REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to reflect current requirements. Editorial changes throughout. - gap 01-02-15 Raymond Monnin B Boilerplate update and part of five year review. tcr 07-01-29 Joseph Rodenbeck C Correction to Table I; ICC2 remove devices 05-07 and 08 from the device type column. ksr 07-06-11 Robert M. Heber THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Gary L. Gross STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY Ray Monnin APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A Michael A. Frye DRAWING APPROVAL DATE MICROCIRCUIT, MEMORY, DIGITAL, CMOS 8K X 8-BIT PROM, MONOLITHIC SILICON 92-07-20 REVISION LEVEL SIZE A CAGE CODE 67268 5962-90803 C SHEET DSCC FORM 2233 APR 97 1 OF 14 5962-E466-07 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 90803 Federal stock class designator \ RHA designator (see 1.2.1) 01 M X X Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 03 04 05 06 07 08 Generic number Circuit function 7C261 7C261 7C261 7C261 7C263, 7C264 7C263, 7C264 7C263, 7C264 7C263, 7C264 Access time 8K X 8-bit PROM 8K X 8-bit PROM 8K X 8-bit PROM 8K X 8-bit PROM 8K X 8-bit PROM 8K X 8-bit PROM 8K X 8-bit PROM 8K X 8-bit PROM 55 ns 45 ns 35 ns 25 ns 55 ns 45 ns 35 ns 25 ns 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter J K L 3 Descriptive designator GDIP1-T24 or CDIP2-T24 GDFP2-F24 or CDFP3-F24 GDIP3-T24 or CDIP4-T24 CQCC1-N28 Terminals 24 24 24 28 Package style Dual-in-line Flat pack Dual-in-line Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 2 1.3 Absolute maximum ratings. 1/ Supply voltage range to ground potential (VCC) ......................... -0.5 V dc to +7.0 V dc DC voltage applied to the outputs in the high-Z state ................ -0.5 V dc to +7.0 V dc DC input voltage ....................................................................... -3.0 V dc to +7.0 V dc DC program voltage .................................................................. 13.0 V dc Maximum power dissipation ....................................................... 1.0 W 2/ Lead temperature (soldering, 10 seconds) ................................ +260C Thermal resistance, junction-to-case (JC) ................................ See MIL-STD-1835 Junction temperature (TJ) .......................................................... +175C Storage temperature range (TSTG) ............................................ -65C to +150C 1.4 Recommended operating conditions. Supply voltage (VCC) ................................................................. Ground voltage (GND) .............................................................. Input high voltage (VIH) .............................................................. Input low voltage (VIL) ............................................................... Case operating temperature range (TC) .................................... +4.5 V dc minimum to +5.5 V dc maximum 0 V dc 2.0 V dc minimum 0.8 V dc maximum 3/ -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Must withstand the added PD due to short circuit test; e.g., IOS. 3/ VIL negative undershoots to a minimum of -3.0 V dc are allowed for pulse widths < 10 ns. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 3 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation. ELECTRONICS INDUSTRIES ALLIANCE (EIA) JEDEC Standard EIA/JESD 78 - IC Latch-Up Test. (Applications for copies should be addressed to the Electronics Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201; http://www.jedec.org.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A, B, C, or D (see 4.4), the devices shall be programmed by the manufacturer prior to test with a checkerboard pattern or equivalent (a minimum of 50 percent of the total number of bits programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed. 3.2.3.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item drawing. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 4 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 42 (see MIL-PRF-38535, appendix A). 3.10.1 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in a wide variety of configurations, two processing options are provided for selection in the contract, using an altered item drawing. 3.10.2 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 4.4.1 and table IIA. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program configuration. 3.10.3 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery. 3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall be done for initial characterization and after any design or process change which may affect data retention. The methods and procedures may be vendor specific, but shall guaranteed over the full military temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with test data. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 5 TABLE I. Electrical performance characteristics. Test Output high voltage Output low voltage Symbol VOH VOL Conditions -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified VCC = 4.5 V, IOH = -4 mA VIN = VIH, VIL VCC = 4.5 V, VIN = VIH, VIL Group A subgroups Device type 1, 2, 3 01-03 05-07 Limits Min IOH = -2 mA IOL = 16 mA IOL = 6 mA Max V 2.4 04, 08 01-03 05-07 1, 2, 3 Unit V 0.4 Input high voltage 1/ VIH 1, 2, 3 04, 08 All Input low voltage 1/ VIL 1, 2, 3 All Input leakage current IIX VIN = VCC to GND 1, 2, 3 All -10 10 A Output leakage current IOZ VOUT = VCC to GND 1, 2, 3 All -10 10 A Output short circuit current 2/, 3/ Power supply current IOS VCC = 5.5 V, VOUT = GND VCC = 5.5 V, IOUT = 0 mA VIN = 0 to 3.0 V, f = fMAX 4/ 1, 2, 3 All -100 mA 1, 2, 3 120 mA 1, 2, 3 01-03 05-07 04, 08 01-03 140 30 mA 4 04 All 50 10 pF 4 All 10 pF 7, 8 All 55 45 35 25 ns ICC1 Standby supply current ICC2 VCC = 5.5 V, CS > VIH IOUT = 0 mA Input capacitance 3/ CIN Output capacitance 3/ COUT VCC = 5.0 V, VIN = 0 V TA = +25C, f = 1 MHz (see 4.4.1d) VCC = 5.0 V, VOUT = 0 V TA = +25C, f = 1 MHz (see 4.4.1d) See 4.4.1c Functional tests Address to output valid tAA See figures 3 and 4 and note 5/ 9, 10, 11 01, 05 02, 06 03, 07 04, 08 2.0 V 0.8 V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified See figures 3 and 4 and note 5/ Group A subgroups Device type 9, 10, 11 01 02 03 04 05 06 07 08 01-04 Min Chip select active to output valid tACS Chip select active to power-up 3/ Chip select inactive to power-down 3/ tPU 9, 10, 11 tPD 9, 10, 11 Chip select inactive to high-Z 3/ 1/ 2/ 3/ 4/ 5/ 6/ tHZCS Limits See figures 3 and 4 and note 5/ and 6/ 9, 10, 11 01 02 03 04 01 02 03, 05 04, 07 06 08 Unit Max 55 45 40 25 35 30 20 15 ns 0 ns 55 45 35 25 55 45 35 25 30 15 ns ns These are absolute values with respect to device ground and all overshoots and undershoots due to system or tester noise are included. For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 30 seconds. Tested initially and after any design or process changes that affect that parameter, and therefore shall be guaranteed to the limits specified in table I. At f = fmax, address inputs are cycling at the maximum frequency of 1/tAA. AC tests are performed with input rise and fall times of 5 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 to 3.0 V, and the output load in figure 4. Transition is measured at steady state high level -500 mV or steady state low level +500 mV on the output from the 1.5 V level on the input, CL = 5 pF (including scope and jig). See figure 4. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 7 Device types Case outlines Terminal number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 All J, K, and L 3 Terminal symbol A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND O3 O4 O5 O6 O7 A12 A11 CS NC A7 A6 A5 A4 A3 A2 A1 A0 NC O0 O1 O2 GND NC O3 O4 O5 O6 O7 21 22 23 24 A10 A9 A8 VCC NC A12 A11 25 26 27 28 --------- A10 A9 A8 VCC CS NC = no connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 8 Type Mode Outputs A12 A11 CS A10 A9 A8 VCC Power All Read DOUT A12 A11 VIL A10 A9 A8 VCC ICC 01-04 Not selected High-Z A12 A11 VIH A10 A9 A8 VCC ISB 05-08 Not selected High-Z A12 A11 VIH A10 A9 A8 VCC ICC All Program 1/ DIN VILP VPP VILP Latch VILP VIHP VCCP ICC All Program High-Z VILP VPP VILP Latch VIHP VIHP VCC ICC DOUT VILP VPP VILP Latch VIHP VILP VCC ICC DOUT VILP VPP VILP Latch VIHP VILP VCC ICC inhibit 1/ All Program verify 1/ All Blank check 1/ 1/ See 4.5. FIGURE 2. Truth table. FIGURE 3. Switching waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 9 Circuit A Output load Circuit B Output load for tHZCS NOTE: Including scope and jig. (minimum values) Load R1 R2 Device types 01-03, 05-07 04, 08 250 658 167 403 AC test conditions Input pulse levels Input rise and fall times Input timing reference levels Output reference levels GND to 3.0 V 5 ns 1.5 V 1.5 V FIGURE 4. Output load circuit and test conditions. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 10 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 11 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device. d. Subgroup 4 (CIN and COUT measurements) shall be measured only for the initial test and after process or design changes which may affect input or output capacitance. Capacitance shall be measured between the designated terminal and GND at a frequency of 1 MHz. Sample size is 15 devices with no failures, and all input and output terminals tested. e. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of group A, subgroups 9, 10, and 11. Either of two techniques is acceptable: (1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability and ac performance without programming the user array. If this is done, the resulting test patterns shall be verified on all devices during subgroups 9, 10, and 11, group A testing in accordance with the sampling plan specified in MIL-STD-883, method 5005. (2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to programming (see 4.4). If more than two devices fail to program, the lot shall be rejected. At the manufacturer's option, the sample may be increased to 24 total devices with no more than four total device failures allowable. Ten devices from the programmability sample shall be submitted to the requirements of group A, subgroups 9, 10, and 11. If more than two devices fail, the lot shall be rejected. At the manufacturer's option, the sample may be increased to 20 total devices with no more than four total device failures allowable. f. O/V (latch-up) tests shall be measured only for initial qualification and after any design or process changes which may affect the performance of the device. For device class M, procedures and circuits shall be maintained under document revision level control by the manufacturer and shall be made available to the preparing activity or acquiring activity upon request. For device classes Q and V, the procedures and circuits shall be under the control of the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the preparing activity or acquiring activity upon request. Testing shall be on all pins, on five devices with zero failures. Latch-up test shall be considered destructive. Information contained in JEDEC Standard EIA/JESD 78 may be used for reference. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. b. TA = +125C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 12 TABLE IIA. Electrical test requirements. Line No. Test requirements 1 3 4 Device class Q Not required Not required Required Required Dynamic burn-in (method 1015) Same as line 1 5 6 Final electrical parameters Group A test requirements Group C end-point electrical parameters Group D end-point electrical parameters Group E end-point electrical parameters 7 8 9 10 1/ 2/ 3/ 4/ 5/ Subgroups (per MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M Interim electrical parameters (see 4.2) Static burn-in I method 1015 Same as line 1 2 1/, 2/, 3/, 4/, 5/ Device class V (1, 7, 9) or (2, 8A, 10) Required 1*, 7* Required 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 1*, 7* 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 2, 3, 7, 8A, 8B 2, 3, 7, 8A, 8B 1, 2, 3, 7, 8A, 8B, 9, 10, 11 2, 3, 7, 8A, 8B 2, 3, 7, 8A, 8B 2, 3, 7, 8A, 8B 1, 7, 9 1, 7, 9 1, 7, 9 Blank spaces indicate tests are not applicable. Any or all subgroups may be combined when using high-speed testers. * indicates PDA applies to subgroup 1 and 7. ** see 4.4.1d. indicates delta limit (see table IIB) shall be required where specified, and the delta values shall be computed with reference to the previous interim electrical parameters (line 1). TABLE IIB. Delta limits at +25C. Test 1/ ICC2 standby IIX Device types All 10 percent of specified value in table I 10 percent of specified value in table I 10 percent of specified value in table I 1/ The above parameter shall be recorded before and after the required burn-in and life tests to determine the delta. IOZ STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 13 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein. 4.5 Programming procedure. The programming procedures shall be as specified by the device manufacturer and shall be made available upon request. 4.6 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical parameters to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option, either perform delta measurements or within 24 hours after burn-in perform final electrical parameter tests, subgroups 1, 7, and 9. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-90803 A REVISION LEVEL C SHEET 14 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 07-06-11 Approved sources of supply for SMD 5962-90803 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ 5962-9080301MKA 5962-9080301MLA 5962-9080301M3A 5962-9080301M3C 5962-9080302MKA 5962-9080302MLA 5962-9080302M3A 5962-9080302M3C 5962-9080303MKA 5962-9080303MLA 5962-9080303M3A 5962-9080303M3C 5962-9080304MKA 5962-9080304MLA 5962-9080304M3A 5962-9080305MJA Vendor CAGE number 0C7V7 0C7V7 3/ 0C7V7 0C7V7 3/ 0C7V7 0C7V7 3/ 0C7V7 0C7V7 0C7V7 3/ 0C7V7 0C7V7 0C7V7 0C7V7 0C7V7 3/ 0C7V7 0C7V7 0C7V7 3/ 0C7V7 0C7V7 0C7V7 65786 0C7V7 0C7V7 3/ 0C7V7 0C7V7 0C7V7 0C7V7 3/ 0C7V7 0C7V7 0C7V7 0C7V7 3/ Page 1 of 3 Vendor similar PIN 2/ WS57C49C-55HMB QP7C261-55KMB CY7C261-55KMB WS57C49C-55KMB QP7C261-55DMB CY7C261-55DMB WS57C49C-55ZMB QP7C261-55LMB CY7C261-55LMB WS57C49C-55ZMB WS57C49C-45HMB QP7C261-45KMB CY7C261-45KMB WS57C49C-45KMB QP7C261-45DMB CY7C261-45DMB WS57C49C-45ZMB QP7C261-45LMB CY7C261-45LMB WS57C49C-45ZMB WS57C49C-35HMB QP7C261-35KMB CY7C261-35KMB WS57C49C-35KMB QP7C261-35DMB CY7C261-35DMB CY7C261-35DMB WS57C49C-35ZMB QP7C261-35LMB CY7C261-35LMB WS57C49C-35ZMB QP7C261-25KMB CY7C261-25KMB QP7C261-25DMB CY7C261-25DMB QP7C261-25LMB CY7C261-25LMB WS57C49C-55YMB QP7C264-55DMB CY7C264-55DMB STANDARD MICROCIRCUIT DRAWING BULLETIN - continued. Standard microcircuit drawing PIN 1/ 5962-9080305MKA 5962-9080305MLA 5962-9080305M3A 5962-9080305M3C 5962-9080306MJA 5962-9080306MKA 5962-9080306MLA 5962-9080306M3A 5962-9080306M3C 5962-9080307MJA 5962-9080307MKA 5962-9080307MLA 5962-9080307M3A 5962-9080307M3C Vendor CAGE number 0C7V7 0C7V7 3/ 0C7V7 0C7V7 3/ 0C7V7 0C7V7 3/ 0C7V7 0C7V7 0C7V7 3/ 0C7V7 0C7V7 3/ 0C7V7 0C7V7 3/ 0C7V7 0C7V7 3/ 0C7V7 0C7V7 0C7V7 3/ 0C7V7 0C7V7 3/ 0C7V7 0C7V7 3/ 0C7V7 0C7V7 3/ 0C7V7 Page 2 of 3 Vendor similar PIN 2/ WS57C49C-55HMB QP7C263-55KMB CY7C263-55KMB WS57C49C-55KMB QP7C263-55DMB CY7C263-55DMB WS57C49C-55ZMB QP7C263-55LMB CY7C263-55LMB WS57C49C-55ZMB WS57C49C-45YMB QP7C264-45DMB CY7C264-45DMB WS57C49C-45HMB QP7C263-45KMB CY7C263-45KMB WS57C49C-45KMB QP7C263-45DMB CY7C263-45DMB WS57C49C-45ZMB QP7C263-45LMB CY7C263-45LMB WS57C49C-45ZMB WS57C49C-35YMB QP7C264-35DMB CY7C264-35DMB WS57C49C-35HMB QP7C263-35KMB CY7C263-35KMB WS57C49C-35KMB QP7C261-35DMB CY7C263-35DMB WS57C49C-35ZMB QP7C263-35LMB CY7C263-35LMB WS57C49C-35ZMB STANDARD MICROCIRCUIT DRAWING BULLETIN - continued. Standard microcircuit drawing PIN 1/ 5962-9080308MJA 5962-9080308MKA 5962-9080308MLA 5962-9080308M3A Vendor CAGE number 0C7V7 0C7V7 0C7V7 0C7V7 0C7V7 0C7V7 0C7V7 0C7V7 Vendor similar PIN 2/ QP7C264-25DMB CY7C264-25DMB QP7C263-25KMB CY7C263-25KMB QP7C263-25DMB CY7C263-25DMB QP7C263-25LMB CY7C263-25LMB 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number Vendor name and address 0C7V7 QP Semiconductor 2945 Oakmead Village Ct. Santa Clara, CA 95051-0812 65786 Cypress Semiconductor 3901 North First Street San Jose, CA 95134 Page 3 of 3 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.