Application Specification
Low Insertion Force (LIF) 114-13226
LOC B
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E
2008 Tyco Electronics Corporation, Harrisburg, PA
All International Rights Reserved
TE logo and Tyco Electronics are trademarks.
*Trademark. Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1-800-722-1111
PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at
www.tycoelectronics.com
Poke-In Connectors
02 JUL 08 Rev A
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless
otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2
_
. Figures and
illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of LIF Pokeā€“In Connectors for use on printed circuit
(pc) board based LED strip lighting typically used for sign lighting. The connector accommodates 18 or 20
AWG solid copper wires; or 18 and 20 AWG prebond copper wires; or 18 AWG stranded copper wires.
The low profile housing with flat top surface allows for vacuum pickā€“andā€“place application. The connector is
packaged in tape and reel packaging per EIAā€“481.
When corresponding with Tyco Electronics Personnel, use the terminology provided in this specification to
facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1.
Figure 1
LIF SMT Poke-In Connector
(One-Position Shown, Two-Position Also Available)
LIF SMT
Contact
Tine Strip
Length
Indicator
Poke-In Hole
for Wire
LIF Through-Hole Poke-In Connector
(Two-Position Shown, One-Position Also Available)
Through-Hole
Contact Tine
2. REFERENCE MATERIAL
2.1. Revision Summary
S
Initial release of document
2.2. Customer Assistance
Reference Product Base Part Number 2008683 and Product Code L012 are representative of the LIF Pokeā€“In
Connector. Use of these numbers will identify the product line and expedite your inquiries through a service
network established to help you obtain product and tooling information. Such information can be obtained
through a local Tyco Electronics Representative or, after purchase, by calling Product Information at the
number at the bottom of this page.
2.3. Drawings
Customer Drawings for product part numbers are available from the service network. If there is a conflict
between the information contained in the Customer Drawings and this specification or with any other technical
documentation supplied, call the Product Information number at the bottom of this page.
NOTE
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2.4. Manuals
Manual 402ā€“40 is available from the service network. This manual provides information on various flux types
and characteristics along with the commercial designation and flux removal procedures. A checklist is included
in the manual as required for information on soldering problems.
2.5. Specifications
Design Objective 108ā€“2284ā€“1 provides expected product performance and test information for the LIF Pokeā€“In
Connector. Workmanship Specification 101ā€“2 and Test Specification 109ā€“11 provides solderability
requirements and evaluation methods.
3. REQUIREMENTS
3.1. Safety
Do not stack product shipping containers so high that the containers buckle or deform.
3.2. Limitations
The connectors are designed to operate in a temperature range of ā€“40
_
to 105
_
C [ā€“40
_
to 221
_
F]
3.3. Material
The housing is made of UL 94Vā€“0 rated thermoplastic. The contacts are made of phosphorous bronze,
underā€“plated with nickel, and plated overall with tin.
3.4. Storage
A. Shelf Life
The connectors should remain in the shipping containers until ready for use to prevent deformation. The
connectors should be used on a first in, first out basis to avoid storage contamination that could adversely
affect performance.
B. Chemical Exposure
Do not store connectors near any chemical listed below as they may cause stress corrosion cracking in
the contacts.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
3.5. Wire Selection and Preparation
These connectors will accept 18 and 20 AWG solid copper wire; 18 and 20 AWG prebond copper wire;
and 18 AWG stranded copper wire. The table in Figure 2 provides wire selection for the LIF Pokeā€“In
Connectors. The wire strip length is 7.00 +1.00 mm for the pokeā€“in cavity with an insulation diameter of
<2.10 mm. See Figure 3.
RECOMMENDED WIRE
18 AWG UL 1007-18 Solid
18 AWG UL 1007-18 (16) Prebond
18 AWG UL 1007-18 (16) Stranded
20 AWG UL 1007-20 Solid
20 AWG UL 1007-20 (7) Prebond
Figure 2
If stranded or prebond wire is used, the strand count must be 16 strands or less.
When preparing stranded wire, it is recommended NOT to twist strands after stripping the insulation. The stranded
wire will insert best if the strands are straight (or slightly twisted) as the wire is manufactured.
NOTE
i
NOTE
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Stranded Wire
(Acceptable) Solid Wire
(Acceptable)
Strip
Length
Conductor
Insulation
Strip
Length
Figure 3
Stranded Wire
(Non-Acceptable) Solid Wire
(Non-Acceptable)
Must be Cut 90
Ā°
3.6. Wire Termination
The receptacles must be terminated according to the instructions packaged with the tooling.
A. Workmanship
The housing must not be damaged in any way. There shall be no bending of the contacts. There shall be no exposed
copper wire or broken or bent conductor strands.
B. Conductor Insertion
All wires must be pushed firmly inside the contact wire openings. The wires must be fully inserted so that
the wire insulation is inserted into and surrounded by the end of the housing. Refer to Figure 4.
C. Wire Termination Depth
The required wire termination depth is achieved when the wire, with insulation stripped to 7.00 +1.00 mm,
has bottomed in the connector housing. Refer to Figure 4.
Figure 4
Wire Bottomed
in Connector
Housing
Insulation Inside
Insulation Barrel
Poke-In Connector
Wire Stop
CAUTION
!
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3.7. Strain Relief
It is recommended that a means be provided to support the wire bundle extending away from the connector to
prevent inadvertent application of high force to the wire bundle from transmitting into the wire/connector
interface. When the wire/connector interface is expected to be exposed to a force greater than 22 N [5.0 lbs],
an external strain relief is recommended. An external strain relief is also recommended for 18 AWG
16ā€“stranded wire. The suggested strain relief method is to use a cable tie and anchor. Refer to Figure 5.
Figure 5
Strain Relief (Cable Tie with Anchor)
Poke-In Connector (Typ)
20 mm Min.
Recommended
Cable Tie
2-160965-1
Recommended
Anchor
2-100691-1
3.8. PC Board
A. Material and Thickness
Common pc board materials may be used such as glass epoxy (FRā€“4 or Gā€“10), Aluminumā€“clad pc
boards and flex circuits. The pc board thickness may vary to suit the end use thickness.
B. Tolerance
Maximum allowable bow of the pc board shall be 0.10 mm over the length of the connector.
Since the connector housings may rest on top of the solder mask, an excessively high mask will allow too much space
between the solder tine and pad for a good solder joint. A solder joint under these conditions would be weak, and
would not provide long-term performance for the connector.
C. Pads
The pc board circuit pads must be solderable in accordance with Test Specification 109ā€“11
(Test Method A, nonā€“activated rosin flux).
D. Layout
The pc board layout must be designed using the dimensions provided on the customer drawing for the
specific connector. The recommended pc board layout is shown in Figure 6.
CAUTION
!
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Figure 6
7.10
1.00
2.00 (Typ)
3.50
15.00
LIF SMT PC Board Layout
1.50 Plated Through-Hole (4 Plc)
9.20
4.00
3.00
LIF Through-Hole PC Board Layout
NOTE
i
One-Position Shown,
Two-Position Dimensions
are the Same and Placed
on 4 mm Centers
E. PC Board Hole Dimensions
The finished hole size for throughā€“hole applications must meet the dimensional requirements provided in
Figure 7.
Figure 7
2.00 Min Pad
Diameter
Drilled Hole Diameter
(As Required)
1.50 + 0.10 Dia of Finished
Hole After Plating
1.57 +0.18 Board
Thickness
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ƏƏ
ƏƏ
ƌ
ƌ
ƌ
ƌ
ƌ
Copper Thickness (As Required)
(Maximum Hardness of Copper to be
150 Knoop)
Tin Thickness
(As Required)
3.9. Spacing
The connector is able to be placed sideā€“byā€“side on the pc board when pads are placed on 4.0 mm centers.
See Figure 8.
Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact
tines.
CAUTION
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Figure 8
LIF Poke-In Connector
0.20-0.00 Min
4.00
NOTE
i
One-Position Shown,
Two-Position Dimensions
are the Same
3.10. Connector Placement
A. SMT Connectors
This product is packaged in tape and reel packaging per EIAā€“481. Robotic/gripper placement requires
total equipment accuracy of 0.13 mm to locate the connector for insertion. This includes gripper and fixture
tolerances, as well as equipment repeatability. Insertion location will be programmed by a simple
pantograph/template system or software package. Optimally, the contact solder tines should be centered
on the pc board pads. However, slight misalignment is permissible for the performance classifications
specified in Association of Connecting Electronics Industries (IPC)ā€“Sā€“815, ā€œGeneral Requirements for
Soldering Electronic Interconnection.ā€ See Figure 9.
PC Board
Optimum Placement of Contact
Solder Tine Centered on Circuit Pad
Contact Solder Tine
Overhang Permissible
Per IPC-S-815
Figure 9
B. Through-Hole Connectors
When placing connectors on the pc board, the contacts must be aligned and started into the matching
holes before seating the connector onto the pc board. After the connector is seated, the standoffs must be
flush to the pc board. Refer to Figure 10.
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Figure 10
Standoffs Flush
with PC Board
PC Board
Poke-In Connector (Typ)
3.11. Soldering
Observe guidelines and procedures when soldering contacts. Solder, clean, and dry all leads to contacts
according to the following. The connectors should be soldered using vapor phase reflow (VPR), doubleā€“sided,
nonā€“focused infrared (IR), forced air convection, or equivalent soldering techniques. All solder joints should
conform to the Workmanship Specification 101ā€“21 and IPCā€“Sā€“815.
A. Flux Selection
Contacts must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will
depend on the type of pc board and other components mounted on the board. Additionally, the flux must
be compatible with the wave solder line, manufacturing, health, and safety requirements. Flux that is
compatible with the connectors is provided in Figure 11.
FLUX TYPE
ACTIVITY
RESIDUE
COMMERCIAL DESIGNATION
FLUX TYPE
ACTIVITY
RESIDUE
KESTER
Y
ALPHA
U
Type RMA (Mildly Activated) Mild Noncorrosive 185/197 611
Y
T rademark of MacDonald & Co.
U
Designation of Alpha Metals Inc.
Figure 11
B. Connectors with LIF SMT Contacts
1. Solderability
The pc board pads must be solderable in accordance with Test Specification 109ā€“11 (Test Method A,
nonā€“activated rosin flux) and all other requirements for surface mount contacts specified in this
document.
2. Solder Paste Characteristics
a. Alloy type shall be SAC 305; Sn 96.5/Ag 3.0/Cu 0.5
b. Flux incorporated in the paste shall be rosin, mildly active (RMA) type.
c. Paste will be at least 80% solids by volume.
d. Mesh designation ā€“200 to +325 (74 to 44 square micron openings, respectively).
e. Minimum viscosity of screen print shall be 5
ī˜
10% cp (centipoise).
f. Minimum viscosity of stencil print shall be 7.5
ī˜
10% cp (centipoise).
3. Solder Volume
Solder paste volumes are required as follows (calculated per 50% solids content). Paste volume may vary depending
on the composition.
Solder volume for each LIF SMT Pokeā€“In Connector must be according to the following:
1.75 mm3 per contact solder tine
NOTE
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4. Stencil
The stencil aperture shall be determined by the circuit pad size and stencil thickness. It may be any
shape as long as it prevents solder bridging from one pad to another. Generally, the thinner stencil will
need a larger aperture to maintain the given volume of solder paste. See Figure 12.
The stencil layouts illustrated apply to the top (connector) side (unless otherwise noted) of the pc board. For any other
variations, refer to the pc board mounting configurations on the appropriate customer drawing to determine
modifications necessary to the solder stencils in Figure 12.
All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create
a short, or wick solder away from the solder tines, producing a weak solder joint.
If a hold-down aperture is required other than that specified, the design must ensure that the connector housing will
not sit on the solder deposit.
Figure 12
2.00 (Typ)
3.50 (Typ)
15.00
7.10
NOTE
i
One-Position Shown,
Two-Position Dimensions
are the Same and Placed
on 4 mm Centers
5. Solder Mask
Solder mask is recommended between all pads when soldering connectors with surface mount contacts
to minimize solder bridging between pads. The mask must not exceed the height of the pad by more
than 0.05 mm. If a trace is run between adjacent pads on the solder side of the pc board, a solder mask
must be applied over the trace to prevent bridging and wicking of solder away from the contact solder
tines. Those most suitable are Liquid Photo Imageable and Dry Film.
Since the connector may rest on top of the solder mask, an excessively high mask will allow too much space between
the lead and pad for a good solder joint. A solder joint under these conditions would be weak and would not provide
long-term performance for the connector.
NOTE
i
CAUTION
!
CAUTION
!
CAUTION
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6. Process
Connectors with surface mount contacts should be soldered using vapor phase (VPR), doubleā€“sided,
nonā€“focused infrared reflow (IR) or equivalent soldering techniques. Due to many variables involved with
the reflow process (i.e., component density, orientation, etc.), it is recommended that trial runs be
conducted under actual manufacturing conditions to ensure product and process compatibility. These
connectors will withstand the temperature and exposure time specified in Figure 13.
SOLDERING PROCESS TEMPERATURE (Max) TIME (At Max Temperature)
IR 220
_
C [428
_
F] 3 Minutes
Figure 13
The leadā€“free reflow profile is shown in Figure 14.
Figure 14
Reflow Zone
Time Above 217
Ā°
C
(90 Seconds Max)
40-70 Seconds Typ
Peak Temperature
235
Ā°
-255
Ā°
C
Soaking Zone
(2.0 Minutes Max)
60-90 Seconds Typ
Pre-Heating Zone
(2.0 -4.0 Minutes Max)
<2.5 C/Second
30 60 90 120 150 180 210 240 270 3000
Time (Seconds)
300
Ā°
C
250
Ā°
C
200
Ā°
C
150
Ā°
C
100
Ā°
C
50
Ā°
C
0
Ā°
C
Kester Lead-Free Reflow Profile
Alloys: Sn96.5/Ag3.0/Cu0.5 and Sn96.5/Ag3.5
C. Connectors with LIF Through-Hole Contacts
1. Solderability
All solder joints should conform to those specified in Workmanship Specification 101ā€“21 and all other
requirements for throughā€“hole contacts specified in this document
2. Process
Connectors with throughā€“hole contacts can be soldered using wave soldering or equivalent soldering
techniques. It is recommended using leadā€“free or SN100C solder for these connectors. The temperature
and exposure time shall be as specified in Figure 15.
SOLDERING PROCESS TEMPERATURE (Max) TIME (At Max Temperature)
Wave 260
_
C [500
_
F] 3 Seconds
Figure 15
LIF Poke-In Connectors 114-13226
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D. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. Common cleaning solvents that will not affect the
connectors or assemblies for the times and temperatures provided without any adverse effects on the
connector assembly are listed in Figure 16.
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Trichloroethylene and Methylene Chloride can be used with no harmful affect to the connectors; however, Tyco
Electronics does not recommend them because of the harmful occupational and environmental effects. Both are
carcinogenic (cancer-causing) and Trichloroethylene is harmful to the earth's ozone layer.
If you have a particular solvent that is not listed, contact Tyco Electronics Tooling Assistance Center or Product
Information at the number on the bottom of page 1.
CLEANER TIME
(Mi )
TEMPERATURES (Maximum)
NAME TYPE (Minutes) CELSIUS FAHRENHEIT
Alpha 2110
H
Aqueous 1 132 270
Bioact EC-7
z
Solvent 5 100 212
Butyl Carbitol
D
Solvent 1 Room Ambient
Isopropyl Alcohol Solvent 5 100 212
Kester 5778
s
Aqueous 5 100 212
Kester 5779
s
Aqueous 5 100 212
Loncoterge 520
D
Aqueous 5 100 212
Loncoterge 530
D
Aqueous 5 100 212
Terpene Solvent Solvent 5 100 212
H
Product of Fryā€™s Metals, Inc.
z
Product of Petroferm, Inc.
D
Product of Union Carbide Corp.
s
Product of Litton Systems, Inc.
Figure 16
E. Drying
Excessive temperatures may cause housing and plating degradation.
When drying cleaned assemblies and pc boards, temperatures to which the connectors are subject should
not exceed 220
_
C [492
_
F] for more than 3 minutes.
3.12. Checking Installed Connector
All solder joints should comply with Tyco Electronics Workmanship Specification 101ā€“21. For typical fillets
for surface mount and throughā€“hole tine requirements, refer to Figure 17.
3.13. Removal and Repair
If needed, the wire can be removed from the connector by first cutting the wire at approximately 50.8 mm from
the connector, and then rotating the wire to cause the wire to ā€œthread outā€ of the connector. Replacement wire
must be newly cut and insulation stripped to 7.00 +1.00 mm.
Replacement wire must be of the same size or of a larger size than the wire previously removed.
DANGER
NOTE
i
CAUTION
!
NOTE
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Figure 17
Solder
Fillet
Pad Width
Pad
Length
LIF SMT Poke-In Connector
Soldered on PC Board
PC Board (Ref)
PC Board (Ref)
Solder Joints
Evenly Formed
Around Contact
Tines
4. QUALIFICATIONS
LIF Pokeā€“In Connectors are Component Recognized by Underwriters Laboratories, Inc. in File E28476,
Volume 39, and have been Investigated to CSA International by UL.
5. TOOLING
5.1. Robotic Equipment
The robotic equipment must have a true position accuracy tolerance of 0.25 mm to properly locate the
connectors. This includes gripper and fixture tolerances as well as equipment repeatability.
Automatic machine placement is recommended for connectors instead of manual placement with surface mount
contacts.
5.2. PC Board Support
For automatic machine placement, a pc board support must be used to prevent bowing of the pc board during
the placement of connectors. It should have flat surfaces with holes or a channel large enough and deep
enough to receive any protruding components. The pc board support must be customer made.
NOTE
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6. VISUAL AID
Figure 18 shows a typical application of LIF Pokeā€“in Connectors. This illustration should be used by production
personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be
inspected using the information in the preceding pages of this specification and in the instructional material
shipped with the product or tooling.
FIGURE 18. VISUAL AID
WIRES MUST BE
FULLY BOTTOMED
IN CONNECTOR
HOUSING
CABLE TIE AND ANCHOR
MUST BE CORRECTLY
PLACED ON WIRES
STANDOFFS MUST
BE SEATED ON PC
BOARD
SOLDER FILLET MUST BE
FORMED EVENLY AROUND
SOLDER TINE
CONTACT TINE SHOULD BE
VISUALLY CENTERED ON PAD
SOLDER MUST BE EVENLY FORMED
AROUND ALL CONTACT SOLDER TINES
WITH NO VISIBLE SKIPS OR VOIDS
CONNECTOR HOUSING
MUST NOT BE DAMAGED
OR CRACKED