STD1109T-100M-B-S - Yageo USA

YAGEO CORPORATION SMD INDUCTOR / BEADS

SMD Power Inductors STD1109 Series

Yageo SMD power inductors are best designed for noise / EMI / RFI lters for surface mounting ap-

plications.

These components contain tremendous electrode straight, solder heat resistance and outstanding

solderability. These products are specially designed for ow, reow and wave soldering required for

surface mounting applications.

ELECTRICAL CHARACTERISTICS

PART NO. INDUCTANCE DC RATED

(µH± 20%) * RESISTANCE CURRENT

  (Ω) (A)Max.

STD1109T-100M-B-S 10 0.06 3.50

STD1109T-120M-B-S 12 0.07 3.40

STD1109T-150M-B-S 15 0.08 3.10

STD1109T-180M-B-S 18 0.09 3.00

STD1109T-220M-B-S 22 0.10 2.60

STD1109T-270M-B-S 27 0.11 2.40

STD1109T-330M-B-S 33 0.12 2.30

STD1109T-390M-B-S 39 0.14 2.10

STD1109T-470M-B-S 47 0.17 1.95

STD1109T-560M-B-S 56 0.19 1.85

STD1109T-680M-B-S 68 0.22 1.65

STD1109T-820M-B-S 82 0.25 1.50

STD1109T-101M-B-S 100 0.35 1.40

STD1109T-121M-B-S 120 0.40 1.30

STD1109T-151M-B-S 150 0.47 1.20

STD1109T-181M-B-S 180 0.63 1.00

STD1109T-221M-B-S 220 0.73 0.95

STD1109T-271M-B-S 270 0.97 0.90

STD1109T-331M-B-S 330 1.15 0.80

STD1109T-391M-B-S 390 1.30 0.75

STD1109T-471M-B-S 470 1.48 0.65

STD1109T-561M-B-S 560 1.90 0.60

STD1109T-681M-B-S 680 2.45 0.50

STD1109T-821M-B-S 820 2.55 0.48

STD1109T-102M-B-S 1000 3.00 0.46

STD1109T-122M-B-S 1200 3.50 0.35

Test Instruments : HP4261 RF Impedance for L, IDC Digital Multimeter SC-7401 for RDC

* Test at HP4263A 1KHz, 1Volt

APPLICATIONS

For high current applications.

Specially designed for high density surface applications.

Ideal for solder ow, reow and wave soldering applications.

SHAPES AND DIMENSIONS

Dimensions : mm

11.6

8.5

14.0

2.55 2.55

FEATURES

Power supply, power ampliers

Switching regulators.

• Packaging: T: Tape and Reel

• Tolerance: M=±20%

• Note: YAGEO will start to release STD Series

inductors with lead-free terminals which

meet SONY SS-00259's criteria for lead-

free product in Q2 of 2004, and YAGEO

Internal No will be changed to “N” as

identication. Ex. STD1109T-100M-B-N

STD - -

PRODUCT IDENTIFICATION

International No.

Tolerance

Inductance

Packaging Style

Dimensions

Product Symbol

289

ELECTRICAL CHARACTERISTICS : LEAD-FREE & ROHS COMPLIANCE

PART NO. INDUCTANCE TEST FREQ Rdc IDC

 (nH±20%) (MHZ) (Ω)Max (A)Max.

STD1109T-100 -B-N 10 1KHz, 1V 0.06 3.5

STD1109T-120 -B-N 12 1KHz, 1V 0.07 3.4

STD1109T-150 -B-N 15 1KHz, 1V 0.08 3.1

STD1109T-180 -B-N 18 1KHz, 1V 0.09 3

STD1109T-220 -B-N 22 1KHz, 1V 0.1 2.6

STD1109T-270 -B-N 27 1KHz, 1V 0.11 2.4

STD1109T-330 -B-N 33 1KHz, 1V 0.12 2.3

STD1109T-390 -B-N 39 1KHz, 1V 0.14 2.1

STD1109T-470 -B-N 47 1KHz, 1V 0.17 1.95

STD1109T-560 -B-N 56 1KHz, 1V 0.19 1.85

STD1109T-590 -B-N 68 1KHz, 1V 0.22 1.65

STD1109T-820 -B-N 82 1KHz, 1V 0.25 1.5

STD1109T-101 -B-N 100 1KHz, 1V 0.35 1.4

STD1109T-121 -B-N 120 1KHz, 1V 0.4 1.3

STD1109T-151 -B-N 150 1KHz, 1V 0.47 1.2

STD1109T-181 -B-N 180 1KHz, 1V 0.63 1

STD1109T-221 -B-N 220 1KHz, 1V 0.73 0.95

STD1109T-271 -B-N 270 1KHz, 1V 0.97 0.9

STD1109T-331 -B-N 330 1KHz, 1V 1.15 0.8

STD1109T-391 -B-N 390 1KHz, 1V 1.3 0.75

STD1109T-471 -B-N 470 1KHz, 1V 1.48 0.65

STD1109T-561 -B-N 560 1KHz, 1V 1.9 0.6

STD1109T-681 -B-N 680 1KHz, 1V 2.45 0.5

STD1109T-821 -B-N 820 1KHz, 1V 2.55 0.48

STD1109T-102 -B-N 1000 1KHz, 1V 3 0.46

STD1109T-122 -B-N 1200 1KHz, 1V 3.5 0.35

NOTE : -tolerance M=±20% / T=±30%

1.Operating temperature range -40°C~85°C

3.Inductance drop =10% typ.

"-N"FOR COMPLETELY LEAD FREE TYPE(INCLUDING FERRITE BODY & SOLDER)

290

REEL DIMENSIONS

CB A

RECOMMENDED PATTERN

Solder Land Inductor

TAPE MATERIAL

Carrier Tape : Polystyrene Cover Type : Polyethylene

160mm Min.

Blank Part

Cover Tape

Chip Mounting

Part

Blank

330mm Min.

Leader

TAPE DIMENSIONS

P2 K0 K0

Plastic

Paper

TYPE TAPE RECOMMENDED REEL QUANTITY

DIMENSIONS PATTERN DIMENSIONS /REEL

K0 D E W P P0 P2 A B C A B C D

STD0804 5.4 1.55 1.75 24 16 4 2 4.0 9 4.5 330 100 13 24.4 750

STD1109 8.7 1.55 1.75 24 20 4 2 6 12~14 5 330 100 13 24.4 400

Dimensions : mm

TYPICAL INDUCTANCE ENERGY STORAGE VS. CURRENT

Test instruments : HP4191A RF Impedance Analyzer

INDUCTANCE vs. FREQUENCY CHARACTERISTICS

120

150

1 1000 1000010010 100000

FREQUENCY (kHz)

L (uH)

Q vs. FREQUENCY CHARACTERISTICS

0 3 4 5 6 71 2 8

IDC (A)

L (uH)

15uH

10uH

33uH

15uH

10uH

33uH

291

STD SERIES RELIABILITY TEST

1-1 MECHANICAL PERFORMANCE

NO. ITEM SPECIFICATION TEST CONDITIONS

1-1-1 Vibration Appearance : No Damage Test device shall be soldered on the substrate.

L Change : within ±10% Oscillation Frequency : 10 to 55 to 10Hz for 1Min.

Q Change : within ±30% Amplitude : 1.5mm

RDC : within Specication Time : 2Hrs. for each Axis (X, Y & Z), Total 6Hrs.

1-1-2 Resistance to Appearance : No Damage Pre-heating : 150°C, 1Min.

Soldering Heat Solder Composition : Sn/Pb = 63/37

Solder Temperature : 260 ± 5°C

Immersion Time : 10 ± 1Sec.

1-1-3 Solderability The electrodes shall be at least 90% covered Pre-heating : 150°C, 1Min.

with new solder coating. Solder Composition : Sn/Pb = 63/37

Solder Temperature : 230 ± 5°C

Immersion Time : 4 ± 1Sec.

1-2 ENVIRONMENTAL PERFORMANCE

NO. ITEM SPECIFICATION TEST CONDITIONS

1-2-1 Temperature Shock Appearance : No Damage 10 Cycles (Air to Air) 1 Cycles shall Consist of :

L Change : within ±10% 30Min. Exposure to -55°C

L Change : within ±30% 30Min. Exposure to 125°C

RDC : within Specication 15Sec. Max. Transition between Temperatures

Measured after Exposure in the Room Condition for 24Hrs.

1-2-2 Temperature Cycle One Cycle

Step Temperature (°C) Time (Min.)

1 -25 ± 3 30

2 25 ± 2 3

3 85 ± 3 30

4 25 ± 2 3

Total : 100 Cycles

Measured after Exposure in the Room Condition for 24Hrs.

1-2-3 Humidity Resistance Temperature : 40 ± 2°C

Relative Humidity : 90 ~ 95%

Time : 1000Hrs.

Measured after Exposure in the Room Condition for 24Hrs.

1-2-4 High Temperature Temperature : 85 ± 3°C

Resistance Relative Humidity : 20%

Applied Current : Rated Current

Time : 1000Hrs.

Measured after Exposure in the Room Condition for 24Hrs.

1-2-5 Low Temperature Temperature : -25 ± 3°C

Resistance Relative Humidity : 0%

Time : 1000Hrs.

Measured after Exposure in the Room Condition for 24Hrs.

292

temperature °C

for: lead solder

for: lead-free solder

time:second

pre-heating

60 second

120 second 80 second

5~10 second

soldering natural cooling

260 °C

230 °C

160 °C

150 °C

RECOMMEND SOLDERING CONDITIONS

for:CL/ CLH/ SQV/ SMD power inductors/ SMD Chip Beads/ SMD Filters, Transformers, Current Sensors