Do not solder the OS-CON by submerging it in melted solder. Use the PCB to protect the OS-CON and only
solder the opposite side that the OS-CON is mounted on.
(c) Set the soldering conditions (soldering temperature, terminal immersion time) so that they fall within the
stipulated range in the specifications. The leakage current value after soldering may increase (from a few µA to
a few mA) depending on the soldering conditions (preheating and solder temperature and time, PCB material
and thickness, etc.). However, the leakage current can be reduced by applying voltage to set into operating
condition.
In regards to flow soldering, be sure to solder within the following conditions.
*1 When soldering 2 times, immersion time should be 10 + 1 sec. or less.
(d) Take care that flux does not adhere to anywhere expect the lead terminal.
(e) When soldering, take care that other components do not fall over and touch the OS-CON.
(f) Flow soldering under extremely abnormal conditions may reduce the capacitance of products after soldering.
7. Reflow soldering
(a) Reflow soldering is unapplicable to Radial lead type.
(b) Set the soldering conditions (soldering temperature, terminal submersion time) so that they fall within the
stipulated range in the specifications. The leakage current value after soldering may increase a little (from a few
µA to several mA) depending on the soldering conditions (preheating and solder temperature and time, PCB
material and thickness, etc.). The leakage current can be reduced through self-repair by applying voltage.
(c) Please contact SANYO for setting VPS soldering conditions
(d) In the case of reflow soldering, capacitive static electricity may decrease after soldering even when the soldering
conditions are within the required values.
8. Handling after soldering
(a) Do not tilt, bend or twist the OS-CON after it has been soldered on the PCB.
(b) Do not move the PCB with catching OS-CON itself by hand after soldering.
(c) Do not dump the OS-CON with objects after it has been soldered to the PCB. When stacking PCBs, make sure
that the OS-CON does not touch other PCBs or components.
(d) Do not subject the OS-CON to excessive stress after it has been soldered to PCB.
8
Instractionsfor
use
1. Operating Precautions
Temperature
Preheating
Soldering conditions 260 + 5°C or less 10 + 1 sec. or less 2 times or less *1
120 sec. or less 1 time
120°C or less (ambient temperature) Duration Flow number
9. Washing the PCB
Check the following items before washing the PCB with these detergents: high quality alcohol-based cleaning fluid
such as Pine-αST-100S, Clean thru 750H, 750L, 710M, 750K, or Techno Care FRW 14 through 17; or detergents
including substitute freon as AK-225AES and IPA.
(a) Use immersion or ultrasonic waves to clean for a total of less than five minutes. (SVP,SVQP,SVPA,SVPB,
SVPC,SVPD,SEP,SEQP and SEPC series are less than two minutes.)
(b) The temperature of the cleaning fluid should be less than 60 °C.
(c) Watch the contamination of the detergent (conductivity, pH, specific gravity, water content, etc.).
(d) After cleaning, do not store the OS-CON in a location subject to gases from the cleaning fluid or in an airtight
container. Dry the PCB and OS-CON with hot air (less than the maximum operating temperature). Please do not
heat (heat run, dry, etc.) soon after cleaning.
(e) Please contact SANYO for details about detergents and cleaning methods, and about detergents other than
those listed above.
10. Fixatives and coatings
(a) Select the appropriate covering and sealant materials for OS-CONs. In particular, make sure the fixative,
coating and thinner do not contain acetone.
(b) Before applying a fixative or coating, completely remove any flux residue and foreign matter from the area
where the board and OS-CON will be jointed together.
(c) Allow any detergent to dry before applying the fixative or coating.
(d) Please contact SANYO for fixative and coating heat curing conditions.
11. Precautions with completed board
(a) Do not touch the lead terminals of OS-CON directly.
(b) Do not use electric conductors to cause short circuits between the OS-CONs lead terminals. Do not subject the
OS-CON to conductive solutions such as acids and alkaline water solutions.
(c) Check the installation environment of the board the OS-CON is installed in.
(d) Age the board at conditions that fall below the capacitors ratings.
(e) It is recommended that the board be used at room temperature and in ordinary humidity.
1. Storage conditions
(a) Do not store the OS-CON at high temperatures and high humidity. Store it in a location that is not subject to
direct sunlight and that has temperatures less than 5°C to 35°C and a relative humidity less than 75 %
generally.
(b) To keep good solderability, store the OS-CONs in its plastic bag under shipping condition. SMD types (SVP,
SVQP, SVPA, SVPB, SVPC and SVPD series) are sealed up in specifically designed aluminum laminate bags
to prevent deterioration in characteristic and solderability before and after reflows resulting from moisture
absorption.
(c) To keep good solderability, store radial lead types packed in bags for not more than one year (after delivery),
and radial lead types with taping and SMD types for not more than six months (after delivery) before
opening.(Refer to the table on the next page.)
(d) Open the bags just before mounting, and use up all products once opened. In case of leftovers, put radial lead
types packed in bags, SMD types and unpackaged ones back into the storage bags (specifically designed
aluminum laminate bags for SMD types), and seal up the opening with tape etc. Put radial lead types with
taping in plastic bags as they are put into storage boxes and seal up the opening with tape etc. In case of
storage after opening, please follow the storage term as stated in the table below.
(e) Do not store the OS-CON in damp conditions such as with water, salt spray, or oil spray, and high humidity.
(f) Do not store the OS-CON in places filled with noxious gas (hydrogen sulfide, sulfurous acid, nitrous acid,
chlorine, ammonia, etc.).
Storage and Disposal
9
1. Operating Precautions
Instractionsfor
use
(g) Do not store the OS-CON in places susceptible to ozone, ultraviolet rays and radiation.
 The moisture absorption level of the SMD type is shown below.
2. Disposal
OS-CON comprises solid organic compounds, various metals, resin, rubber, etc. Treat it as industrial waste when
disposing of it. In case of disposing a large amount of OS-CON, SANYO can dispose on behalf.
Before unseal After unseal
Within 6 months after delivery
(Unopened condition)
Within 1 year after delivery
(Unopened condition)
Within 6 months after delivery
(Unopened condition)
SMD type
Radial lead type
bag packing product
Radial lead type
taping product
Within 30 days from opening
(
Packaged condition with carrier tape
)
Within 7 days from opening
(1 week)
Within 7 days from opening
(1 week)
Note:
In case of some problems concerning industrial possessive rights of third party by using this product, we don’t
take responsibility except for what to be directly conceded with structure processes OS-CON. Please design
with safety measures taking into consideration any social damage, such as personal or fire accident when
using this product.
10
Instractionsfor
use
1. Operating Precautions
Floor Life Storage Condition
LEVEL Time
4Week
Condition
30/60%RH Packed with carrier tape
(Required standard : IPC/JEDEC J-STD-020B)
2a
We are working on complete removal of environmental hazardous substances from the OS-CON, in order to
conform to EU RoHS Directive (refer to below) coming into effect from July 2006 and to green procurement
introduced in many companies.
RoHS Directive
Restriction of the use of certain hazardous substances in electrical and electronic equipment
• EU environmental regulation
• RoHS aims to improve the regulations for hazardous substances in electrical and electronic equipment, and to
minimize the hazardous effects on environment and to people’s health from the production process up to and
including the disposal process.
• RoHS prohibits the use of 6 substances including cadmium, lead, hexavalent chromium, mercury, polybrominated
biphenyls (PBBs), and polybrominated diphenyl ethers (PBDEs).
OS-CON Measures for the RoHS Directive
*1 Contact us about the detailed status because a few specific special products do not meet the RoHS Directive
yet.
Also, contact us concerning the status of sleeve material change.
11
2. Measures to Protect the Environment
Measuresto
Protectthe
Environment
TM
Measures status *1
Conductive polymer
OS-CON
Organic semiconductor
OS-CON
Already in conformation
Sleeve material is being changed from PVC to PET
(Complete removal of lead and phtalic esters)
12
Seriessystem
diagram
3. SERIES SYSTEM DIAGRAM
SMD
Radial
Radial
SVQP Series
P26〜27
Guaranteed at 125
SVP Series
P28〜29
standard
SVPA Series
P24〜25
Low ESR and large ripple current
SVPC Series
P20〜21
Large capacitance and low ESR
Environmental productLead-free reflow product
Environmental productLead-free flow product
Aluminum solid capacitors with Conductive polymer
Aluminum solid capacitors with Organic semiconductive electrolyte
High
Temp.
Large
Cap.
Low
ESR
SS Series
P48〜49
Miniaturization
SL Series
P44〜45
Low profile
SP Series
P38〜39
Large capacitance
and low ESR
SC Series
P40〜41
Standard
SH Series
P46〜47
Long life span
SA Series
P42〜43
Large capacitance
and miniaturization
Long
life.
Long
life.
Low
profile
Low
ESR
Low
ESR
SPA Series
P36〜37
Low ESL and low ESR
Low
ESL
Low
profile
SF Series
P36〜37
5mm height (max.)
Low
profile
Large
Cap.
SEQP Series
P32〜33
Guaranteed at 125
High voltage resistant
SEP Series
P34〜35
Guaranteed for 3,000h
Aluminum solid capacitors with Conductive polymer
High
Temp. SEPC Series
P30〜31
Large capacitance and low ESR
SVPD Series
P18〜19
High voltage resistant and guaranteed at 125°C
SVPB Series
P22〜23
Low profile
Low
profile
High
Voltage
13
Seriessystem
diagram
Profile of case size are all expressed in maximum values.
6.0
φ4.0
6.0
φ5.0
6.0
φ6.3
6.0
φ8.0
6.0
φ10.0
A' B' C' E'
5.0
φ8.0
E1F'
10.0
φ8.0
10.0
φ10.0
9E 9F
7.8
φ4.0
7.8
φ5.0
7.8
φ6.3
10.8
φ6.3
11.5
φ8.0
11.5
φ10.0
21.0
φ10.0
26.0
φ16.0
23.0
φ12.5
AB C D E F
F0HG
• Sketch of Case Size (unit : mm)
SMD type with conductive polymer electrolyte
Radial lead type with conductive polymer electrolyte
Radial lead type with Organic semiconductive electrolyte
(Size code)
(Size code)
(Size code)
(Size code)
3. SERIES SYSTEM DIAGRAM
C6 E7 F8 E12 E13
6.0
φ6.3
7.0
φ8.0
8.0
φ10.0
12.0
φ8.0
13.0
φ8.0
F13
13.0
φ10.0
φ4.0
5.5
4.3
4.3
φ5.0
6.0
5.3
5.3
φ8.0
7.0
8.3
8.3
φ8.0
12.0
8.3
8.3
φ10.0
8.0
10.3
10.3
φ10.0
12.7
10.3
10.3
φ6.3
6.0
6.6
6.6
φ6.3
5.5
6.6
6.6
φ6.3
5.0
6.6
6.6
A5 B6 C6 E7 F8C5 C55 E12 F12
E9
9.0
φ8.0
14
●…Conductive polymer type●…Organic semiconductor type
Seriessystem
diagram
3. SERIES SYSTEM DIAGRAM
Size List
V
1
1.5
2.2
3.3
4.7
6.8
8.2
10
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2700
2200
SP(F)
SP(F0)
SVPA(B6)
SVPB(C5)
SVP(C6)
SVPA(C6),
SVPC(B6)
SVPA(E7)
SVPC(C6)
SVPC(E7),
SVP(E12),
SEP(E12)
SEPC(E9)
SEPC(E9,E13),
SVPA(F8),SVPC(E12)
SP(F)
SVPC(E12),SVP(F12),
SEP(F13)
SEPC(F13),SVPC(F12)
μF 2 2.5
SVP(A5)
SVP(B6)
SVPA(B6),SVP(B6),
SS(C')
SVPB(C5),
SEP(C6),
SP(C')
SVPA(C6),SVPC(B6),
SEQP(C6),SVP(C6,E7),
SVQP(C6),SEP(C6),
SP(C),SL(E'),SS(D)
SVQP(E7),SEP(E7),
SF(E1),SP(E'),SL(F')
SVPA(E7),SP(D)
SVPC(C6),SEQP(E7),
SVP(E7),SEP(E7),SP(F')
SEP(F8),SS(F)
SEPC(E9,E12,E13),
SVPC(E7),SEQP(E12),
SVP(E12),SEP(E12),
SPA(9E),SP(E)
SEPC(E13),SVPA(F8),
SVPC(E7),SEQP(F8),
SVP(F8),SEP(F8)
SEPC(F13),SPA(9F),SP(F)
SP(F)
SVPC(E12),SEQP(F13),
SVP(F12),SEP(F13)
SP(F0)
SP(G)
4
SC(A),SL(A'),SH(A)
SC(B),SL(B'),SH(B),
SS(A')
SVP(A5)
SC(C),SS(B')
SVPA(B6),SVP(B6),
SA(C),SH(C)
SP(C')
SVPB(C5),SEQP(C6)
SVP(C6),SVQP(C6),SEP(C6)
SVPC(B6),
SVP(C6),
SVQP(C6),SL(E')
SVPA(C6),SVP(C6),SP(C)
SEQP(E7),SVQP(E7),
SEP(E7),SF(E1),SP(E'),
SA(E),SL(F'),SH(E)
SVPA(E7),
SVPC(C6),
SVP(E7,F8),
SVQP(E7),
SP(F',D),SS(E)
SEQP(F8),SVP(F8),
SEP(F8),SA(F),SH(F)
SVPC(E7),SP(E)
SVPA(F8),SEQP(E12),
SVP(F8,E12),
SEPC(E9,E13),SEP(E12)
SEPC(F13),SP(F)
SEPC(F13)
SVPC(E12),SEQP(F13),
SVP(F12),SEP(F13)
SA(H)
6.3
SVP(A5),
SC(A),SL(A'),SH(A)
SVP(A5)
SVP(A5),SC(B),
SL(B'),SH(B),SS(A')
SVP(A5)
SC(C),SL(C'),SS(B')
SVP(B6),SL(C')
SVP(C6),
SC(D),SL(C')
SVPD(C6),SEQP(C6),SVP(C6),
SVPB(C5),SVQP(C6),SEP(C6),
SP(C')
SVPA(C6),SVPC(B6)
SA(D),SL(E'),SH(D)
SP(C)
SP(E'),SL(F'),SS(D)
SEQP(F7),SVP(E7),SVPC(C6)
SVQP(E7),SEP(E7)
SVPA(E7),
SVP(E7,F8),
SVQP(E7),SP(D),
SS(E)
SP(F')
SA(F),SH(F)
SEQP(F8),SVP(F8),SVPC(E7)
SEP(F8),SP(E)
SVPA(F8),SEQP(E12),
SVP(F8,E12),
SEP(E12),SS(F)
SP(F)
SEQP(F13),
SVP(F12),SEP(F13)
10
15
3. SERIES SYSTEM DIAGRAM
Size List
●…Conductive polymer type●…Organic semiconductor type
Seriessystem
diagram
V
1
1.5
2.2
3.3
4.7
6.8
8.2
10
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
μF
SC(A),SL(A'),SH(A)
SVP(A5),
SC(A),SL(A'),SH(A)
SC(B),SL(B'),SH(B),
SS(A')
SC(B),SL(B'),SH(B),
SS(A')
SL(C'),SS(B')
SVP(B6),
SC(C),SL(C'),SS(B')
SVP(B6),SC(D)
SVPB(C5),SP(C'),SC(D),
SA(C),SH(C),SS(C')
SVPA(C6),SEQP(C6),SVP(C6),
SVQP(C6),SEP(C6),SVPC(B6)
SP(C),SA(D),SL(E'),
SH(D)
SVP(E7)
SVPC(C6),SP(E'),SL(F'),
SS(D)
SVPC(E7)
SVPD(E7),SVPA(E7),SEQP(E7),
SVP(E7),SVQP(E7),SEP(E7)
SVP(F8),
SP(F',D),SA(E),SH(E)
SEQP(F8),SVP(F8),SEP(F8),
SA(F),SH(F)
SVPA(F8),
SEQP(E12),
SVP(F8,E12),
SEP(E12),SP(E)
SEPC(E12),SP(F)
SEQP(F13),SVP(F12),
SEP(F13)
SEPC(E13),SA(G)
SA(H)
16
SS(A')
SS(A')
SS(B')
SS(B')
SVP(B6),SS(C')
SVPB(C5),SA(C),
SH(C),SS(C')
SVPB(C55),SEQP(C6),
SVP(C6),SVQP(C6),
SEP(C6),SP(C'),SA(C),
SH(C),SS(C')
SVP(C6)
SVP(E7),SEP(E7),
SP(C),SA(D),SH(D)
SEQP(E7),SVP(E7),
SVQP(E7),SEP(E7),
SP(E'),SA(E),SH(E),SS(D)
SVP(F8),SEP(F8)
SEQP(F8),SVP(F8),
SEP(F8),SP(F',D),
SA(E),SH(E)
SVP(E12),
SEQP(E12),
SEP(F8,E12),
SA(F),SH(F),SS(E)
SP(E)
SEQP(F13),SVP(F12),
SEP(F13),SS(F)
SP(F)
20
SC(A),SL(A'),SH(A)
SC(A),SL(A'),SH(A)
SC(B),SL(B'),SH(B)
SC(B),SL(B'),SH(B)
SC(C),SL(C'),SH(C)
SVP(C6),SEP(C6),
SP(C'),SC(C),
SL(C'),SH(C)
SVPD(C6),SVP(E7),
SEP(E7),SP(C),
SC(C),SH(C)
SC(D),SL(E'),SH(D)
SP(D)
SVPD(E7),
SVP(F8),SEP(F8),
SC(E),SL(F')
SVP(E12),SEP(E12),
SP(E),SC(F)
SVPD(F8)
SVPD(E12),SC(F)
SVP(F12),SEP(F13),
SP(F)
SVPD(F12)
25
SC(A)
SC(B)
SC(B)
SC(C)
SC(D)
SC(D)
SC(E)
SC(F)
30
SEQP(E12)
SEQP(F8)
SEQP(E7)
SVPD(E7)
SVPD(F8)
SVPD(E12)
32 35
16
●…Conductive polymer type●…Organic semiconductor type
Seriessystem
diagram
3. SERIES SYSTEM DIAGRAM
ESR Matrix
8
7
V
mΩ
10
11
12
13
14
15
16
17
18
19
20
22
24
25
27
28
29
30
32
34
35
36
40
45
48
50
55
60
65
70
75
80
90
100
SEPC(E9),SP(F0)
9
SVPC(E12),SEPC(F13)
SVPC(E12)
SP(F)
SVP(F12),
SEP(F13),
SP(F)
SVP(E12),
SEP(E12)
SVPA(F8)
SVP(C6)
SVPC(B6)
SVPA(C6,E7),
SVPC(E7)
SVPC(C6)
SVPA(B6),
SVPC(B6)
SVPB(C5)
110
120
150
180
200
220
240
250
260
280
300
350
400
450
23
21
2V/2.5V
SP(F0)
SP(G)
SPA(9F)
SEPC(E9,E13) SEPC(E9,E13,F13)
SVPC(E12)
SVPC(E12,F12),SEQP(F13),
SVP(F12),SEP(F13),SPA(9E),
SP(F)
SEQP(E12),SVP(E12),
SEP(E12),
SP(E)
SVPA(F8),SP(D)
SVPC(B6)
SVPA(C6,E7),
SVPC(E7)
SVPC(C6)
SP(F')
SEQP(F8),SVP(F8),
SEP(F8),SS(F)
SVPC(C6)
SP(E')
SVPA(B6),
SVPC(B6),SF(E1)
SEQP(E7),SVP(E7),SVQP(E7)
SEP(E7),SP(C)
SVPB(C5),SEQP(C6),SVP(C6),
SVQP(C6),SEP(C6),SP(C'),
SS(D)
SL(F')
SVP(B6),SL(E')
SVP(B6),SS(C')
SVP(A5)
4V
SVPC(E12),SEQP(F13),SVP(F12),
SEP(F13),
SEPC(F13)
SEPC(E9,E13)
SEPC(F13)
SP(F)
SVPC(C6),SEQP(E12),SVP(E12),
SEP(E12),SA(H)
SP(E)
SVPA(F8),SP(D)
SVP(C6)
SVPA(C6,E7),
SVPC(E7)
SVPC(B6),SEQP(F8),SVP(F8),
SEP(F8),SA(F),SH(F)
SVPC(C6)
SP(F')
SVPA(B6),
SVPC(B6),SP(E'),
SA(E),SH(E),SS(E)
SF(E1)
SEQP(E7),SVP(E7),SVQP(E7),
SEP(E7),SP(C)
SVPB(C5),SVP(C6),SVQP(C6),
SP(C')
SVP(C6),SVQP(C6),
SEP(C6)
SA(C),SL(F'),SH(C)
SL(E')
SVP(B6),SC(C)
SC(B),SL(B'),SH(B)
SS(B')
SVP(A5)
SC(A),SH(A)
SL(A'),SS(A')
6.3V
SEQP(F13),SVP(E12),SEP(F13)
SP(F)
SEQP(E12),SVP(E12),
SEP(E12),
SP(E)
SVPA(F8)
SVPC(E7)
SEQP(F8),SVP(F8),SEP(F8),
SP(D),SS(F)
SVPC(C6),SA(F),SH(F)
SP(F')
SVPA(C6,E7),SVPC(B6)
SVP(F8),SS(E)
SP(E')
SEQP(E7),SVP(E7),SVQP(E7),
SEP(E7)
SVPB(C5),SP(C),SS(D)
SVPD(C6),SEQP(C6),SVP(C6),
SVQP(C6),SEP(C6),SP(C')
SVP(C6),
SA(D),SH(D)
SC(D),SL(F')
SL(E')
SVP(B6),
SC(C),SL(C')
SL(C')
SC(B),SL(B'),SH(B),
SS(B')
SVP(A5)
SVP(A5)
SVP(A5)
SC(A),SH(A)
SS(A')
SL(A')
10V
17
3. SERIES SYSTEM DIAGRAM
●…Conductive polymer type●…Organic semiconductor type
Seriessystem
diagram
ESR Matrix V
mΩ
SA(H)
SEQP(F13),SVP(F12),SEP(F13)
SEPC(F13)
SEPC(E12)
SVPA(C6)
SVPC(E7)
SP(F)
SEQP(E12),SVP(E12),
SEP(E12),
SP(E),SA(G)
SP(D)
SA(F),SH(F)
SVPA(F8)
SVPA(E7),SEQP(F8),SVP(F8),
SEP(F8),SA(E),SVPC(C6),
SH(E)
SP(F')
SP(E')
SVPA(C6),SVPC(B6),SVP(F8)
SVPD(E7),SEQP(E7),SVP(E7),
SVQP(E7),SVPB(C5),SEP(E7)
SVP(E7),SP(C)
SEQP(C6),SVP(C6),SVQP(C6),
SEP(C6),SP(C'),
SS(D)
SA(D),SH(D)
SL(F')
SC(D),SA(C),SL(E'),
SH(C)
SVP(B6),SC(C)
SL(C'),SS(C')
SVP(B6)
SC(B),SH(B),SS(B')
SC(B),SL(B'),SH(B),
SL(B')
SVP(A5)
SC(A),SH(A)
SL(A'),SS(A')
16V
SEQP(F13),SVP(F12),
SEP(F13),SP(F)
SEQP(E12),
SVP(E12),SEP(E12),
SP(E)
SP(D),SA(F),SH(F),
SS(E,F),
SP(F')
SP(E'),SA(E),SH(E)
SEQP(F8),SVP(F8),
SEP(F8),SA(E),SH(E)
SVPB(C55),
SEP(F8)
SVPB(C5),SEQP(E7),SVP(E7),
SVQP(E7),SEP(E7),SP(C)
SP(C')
SEQP(C6),SVP(C6),SVQP(C6),
SEP(C6),SS(D)
SA(C,D),SH(C,D)
SA(C),SH(C)
SS(C')
SVP(B6)
SS(B')
SS(B')
SS(A')
20V
SP(F)
SVPD(F12),
SVP(F12),SEP(F13)