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Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
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reserved
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1. Product profile
1.1 General description
High-speed switching diode fabricated in planar technology, and encapsulated in a small
hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package.
1.2 Features and benefits
High switching speed: max. 4 ns
General application
Reverse voltage: max. 50 V
Repetitive peak reverse voltage: max. 75 V
Repetitive peak forward curre nt: max. 450 mA
Small hermetically sealed glass SMD package
1.3 Applications
High-speed switching
Military and industrial applications
1.4 Quick reference data
[1] Device mounted on an FR4 Printed-Circuit Board (PCB).
2. Pinning information
[1] The marking band indicates the cathode.
PMLL4153
High-speed diode
Rev. 3 — 19 August 2010 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current [1] --200mA
VRreverse voltage - - 50 V
VFforward voltage IF=50mA 740 - 880 mV
Ta ble 2. Pinnin g
Pin Description Simplified outline Graphic symbol
1 cathode [1]
2 anode ka
006aab04
0
2
1
PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 19 August 2010 2 of 10
NXP Semiconductors PMLL4153
High-speed diode
3. Ordering information
4. Marking
5. Limiting values
[1] Device mounted on an FR4 PCB.
[2] Tj=25°C prior to surge.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB.
Table 3. Ordering i nformation
Type number Package
Name Description Version
PMLL4153 - hermetically sealed glass surface-mounted package;
2 connectors SOD80C
Table 4. Marking codes
Type number Marking code
PMLL4153 marking band
Ta ble 5. Limitin g values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRRM repetitive peak reverse
voltage -75V
VRreverse voltage - 50 V
IFforward current [1] -200mA
IFRM repetitive peak forward
current -450mA
IFSM non-repetitive peak
forward current square wave [2]
tp=1μs-4A
tp=1ms - 1 A
tp=1s - 0.5 A
Ptot total power dissipation Tamb 25 °C[1] -500mW
Tjjunction temperature - 200 °C
Tstg storage temperature 65 +200 °C
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-t) thermal resistance from
junction to tie-point - - 300 K/W
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 350 K/W
PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 19 August 2010 3 of 10
NXP Semiconductors PMLL4153
High-speed diode
7. Characteristics
[1] When switched from IF= 10 mA to IR=10mA; R
L= 100 Ω; measured at IR=1mA.
[2] When switched from IF= 10 mA to IR=60mA; R
L= 100 Ω; measured at IR=1mA.
[3] When switched to IF= 200 mA; tr= 0.4 ns; measured at VF=1V.
Ta ble 7. Ch aracteristics
Tj=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF= 0.1 mA 490 - 550 mV
IF= 0.25 mA 530 - 590 mV
IF= 1 mA 590 - 670 mV
IF= 2 mA 620 - 700 mV
IF= 10 mA 700 - 810 mV
IF= 50 mA 740 - 880 mV
IRreverse current VR=50V --0.05μA
VR=50V; T
j= 150 °C --50μA
Cddiode capacitance VR=0V; f=1MHz --2pF
trr reverse recovery time [1] --4ns
[2] --2ns
tfr forward recovery time [3] --10ns
Device mounted on an FR4 Printed-Circuit Board (PCB). (1) Tj= 175 °C; typical values
(2) Tj=25°C; typical values
(3) Tj=25°C; maximum values
Fig 1. Forward current as a function of ambient
temperature; derating curve Fig 2. Forward current as a function of forward
voltage
0 100 200
300
200
0
100
mbg451
Tamb (°C)
IF
(mA)
012
600
0
200
400
mbg464
VF (V)
IF
(mA)
(1) (2) (3)
PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 19 August 2010 4 of 10
NXP Semiconductors PMLL4153
High-speed diode
Based on square wave currents.
Tj=25°C prior to surge
Fig 3. No n-repetitive peak forwar d current as a function of pulse duration; maximum values
(1) VR= 75 V; maximum values
(2) VR= 75 V; typical values
(3) VR= 20 V; typical values
f=1MHz; T
j=25°C
Fig 4. Reverse current as a func tion of junction
temperature Fig 5. Diode capacitance as a function of reverse
voltage; typical values
mbg704
10
1
102
IFSM
(A)
101
tp (μs)
110
4
103
10 102
0 100 Tj (°C) 200
103
102
101
102
10 (1) (2)
1
IR
(μA)
mgd006
(3)
01020
1.2
1.0
0.6
0.4
0.8
mgd004
VR (V)
Cd
(pF)
PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 19 August 2010 5 of 10
NXP Semiconductors PMLL4153
High-speed diode
8. Test information
9. Package outline
Fig 6. Re verse recovery voltage test circuit and waveforms
Input signal: forward pulse rise time tr= 0.4 ns; forward pulse duration tp= 100 ns; duty factor δ=0.01
Fig 7. Forward recovery time test circuit and waveforms
trr
(1)
+ I
F
t
output signal
t
r
t
p
t
10 %
90 %
V
R
input signal
V = V
R
+
I
F
×
R
S
R
S
= 50 ΩI
F
D.U.T.
R
i
= 50 Ω
SAMPLING
OSCILLOSCOPE
mga881
t
r
t
t
p
10%
90%
I
input
signal
R
S
= 50 Ω
I
R
i
= 50 Ω
OSCILLOSCOPE
1 kΩ450 Ω
D.U.T.
mbh181
V
fr
t
fr
t
output
signal
V
F
(V)
1.0
Fig 8. Package outline SOD80C
06-03-16Dimensions in mm
1.60
1.45
0.3
3.7
3.3
0.3
PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 19 August 2010 6 of 10
NXP Semiconductors PMLL4153
High-speed diode
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Table 8. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
2500 10000
PMLL4153 SOD80C 4 mm pitch, 8 mm tape and reel -115 -135
Fig 9. Reflow soldering footprint SOD80C
Fig 10. Wave soldering footprint SOD80C
sod080c
2.30
4.30
4.55
1.601.702.25
0.90
(2x)
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
sod080c
2.70
4.90
6.30
1.702.90
1.90
solder lands
tracks
solder resist
occupied area
Dimensions in mm
PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 19 August 2010 7 of 10
NXP Semiconductors PMLL4153
High-speed diode
12. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PMLL4153 v.3 20100819 Product data sheet - PMLL4150_2
Modifications: The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Type numbers PMLL4150 and PMLL4151 removed.
Legal texts have been adapted to the new company name where appropriate .
Table 1 “Quick reference data: added
Section 4 “Marking: added
Figure 1: updated
Figure 8: superseded by minimized package outline drawing
Section 10 “Packing information: added
Section 11Soldering: added
Section 13 “Legal information: updated
PMLL4150_2 19960918 Product specification - PMLL4150_1
PMLL4150_1 19960423 Product specification - -
PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 19 August 2010 8 of 10
NXP Semiconductors PMLL4153
High-speed diode
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full informatio n see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre va il.
Product specificat io nThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warrant ies, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental ,
punitive, special or consequ ential damages (including - wit hout limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconduct ors’ aggregate and cumulati ve liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconduct ors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe propert y or environment al
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Custo mers should provide appropriate
design and operating safeguards to minimize the risks associated with t heir
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party custo m er(s). Customer is responsible for doing all necessary
testing for the customer’s applications and pro ducts using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter m s and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
PMLL4153 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 19 August 2010 9 of 10
NXP Semiconductors PMLL4153
High-speed diode
Quick reference data — The Quick reference dat a is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neit her qualif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standards, custome r
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y
liability, damages or failed produ ct cl aims resulting from custome r design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
13.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PMLL4153
High-speed diode
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 August 2010
Document iden tifier: PMLL4153
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Packing information . . . . . . . . . . . . . . . . . . . . . 6
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Legal in formation. . . . . . . . . . . . . . . . . . . . . . . . 8
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10