DS90CF366,DS90CF386
DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD)
Link - 85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link
- 85 MHz
Literature Number: SNLS055H
DS90CF386/DS90CF366
April 7, 2011
+3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link
- 85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display
(FPD) Link - 85 MHz
General Description
The DS90CF386 receiver converts the four LVDS data
streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/
sec bandwidth) back into parallel 28 bits of CMOS/TTL data
(24 bits of RGB and 4 bits of Hsync, Vsync, DE and CNTL).
Also available is the DS90CF366 that converts the three
LVDS data streams (Up to 1.78 Gbps throughput or 223
Megabytes/sec bandwidth) back into parallel 21 bits of
CMOS/TTL data (18 bits of RGB and 3 bits of Hsync, Vsync
and DE). Both Receivers' outputs are Falling edge strobe. A
Rising edge or Falling edge strobe transmitter (DS90C385/
DS90C365) will interoperate with a Falling edge strobe Re-
ceiver without any translation logic.
The DS90CF386 is also offered in a 64 ball, 0.8mm fine pitch
ball grid array (FBGA) package which provides a 44 % re-
duction in PCB footprint compared to the 56L TSSOP pack-
age.
This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.
Features
■20 to 85 MHz shift clock support
■Rx power consumption <142 mW (typ) @85MHz
Grayscale
■Rx Power-down mode <1.44 mW (max)
■ESD rating >7 kV (HBM), >700V (EIAJ)
■Supports VGA, SVGA, XGA and Single Pixel SXGA.
■PLL requires no external components
■Compatible with TIA/EIA-644 LVDS standard
■Low profile 56-lead or 48-lead TSSOP package
■DS90CF386 also available in a 64 ball, 0.8mm fine pitch
ball grid array (FBGA) package
Block Diagrams
DS90CF386
10108527
Order Number DS90CF386MTD or DS90CF386SLC
See NS Package Number MTD56 or SLC64A
DS90CF366
10108528
Order Number DS90CF366MTD
See NS Package Number MTD48
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
© 2011 National Semiconductor Corporation 101085 www.national.com
DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit-Color Flat Panel Display (FPD)
Link - 85 MHz, +3.3V LVDS Receiver 18-Bit-Color Flat Panel Display (FPD) Link - 85 MHz
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC)−0.3V to +4V
CMOS/TTL Output Voltage −0.3V to (VCC + 0.3V)
LVDS Receiver Input Voltage −0.3V to (VCC + 0.3V)
Junction Temperature +150°C
Storage Temperature −65°C to +150°C
Lead Temperature
(Soldering, 4 sec for
TSSOP) +260°C
Solder Reflow Temperature
(Soldering, 20 sec for FBGA) +220°C
Maximum Package Power
Dissipation Capacity @ 25°C
MTD56 (TSSOP) Package:
DS90CF386MTD 1.61 W
MTD48 (TSSOP) Package:
DS90CF366MTD 1.89 W
Package Derating:
DS90CF386MTD 12.4 mW/°C above +25°C
DS90CF366MTD 15 mW/°C above +25°C
Maximum Package Power
Dissipation Capacity @ 25°C
SLC64A Package:
DS90CF386SLC 2.0 W
Package Derating:
DS90CF386SLC 10.2 mW/°C above +25°C
ESD Rating
(HBM, 1.5 kΩ, 100 pF) > 7 kV
(EIAJ, 0Ω, 200 pF) > 700V
Recommended Operating
Conditions
Min No
m
Max Units
Supply Voltage (VCC) 3.0 3.3 3.6 V
Operating Free Air
Temperature (TA) −10 +25 +70 °C
Receiver Input Range 0 2.4 V
Supply Noise Voltage (VCC) 100 mVPP
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
CMOS/TTL DC SPECIFICATIONS
VIH High Level Input Voltage 2.0 VCC V
VIL Low Level Input Voltage GND 0.8 V
VOH High Level Output Voltage IOH = - 0.4 mA 2.7 3.3 V
VOL Low Level Output Voltage IOL = 2 mA 0.06 0.3 V
VCL Input Clamp Voltage ICL = −18 mA -0.79 -1.5 V
IIN Input Current VIN = 0.4V, 2.5V or VCC +1.8 +15 uA
VIN = GND -10 0 uA
IOS Output Short Circuit Current VOUT = 0V -60 -120 mA
LVDS RECEIVER DC SPECIFICATIONS
VTH Differential Input High Threshold V CM = +1.2V +100 mV
VTL Differential Input Low Threshold −100 mV
I IN Input Current V IN = +2.4V, VCC = 3.6V ±10 μA
V IN = 0V, VCC = 3.6V ±10 μA
RECEIVER SUPPLY CURRENT
ICCRW Receiver Supply Current CL = 8 pF, f = 32.5 MHz 49 70 mA
Worst Case Worst Case Pattern, f = 37.5 MHz 53 75 mA
DS90CF386 (Figures 1,
4 )
f = 65 MHz 81 114 mA
f = 85 MHz 96 135 mA
ICCRW Receiver Supply Current CL = 8 pF, f = 32.5 MHz 49 60 mA
Worst Case Worst Case Pattern, f = 37.5 MHz 53 65 mA
DS90CF366 (Figures 1,
4 )
f = 65 MHz 78 100 mA
f = 85 MHz 90 115 mA
ICCRG Receiver Supply Current, CL = 8 pF, f = 32.5 MHz 28 45 mA
16 Grayscale 16 Grayscale Pattern, f = 37.5 MHz 30 47 mA
www.national.com 2
DS90CF386/DS90CF366
Symbol Parameter Conditions Min Typ Max Units
(Figures 2, 3, 4 ) f = 65 MHz 43 60 mA
f = 85 MHz 43 70 mA
ICCRZ Receiver Supply Current Power Down = Low 140 400 μA
Power Down Receiver Outputs Stay Low during
Power Down Mode
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for VCC = 3.3V and TA = +25C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise
specified (except VOD and ΔV OD).
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
CLHT CMOS/TTL Low-to-High Transition Time (Figure 4 ) 2.0 3.5 ns
CHLT CMOS/TTL High-to-Low Transition Time (Figure 4 ) 1.8 3.5 ns
RSPos0 Receiver Input Strobe Position for Bit 0 (Figure 11,
Figure 12 )
f = 85 MHz 0.49 0.84 1.19 ns
RSPos1 Receiver Input Strobe Position for Bit 1 2.17 2.52 2.87 ns
RSPos2 Receiver Input Strobe Position for Bit 2 3.85 4.20 4.55 ns
RSPos3 Receiver Input Strobe Position for Bit 3 5.53 5.88 6.23 ns
RSPos4 Receiver Input Strobe Position for Bit 4 7.21 7.56 7.91 ns
RSPos5 Receiver Input Strobe Position for Bit 5 8.89 9.24 9.59 ns
RSPos6 Receiver Input Strobe Position for Bit 6 10.57 10.92 11.27 ns
RSKM RxIN Skew Margin (Note 4) (Figure 13 ) f = 85 MHz 290 ps
RCOP RxCLK OUT Period (Figure 5)11.76 T 50 ns
RCOH RxCLK OUT High Time (Figure 5 ) f = 85 MHz 4.5 5 7 ns
RCOL RxCLK OUT Low Time (Figure 5)4.0 5 6.5 ns
RSRC RxOUT Setup to RxCLK OUT (Figure 5 ) 2.0 ns
RHRC RxOUT Hold to RxCLK OUT (Figure 5 ) 3.5 ns
RCCD RxCLK IN to RxCLK OUT Delay @ 25°C, VCC = 3.3V (Figure 6 ) 5.5 7.0 9.5 ns
RPLLS Receiver Phase Lock Loop Set (Figure 7 ) 10 ms
RPDD Receiver Power Down Delay (Figure 10 ) 1 μs
Note 4: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the transmitter pulse positions
(min and max) and the receiver input setup and hold time (internal data sampling window - RSPos). This margin allows for LVDS interconnect skew, inter-symbol
interference (both dependent on type/length of cable), and clock jitter (less than 150 ps).
3 www.national.com
DS90CF386/DS90CF366
10108503
FIGURE 3. “16 Grayscale” Test Pattern (DS90CF366)(Note 5, Note 6, Note 7, Note 8)
Note 5: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 6: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
Note 7: Figures 1, 3 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Note 8: Recommended pin to signal mapping. Customer may choose to define differently.
10108504
FIGURE 4. DS90CF386/DS90CF366 (Receiver) CMOS/TTL Output Load and Transition Times
5 www.national.com
DS90CF386/DS90CF366
10108505
FIGURE 5. DS90CF386/DS90CF366 (Receiver) Setup/Hold and High/Low Times
10108506
FIGURE 6. DS90CF386/DS90CF366 (Receiver) Clock In to Clock Out Delay
10108507
FIGURE 7. DS90CF386/DS90CF366 (Receiver) Phase Lock Loop Set Time
www.national.com 6
DS90CF386/DS90CF366
10108509
FIGURE 8. 28 Parallel TTL Data Inputs Mapped to LVDS Outputs - DS90CF386
10108510
FIGURE 9. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs - DS90CF366
10108508
FIGURE 10. DS90CF386/DS90CF366 (Receiver) Power Down Delay
7 www.national.com
DS90CF386/DS90CF366
10108525
FIGURE 11. DS90CF386 (Receiver) LVDS Input Strobe Position
www.national.com 8
DS90CF386/DS90CF366
10108526
FIGURE 12. DS90CF366 (Receiver) LVDS Input Strobe Position
9 www.national.com
DS90CF386/DS90CF366
10108511
C—Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max
Tppos—Transmitter output pulse position (min and max)
RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) (Note Cycle-to-cycle jitter is less than 250 ps at 85 MHz. ) + ISI (Inter-symbol interference)
(Note ISI is dependent on interconnect length; may be zero. )
Cable Skew—typically 10 ps–40 ps per foot, media dependent
Note 9: Cycle-to-cycle jitter is less than 250 ps at 85 MHz.
Note 10: ISI is dependent on interconnect length; may be zero.
FIGURE 13. Receiver LVDS Input Skew Margin
www.national.com 10
DS90CF386/DS90CF366
DS90CF386 MTD56 Package Pin Descriptions—24-Bit FPD Link Receiver
Pin Name I/O No
.
Description
RxIN+ I 4 Positive LVDS differentiaI data inputs.
RxIN− I 4 Negative LVDS differential data inputs.
RxOUT O 28 TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 3 control lines—FPLINE, FPFRAME,
DRDY (also referred to as HSYNC, VSYNC, Data Enable).
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN− I 1 Negative LVDS differential clock input.
RxCLK OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe.
PWR DOWN I 1 TTL level input. When asserted (low input) the receiver outputs are low.
V CC I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
PLL V CC I 1 Power supply for PLL.
PLL GND I 2 Ground pin for PLL.
LVDS V CC I 1 Power supply pin for LVDS inputs.
LVDS GND I 3 Ground pins for LVDS inputs.
DS90CF366 MTD48 Package Pin Descriptions—18-Bit FPD Link Receiver
Pin Name I/O No
.
Description
RxIN+ I 3 Positive LVDS differentiaI data inputs.
RxIN− I 3 Negative LVDS differential data inputs.
RxOUT O 21 TTL level data outputs. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines—FPLINE, FPFRAME,
DRDY (also referred to as HSYNC, VSYNC, Data Enable).
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN− I 1 Negative LVDS differential clock input.
RxCLK OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe.
PWR DOWN I 1 TTL level input. When asserted (low input) the receiver outputs are low.
V CC I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
PLL V CC I 1 Power supply for PLL.
PLL GND I 2 Ground pin for PLL.
LVDS V CC I 1 Power supply pin for LVDS inputs.
LVDS GND I 3 Ground pins for LVDS inputs.
DS90CF386 — 64 ball FBGA package Pin Descriptions —
FPD Link Receiver
Pin Name I/O No
.
Description
RxIN+ I 4 Positive LVDS differentiaI data inputs.
RxIN− I 4 Negative LVDS differential data inputs.
RxOUT O 28 TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines—FPLINE, FPFRAME,
DRDY (also referred to as HSYNC, VSYNC, Data Enable).
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN− I 1 Negative LVDS differential clock input.
FPSHIFT OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe. Pin name RxCLK OUT.
PWR DOWN I 1 TTL level input. When asserted (low input) the receiver outputs are low.
VCC I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
11 www.national.com
DS90CF386/DS90CF366
Pin Name I/O No
.
Description
PLL VCC I 1 Power supply for PLL.
PLL GND I 2 Ground pin for PLL.
LVDS VCC I 1 Power supply pin for LVDS inputs.
LVDS GND I 3 Ground pins for LVDS inputs.
NC 6 Pins not connected.
DS90CF386 Pin Descriptions — 64 ball FBGA Package —
FPD Link Receiver
By Pin By Pin Type
Pin Pin Name Type Pin Pin Name Type
A1 RxOUT17 O A4 GND G
A2 VCC P B1 GND G
A3 RxOUT15 O B6 GND G
A4 GND G D8 GND G
A5 RxOUT12 O E3 GND G
A6 RxOUT8 O E5 LVDS GND G
A7 RxOUT7 O G3 LVDS GND G
A8 RxOUT6 O G7 LVDS GND G
B1 GND G H5 LVDS GND G
B2 NC F6 PLL GND G
B3 RxOUT16 O G8 PLL GND G
B4 RxOUT11 O E6 PWR DWN I
B5 VCC P H6 RxCLKIN- I
B6 GND G H7 RxCLKIN+ I
B7 RxOUT5 O H2 RxIN0- I
B8 RxOUT3 O H3 RxIN0+ I
C1 RxOUT21 O F4 RxIN1- I
C2 NC G4 RxIN1+ I
C3 RxOUT18 O G5 RxIN2- I
C4 RxOUT14 O F5 RxIN2+ I
C5 RxOUT9 O G6 RxIN3- I
C6 RxOUT4 O H8 RxIN3+ I
C7 NC E7 RxCLKOUT O
C8 RxOUT1 O E8 RxOUT0 O
D1 VCC P C8 RxOUT1 O
D2 RxOUT20 O D5 RxOUT10 O
D3 RxOUT19 O B4 RxOUT11 O
D4 RxOUT13 O A5 RxOUT12 O
D5 RxOUT10 O D4 RxOUT13 O
D6 VCC P C4 RxOUT14 O
D7 RxOUT2 O A3 RxOUT15 O
D8 GND G B3 RxOUT16 O
E1 RxOUT22 O A1 RxOUT17 O
E2 RxOUT24 O C3 RxOUT18 O
E3 GND G D3 RxOUT19 O
E4 LVDS VCC P D7 RxOUT2 O
E5 LVDS GND G D2 RxOUT20 O
E6 PWR DWN I C1 RxOUT21 O
E7 RxCLKOUT O E1 RxOUT22 O
www.national.com 12
DS90CF386/DS90CF366
By Pin By Pin Type
E8 RxOUT0 O F1 RxOUT23 O
F1 RxOUT23 O E2 RxOUT24 O
F2 RxOUT26 O G1 RxOUT25 O
F3 NC F2 RxOUT26 O
F4 RxIN1- I H1 RxOUT27 O
F5 RxIN2+ I B8 RxOUT3 O
F6 PLL GND G C6 RxOUT4 O
F7 PLL VCC P B7 RxOUT5 O
F8 NC A8 RxOUT6 O
G1 RxOUT25 O A7 RxOUT7 O
G2 NC A6 RxOUT8 O
G3 LVDS GND G C5 RxOUT9 O
G4 RxIN1+ I E4 LVDS VCC P
G5 RxIN2- I H4 LVDS VCC P
G6 RxIN3- I F7 PLL VCC P
G7 LVDS GND G A2 VCC P
G8 PLL GND G B5 VCC P
H1 RxOUT27 O D1 VCC P
H2 RxIN0- I D6 VCC P
H3 RxIN0+ I B2 NC
H4 LVDS VCC P C2 NC
H5 LVDS GND G C7 NC
H6 RxCLKIN- I F3 NC
H7 RxCLKIN+ I F8 NC
H8 RxIN3+ I G2 NC
G: Ground
I : Input
O: Output
P: Power
NC: Not connectted
13 www.national.com
DS90CF386/DS90CF366
Pin Diagrams for TSSOP Packages
DS90CF386MTD
10108523
DS90CF366MTD
10108513
Applications Information
POWER SEQUENCING AND POWERDOWN MODE
Outputs of the transmitter remain in TRI-STATE until the pow-
er supply reaches 2V. Clock and data outputs will begin to
toggle 10 ms after VCC has reached 3V and the Powerdown
pin is above 1.5V. Either device may be placed into a power-
down mode at any time by asserting the Powerdown pin
(active low). Total power dissipation for each device will de-
crease to 5 μW (typical).
The transmitter input clock may be applied prior to powering
up and enabling the transmitter. The transmitter input clock
may also be applied after power up; however, the use of the
PWR DOWN pin is required as described in the Transmitter
Input Clock section. Do not power up and enable (PWR
DOWN = HIGH) the transmitter without a valid clock signal
applied to the TxCLK IN pin.
The FPD Link chipset is designed to protect itself from acci-
dental loss of power to either the transmitter or receiver. If
power to the transmit board is lost, the receiver clocks (input
and output) stop. The data outputs (RxOUT) retain the states
they were in when the clocks stopped. When the receiver
board loses power, the receiver inputs are controlled by a
failsafe bias circuitry. The LVDS inputs are High-Z during ini-
tial power on and power off conditions. Current is limited (5
mA per input) by the fixed current mode drivers, thus avoiding
the potential for latchup when powering the device.
www.national.com 14
DS90CF386/DS90CF366
Physical Dimensions inches (millimeters) unless otherwise noted
56-Lead Molded Thin Shrink Small Outline Package, JEDEC
Dimensions shown in millimeters only
Order Number DS90CF386MTD
NS Package Number MTD56
48-Lead Molded Thin Shrink Small Outline Package, JEDEC
Dimensions shown in millimeters only
Order Number DS90CF366MTD
NS Package Number MTD48
15 www.national.com
DS90CF386/DS90CF366
64 ball, 0.8mm fine pitch ball grid array (FBGA) Package
Dimensions show in millimeters
Order Number DS90CF386SLC
NS Package Number SLC64A
www.national.com 16
DS90CF386/DS90CF366
Notes
17 www.national.com
DS90CF386/DS90CF366
Notes
DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit-Color Flat Panel Display (FPD)
Link - 85 MHz, +3.3V LVDS Receiver 18-Bit-Color Flat Panel Display (FPD) Link - 85 MHz
For more National Semiconductor product information and proven design tools, visit the following Web sites at:
www.national.com
Products Design Support
Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench
Audio www.national.com/audio App Notes www.national.com/appnotes
Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns
Data Converters www.national.com/adc Samples www.national.com/samples
Interface www.national.com/interface Eval Boards www.national.com/evalboards
LVDS www.national.com/lvds Packaging www.national.com/packaging
Power Management www.national.com/power Green Compliance www.national.com/quality/green
Switching Regulators www.national.com/switchers Distributors www.national.com/contacts
LDOs www.national.com/ldo Quality and Reliability www.national.com/quality
LED Lighting www.national.com/led Feedback/Support www.national.com/feedback
Voltage References www.national.com/vref Design Made Easy www.national.com/easy
PowerWise® Solutions www.national.com/powerwise Applications & Markets www.national.com/solutions
Serial Digital Interface (SDI) www.national.com/sdi Mil/Aero www.national.com/milaero
Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic
PLL/VCO www.national.com/wireless PowerWise® Design
University
www.national.com/training
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY
OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO
SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,
IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT.
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT
NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL
PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR
APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND
APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE
NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.
EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO
LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE
AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY
RIGHT.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other
brand or product names may be trademarks or registered trademarks of their respective holders.
Copyright© 2011 National Semiconductor Corporation
For the most current product information visit us at www.national.com
National Semiconductor
Americas Technical
Support Center
Email: support@nsc.com
Tel: 1-800-272-9959
National Semiconductor Europe
Technical Support Center
Email: europe.support@nsc.com
National Semiconductor Asia
Pacific Technical Support Center
Email: ap.support@nsc.com
National Semiconductor Japan
Technical Support Center
Email: jpn.feedback@nsc.com
www.national.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated
