REV. D
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REF43
+2.5 V Low Power Precision
Voltage Reference
FEATURES
PIN CONFIGURATION
GENERAL DESCRIPTION
The REF43 is a low power precision reference providing a
stable 2.5 V output independent of variations in supply voltage,
load conditions or ambient temperature. It is suitable as a
reference level for 8-, 10- and 12-bit data acquisition systems,
or wherever a stable, known voltage is required.
SIMPLIFIED SCHEMATIC
ORDERING GUIDE
Number of
Initial Temperature Package Package Part per Temperature
Model Accuracy Coefficient Description Option Reel/Tray Range
REF43FZ 0.06% 10ppm/∞C8-Pin Hermetic DIP Q-8 48 –40∞C to +85∞C
REF43GZ 0.10% 25ppm/∞C8-Pin Hermetic DIP Q-8 48 –40∞C to +85∞C
REF43GP 0.10% 25ppm/∞C8-Pin Plastic DIP N-8 50 –40∞C to +85∞C
REF43GS 0.10% 25ppm/∞C8-Pin SOIC R-8 98 –40∞C to +85∞C
REF43GS-REEL 0.10% 25ppm/∞C8-Pin SOIC R-8 2,500 –40∞C to +85∞C
REF43GS-REEL7 0.10% 25ppm/∞C8-Pin SOIC R-8 1,000 –40∞C to +85∞C
REF43GSZ*0.10% 25ppm/∞C8-Pin SOIC R-8 98 –40∞C to +85∞C
REF43GSZ-REEL7*0.10% 25ppm/∞C8-Pin SOIC R-8 1,000 –40∞C to +85∞C
REF43NBC 0.20% Die 221
*Z = Pb-free part.
Tight output tolerances and low thermal drift are assured by
zener-zap trimming of both output voltage and its temperature
coefficient. A unique curvature correction circuit reduces the
thermal curvature which is characteristic of many previous
bandgap references.
TEMP
V
IN
V
OUT
TRIM
GROUND
REV. D–2–
REF43
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
REF43 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. D –3–
REV. D–4–
REF43
DICE CHARACTERISTICS
DIE SIZE 0.085 ⴛ 0.062 inch, 5270 sq. mils
(2.16 ⴛ 1.57 mm, 3.39 sq. mm)
2.
3.
4A.
4B.
5.
6A.
6B.
*PADS 4A AND 4B MUST BOTH BE BONDED TO GROUND.
‡VOUT FORCE AND SENSE ARE TYPICALLY BONDED
TOGETHER AT THE LOAD.
VIN
TEMPERATURE OUT
GROUND*
GROUND*
TRIM
VOUT FO2. VIN
VOUT SENSE‡
REV. D
REF43
–5–
Typical Performance Characteristics–
REV. D–6–
REF43
REV. D
REF43
–7–
REV. D–8–
REF43
*OP AMP IS OP43 IF HIGHER SPEED AND FASTER SETTING IS REQUIRED.
OP97 IF LOWER SPEED AND HIGHER LINEARITY IS REQUIRED.
REV. D
REF43
–9–
REV. D–10–
REF43
REV. D
REF43
–11–
REV. D
C00374–0–8/04(D)
–12–
REF43
Revision History
Location Page
8/04—Data Sheet Changed from REV. C to REV. D.
Edits to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to PIN CONFIGURATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Changes to PACKAGE TYPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Changes to ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Delected PACKAGE TYPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
8-Lead Plastic Dual In-Line Package [PDIP]
(N-8)
P-Suffix
Dimensions shown in inches and (millimeters)
SEATING
PLANE
0.180
(4.57)
MAX
0.150 (3.81)
0.130 (3.30)
0.110 (2.79) 0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
8
14
50.295 (7.49)
0.285 (7.24)
0.275 (6.98)
0.100 (2.54)
BSC
0.375 (9.53)
0.365 (9.27)
0.355 (9.02)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AA
0.015
(0.38)
MIN
OUTLINE DIMENSIONS
8-Lead Standard Small Outline Package [SOIC]
(R-8)
S-Suffix
Dimensions shown in millimeters and (inches)
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099) ⴛ 45ⴗ
8ⴗ
0ⴗ
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
85
41
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2440)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012AA
8-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-8)
Z-Suffix
Dimensions shown in inches and (millimeters)
14
85
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005 (0.13)
MIN
0.055 (1.40)
MAX
0.100 (2.54) BSC
15
0
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
0.405 (10.29) MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36) 0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
