16-Bit Architecture XE162FN, XE162HN 16-Bit Single-Chip Real Time Signal Controller XE166 Family / Value Line Data Sheet V1.5 2013-02 Microcontrollers Edition 2013-02 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2013 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 16-Bit Architecture XE162FN, XE162HN 16-Bit Single-Chip Real Time Signal Controller XE166 Family / Value Line Data Sheet V1.5 2013-02 Microcontrollers XE162FN, XE162HN XE166 Family / Value Line XE162xN Data Sheet Revision History: V1.5 2013-02 Previous Versions: V1.4, 2011-07 V1.3, 2010-04 V1.2, 2009-07 V1.1, 2009-07 V1.0, 2009-03 Preliminary Page Subjects (major changes since last revision) 26 Added AB step marking. 76 Errata SWD_X.P002 implemented: VSWD tolerance boundaries for 5.5 V are changed. 78 Clarified "Coding of bit fields LEVxV" descriptions. Matched with Operating Conditions: marked some coding values "out of valid operation range". 79 Errata FLASH_X.P001 implemented: Test Condition for Flash parameter NER corrected Trademarks C166TM, TriCoreTM and DAVETM are trademarks of Infineon Technologies AG. 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Please send your proposal (including a reference to this document) to: mcdocu.comments@infineon.com Data Sheet 4 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Table of Contents Table of Contents 1 1.1 1.2 Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Definition of Feature Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2 2.1 2.2 General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 3.13 3.14 3.15 3.16 3.17 3.18 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Protection Unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Checker Module (MCHK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capture/Compare Unit (CC2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capture/Compare Units CCU6x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Universal Serial Interface Channel Modules (USIC) . . . . . . . . . . . . . . . . . MultiCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 28 32 34 34 35 36 37 40 42 46 48 49 51 52 52 53 54 55 4 4.1 4.1.1 4.2 4.2.1 4.3 4.3.1 4.3.2 4.3.3 4.4 4.5 4.6 4.7 4.7.1 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage Range definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Parameters for Upper Voltage Area . . . . . . . . . . . . . . . . . . . . . . . . DC Parameters for Lower Voltage Area . . . . . . . . . . . . . . . . . . . . . . . . Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 58 59 61 61 62 64 66 68 72 76 79 81 81 Data Sheet 5 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Table of Contents 4.7.2 4.7.2.1 4.7.2.2 4.7.2.3 4.7.3 4.7.4 4.7.5 4.7.6 5 5.1 5.2 5.3 Data Sheet Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Wakeup Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Selecting and Changing the Operating Frequency . . . . . . . . . . . . . . External Clock Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pad Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Synchronous Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . Debug Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 82 83 86 86 87 89 93 97 103 103 105 106 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Summary of Features 16-Bit Single-Chip Real Time Signal Controller XE162xN (XE166 Family) 1 Summary of Features For a quick overview and easy reference, the features of the XE162xN are summarized here. * * * * * * High-performance CPU with five-stage pipeline and MPU - 12.5 ns instruction cycle @ 80 MHz CPU clock (single-cycle execution) - One-cycle 32-bit addition and subtraction with 40-bit result - One-cycle multiplication (16 x 16 bit) - Background division (32 / 16 bit) in 21 cycles - One-cycle multiply-and-accumulate (MAC) instructions - Enhanced Boolean bit manipulation facilities - Zero-cycle jump execution - Additional instructions to support HLL and operating systems - Register-based design with multiple variable register banks - Fast context switching support with two additional local register banks - 16 Mbytes total linear address space for code and data - 1,024 Bytes on-chip special function register area (C166 Family compatible) - Integrated Memory Protection Unit (MPU) Interrupt system with 16 priority levels providing 96 interrupt nodes - Selectable external inputs for interrupt generation and wake-up - Fastest sample-rate 12.5 ns Eight-channel interrupt-driven single-cycle data transfer with Peripheral Event Controller (PEC), 24-bit pointers cover total address space Clock generation from internal or external clock sources, using on-chip PLL or prescaler Hardware CRC-Checker with Programmable Polynomial to Supervise On-Chip Memory Areas On-chip memory modules - 8 Kbytes on-chip stand-by RAM (SBRAM) - 2 Kbytes on-chip dual-port RAM (DPRAM) - Up to 16 Kbytes on-chip data SRAM (DSRAM) - Up to 16 Kbytes on-chip program/data SRAM (PSRAM) - Up to 320 Kbytes on-chip program memory (Flash memory) - Memory content protection through Error Correction Code (ECC) Data Sheet 7 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Summary of Features * * * * * * * * * On-Chip Peripheral Modules - Two synchronizable A/D Converters with up to 9 channels, 10-bit resolution, conversion time below 1 s, optional data preprocessing (data reduction, range check), broken wire detection - 16-channel general purpose capture/compare unit (CC2) - One capture/compare units for flexible PWM signal generation (CCU60) - Multi-functional general purpose timer unit with 5 timers - 6 serial interface channels to be used as UART, LIN, high-speed synchronous channel (SPI/QSPI), IIC bus interface (10-bit addressing, 400 kbit/s), IIS interface - On-chip MultiCAN interface (Rev. 2.0B active) with 64 message objects (Full CAN/Basic CAN) on up to 2 CAN nodes and gateway functionality - On-chip system timer and on-chip real time clock Single power supply from 3.0 V to 5.5 V Power reduction and wake-up modes Programmable watchdog timer and oscillator watchdog Up to 40 general purpose I/O lines On-chip bootstrap loaders Supported by a full range of development tools including C compilers, macroassembler packages, emulators, evaluation boards, HLL debuggers, simulators, logic analyzer disassemblers, programming boards On-chip debug support via Device Access Port (DAP) or JTAG interface 64-pin Green LQFP package, 0.5 mm (19.7 mil) pitch Ordering Information The ordering code for an Infineon microcontroller provides an exact reference to a specific product. This ordering code identifies: * * * the derivative itself, i.e. its function set, the temperature range, and the supply voltage the temperature range: - SAF-...: -40C to 85C - SAK-...: -40C to 125C the package and the type of delivery. For ordering codes for the XE162xN please contact your sales representative or local distributor. Data Sheet 8 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Summary of Features 1.1 Device Types The following XE162xN device types are available and can be ordered through Infineon's direct and/or distribution channels. The devices are available for the SAF temperature range. SAK types are available upon request only. Table 1 Derivative Synopsis of XE162xN Device Types Flash Memory1) PSRAM Capt./Comp. ADC3) Interfaces3) 2) DSRAM Modules Chan. XE162FN-16F80L 128 Kbytes 8 Kbytes 8 Kbytes CC2 CCU60 7+2 2 CAN Node, 6 Serial Chan. XE162FN-24F80L 192 Kbytes 8 Kbytes CC2 16 Kbytes CCU60 7+2 2 CAN Node, 6 Serial Chan. XE162FN-40F80L 320 Kbytes 16 Kbytes CC2 16 Kbytes CCU60 7+2 2 CAN Node, 6 Serial Chan. XE162HN-16F80L 128 Kbytes 8 Kbytes 8 Kbytes CC2 CCU60 7+2 no CAN Nodes, 6 Serial Chan. XE162HN-24F80L 192 Kbytes 8 Kbytes CC2 16 Kbytes CCU60 7+2 no CAN Nodes, 6 Serial Chan. XE162HN-40F80L 320 Kbytes 16 Kbytes CC2 16 Kbytes CCU60 7+2 no CAN Nodes, 6 Serial Chan. 1) Specific information about the on-chip Flash memory in Table 2. 2) All derivatives additionally provide 8 Kbytes SBRAM and 2 Kbytes DPRAM. 3) Specific information about the available channels in Table 4. Analog input channels are listed for each Analog/Digital Converter module separately (ADC0 + ADC1). Data Sheet 9 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Summary of Features 1.2 Definition of Feature Variants The XE162xN types are offered with several Flash memory sizes. Table 2 and Table 3 describe the location of the available Flash memory. Table 2 Continuous Flash Memory Ranges Total Flash Size 1st Range1) 2nd Range 3rd Range 320 Kbytes C0'0000H ... C0'EFFFH C1'0000H ... C4'FFFFH n.a. 192 Kbytes C0'0000H ... C0'EFFFH C1'0000H ... C1'FFFFH C4'0000H ... C4'FFFFH 128 Kbytes C0'0000H ... C0'EFFFH C4'0000H ... C4'FFFFH n.a. 1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0'F000H to C0'FFFFH). Table 3 Flash Memory Module Allocation (in Kbytes) Total Flash Size Flash 01) Flash 1 320 256 64 192 128 64 128 64 64 1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0'F000H to C0'FFFFH). The XE162xN types are offered with different interface options. Table 4 lists the available channels for each option. Table 4 Interface Channel Association Total Number Available Channels / Message Objects 7 ADC0 channels CH0, CH2, Ch4, CH8, CH10, CH13, CH15 2 ADC1 channels CH0, CH4 2 CAN nodes CAN0, CAN1 64 message objects 6 serial channels U0C0, U0C1, U1C0, U1C1, U2C0, U2C1 The XE162xN types are offered with several SRAM memory sizes. Figure 1 shows the allocation rules for PSRAM and DSRAM. Note that the rules differ: * * PSRAM allocation starts from the lower address DSRAM allocation starts from the higher address Data Sheet 10 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Summary of Features For example 8 Kbytes of PSRAM will be allocated at E0'0000h-E0'1FFFh and 8 Kbytes of DSRAM will be at 00'C000h-00'DFFFh. E7'FFFFh (EF'FFFFh) 00'DFFFh Reserved for PSRAM Available DSRAM Available PSRAM Reserved for DSRAM E0'0000h (E8'0000h) 00'8000h MC_XC_SRAM_ALLOCATION Figure 1 Data Sheet SRAM Allocation 11 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information 2 General Device Information The XE162xN series (16-Bit Single-Chip Real Time Signal Controller) is a part of the Infineon XE166 Family of full-feature singlechip CMOS microcontrollers. These devices extend the functionality and performance of the C166 Family in terms of instructions (MAC unit), peripherals, and speed. They combine high CPU performance (up to 80 million instructions per second) with extended peripheral functionality and enhanced IO capabilities. Optimized peripherals can be adapted flexibly to meet the application requirements. These derivatives utilize clock generation via PLL and internal or external clock sources. On-chip memory modules include program Flash, program RAM, and data RAM. VAREFVAGND VDDIM VDDI1 VDDP VSS (1) (1) (1) (3) (9) (4) XTAL1 XTAL2 ESR0 Port 2 11 bit Port 10 16 bit Port 6 2 bit Port 15 2 bit Port 7 1 bit Port 5 7 bit PORST TRST DAP/JTAG Debug 2 / 4 bit 2 bit via Port Pins TESTM MC_XY _LOGSYMB 64 Figure 2 Data Sheet XE162xN Logic Symbol 12 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information 2.1 Pin Configuration and Definition 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 VDDPB ESR0 PORST XTAL1 XTAL2 P10.15 P10.14 VDDI1 P10.13 P10.12 P10.11 P10.10 P10.9 P10.8 VDDPB VS S The pins of the XE162xN are described in detail in Table 5, which includes all alternate functions. For further explanations please refer to the footnotes at the end of the table. The following figure summarizes all pins, showing their locations on the four sides of the package. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 LQFP64 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 VDDPB P10.7 P10.6 P10.5 P10.4 P10.3 P2.10 VDDI1 P10.2 P10.1 P10.0 P2.9 P2.8 P2.7 VDDPB VSS VSS VDDPB P5.4 P5.8 P5.10 P5.13 P5.15 VDDI 1 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 V DDPB 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 VSS VDDPB TESTM TRST P7.0 V DDIM P6.0 P6.1 VDDPA P15.0 P15.4 VAREF VAGND P5.0 P5.2 VDDPB MC_XY_PIN64 Figure 3 Data Sheet XE162xN Pin Configuration (top view) 13 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Key to Pin Definitions * * Ctrl.: The output signal for a port pin is selected by bit field PC in the associated register Px_IOCRy. Output O0 is selected by setting the respective bit field PC to 1x00B, output O1 is selected by 1x01B, etc. Output signal OH is controlled by hardware. Type: Indicates the pad type and its power supply domain (A, B, M, 1). - St: Standard pad - Sp: Special pad e.g. XTALx - DP: Double pad - can be used as standard or high speed pad - In: Input only pad - PS: Power supply pad Table 5 Pin Definitions and Functions Pin Symbol Ctrl. Type Function 3 TESTM I In/B Testmode Enable Enables factory test modes, must be held HIGH for normal operation (connect to VDDPB). An internal pull-up device will hold this pin high when nothing is driving it. 4 TRST I In/B Test-System Reset Input For normal system operation, pin TRST should be held low. A high level at this pin at the rising edge of PORST activates the XE162xN's debug system. In this case, pin TRST must be driven low once to reset the debug system. An internal pull-down device will hold this pin low when nothing is driving it. 5 P7.0 O0 / I St/B Bit 0 of Port 7, General Purpose Input/Output T3OUT O1 St/B GPT12E Timer T3 Toggle Latch Output T6OUT O2 St/B GPT12E Timer T6 Toggle Latch Output TDO_A OH / IH St/B JTAG Test Data Output / DAP1 Input/Output If DAP pos. 0 or 2 is selected during start-up, an internal pull-down device will hold this pin low when nothing is driving it. ESR2_1 I St/B ESR2 Trigger Input 1 Data Sheet 14 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. 7 P6.0 O0 / I DA/A Bit 0 of Port 6, General Purpose Input/Output 8 Type Function EMUX0 O1 DA/A External Analog MUX Control Output 0 (ADC0) BRKOUT O3 DA/A OCDS Break Signal Output ADCx_REQG I TyG DA/A External Request Gate Input for ADC0/1 U1C1_DX0E I DA/A USIC1 Channel 1 Shift Data Input P6.1 O0 / I DA/A Bit 1 of Port 6, General Purpose Input/Output EMUX1 O1 DA/A External Analog MUX Control Output 1 (ADC0) T3OUT O2 DA/A GPT12E Timer T3 Toggle Latch Output U1C1_DOUT O3 DA/A USIC1 Channel 1 Shift Data Output ADCx_REQT I RyE DA/A External Request Trigger Input for ADC0/1 ESR1_6 I DA/A ESR1 Trigger Input 6 P15.0 I In/A Bit 0 of Port 15, General Purpose Input ADC1_CH0 I In/A Analog Input Channel 0 for ADC1 P15.4 I In/A Bit 4 of Port 15, General Purpose Input ADC1_CH4 I In/A Analog Input Channel 4 for ADC1 T6INA I In/A GPT12E Timer T6 Count/Gate Input VAREF VAGND - PS/A Reference Voltage for A/D Converters ADC0/1 13 - PS/A Reference Ground for A/D Converters ADC0/1 14 P5.0 I In/A Bit 0 of Port 5, General Purpose Input ADC0_CH0 I In/A Analog Input Channel 0 for ADC0 P5.2 I In/A Bit 2 of Port 5, General Purpose Input ADC0_CH2 I In/A Analog Input Channel 2 for ADC0 TDI_A I In/A JTAG Test Data Input P5.4 I In/A Bit 4 of Port 5, General Purpose Input 10 11 12 15 19 ADC0_CH4 I In/A Analog Input Channel 4 for ADC0 T3EUDA I In/A GPT12E Timer T3 External Up/Down Control Input TMS_A I In/A JTAG Test Mode Selection Input Data Sheet 15 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. Type Function 20 P5.8 I In/A Bit 8 of Port 5, General Purpose Input ADC0_CH8 I In/A Analog Input Channel 8 for ADC0 ADC1_CH8 I In/A Analog Input Channel 8 for ADC1 CCU6x_T12H I RC In/A External Run Control Input for T12 of CCU60/1 CCU6x_T13H I RC In/A External Run Control Input for T13 of CCU60/1 21 22 23 25 26 27 U2C0_DX0F I In/A USIC2 Channel 0 Shift Data Input P5.10 I In/A Bit 10 of Port 5, General Purpose Input ADC0_CH10 I In/A Analog Input Channel 10 for ADC0 ADC1_CH10 I In/A Analog Input Channel 10 for ADC1 BRKIN_A I In/A OCDS Break Signal Input U2C1_DX0F I In/A USIC2 Channel 1 Shift Data Input P5.13 I In/A Bit 13 of Port 5, General Purpose Input ADC0_CH13 I In/A Analog Input Channel 13 for ADC0 P5.15 I In/A Bit 15 of Port 5, General Purpose Input ADC0_CH15 I In/A Analog Input Channel 15 for ADC0 P2.0 O0 / I St/B Bit 0 of Port 2, General Purpose Input/Output RxDC0C I St/B CAN Node 0 Receive Data Input T5INB I St/B GPT12E Timer T5 Count/Gate Input P2.1 O0 / I St/B Bit 1 of Port 2, General Purpose Input/Output TxDC0 O1 St/B CAN Node 0 Transmit Data Output T5EUDB I St/B GPT12E Timer T5 External Up/Down Control Input ESR1_5 I St/B ESR1 Trigger Input 5 P2.2 O0 / I St/B Bit 2 of Port 2, General Purpose Input/Output TxDC1 O1 St/B CAN Node 1 Transmit Data Output ESR2_5 I St/B ESR2 Trigger Input 5 Data Sheet 16 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. 28 P2.3 O0 / I St/B U0C0_DOUT O1 29 30 31 Type Function St/B Bit 3 of Port 2, General Purpose Input/Output USIC0 Channel 0 Shift Data Output CC2_CC16 O3 / I St/B CAPCOM2 CC16IO Capture Inp./ Compare Out. ESR2_0 I St/B ESR2 Trigger Input 0 U0C0_DX0E I St/B USIC0 Channel 0 Shift Data Input U0C1_DX0D I St/B USIC0 Channel 1 Shift Data Input RxDC0A I St/B CAN Node 0 Receive Data Input P2.4 O0 / I St/B Bit 4 of Port 2, General Purpose Input/Output U0C1_DOUT O1 St/B USIC0 Channel 1 Shift Data Output TxDC0 O2 St/B CAN Node 0 Transmit Data Output CC2_CC17 O3 / I St/B CAPCOM2 CC17IO Capture Inp./ Compare Out. ESR1_0 I St/B ESR1 Trigger Input 0 U0C0_DX0F I St/B USIC0 Channel 0 Shift Data Input RxDC1A I St/B CAN Node 1 Receive Data Input P2.5 O0 / I St/B Bit 5 of Port 2, General Purpose Input/Output U0C0_SCLK OUT O1 St/B USIC0 Channel 0 Shift Clock Output TxDC0 O2 St/B CAN Node 0 Transmit Data Output CC2_CC18 O3 / I St/B CAPCOM2 CC18IO Capture Inp./ Compare Out. U0C0_DX1D I St/B USIC0 Channel 0 Shift Clock Input ESR1_10 I St/B ESR1 Trigger Input 10 P2.6 O0 / I St/B Bit 6 of Port 2, General Purpose Input/Output U0C0_SELO 0 O1 St/B USIC0 Channel 0 Select/Control 0 Output U0C1_SELO 1 O2 St/B USIC0 Channel 1 Select/Control 1 Output CC2_CC19 O3 / I St/B CAPCOM2 CC19IO Capture Inp./ Compare Out. U0C0_DX2D I St/B USIC0 Channel 0 Shift Control Input RxDC0D I St/B CAN Node 0 Receive Data Input ESR2_6 I St/B ESR2 Trigger Input 6 Data Sheet 17 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. 35 P2.7 O0 / I St/B Bit 7 of Port 2, General Purpose Input/Output U0C1_SELO 0 O1 St/B USIC0 Channel 1 Select/Control 0 Output U0C0_SELO 1 O2 St/B USIC0 Channel 0 Select/Control 1 Output CC2_CC20 O3 / I St/B CAPCOM2 CC20IO Capture Inp./ Compare Out. U0C1_DX2C I St/B USIC0 Channel 1 Shift Control Input 36 37 Type Function RxDC1C I St/B CAN Node 1 Receive Data Input ESR2_7 I St/B ESR2 Trigger Input 7 P2.8 O0 / I DP/B Bit 8 of Port 2, General Purpose Input/Output U0C1_SCLK OUT O1 DP/B USIC0 Channel 1 Shift Clock Output EXTCLK O2 DP/B Programmable Clock Signal Output CC2_CC21 O3 / I DP/B CAPCOM2 CC21IO Capture Inp./ Compare Out. U0C1_DX1D I P2.9 O0 / I St/B DP/B USIC0 Channel 1 Shift Clock Input Bit 9 of Port 2, General Purpose Input/Output U0C1_DOUT O1 St/B USIC0 Channel 1 Shift Data Output TxDC1 O2 St/B CAN Node 1 Transmit Data Output CC2_CC22 O3 / I St/B CAPCOM2 CC22IO Capture Inp./ Compare Out. CLKIN1 I St/B Clock Signal Input 1 TCK_A IH St/B DAP0/JTAG Clock Input If JTAG pos. A is selected during start-up, an internal pull-up device will hold this pin high when nothing is driving it. If DAP pos. 0 is selected during start-up, an internal pull-down device will hold this pin low when nothing is driving it. Data Sheet 18 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. 38 P10.0 O0 / I St/B 39 40 42 Type Function Bit 0 of Port 10, General Purpose Input/Output U0C1_DOUT O1 St/B USIC0 Channel 1 Shift Data Output CCU60_CC6 0 O2 St/B CCU60 Channel 0 Output CCU60_CC6 0INA I St/B CCU60 Channel 0 Input ESR1_2 I St/B ESR1 Trigger Input 2 U0C0_DX0A I St/B USIC0 Channel 0 Shift Data Input U0C1_DX0A I St/B USIC0 Channel 1 Shift Data Input P10.1 O0 / I St/B Bit 1 of Port 10, General Purpose Input/Output U0C0_DOUT O1 St/B USIC0 Channel 0 Shift Data Output CCU60_CC6 1 O2 St/B CCU60 Channel 1 Output CCU60_CC6 1INA I St/B CCU60 Channel 1 Input U0C0_DX1A I St/B USIC0 Channel 0 Shift Clock Input U0C0_DX0B I St/B USIC0 Channel 0 Shift Data Input P10.2 O0 / I St/B Bit 2 of Port 10, General Purpose Input/Output U0C0_SCLK OUT O1 St/B USIC0 Channel 0 Shift Clock Output CCU60_CC6 2 O2 St/B CCU60 Channel 2 Output CCU60_CC6 2INA I St/B CCU60 Channel 2 Input U0C0_DX1B I St/B USIC0 Channel 0 Shift Clock Input P2.10 O0 / I St/B Bit 10 of Port 2, General Purpose Input/Output U0C1_DOUT O1 St/B USIC0 Channel 1 Shift Data Output U0C0_SELO 3 O2 St/B USIC0 Channel 0 Select/Control 3 Output CC2_CC23 O3 / I St/B CAPCOM2 CC23IO Capture Inp./ Compare Out. U0C1_DX0E I St/B USIC0 Channel 1 Shift Data Input CAPINA I St/B GPT12E Register CAPREL Capture Input Data Sheet 19 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. 43 P10.3 O0 / I St/B 44 45 46 Type Function Bit 3 of Port 10, General Purpose Input/Output CCU60_COU O2 T60 St/B CCU60 Channel 0 Output U0C0_DX2A I St/B USIC0 Channel 0 Shift Control Input U0C1_DX2A I St/B USIC0 Channel 1 Shift Control Input P10.4 O0 / I St/B Bit 4 of Port 10, General Purpose Input/Output U0C0_SELO 3 O1 St/B USIC0 Channel 0 Select/Control 3 Output CCU60_COU O2 T61 St/B CCU60 Channel 1 Output U0C0_DX2B I St/B USIC0 Channel 0 Shift Control Input U0C1_DX2B I St/B USIC0 Channel 1 Shift Control Input ESR1_9 I St/B ESR1 Trigger Input 9 P10.5 O0 / I St/B Bit 5 of Port 10, General Purpose Input/Output U0C1_SCLK OUT O1 St/B USIC0 Channel 1 Shift Clock Output CCU60_COU O2 T62 St/B CCU60 Channel 2 Output U2C0_DOUT O3 St/B USIC2 Channel 0 Shift Data Output U0C1_DX1B I St/B USIC0 Channel 1 Shift Clock Input P10.6 O0 / I St/B Bit 6 of Port 10, General Purpose Input/Output U0C0_DOUT O1 St/B USIC0 Channel 0 Shift Data Output U1C0_SELO 0 O3 St/B USIC1 Channel 0 Select/Control 0 Output U0C0_DX0C I St/B USIC0 Channel 0 Shift Data Input U1C0_DX2D I St/B USIC1 Channel 0 Shift Control Input CCU60_CTR APA I St/B CCU60 Emergency Trap Input Data Sheet 20 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. 47 P10.7 O0 / I St/B Bit 7 of Port 10, General Purpose Input/Output U0C1_DOUT O1 St/B USIC0 Channel 1 Shift Data Output CCU60_COU O2 T63 St/B CCU60 Channel 3 Output U0C1_DX0B 51 Type Function I St/B USIC0 Channel 1 Shift Data Input CCU60_CCP I OS0A St/B CCU60 Position Input 0 T4INB I St/B GPT12E Timer T4 Count/Gate Input P10.8 O0 / I St/B Bit 8 of Port 10, General Purpose Input/Output U0C0_MCLK OUT O1 St/B USIC0 Channel 0 Master Clock Output U0C1_SELO 0 O2 St/B USIC0 Channel 1 Select/Control 0 Output U2C1_DOUT O3 St/B USIC2 Channel 1 Shift Data Output CCU60_CCP I OS1A St/B CCU60 Position Input 1 U0C0_DX1C I St/B USIC0 Channel 0 Shift Clock Input BRKIN_B I St/B OCDS Break Signal Input T3EUDB I St/B GPT12E Timer T3 External Up/Down Control Input Data Sheet 21 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. 52 P10.9 O0 / I St/B Bit 9 of Port 10, General Purpose Input/Output U0C0_SELO 4 O1 St/B USIC0 Channel 0 Select/Control 4 Output U0C1_MCLK OUT O2 St/B USIC0 Channel 1 Master Clock Output CCU60_CCP I OS2A St/B CCU60 Position Input 2 TCK_B IH St/B DAP0/JTAG Clock Input If JTAG pos. B is selected during start-up, an internal pull-up device will hold this pin high when nothing is driving it. If DAP pos. 1 is selected during start-up, an internal pull-down device will hold this pin low when nothing is driving it. T3INB I St/B GPT12E Timer T3 Count/Gate Input P10.10 O0 / I St/B Bit 10 of Port 10, General Purpose Input/Output U0C0_SELO 0 O1 St/B USIC0 Channel 0 Select/Control 0 Output CCU60_COU O2 T63 St/B CCU60 Channel 3 Output U0C0_DX2C St/B USIC0 Channel 0 Shift Control Input 53 54 I Type Function U0C1_DX1A I St/B USIC0 Channel 1 Shift Clock Input TDI_B IH St/B JTAG Test Data Input If JTAG pos. B is selected during start-up, an internal pull-up device will hold this pin high when nothing is driving it. P10.11 O0 / I St/B Bit 11 of Port 10, General Purpose Input/Output U1C0_SCLK OUT O1 St/B USIC1 Channel 0 Shift Clock Output BRKOUT O2 St/B OCDS Break Signal Output U1C0_DX1D I St/B USIC1 Channel 0 Shift Clock Input TMS_B IH St/B JTAG Test Mode Selection Input If JTAG pos. B is selected during start-up, an internal pull-up device will hold this pin high when nothing is driving it. Data Sheet 22 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. 55 P10.12 O0 / I St/B 56 Type Function Bit 12 of Port 10, General Purpose Input/Output U1C0_DOUT O1 St/B USIC1 Channel 0 Shift Data Output TDO_B OH / IH St/B JTAG Test Data Output / DAP1 Input/Output If DAP pos. 1 is selected during start-up, an internal pull-down device will hold this pin low when nothing is driving it. U1C0_DX0C I St/B USIC1 Channel 0 Shift Data Input U1C0_DX1E I St/B USIC1 Channel 0 Shift Clock Input P10.13 O0 / I St/B Bit 13 of Port 10, General Purpose Input/Output U1C0_DOUT O1 St/B USIC1 Channel 0 Shift Data Output U1C0_SELO 3 O3 St/B USIC1 Channel 0 Select/Control 3 Output U1C0_DX0D I St/B USIC1 Channel 0 Shift Data Input P10.14 O0 / I St/B Bit 14 of Port 10, General Purpose Input/Output U1C0_SELO 1 O1 St/B USIC1 Channel 0 Select/Control 1 Output U0C1_DOUT O2 St/B USIC0 Channel 1 Shift Data Output ESR2_2 I St/B ESR2 Trigger Input 2 U0C1_DX0C I St/B USIC0 Channel 1 Shift Data Input P10.15 O0 / I St/B Bit 15 of Port 10, General Purpose Input/Output U1C0_SELO 2 O1 St/B USIC1 Channel 0 Select/Control 2 Output U0C1_DOUT O2 St/B USIC0 Channel 1 Shift Data Output U1C0_DOUT O3 St/B USIC1 Channel 0 Shift Data Output U0C1_DX1C I St/B USIC0 Channel 1 Shift Clock Input 60 XTAL2 O Sp/M Crystal Oscillator Amplifier Output 61 XTAL1 I Sp/M Crystal Oscillator Amplifier Input To clock the device from an external source, drive XTAL1, while leaving XTAL2 unconnected. Voltages on XTAL1 must comply to the core supply voltage VDDIM. ESR2_9 I St/B 58 59 Data Sheet ESR2 Trigger Input 9 23 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. Type Function 62 PORST I In/B 63 ESR0 O0 / I St/B External Service Request 0 After power-up, ESR0 operates as open-drain bidirectional reset with a weak pull-up. U1C0_DX0E I St/B USIC1 Channel 0 Shift Data Input USIC1 Channel 0 Shift Control Input Power On Reset Input A low level at this pin resets the XE162xN completely. A spike filter suppresses input pulses <10 ns. Input pulses >100 ns safely pass the filter. The minimum duration for a safe recognition should be 120 ns. An internal pull-up device will hold this pin high when nothing is driving it. U1C0_DX2B I St/B 6 VDDIM - PS/M Digital Core Supply Voltage for Domain M Decouple with a ceramic capacitor, see Data Sheet for details. 24, 41, 57 VDDI1 - PS/1 Digital Core Supply Voltage for Domain 1 Decouple with a ceramic capacitor, see Data Sheet for details. All VDDI1 pins must be connected to each other. 9 VDDPA - PS/A Digital Pad Supply Voltage for Domain A Connect decoupling capacitors to adjacent VDDP/VSS pin pairs as close as possible to the pins. Note: The A/D_Converters and ports P5, P6 and P15 are fed from supply voltage VDDPA. Data Sheet 24 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information Table 5 Pin Definitions and Functions (cont'd) Pin Symbol Ctrl. Type Function 2, 16, 18, 32, 34, 48, 50, 64 VDDPB - PS/B Digital Pad Supply Voltage for Domain B Connect decoupling capacitors to adjacent VDDP/VSS pin pairs as close as possible to the pins. 1, 17, 33, 49 VSS Note: The on-chip voltage regulators and all ports except P5, P6 and P15 are fed from supply voltage VDDPB. Data Sheet - PS/-- Digital Ground All VSS pins must be connected to the ground-line or ground-plane. Note: Also the exposed pad is connected internally to VSS. To improve the EMC behavior, it is recommended to connect the exposed pad to the board ground. For thermal aspects, please refer to the Data Sheet. Board layout examples are given in an application note. 25 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line General Device Information 2.2 Identification Registers The identification registers describe the current version of the XE162xN and of its modules. Table 6 XE162xN Identification Registers Short Name Value Address Notes SCU_IDMANUF 1820H 00'F07EH SCU_IDCHIP 3001H 00'F07CH marking EES-AA or ES-AA 3002H 00'F07CH marking AA, AB SCU_IDMEM 304FH 00'F07AH SCU_IDPROG 1313H 00'F078H JTAG_ID 0018'B083H --- marking EES-AA or ES-AA 1018'B083H --- marking AA, AB Data Sheet 26 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3 Functional Description The architecture of the XE162xN combines advantages of RISC, CISC, and DSP processors with an advanced peripheral subsystem in a well-balanced design. On-chip memory blocks allow the design of compact systems-on-silicon with maximum performance suited for computing, control, and communication. The on-chip memory blocks (program code memory and SRAM, dual-port RAM, data SRAM) and the generic peripherals are connected to the CPU by separate high-speed buses. Another bus, the LXBus, connects additional on-chip resources and external resources. This bus structure enhances overall system performance by enabling the concurrent operation of several subsystems of the XE162xN. The block diagram gives an overview of the on-chip components and the advanced internal bus structure of the XE162xN. DPRAM EBC LXBus Control External Bus Control DMU Flash Memory OCDS Debug Support DSRAM CPU PMU IMB PSRAM MAC Unit System Functions MPU Clock, Reset, Power Control, StandBy RAM WDT Interrupt & PEC RTC LXBus MCHK ADC0 ADC1 Module Module 8-/10Bit 8-/10Bit GPT CC2 Module CCU6x Modules 5 Timers 16 Chan. 3+1 Chan. each Peripheral Data Bus Interrupt Bus USICx Modules Multi CAN 2 Chan. each Analog and Digital General Purpose IO (GPIO) Ports MC_N-SERIES_BLOCKDIAGRAM Figure 4 Data Sheet Block Diagram 27 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.1 Memory Subsystem and Organization The memory space of the XE162xN is configured in the von Neumann architecture. In this architecture all internal and external resources, including code memory, data memory, registers and I/O ports, are organized in the same linear address space. Table 7 XE162xN Memory Map 1) Address Area Start Loc. End Loc. Area Size2) IMB register space FF'FF00H FF'FFFFH 256 Bytes Reserved F0'0000H FF'FEFFH < 1 Mbyte Minus IMB registers Reserved for EPSRAM E8'4000H EF'FFFFH 496 Kbytes Mirrors EPSRAM Emulated PSRAM E8'0000H E8'3FFFH up to 16 Kbytes With Flash timing Reserved for PSRAM E0'4000H E7'FFFFH 496 Kbytes Mirrors PSRAM PSRAM E0'0000H E0'3FFFH up to 16 Kbytes Program SRAM Reserved for Flash C5'0000H DF'FFFFH 1,728 Kbytes Flash 1 C4'0000H C4'FFFFH 64 Kbytes Flash 0 C0'0000H C3'FFFFH 256 Kbytes3) External memory area 40'0000H BF'FFFFH 8 Mbytes External IO area4) 21'0000H 3F'FFFFH 1,984 Kbytes Reserved Notes Minus res. seg. 20'BC00H 20'FFFFH 17 Kbytes USIC0-2 alternate regs. 20'B000H 20'BBFFH 3 Kbytes Accessed via EBC MultiCAN alternate regs. 20'8000H 20'AFFFH 12 Kbytes Accessed via EBC Reserved 20'5800H 20'7FFFH 10 Kbytes USIC0-2 registers 20'4000H 20'57FFH 6 Kbytes Reserved 20'6800H 20'7FFFH 6 Kbytes MultiCAN registers 20'0000H 20'3FFFH 16 Kbytes External memory area 01'0000H 1F'FFFFH 1984 Kbytes SFR area 00'FE00H 00'FFFFH 0.5 Kbytes Dualport RAM (DPRAM) 00'F600H 00'FDFFH 2 Kbytes Reserved for DPRAM 00'F200H 00'F5FFH 1 Kbytes ESFR area 00'F000H 00'F1FFH 0.5 Kbytes XSFR area 00'E000H 00'EFFFH 4 Kbytes Data SRAM (DSRAM) 00'A000H 00'DFFFH 16 Kbytes Data Sheet 28 Accessed via EBC Accessed via EBC V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description Table 7 XE162xN Memory Map (cont'd)1) Address Area Start Loc. End Loc. Area Size2) Reserved for DSRAM 00'8000H 00'9FFFH 8 Kbytes External memory area 00'0000H 00'7FFFH 32 Kbytes Notes 1) Accesses to the shaded areas are reserved. In devices with external bus interface these accesses generate external bus accesses. 2) The areas marked with "<" are slightly smaller than indicated, see column "Notes". 3) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0'F000H to C0'FFFFH). 4) Several pipeline optimizations are not active within the external IO area. This is necessary to control external peripherals properly. This common memory space consists of 16 Mbytes organized as 256 segments of 64 Kbytes; each segment contains four data pages of 16 Kbytes. The entire memory space can be accessed bytewise or wordwise. Portions of the on-chip DPRAM and the register spaces (ESFR/SFR) additionally are directly bit addressable. The internal data memory areas and the Special Function Register areas (SFR and ESFR) are mapped into segment 0, the system segment. The Program Management Unit (PMU) handles all code fetches and, therefore, controls access to the program memories such as Flash memory and PSRAM. The Data Management Unit (DMU) handles all data transfers and, therefore, controls access to the DSRAM and the on-chip peripherals. Both units (PMU and DMU) are connected to the high-speed system bus so that they can exchange data. This is required if operands are read from program memory, code or data is written to the PSRAM, code is fetched from external memory, or data is read from or written to external resources. These include peripherals on the LXBus such as USIC or MultiCAN. The system bus allows concurrent two-way communication for maximum transfer performance. Up to 16 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code or data. The PSRAM is accessed via the PMU and is optimized for code fetches. A section of the PSRAM with programmable size can be write-protected. Note: The actual size of the PSRAM depends on the quoted device type. Data Sheet 29 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description Up to 16 Kbytes of on-chip Data SRAM (DSRAM) are used for storage of general user data. The DSRAM is accessed via a separate interface and is optimized for data access. Note: The actual size of the DSRAM depends on the quoted device type. 2 Kbytes of on-chip Dual-Port RAM (DPRAM) provide storage for user-defined variables, for the system stack, and for general purpose register banks. A register bank can consist of up to 16 word-wide (R0 to R15) and/or byte-wide (RL0, RH0, ..., RL7, RH7) General Purpose Registers (GPRs). The upper 256 bytes of the DPRAM are directly bit addressable. When used by a GPR, any location in the DPRAM is bit addressable. 8 Kbytes of on-chip Stand-By SRAM (SBRAM) provide storage for system-relevant user data that must be preserved while the major part of the device is powered down. The SBRAM is accessed via a specific interface and is powered in domain M. 1024 bytes (2 x 512 bytes) of the address space are reserved for the Special Function Register areas (SFR space and ESFR space). SFRs are word-wide registers which are used to control and monitor functions of the different on-chip units. Unused SFR addresses are reserved for future members of the XE166 Family. In order to ensure upward compatibility they should either not be accessed or written with zeros. In order to meet the requirements of designs where more memory is required than is available on chip, up to 12 Mbytes (approximately, see Table 7) of external RAM and/or ROM can be connected to the microcontroller. The External Bus Interface also provides access to external peripherals. The on-chip Flash memory stores code, constant data, and control data. The 320 Kbytes of on-chip Flash memory consist of 1 module of 64 Kbytes (preferably for data storage) and 1 module of 256 Kbytes. Each module is organized in 4-Kbyte sectors. The uppermost 4-Kbyte sector of segment 0 (located in Flash module 0) is used internally to store operation control parameters and protection information. Note: The actual size of the Flash memory depends on the chosen device type. Each sector can be separately write protected1), erased and programmed (in blocks of 128 Bytes). The complete Flash area can be read-protected. A user-defined password sequence temporarily unlocks protected areas. The Flash modules combine 128-bit read access with protected and efficient writing algorithms for programming and erasing. Dynamic error correction provides extremely high read data security for all read access operations. Access to different Flash modules can be executed in parallel. For Flash parameters, please see Section 4.6. 1) To save control bits, sectors are clustered for protection purposes, they remain separate for programming/erasing. Data Sheet 30 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description Memory Content Protection The contents of on-chip memories can be protected against soft errors (induced e.g. by radiation) by activating the parity mechanism or the Error Correction Code (ECC). The parity mechanism can detect a single-bit error and prevent the software from using incorrect data or executing incorrect instructions. The ECC mechanism can detect and automatically correct single-bit errors. This supports the stable operation of the system. It is strongly recommended to activate the ECC mechanism wherever possible because this dramatically increases the robustness of an application against such soft errors. Data Sheet 31 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.2 Central Processing Unit (CPU) The core of the CPU consists of a 5-stage execution pipeline with a 2-stage instructionfetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply and accumulate unit (MAC), a register-file providing three register banks, and dedicated SFRs. The ALU features a multiply-and-divide unit, a bit-mask generator, and a barrel shifter. PSRAM Flash/ROM PMU CPU Prefetch Unit Branch Unit FIFO CSP IP VECSEG CPUCON1 CPUCON2 Return Stack IDX0 IDX1 QX0 QX1 QR0 QR1 +/- +/- Multiply Unit MRW +/- MCW MSW MAH MAL 2-Stage Prefetch Pipeline TFR Injection/ Exception Handler 5-Stage Pipeline IFU DPP0 DPP1 DPP2 DPP3 DPRAM IPIP SPSEG SP STKOV STKUN ADU Division Unit Bit-Mask-Gen. Multiply Unit Barrel-Shifter MDC MDH MDL ZEROS ONES MAC R15 R15 R14 R15 R14 R14 R15 R14 GPRs GPRs GPRs GPRs R1 R1 R0 R0R1 R0 R1 R0 RF +/- PSW CP Buffer ALU WB DSRAM EBC Peripherals DMU mca04917_x.vsd Figure 5 Data Sheet CPU Block Diagram 32 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description With this hardware most XE162xN instructions are executed in a single machine cycle of 12.5 ns @ 80-MHz CPU clock. For example, shift and rotate instructions are always processed during one machine cycle, no matter how many bits are shifted. Also, multiplication and most MAC instructions execute in one cycle. All multiple-cycle instructions have been optimized so that they can be executed very fast; for example, a 32-/16-bit division is started within 4 cycles while the remaining cycles are executed in the background. Another pipeline optimization, the branch target prediction, eliminates the execution time of branch instructions if the prediction was correct. The CPU has a register context consisting of up to three register banks with 16 wordwide GPRs each at its disposal. One of these register banks is physically allocated within the on-chip DPRAM area. A Context Pointer (CP) register determines the base address of the active register bank accessed by the CPU at any time. The number of these register bank copies is only restricted by the available internal RAM space. For easy parameter passing, a register bank may overlap others. A system stack of up to 32 Kwords is provided for storage of temporary data. The system stack can be allocated to any location within the address space (preferably in the on-chip RAM area); it is accessed by the CPU with the stack pointer (SP) register. Two separate SFRs, STKOV and STKUN, are implicitly compared with the stack pointer value during each stack access to detect stack overflow or underflow. The high performance of the CPU hardware implementation can be best utilized by the programmer with the highly efficient XE162xN instruction set. This includes the following instruction classes: * * * * * * * * * * * * * Standard Arithmetic Instructions DSP-Oriented Arithmetic Instructions Logical Instructions Boolean Bit Manipulation Instructions Compare and Loop Control Instructions Shift and Rotate Instructions Prioritize Instruction Data Movement Instructions System Stack Instructions Jump and Call Instructions Return Instructions System Control Instructions Miscellaneous Instructions The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes and words. A variety of direct, indirect or immediate addressing modes are provided to specify the required operands. Data Sheet 33 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.3 Memory Protection Unit (MPU) The XE162xN's Memory Protection Unit (MPU) protects user-specified memory areas from unauthorized read, write, or instruction fetch accesses. The MPU can protect the whole address space including the peripheral area. This completes established mechanisms such as the register security mechanism or stack overrun/underrun detection. Four Protection Levels support flexible system programming where operating system, low level drivers, and applications run on separate levels. Each protection level permits different access restrictions for instructions and/or data. Every access is checked (if the MPU is enabled) and an access violating the permission rules will be marked as invalid and leads to a protection trap. A set of protection registers for each protection level specifies the address ranges and the access permissions. Applications requiring more than 4 protection levels can dynamically re-program the protection registers. 3.4 Memory Checker Module (MCHK) The XE162xN's Memory Checker Module calculates a checksum (fractional polynomial division) on a block of data, often called Cyclic Redundancy Code (CRC). It is based on a 32-bit linear feedback shift register and may, therefore, also be used to generate pseudo-random numbers. The Memory Checker Module is a 16-bit parallel input signature compression circuitry which enables error detection within a block of data stored in memory, registers, or communicated e.g. via serial communication lines. It reduces the probability of error masking due to repeated error patterns by calculating the signature of blocks of data. The polynomial used for operation is configurable, so most of the commonly used polynomials may be used. Also, the block size for generating a CRC result is configurable via a local counter. An interrupt may be generated if testing the current data block reveals an error. An autonomous CRC compare circuitry is included to enable redundant error detection, e.g. to enable higher safety integrity levels. The Memory Checker Module provides enhanced fault detection (beyond parity or ECC) for data and instructions in volatile and non volatile memories. This is especially important for the safety and reliability of embedded systems. Data Sheet 34 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.5 Interrupt System The architecture of the XE162xN supports several mechanisms for fast and flexible response to service requests; these can be generated from various sources internal or external to the microcontroller. Any of these interrupt requests can be programmed to be serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC). Using a standard interrupt service the current program execution is suspended and a branch to the interrupt vector table is performed. With the PEC just one cycle is `stolen' from the current CPU activity to perform the PEC service. A PEC service implies a single byte or word data transfer between any two memory locations with an additional increment of either the PEC source pointer, the destination pointer, or both. An individual PEC transfer counter is implicitly decremented for each PEC service except when performing in the continuous transfer mode. When this counter reaches zero, a standard interrupt is performed to the corresponding source-related vector location. PEC services are particularly well suited to supporting the transmission or reception of blocks of data. The XE162xN has eight PEC channels, each with fast interrupt-driven data transfer capabilities. With a minimum interrupt response time of 7/111) CPU clocks, the XE162xN can react quickly to the occurrence of non-deterministic events. Interrupt Nodes and Source Selection The interrupt system provides 96 physical nodes with separate control register containing an interrupt request flag, an interrupt enable flag and an interrupt priority bit field. Most interrupt sources are assigned to a dedicated node. A particular subset of interrupt sources shares a set of nodes. The source selection can be programmed using the interrupt source selection (ISSR) registers. External Request Unit (ERU) A dedicated External Request Unit (ERU) is provided to route and preprocess selected on-chip peripheral and external interrupt requests. The ERU features 4 programmable input channels with event trigger logic (ETL) a routing matrix and 4 output gating units (OGU). The ETL features rising edge, falling edge, or both edges event detection. The OGU combines the detected interrupt events and provides filtering capabilities depending on a programmable pattern match or miss. Trap Processing The XE162xN provides efficient mechanisms to identify and process exceptions or error conditions that arise during run-time, the so-called `Hardware Traps'. A hardware trap causes an immediate system reaction similar to a standard interrupt service (branching 1) Depending if the jump cache is used or not. Data Sheet 35 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description to a dedicated vector table location). The occurrence of a hardware trap is also indicated by a single bit in the trap flag register (TFR). Unless another higher-priority trap service is in progress, a hardware trap will interrupt any ongoing program execution. In turn, hardware trap services can normally not be interrupted by standard or PEC interrupts. Depending on the package option up to 3 External Service Request (ESR) pins are provided. The ESR unit processes their input values and allows to implement user controlled trap functions (System Requests SR0 and SR1). In this way reset, wakeup and power control can be efficiently realized. Software interrupts are supported by the `TRAP' instruction in combination with an individual trap (interrupt) number. Alternatively to emulate an interrupt by software a program can trigger interrupt requests by writing the Interrupt Request (IR) bit of an interrupt control register. 3.6 On-Chip Debug Support (OCDS) The On-Chip Debug Support system built into the XE162xN provides a broad range of debug and emulation features. User software running on the XE162xN can be debugged within the target system environment. The OCDS is controlled by an external debugging device via the debug interface. This either consists of the 2-pin Device Access Port (DAP) or of the JTAG port conforming to IEEE-1149. The debug interface can be completed with an optional break interface. The debugger controls the OCDS with a set of dedicated registers accessible via the debug interface (DAP or JTAG). In addition the OCDS system can be controlled by the CPU, e.g. by a monitor program. An injection interface allows the execution of OCDSgenerated instructions by the CPU. Multiple breakpoints can be triggered by on-chip hardware, by software, or by an external trigger input. Single stepping is supported, as is the injection of arbitrary instructions and read/write access to the complete internal address space. A breakpoint trigger can be answered with a CPU halt, a monitor call, a data transfer, or/and the activation of an external signal. Tracing of data can be obtained via the debug interface, or via the external bus interface for increased performance. Tracing of program execution is supported by the XE166 Family emulation device. With this device the DAP can operate on clock rates of up to 20 MHz. The DAP interface uses two interface signals, the JTAG interface uses four interface signals, to communicate with external circuitry. The debug interface can be amended with two optional break lines. Data Sheet 36 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.7 Capture/Compare Unit (CC2) The CAPCOM unit supports generation and control of timing sequences on up to 16 channels with a maximum resolution of one system clock cycle (eight cycles in staggered mode). The CAPCOM unit is typically used to handle high-speed I/O tasks such as pulse and waveform generation, pulse width modulation (PWM), digital to analog (D/A) conversion, software timing, or time recording with respect to external events. Two 16-bit timers with reload registers provide two independent time bases for the capture/compare register array. The input clock for the timers is programmable to several prescaled values of the internal system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2. This provides a wide range of variation for the timer period and resolution and allows precise adjustments to the application specific requirements. In addition, external count inputs allow event scheduling for the capture/compare registers relative to external events. The capture/compare register array contains 16 dual purpose capture/compare registers, each of which may be individually allocated to either CAPCOM timer and programmed for capture or compare function. All registers have each one port pin associated with it which serves as an input pin for triggering the capture function, or as an output pin to indicate the occurrence of a compare event. When a capture/compare register has been selected for capture mode, the current contents of the allocated timer will be latched (`captured') into the capture/compare register in response to an external event at the port pin which is associated with this register. In addition, a specific interrupt request for this capture/compare register is generated. Either a positive, a negative, or both a positive and a negative external signal transition at the pin can be selected as the triggering event. The contents of all registers which have been selected for one of the five compare modes are continuously compared with the contents of the allocated timers. When a match occurs between the timer value and the value in a capture/compare register, specific actions will be taken based on the selected compare mode. Table 8 Compare Modes Compare Modes Function Mode 0 Interrupt-only compare mode; Several compare interrupts per timer period are possible Mode 1 Pin toggles on each compare match; Several compare events per timer period are possible Data Sheet 37 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description Table 8 Compare Modes (cont'd) Compare Modes Function Mode 2 Interrupt-only compare mode; Only one compare interrupt per timer period is generated Mode 3 Pin set `1' on match; pin reset `0' on compare timer overflow; Only one compare event per timer period is generated Double Register Mode Two registers operate on one pin; Pin toggles on each compare match; Several compare events per timer period are possible Single Event Mode Generates single edges or pulses; Can be used with any compare mode When a capture/compare register has been selected for capture mode, the current contents of the allocated timer will be latched (`captured') into the capture/compare register in response to an external event at the port pin associated with this register. In addition, a specific interrupt request for this capture/compare register is generated. Either a positive, a negative, or both a positive and a negative external signal transition at the pin can be selected as the triggering event. The contents of all registers selected for one of the five compare modes are continuously compared with the contents of the allocated timers. When a match occurs between the timer value and the value in a capture/compare register, specific actions will be taken based on the compare mode selected. Data Sheet 38 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description Reload Reg. T7REL fCC T7IN T6OUF T7 Input Control Timer T7 CC16IO CC17IO CC16IRQ CC17IRQ Mode Control (Capture or Compare) Sixteen 16-bit Capture/ Compare Registers CC31IO fCC T6OUF T7IRQ CC31IRQ T8 Input Control Timer T8 T8IRQ Reload Reg. T8REL MC_CAPCOM2_BLOCKDIAG Figure 6 Data Sheet CAPCOM Unit Block Diagram 39 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.8 Capture/Compare Units CCU6x The XE162xN types feature the CCU60 unit(s). CCU6 is a high-resolution capture and compare unit with application-specific modes. It provides inputs to start the timers synchronously, an important feature in devices with several CCU6 modules. The module provides two independent timers (T12, T13), that can be used for PWM generation, especially for AC motor control. Additionally, special control modes for block commutation and multi-phase machines are supported. Timer 12 Features * * * * * * * * * * Three capture/compare channels, where each channel can be used either as a capture or as a compare channel. Supports generation of a three-phase PWM (six outputs, individual signals for highside and low-side switches) 16-bit resolution, maximum count frequency = peripheral clock Dead-time control for each channel to avoid short circuits in the power stage Concurrent update of the required T12/13 registers Center-aligned and edge-aligned PWM can be generated Single-shot mode supported Many interrupt request sources Hysteresis-like control mode Automatic start on a HW event (T12HR, for synchronization purposes) Timer 13 Features * * * * * * One independent compare channel with one output 16-bit resolution, maximum count frequency = peripheral clock Can be synchronized to T12 Interrupt generation at period match and compare match Single-shot mode supported Automatic start on a HW event (T13HR, for synchronization purposes) Additional Features * * * * * * * Block commutation for brushless DC drives implemented Position detection via Hall sensor pattern Automatic rotational speed measurement for block commutation Integrated error handling Fast emergency stop without CPU load via external signal (CTRAP) Control modes for multi-channel AC drives Output levels can be selected and adapted to the power stage Data Sheet 40 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description CCU6 Module Kernel fSYS T13 Channel 3 com pare 1 3 2 2 2 trap i nput st art Trap Control output select 1 Multichannel Control Hal l i nput Channel 2 Deadtime Control compa re 1 compa re Interrupts Channel 1 compa re T12 1 capture TxHR Channel 0 output select com pare 3 1 CTRAP CCPOS0 CCPOS1 CCPOS2 COUT60 CC60 COUT61 CC61 COUT62 CC62 COUT63 Input / Output Control m c_ccu6_blockdiagram . vsd Figure 7 CCU6 Block Diagram Timer T12 can work in capture and/or compare mode for its three channels. The modes can also be combined. Timer T13 can work in compare mode only. The multi-channel control unit generates output patterns that can be modulated by timer T12 and/or timer T13. The modulation sources can be selected and combined for signal modulation. Data Sheet 41 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.9 General Purpose Timer (GPT12E) Unit The GPT12E unit is a very flexible multifunctional timer/counter structure which can be used for many different timing tasks such as event timing and counting, pulse width and duty cycle measurements, pulse generation, or pulse multiplication. The GPT12E unit incorporates five 16-bit timers organized in two separate modules, GPT1 and GPT2. Each timer in each module may either operate independently in a number of different modes or be concatenated with another timer of the same module. Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for one of four basic modes of operation: Timer, Gated Timer, Counter, and Incremental Interface Mode. In Timer Mode, the input clock for a timer is derived from the system clock and divided by a programmable prescaler. Counter Mode allows timer clocking in reference to external events. Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the operation of a timer is controlled by the `gate' level on an external input pin. For these purposes each timer has one associated port pin (TxIN) which serves as a gate or clock input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles. The counting direction (up/down) for each timer can be programmed by software or altered dynamically by an external signal on a port pin (TxEUD), e.g. to facilitate position tracking. In Incremental Interface Mode the GPT1 timers can be directly connected to the incremental position sensor signals A and B through their respective inputs TxIN and TxEUD. Direction and counting signals are internally derived from these two input signals, so that the contents of the respective timer Tx corresponds to the sensor position. The third position sensor signal TOP0 can be connected to an interrupt input. Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out monitoring of external hardware components. It may also be used internally to clock timers T2 and T4 for measuring long time periods with high resolution. In addition to the basic operating modes, T2 and T4 may be configured as reload or capture register for timer T3. A timer used as capture or reload register is stopped. The contents of timer T3 is captured into T2 or T4 in response to a signal at the associated input pin (TxIN). Timer T3 is reloaded with the contents of T2 or T4, triggered either by an external signal or a selectable state transition of its toggle latch T3OTL. When both T2 and T4 are configured to alternately reload T3 on opposite state transitions of T3OTL with the low and high times of a PWM signal, this signal can be continuously generated without software intervention. Note: Signals T2IN, T2EUD, T4EUD, and T6EUD are not connected to pins. Data Sheet 42 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description T3CON.BPS1 fGPT 2n:1 Basic Clock Interrupt Request (T2IRQ) Aux. Timer T2 T2IN T2EUD U/D T2 Mode Reload Control Capture Interrupt Request (T3IRQ) T3IN T3 Mode Control T3EUD Core Timer T3 U/D T3OTL T3OUT Toggle Latch Capture T4IN T4EUD T4 Mode Control Reload Aux. Timer T4 U/D Interrupt Request (T4IRQ) MC_GPT_BLOCK1 Figure 8 Data Sheet Block Diagram of GPT1 43 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description With its maximum resolution of 2 system clock cycles, the GPT2 module provides precise event control and time measurement. It includes two timers (T5, T6) and a capture/reload register (CAPREL). Both timers can be clocked with an input clock which is derived from the CPU clock via a programmable prescaler or with external signals. The counting direction (up/down) for each timer can be programmed by software or altered dynamically with an external signal on a port pin (TxEUD). Concatenation of the timers is supported with the output toggle latch (T6OTL) of timer T6, which changes its state on each timer overflow/underflow. The state of this latch may be used to clock timer T5, and/or it may be output on pin T6OUT. The overflows/underflows of timer T6 can also be used to clock the CAPCOM2 timers and to initiate a reload from the CAPREL register. The CAPREL register can capture the contents of timer T5 based on an external signal transition on the corresponding port pin (CAPIN); timer T5 may optionally be cleared after the capture procedure. This allows the XE162xN to measure absolute time differences or to perform pulse multiplication without software overhead. The capture trigger (timer T5 to CAPREL) can also be generated upon transitions of GPT1 timer T3 inputs T3IN and/or T3EUD. This is especially advantageous when T3 operates in Incremental Interface Mode. Data Sheet 44 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description T6CON.BPS2 fGPT 2n:1 Basic Clock Interrupt Request (T5IRQ) GPT2 Timer T5 T5IN T5EUD T5 Mode Control U/D Clear Capture CAPIN T3IN/ T3EUD CAPREL Mode Control GPT2 CAPREL Interrupt Request (CRIRQ) Reload Clear Interrupt Request (T6IRQ) Toggle FF T6IN T6 Mode Control GPT2 Timer T6 T6OTL T6OUT T6OUF U/D T6EUD MC_GPT_BLOCK2 Figure 9 Data Sheet Block Diagram of GPT2 45 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.10 Real Time Clock The Real Time Clock (RTC) module of the XE162xN can be clocked with a clock signal selected from internal sources or external sources (pins). The RTC basically consists of a chain of divider blocks: * * * Selectable 32:1 and 8:1 dividers (on - off) The reloadable 16-bit timer T14 The 32-bit RTC timer block (accessible via registers RTCH and RTCL) consisting of: - a reloadable 10-bit timer - a reloadable 6-bit timer - a reloadable 6-bit timer - a reloadable 10-bit timer All timers count up. Each timer can generate an interrupt request. All requests are combined to a common node request. fRTC :32 M UX RUN M UX Interrupt Sub Node :8 PRE REFCLK CNT INT0 CNT INT1 CNT INT2 RTCINT CNT INT3 REL-Register f CNT T14REL 10 Bits 6 Bits 6 Bits 10 Bits T14 10 Bits 6 Bits 6 Bits 10 Bits T14-Register CNT-Register M CB05568B Figure 10 RTC Block Diagram Note: The registers associated with the RTC are only affected by a power reset. Data Sheet 46 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description The RTC module can be used for different purposes: * * * * System clock to determine the current time and date Cyclic time-based interrupt, to provide a system time tick independent of CPU frequency and other resources 48-bit timer for long-term measurements Alarm interrupt at a defined time Data Sheet 47 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.11 A/D Converters For analog signal measurement, up to two 10-bit A/D converters (ADC0, ADC1) with 7 + 2 multiplexed input channels and a sample and hold circuit have been integrated onchip. 2 inputs can be converted by both A/D converters. Conversions use the successive approximation method. The sample time (to charge the capacitors) and the conversion time are programmable so that they can be adjusted to the external circuit. The A/D converters can also operate in 8-bit conversion mode, further reducing the conversion time. Several independent conversion result registers, selectable interrupt requests, and highly flexible conversion sequences provide a high degree of programmability to meet the application requirements. Both modules can be synchronized to allow parallel sampling of two input channels. For applications that require more analog input channels, external analog multiplexers can be controlled automatically. For applications that require fewer analog input channels, the remaining channel inputs can be used as digital input port pins. The A/D converters of the XE162xN support two types of request sources which can be triggered by several internal and external events. * * Parallel requests are activated at the same time and then executed in a predefined sequence. Queued requests are executed in a user-defined sequence. In addition, the conversion of a specific channel can be inserted into a running sequence without disturbing that sequence. All requests are arbitrated according to the priority level assigned to them. Data reduction features reduce the number of required CPU access operations allowing the precise evaluation of analog inputs (high conversion rate) even at a low CPU speed. Result data can be reduced by limit checking or accumulation of results. The Peripheral Event Controller (PEC) can be used to control the A/D converters or to automatically store conversion results to a table in memory for later evaluation, without requiring the overhead of entering and exiting interrupt routines for each data transfer. Each A/D converter contains eight result registers which can be concatenated to build a result FIFO. Wait-for-read mode can be enabled for each result register to prevent the loss of conversion data. In order to decouple analog inputs from digital noise and to avoid input trigger noise, those pins used for analog input can be disconnected from the digital input stages. This can be selected for each pin separately with the Port x Digital Input Disable registers. The Auto-Power-Down feature of the A/D converters minimizes the power consumption when no conversion is in progress. Broken wire detection for each channel and a multiplexer test mode provide information to verify the proper operation of the analog signal sources (e.g. a sensor system). Data Sheet 48 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.12 Universal Serial Interface Channel Modules (USIC) The XE162xN features the USIC modules USIC0, USIC1, USIC2. Each module provides two serial communication channels. The Universal Serial Interface Channel (USIC) module is based on a generic data shift and data storage structure which is identical for all supported serial communication protocols. Each channel supports complete full-duplex operation with a basic data buffer structure (one transmit buffer and two receive buffer stages). In addition, the data handling software can use FIFOs. The protocol part (generation of shift clock/data/control signals) is independent of the general part and is handled by protocol-specific preprocessors (PPPs). The USIC's input/output lines are connected to pins by a pin routing unit. The inputs and outputs of each USIC channel can be assigned to different interface pins, providing great flexibility to the application software. All assignments can be made during runtime. Bus Buffer & Shift Structure Protocol Preprocessors Pins Control 0 DBU 0 PPP_B DSU 0 PPP_C PPP_D Control 1 PPP_A DBU 1 Pin Routing Shell Bus Interface PPP_A PPP_B DSU 1 PPP_C PPP_D fsys Fractional Dividers Baud rate Generators USIC_basic.vsd Figure 11 General Structure of a USIC Module The regular structure of the USIC module brings the following advantages: * * * Higher flexibility through configuration with same look-and-feel for data management Reduced complexity for low-level drivers serving different protocols Wide range of protocols with improved performances (baud rate, buffer handling) Data Sheet 49 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description Target Protocols Each USIC channel can receive and transmit data frames with a selectable data word width from 1 to 16 bits in each of the following protocols: * * * * * UART (asynchronous serial channel) - module capability: maximum baud rate = fSYS / 4 - data frame length programmable from 1 to 63 bits - MSB or LSB first LIN Support (Local Interconnect Network) - module capability: maximum baud rate = fSYS / 16 - checksum generation under software control - baud rate detection possible by built-in capture event of baud rate generator SSC/SPI (synchronous serial channel with or without data buffer) - module capability: maximum baud rate = fSYS / 2, limited by loop delay - number of data bits programmable from 1 to 63, more with explicit stop condition - MSB or LSB first - optional control of slave select signals IIC (Inter-IC Bus) - supports baud rates of 100 kbit/s and 400 kbit/s IIS (Inter-IC Sound Bus) - module capability: maximum baud rate = fSYS / 2 Note: Depending on the selected functions (such as digital filters, input synchronization stages, sample point adjustment, etc.), the maximum achievable baud rate can be limited. Please note that there may be additional delays, such as internal or external propagation delays and driver delays (e.g. for collision detection in UART mode, for IIC, etc.). Data Sheet 50 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.13 MultiCAN Module The MultiCAN module contains independently operating CAN nodes with Full-CAN functionality which are able to exchange Data and Remote Frames using a gateway function. Transmission and reception of CAN frames is handled in accordance with CAN specification V2.0 B (active). Each CAN node can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. All CAN nodes share a common set of message objects. Each message object can be individually allocated to one of the CAN nodes. Besides serving as a storage container for incoming and outgoing frames, message objects can be combined to build gateways between the CAN nodes or to set up a FIFO buffer. Note: The number of CAN nodes and message objects depends on the selected device type. The message objects are organized in double-chained linked lists, where each CAN node has its own list of message objects. A CAN node stores frames only into message objects that are allocated to its own message object list and it transmits only messages belonging to this message object list. A powerful, command-driven list controller performs all message object list operations. MultiCAN Module Kernel Clock Control CAN Node 0 Interrupt Control Port Control ... Linked List Control TXDCn RXDCn ... Message Object Buffer ... Address Decoder CAN Node n fCAN TXDC0 RXDC0 CAN Control mc_multican_block.vsd Figure 12 Data Sheet Block Diagram of MultiCAN Module 51 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description MultiCAN Features * * * * * * * * * * CAN functionality conforming to CAN specification V2.0 B active for each CAN node (compliant to ISO 11898) Independent CAN nodes Set of independent message objects (shared by the CAN nodes) Dedicated control registers for each CAN node Data transfer rate up to 1 Mbit/s, individually programmable for each node Flexible and powerful message transfer control and error handling capabilities Full-CAN functionality for message objects: - Can be assigned to one of the CAN nodes - Configurable as transmit or receive objects, or as message buffer FIFO - Handle 11-bit or 29-bit identifiers with programmable acceptance mask for filtering - Remote Monitoring Mode, and frame counter for monitoring Automatic Gateway Mode support 16 individually programmable interrupt nodes Analyzer mode for CAN bus monitoring 3.14 System Timer The System Timer consists of a programmable prescaler and two concatenated timers (10 bits and 6 bits). Both timers can generate interrupt requests. The clock source can be selected and the timers can also run during power reduction modes. Therefore, the System Timer enables the software to maintain the current time for scheduling functions or for the implementation of a clock. 3.15 Watchdog Timer The Watchdog Timer is one of the fail-safe mechanisms which have been implemented to prevent the controller from malfunctioning for longer periods of time. The Watchdog Timer is always enabled after an application reset of the chip. It can be disabled and enabled at any time by executing the instructions DISWDT and ENWDT respectively. The software has to service the Watchdog Timer before it overflows. If this is not the case because of a hardware or software failure, the Watchdog Timer overflows, generating a prewarning interrupt and then a reset request. The Watchdog Timer is a 16-bit timer clocked with the system clock divided by 16,384 or 256. The Watchdog Timer register is set to a prespecified reload value (stored in WDTREL) in order to allow further variation of the monitored time interval. Each time it is serviced by the application software, the Watchdog Timer is reloaded and the prescaler is cleared. Time intervals between 3.2 s and 13.4 s can be monitored (@ 80 MHz). The default Watchdog Timer interval after power-up is 6.5 ms (@ 10 MHz). Data Sheet 52 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.16 Clock Generation The Clock Generation Unit can generate the system clock signal fSYS for the XE162xN from a number of external or internal clock sources: * * * * External clock signals with pad voltage or core voltage levels External crystal or resonator using the on-chip oscillator On-chip clock source for operation without crystal/resonator Wake-up clock (ultra-low-power) to further reduce power consumption The programmable on-chip PLL with multiple prescalers generates a clock signal for maximum system performance from standard crystals, a clock input signal, or from the on-chip clock source. See also Section 4.7.2. The Oscillator Watchdog (OWD) generates an interrupt if the crystal oscillator frequency falls below a certain limit or stops completely. In this case, the system can be supplied with an emergency clock to enable operation even after an external clock failure. All available clock signals can be output on one of two selectable pins. Data Sheet 53 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.17 Parallel Ports The XE162xN provides up to 40 I/O lines which are organized into 4 input/output ports and 2 input ports. All port lines are bit-addressable, and all input/output lines can be individually (bit-wise) configured via port control registers. This configuration selects the direction (input/output), push/pull or open-drain operation, activation of pull devices, and edge characteristics (shape) and driver characteristics (output current) of the port drivers. The I/O ports are true bidirectional ports which are switched to high impedance state when configured as inputs. During the internal reset, all port pins are configured as inputs without pull devices active. All port lines have alternate input or output functions associated with them. These alternate functions can be programmed to be assigned to various port pins to support the best utilization for a given application. For this reason, certain functions appear several times in Table 9. All port lines that are not used for alternate functions may be used as general purpose I/O lines. Table 9 Summary of the XE162xN's Ports Port Width I/O Connected Modules P2 11 I/O CAN, CC2, GPT12E, USIC, DAP/JTAG P5 7 I Analog Inputs, CCU6, DAP/JTAG, GPT12E, CAN P6 2 I/O ADC, CAN, GPT12E P7 1 I/O CAN, GPT12E, SCU, DAP/JTAG, USIC P10 16 I/O CCU6, USIC, DAP/JTAG, CAN P15 2 I Analog Inputs, GPT12E Data Sheet 54 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description 3.18 Instruction Set Summary Table 10 lists the instructions of the XE162xN. The addressing modes that can be used with a specific instruction, the function of the instructions, parameters for conditional execution of instructions, and the opcodes for each instruction can be found in the "Instruction Set Manual". This document also provides a detailed description of each instruction. Table 10 Instruction Set Summary Mnemonic Description Bytes ADD(B) Add word (byte) operands 2/4 ADDC(B) Add word (byte) operands with Carry 2/4 SUB(B) Subtract word (byte) operands 2/4 SUBC(B) Subtract word (byte) operands with Carry 2/4 MUL(U) (Un)Signed multiply direct GPR by direct GPR (16- x 16-bit) 2 DIV(U) (Un)Signed divide register MDL by direct GPR (16-/16-bit) 2 DIVL(U) (Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2 CPL(B) Complement direct word (byte) GPR 2 NEG(B) Negate direct word (byte) GPR 2 AND(B) Bitwise AND, (word/byte operands) 2/4 OR(B) Bitwise OR, (word/byte operands) 2/4 XOR(B) Bitwise exclusive OR, (word/byte operands) 2/4 BCLR/BSET Clear/Set direct bit 2 BMOV(N) Move (negated) direct bit to direct bit 4 BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit 4 BCMP Compare direct bit to direct bit 4 BFLDH/BFLDL Bitwise modify masked high/low byte of bit-addressable direct word memory with immediate data 4 CMP(B) Compare word (byte) operands 2/4 CMPD1/2 Compare word data to GPR and decrement GPR by 1/2 2/4 CMPI1/2 Compare word data to GPR and increment GPR by 1/2 2/4 PRIOR Determine number of shift cycles to normalize direct word GPR and store result in direct word GPR 2 SHL/SHR Shift left/right direct word GPR 2 Data Sheet 55 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description Table 10 Instruction Set Summary (cont'd) Mnemonic Description Bytes ROL/ROR Rotate left/right direct word GPR 2 ASHR Arithmetic (sign bit) shift right direct word GPR 2 MOV(B) Move word (byte) data 2/4 MOVBS/Z Move byte operand to word op. with sign/zero extension 2/4 JMPA/I/R Jump absolute/indirect/relative if condition is met 4 JMPS Jump absolute to a code segment 4 JB(C) Jump relative if direct bit is set (and clear bit) 4 JNB(S) Jump relative if direct bit is not set (and set bit) 4 CALLA/I/R Call absolute/indirect/relative subroutine if condition is met 4 CALLS Call absolute subroutine in any code segment 4 PCALL Push direct word register onto system stack and call absolute subroutine 4 TRAP Call interrupt service routine via immediate trap number 2 PUSH/POP Push/pop direct word register onto/from system stack 2 SCXT Push direct word register onto system stack and update register with word operand 4 RET(P) Return from intra-segment subroutine (and pop direct word register from system stack) 2 RETS Return from inter-segment subroutine 2 RETI Return from interrupt service subroutine 2 SBRK Software Break 2 SRST Software Reset 4 IDLE Enter Idle Mode PWRDN Unused instruction 4 1) 4 SRVWDT Service Watchdog Timer 4 DISWDT/ENWDT Disable/Enable Watchdog Timer 4 EINIT End-of-Initialization Register Lock 4 ATOMIC Begin ATOMIC sequence 2 EXTR Begin EXTended Register sequence 2 EXTP(R) Begin EXTended Page (and Register) sequence 2/4 EXTS(R) Begin EXTended Segment (and Register) sequence 2/4 Data Sheet 56 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Functional Description Table 10 Instruction Set Summary (cont'd) Mnemonic Description Bytes NOP Null operation 2 CoMUL/CoMAC Multiply (and accumulate) 4 CoADD/CoSUB Add/Subtract 4 Co(A)SHR (Arithmetic) Shift right 4 CoSHL Shift left 4 CoLOAD/STORE Load accumulator/Store MAC register 4 CoCMP Compare 4 CoMAX/MIN Maximum/Minimum 4 CoABS/CoRND Absolute value/Round accumulator 4 CoMOV Data move 4 CoNEG/NOP Negate accumulator/Null operation 4 1) The Enter Power Down Mode instruction is not used in the XE162xN, due to the enhanced power control scheme. PWRDN will be correctly decoded, but will trigger no action. Data Sheet 57 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4 Electrical Parameters The operating range for the XE162xN is defined by its electrical parameters. For proper operation the specified limits must be respected when integrating the device in its target environment. 4.1 General Parameters These parameters are valid for all subsequent descriptions, unless otherwise noted. Table 11 Absolute Maximum Rating Parameters Parameter Symbol Values Unit Min. Typ. Max. Note / Test Condition Output current on a pin when high value is driven IOH SR -30 - - mA Output current on a pin when low value is driven IOL SR - - 30 mA -10 - 10 mA 1) - - 100 mA 1) IOV SR Absolute sum of overload |IOV| Overload current currents SR Junction Temperature TJ SR -40 TST SR -65 VDDP SR -0.5 - 150 C - 150 C - 6.0 V VIN SR - Storage Temperature Digital supply voltage for IO pads and voltage regulators Voltage on any pin with respect to ground (Vss) -0.5 VDDP + V 0.5 VIN VDDP(max) 1) Overload condition occurs if the input voltage VIN is out of the absolute maximum rating range. In this case the current must be limited to the listed values by design measures. Note: Stresses above the values listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for an extended time may affect device reliability. During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the voltage on VDDP pins with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings. Data Sheet 58 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.1.1 Operating Conditions The following operating conditions must not be exceeded to ensure correct operation of the XE162xN. All parameters specified in the following sections refer to these operating conditions, unless otherwise noticed. Note: Typical parameter values refer to room temperature and nominal supply voltage, minimum/maximum parameter values also include conditions of minimum/maximum temperature and minimum/maximum supply voltage. Additional details are described where applicable. Table 12 Operating Conditions Parameter Symbol Values Unit Min. Typ. Max. Note / Test Condition Voltage Regulator Buffer Capacitance for DMP_M CEVRM 1.0 - 4.7 F 1) Voltage Regulator Buffer Capacitance for DMP_1 CEVR1 0.47 - 2.2 F 2)1) External Load Capacitance CL SR - 203) - pF System frequency fSYS SR - IOVA SR -2 Overload current for analog inputs6) SR SR 4) Overload current for digital IOVD SR -5 inputs6) Overload current coupling KOVA factor for analog inputs7) CC - - Data Sheet pin out driver= default 59 5) - 80 MHz - 5 mA not subject to production test - 5 mA not subject to production test 2.5 x 10-4 1.5 x 10-3 - IOV< 0 mA; not 1.0 x 10-6 1.0 x 10-4 - subject to production test IOV> 0 mA; not subject to production test V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 12 Operating Conditions (cont'd) Parameter Symbol Overload current coupling KOVD factor for digital I/O pins CC Values Unit Note / Test Condition 3.0 x 10-2 - IOV< 0 mA; not 1.0 x 10-4 5.0 x 10-3 - mA Min. Typ. Max. - 1.0 x 10-2 - subject to production test subject to production test |IOV| SR - - 50 Digital core supply voltage VDDIM for domain M8) CC - 1.5 - Digital core supply voltage VDDI1 for domain 18) CC - 1.5 - - 5.5 V 0 - V Absolute sum of overload currents Digital supply voltage for IO pads and voltage regulators VDDP SR 3.0 Digital ground voltage VSS SR - IOV> 0 mA; not not subject to production test 1) To ensure the stability of the voltage regulators the EVRs must be buffered with ceramic capacitors. Separate buffer capacitors with the recomended values shall be connected as close as possible to each VDDIM and VDDI1 pin to keep the resistance of the board tracks below 2 Ohm. Connect all VDDI1 pins together. The minimum capacitance value is required for proper operation under all conditions (e.g. temperature). Higher values slightly increase the startup time. 2) Use one Capacitor for each pin. 3) This is the reference load. For bigger capacitive loads, use the derating factors listed in the pad properties section. 4) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output current may lead to increased delays or reduced driving capability (CL). 5) The operating frequency range may be reduced for specific device types. This is indicated in the device designation (...FxxL). 80 MHz devices are marked ...F80L. 6) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin exceeds the specified range: VOV > VIHmax (IOV > 0) or VOV < VILmin ((IOV < 0). The absolute sum of input overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the specified limits. Proper operation under overload conditions depends on the application. Overload conditions must not occur on pin XTAL1 (powered by VDDIM). Data Sheet 60 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 7) An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error current adds to the respective pins leakage current (IOZ). The amount of error current depends on the overload current and is defined by the overload coupling factor KOV. The polarity of the injected error current is inverse compared to the polarity of the overload current that produces it.The total current through a pin is |ITOT| = |IOZ| + (|IOV| KOV). The additional error current may distort the input voltage on analog inputs. 8) Value is controlled by on-chip regulator 4.2 Voltage Range definitions The XE162xN timing depends on the supply voltage. If such a dependency exists the timing values are given for 2 voltage areas commonly used. The voltage areas are defined in the following tables. Table 13 Upper Voltage Range Definition Parameter Symbol Values Min. Digital supply voltage for IO pads and voltage regulators Table 14 VDDP SR 4.5 Max. 5 5.5 Note / Test Condition V Lower Voltage Range Definition Parameter Symbol Digital supply voltage for IO pads and voltage regulators VDDP SR 3.0 Values Min. 4.2.1 Unit Typ. Unit Typ. Max. 3.3 4.5 Note / Test Condition V Parameter Interpretation The parameters listed in the following include both the characteristics of the XE162xN and its demands on the system. To aid in correctly interpreting the parameters when evaluating them for a design, they are marked accordingly in the column "Symbol": CC (Controller Characteristics): The logic of the XE162xN provides signals with the specified characteristics. SR (System Requirement): The external system must provide signals with the specified characteristics to the XE162xN. Data Sheet 61 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.3 DC Parameters These parameters are static or average values that may be exceeded during switching transitions (e.g. output current). The XE162xN can operate within a wide supply voltage range from 3.0 V to 5.5 V. However, during operation this supply voltage must remain within 10 percent of the selected nominal supply voltage. It cannot vary across the full operating voltage range. Because of the supply voltage restriction and because electrical behavior depends on the supply voltage, the parameters are specified separately for the upper and the lower voltage range. During operation, the supply voltages may only change with a maximum speed of dV/dt < 1 V/ms. Leakage current is strongly dependent on the operating temperature and the voltage level at the respective pin. The maximum values in the following tables apply under worst case conditions, i.e. maximum temperature and an input level equal to the supply voltage. The value for the leakage current in an application can be determined by using the respective leakage derating formula (see tables) with values from that application. The pads of the XE162xN are designed to operate in various driver modes. The DC parameter specifications refer to the pad current limits specified in Section 4.7.4. Data Sheet 62 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Pullup/Pulldown Device Behavior Most pins of the XE162xN feature pullup or pulldown devices. For some special pins these are fixed; for the port pins they can be selected by the application. The specified current values indicate how to load the respective pin depending on the intended signal level. Figure 13 shows the current paths. The shaded resistors shown in the figure may be required to compensate system pull currents that do not match the given limit values. VDDP Pullup Pulldown VSS MC_XC2X_PULL Figure 13 Data Sheet Pullup/Pulldown Current Definition 63 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.3.1 DC Parameters for Upper Voltage Area Keeping signal levels within the limits specified in this table ensures operation without overload conditions. For signal levels outside these specifications, also refer to the specification of the overload current IOV. Note: Operating Conditions apply. Table 15 is valid under the following conditions: VDDP 5.5 V; VDDPtyp. 5 V; VDDP 4.5 V Table 15 DC Characteristics for Upper Voltage Range Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. - - 10 pF not subject to production test - - V RS= 0 Ohm Pin capacitance (digital inputs/outputs). To be doubled for double bond pins.1) CIO CC Input Hysteresis2) HYS CC 0.11 x VDDP Absolute input leakage current on pins of analog ports3) |IOZ1| CC - 10 200 nA VIN> VSS ; VIN< VDDP Absolute input leakage current for all other pins. To be doubled for double bond pins.3)1)4) |IOZ2| CC - 0.2 5 A - 0.2 15 A Pull Level Force Current5) |IPLF| SR 250 - - A Pull Level Keep Current6) |IPLK| SR - - 30 A TJ 110 C; VIN> VSS ; VIN< VDDP TJ 150 C; VIN> VSS ; VIN< VDDP VIN VIHmin(pull down_enabled); VIN VILmax(pull up_enabled) VIN VIHmin(pull up_enabled); VIN VILmax(pull down_enabled) Input high voltage (all except XTAL1) VIH SR 0.7 x - Input low voltage (all except XTAL1) VIL SR Data Sheet VDDP - -0.3 VDDP + V 0.3 0.3 x V VDDP 64 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 15 DC Characteristics for Upper Voltage Range (cont'd) Parameter Symbol Values Min. Output High voltage7) Typ. Unit Note / Test Condition Max. VOH CC VDDP - - - V IOH IOHmax VDDP - - - V IOH IOHnom 8) - - 0.4 V - - 1.0 V IOL IOLnom 8) IOL IOLmax 1.0 0.4 Output Low Voltage 7) VOL CC 1) Because each double bond pin is connected to two pads (standard pad and high-speed pad), it has twice the normal value. For a list of affected pins refer to the pin definitions table in chapter 2. 2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It cannot suppress switching due to external system noise under all conditions. 3) If the input voltage exceeds the respective supply voltage due to ground bouncing (VIN < VSS) or supply ripple (VIN > VDDP), a certain amount of current may flow through the protection diodes. This current adds to the leakage current. An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. Please refer to the definition of the overload coupling factor KOV. 4) The given values are worst-case values. In production test, this leakage current is only tested at 125 C; other values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating depending on temperature (TJ = junction temperature [C]): IOZ = 0.05 x e(1.5 + 0.028 x TJ>) [A]. For example, at a temperature of 95 C the resulting leakage current is 3.2 A. Leakage derating depending on voltage level (DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) (A]. This voltage derating formula is an approximation which applies for maximum temperature. 5) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull device. 6) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default pin level. 7) The maximum deliverable output current of a port driver depends on the selected output driver mode. This specification is not valid for outputs which are switched to open drain mode. In this case the respective output will float and the voltage is determined by the external circuit. 8) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS, VOH->VDDP). However, only the levels for nominal output currents are verified. Data Sheet 65 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.3.2 DC Parameters for Lower Voltage Area Keeping signal levels within the limits specified in this table ensures operation without overload conditions. For signal levels outside these specifications, also refer to the specification of the overload current IOV. Note: Operating Conditions apply. Table 16 is valid under the following conditions: VDDP 3.0 V; VDDPtyp. 3.3 V; VDDP 4.5 V Table 16 DC Characteristics for Lower Voltage Range Parameter Symbol Values Pin capacitance (digital inputs/outputs). To be doubled for double bond pins.1) CIO CC Input Hysteresis2) HYS CC 0.07 x Unit Note / Test Condition Min. Typ. Max. - - 10 pF not subject to production test - - V RS= 0 Ohm VDDP Absolute input leakage current on pins of analog ports3) |IOZ1| CC - 10 200 nA VIN> VSS ; VIN< VDDP Absolute input leakage current for all other pins. To be doubled for double bond pins.3)1)4) |IOZ2| CC - 0.2 2.5 A - 0.2 8 A Pull Level Force Current5) |IPLF| SR 150 - - A Pull Level Keep Current6) |IPLK| SR - - 10 A TJ 110 C; VIN> VSS ; VIN< VDDP TJ 150 C; VIN> VSS ; VIN< VDDP VIN VIHmin(pull down) ; VIN VILmax(pull up) VIN VIHmin(pull up) ; VIN VILmax(pull down) Input high voltage (all except XTAL1) VIH SR 0.7 x - Input low voltage (all except XTAL1) VIL SR Data Sheet VDDP - -0.3 VDDP + V 0.3 0.3 x V VDDP 66 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 16 DC Characteristics for Lower Voltage Range (cont'd) Parameter Symbol Values Min. Output High voltage7) Typ. Unit Note / Test Condition Max. VOH CC VDDP - - - V IOH IOHmax VDDP - - - V IOH IOHnom 8) - - 0.4 V - - 1.0 V IOL IOLnom 8) IOL IOLmax 1.0 0.4 Output Low Voltage 7) VOL CC 1) Because each double bond pin is connected to two pads (standard pad and high-speed pad), it has twice the normal value. For a list of affected pins refer to the pin definitions table in chapter 2. 2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It cannot suppress switching due to external system noise under all conditions. 3) If the input voltage exceeds the respective supply voltage due to ground bouncing (VIN < VSS) or supply ripple (VIN > VDDP), a certain amount of current may flow through the protection diodes. This current adds to the leakage current. An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. Please refer to the definition of the overload coupling factor KOV. 4) The given values are worst-case values. In production test, this leakage current is only tested at 125 C; other values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating depending on temperature (TJ = junction temperature [C]): IOZ = 0.05 x e(1.5 + 0.028 x TJ>) [A]. For example, at a temperature of 95 C the resulting leakage current is 3.2 A. Leakage derating depending on voltage level (DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) (A]. This voltage derating formula is an approximation which applies for maximum temperature. 5) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull device: VPIN <= VIL for a pullup; VPIN >= VIH for a pulldown. 6) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default pin level: VPIN >= VIH for a pullup; VPIN <= VIL for a pulldown. 7) The maximum deliverable output current of a port driver depends on the selected output driver mode. This specification is not valid for outputs which are switched to open drain mode. In this case the respective output will float and the voltage is determined by the external circuit. 8) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS, VOH->VDDP). However, only the levels for nominal output currents are verified. Data Sheet 67 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.3.3 Power Consumption The power consumed by the XE162xN depends on several factors such as supply voltage, operating frequency, active circuits, and operating temperature. The power consumption specified here consists of two components: * * The switching current IS depends on the device activity The leakage current ILK depends on the device temperature To determine the actual power consumption, always both components, switching current IS and leakage current ILK must be added: IDDP = IS + ILK. Note: The power consumption values are not subject to production test. They are verified by design/characterization. To determine the total power consumption for dimensioning the external power supply, also the pad driver currents must be considered. The given power consumption parameters and their values refer to specific operating conditions: * * Active mode: Regular operation, i.e. peripherals are active, code execution out of Flash. Stopover mode: Crystal oscillator and PLL stopped, Flash switched off, clock in domain DMP_1 stopped. Note: The maximum values cover the complete specified operating range of all manufactured devices. The typical values refer to average devices under typical conditions, such as nominal supply voltage, room temperature, application-oriented activity. After a power reset, the decoupling capacitors for VDDIM and VDDI1 are charged with the maximum possible current. For additional information, please refer to Section 5.2, Thermal Considerations. Note: Operating Conditions apply. Data Sheet 68 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 17 Parameter Switching Power Consumption Symbol Power supply current ISACT (active) with all peripherals CC active and EVVRs on Values Unit Typ. - 6 + 0.6 8 + 1.0 mA x fSYS1) x fSYS1) power_mode= active ; voltage_range= both 2)3)4) 0.7 power_mode= stopover ; voltage_range= both 4) Power supply current in ISSO CC - stopover mode, EVVRs on Max. Note / Test Condition Min. 2.0 mA 1) fSYS in MHz 2) The pad supply voltage pins (VDDPB) provide the input current for the on-chip EVVRs and the current consumed by the pin output drivers. A small current is consumed because the drivers input stages are switched. In Fast Startup Mode (with the Flash modules deactivated), the typical current is reduced to 3 + 0.6 x fSYS. 3) Please consider the additional conditions described in section "Active Mode Power Supply Current". 4) The pad supply voltage has only a minor influence on this parameter. Active Mode Power Supply Current The actual power supply current in active mode not only depends on the system frequency but also on the configuration of the XE162xN's subsystem. Besides the power consumed by the device logic the power supply pins also provide the current that flows through the pin output drivers. A small current is consumed because the drivers' input stages are switched. The IO power domains can be supplied separately. Power domain A (VDDPA) supplies the A/D converters and Port 6. Power domain B (VDDPB) supplies the on-chip EVVRs and all other ports. During operation domain A draws a maximum current of 1.5 mA for each active A/D converter module from VDDPA. In Fast Startup Mode (with the Flash modules deactivated), the typical current is reduced to 3 + 0.6xfSYS mA. Data Sheet 69 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters IS [mA] 100 ISACTmax 90 80 70 ISACTtyp 60 50 40 30 20 10 20 60 40 80 fSYS [MHz] MC_XC2XN_IS Figure 14 Supply Current in Active Mode as a Function of Frequency Note: Operating Conditions apply. Table 18 Leakage Power Consumption Parameter Symbol Leakage supply current 1) ILK1 CC Values Unit Note / Test Condition TJ= 25 C1) TJ= 85 C1) TJ= 125 C1) TJ= 150 C1) Min. Typ. Max. - 0.03 0.04 mA - 0.5 1.2 mA - 1.9 5.5 mA - 3.9 12.2 mA 1) All inputs (including pins configured as inputs) are set at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP and all outputs (including pins configured as outputs) are disconnected. Data Sheet 70 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Note: A fraction of the leakage current flows through domain DMP_A (pin VDDPA). This current can be calculated as 7,000 x e-, with = 5000 / (273 + 1.3 x TJ). For TJ = 150C, this results in a current of 160 A. Leakage Power Consumption Calculation The leakage power consumption can be calculated according to the following formula: ILK1 = 530,000 x e- with = 5000 / (273 + B x TJ) Parameter B must be replaced by * * 1.0 for typical values 1.3 for maximum values ILK [mA] ILK1max 12 10 8 6 ILK1typ 4 2 -50 0 100 50 125 150 TJ [C] MC_XC2XN_ILKN Figure 15 Leakage Supply Current as a Function of Temperature Data Sheet 71 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.4 Analog/Digital Converter Parameters These parameters describe the conditions for optimum ADC performance. Note: Operating Conditions apply. Table 19 ADC Parameters Parameter Symbol Switched capacitance at an analog input CAINSW Values Min. Typ. Max. - - 4 Unit Note / Test Condition pF not subject to production test CC 1) - Total capacitance at an analog input CAINT Switched capacitance at the reference input CAREFSW - Total capacitance at the reference input CAREFT - 10 pF CC not subject to production test 1) - 7 pF CC not subject to production test 1) - - 15 pF CC not subject to production test 1) Differential Non-Linearity Error |EADNL| CC - 0.8 1 LSB Gain Error |EAGAIN| - CC 0.4 0.8 LSB Integral Non-Linearity |EAINL| CC - 0.8 1.2 LSB Offset Error |EAOFF| CC - 0.5 0.8 LSB Analog clock frequency fADCI SR 0.5 - 16.5 MHz voltage_range= lower 0.5 - 20 MHz voltage_range= upper - 2 kOh m not subject to production test kOh m not subject to production test Input resistance of the selected analog channel Input resistance of the reference input RAIN CC - RAREF - - CC 2 1) 1) Data Sheet 72 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 19 ADC Parameters (cont'd) Parameter Symbol Values Min. Unit Typ. Max. Broken wire detection delay against VAGND2) tBWG CC - - 503) Broken wire detection delay against VAREF2) tBWR CC - - 504) Conversion time for 8-bit result2) tc8 CC (11+S - TC) x tADCI + 2x Note / Test Condition - tSYS Conversion time for 10-bit tc10 CC result2) (13+S - TC) x tADCI + - 2x tSYS - 1 2 LSB Wakeup time from analog tWAF CC - powerdown, fast mode - 4 s Wakeup time from analog tWAS CC - powerdown, slow mode - 15 s - 1.5 V VAIN SR VAGND - VAREF V VAREF - VDDPA V Total Unadjusted Error Analog reference ground |TUE| CC VAGND SR Analog input voltage range Analog reference voltage SR VSS - 5) 0.05 VAGND + 1.0 6) + 0.05 1) These parameter values cover the complete operating range. Under relaxed operating conditions (temperature, supply voltage) typical values can be used for calculation. At room temperature and nominal supply voltage the following typical values can be used: CAINTtyp = 12 pF, CAINStyp = 5 pF, RAINtyp = 1.0 kOhm, CAREFTtyp = 15 pF, CAREFStyp = 10 pF, RAREFtyp = 1.0 kOhm. 2) This parameter includes the sample time (also the additional sample time specified by STC), the time to determine the digital result and the time to load the result register with the conversion result. Values for the basic clock tADCI depend on programming. 3) The broken wire detection delay against VAGND is measured in numbers of consecutive precharge cycles at a conversion rate of not more than 500 s. Result below 10% (66H) Data Sheet 73 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4) The broken wire detection delay against VAREF is measured in numbers of consecutive precharge cycles at a conversion rate of not more than 10 s. This function is influenced by leakage current, in particular at high temperature. Result above 80% (332H) 5) TUE is tested at VAREF = VDDPA = 5.0 V, VAGND = 0 V. It is verified by design for all other voltages within the defined voltage range. The specified TUE is valid only if the absolute sum of input overload currents on analog port pins (see IOV specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the measurement time. 6) VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these cases will be X000H or X3FFH, respectively. RSource V AIN R AIN, On C AINT - C AINS C Ext A/D Converter CAINS MCS05570 Figure 16 Data Sheet Equivalent Circuitry for Analog Inputs 74 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Sample time and conversion time of the XE162xN's A/D converters are programmable. The timing above can be calculated using Table 20. The limit values for fADCI must not be exceeded when selecting the prescaler value. Table 20 A/D Converter Computation Table GLOBCTR.5-0 (DIVA) A/D Converter Analog Clock fADCI INPCRx.7-0 (STC) 000000B fSYS fSYS / 2 fSYS / 3 fSYS / (DIVA+1) fSYS / 63 fSYS / 64 00H 000001B 000010B : 111110B 111111B 01H 02H : FEH FFH Sample Time1) tS tADCI x 2 tADCI x 3 tADCI x 4 tADCI x (STC+2) tADCI x 256 tADCI x 257 1) The selected sample time is doubled if broken wire detection is active (due to the presampling phase). Converter Timing Example A: Assumptions: Analog clock Sample time fSYS fADCI tS = 80 MHz (i.e. tSYS = 12.5 ns), DIVA = 03H, STC = 00H = fSYS / 4 = 20 MHz, i.e. tADCI = 50 ns = tADCI x 2 = 100 ns Conversion 10-bit: tC10 = 13 x tADCI + 2 x tSYS = 13 x 50 ns + 2 x 12.5 ns = 0.675 s Conversion 8-bit: tC8 = 11 x tADCI + 2 x tSYS = 11 x 50 ns + 2 x 12.5 ns = 0.575 s Converter Timing Example B: Assumptions: Analog clock Sample time fSYS fADCI tS = 40 MHz (i.e. tSYS = 25 ns), DIVA = 02H, STC = 03H = fSYS / 3 = 13.3 MHz, i.e. tADCI = 75 ns = tADCI x 5 = 375 ns Conversion 10-bit: tC10 = 16 x tADCI + 2 x tSYS = 16 x 75 ns + 2 x 25 ns = 1.25 s Conversion 8-bit: tC8 Data Sheet = 14 x tADCI + 2 x tSYS = 14 x 75 ns + 2 x 25 ns = 1.10 s 75 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.5 System Parameters The following parameters specify several aspects which are important when integrating the XE162xN into an application system. Note: These parameters are not subject to production test but verified by design and/or characterization. Note: Operating Conditions apply. Table 21 Various System Parameters Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition TJ 10C Short-term deviation of internal clock source frequency1) fINT CC -1 - 1 % Internal clock source frequency fINT CC 4.8 5.0 5.2 MHz Wakeup clock source frequency2) fWU CC 400 - 700 kHz FREQSEL= 00 210 - 390 kHz FREQSEL= 01 140 - 260 kHz FREQSEL= 10 110 - 200 kHz FREQSEL= 11 2.0 2.4 ms fWU= 500 kHz - 12 / s VLV + V Startup time from poweron with code execution from Flash tSPO CC 1.5 Startup time from stopover tSSO CC 11 / mode with code execution fWU3) from PSRAM fWU3) 5) Core voltage (PVC) supervision level VPVC CC VLV - VLV Supply watchdog (SWD) supervision level VSWD VLV - VLV VLV + 0.15 V voltage_range= lower 5) VLV 0.15 VLV VLV + 0.15 V voltage_range= upper 5) VLV - VLV VLV + V VLV = 5.5 V 5) 0.03 CC 0.106) 0.30 0.07 0.30 4) 1) The short-term frequency deviation refers to a timeframe of a few hours and is measured relative to the current frequency at the beginning of the respective timeframe. This parameter is useful to determine a time span for re-triggering a LIN synchronization. Data Sheet 76 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 2) This parameter is tested for the fastest and the slowest selection. The medium selections are not subject to production test - verified by design/characterization 3) fWU in MHz 4) This value includes a hysteresis of approximately 50 mV for rising voltage. 5) VLV = selected SWD voltage level 6) The limit VLV - 0.10 V is valid for the OK1 level. The limit for the OK2 level is VLV - 0.15 V. Conditions for tSPO Timing Measurement The time required for the transition from Power-on to Base mode is called tSPO. It is measured under the following conditions: Precondition: The pad supply is valid, i.e. VDDPB is above 3.0V and remains above 3.0V even though the XE162xN is starting up. No debugger is attached. Start condition: Power-on reset is removed (PORST = 1). End condition: External pin toggle caused by first user instruction executed from FLASH after startup. Conditions for tSSO Timing Measurement The time required for the transition from Stopover to Stopover Waked-Up mode is called tSSO. It is measured under the following conditions: Precondition: The Stopover mode has been entered using the procedure defined in the Programmer's Guide. Start condition: Pin toggle on ESR pin triggering the startup sequence. End condition: External pin toggle caused by first user instruction executed from PSRAM after startup. Data Sheet 77 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Coding of bit fields LEVxV in SWD Configuration Registers After power-on the supply watch dog is preconfigured to operate in the lower voltage range. Table 22 Coding of bit fields LEVxV in Register SWDCON0 Code Voltage Level Notes1) 0000B - out of valid operation range 0001B 3.0 V LEV1V: reset request 0010B - 0101B 3.1 V- 3.4 V step width is 0.1 V 0110B 3.6 V 0111B 4.0 V 1000B 4.2 V 1001B 4.5 V LEV2V: no request 1010B - 1110B 4.6 V - 5.0 V step width is 0.1 V 1111B 5.5 V 1) The indicated default levels for LEV1V and LEV2V are selected automatically after a power-on reset. Coding of bit fields LEVxV in PVC Configuration Registers The core voltages are controlled internally to the nominal value of 1.5 V; a variation of 10 % is allowed. These operation conditions limit the possible PVC monitoring values to the predefined reset values shown in Table 23. Table 23 Coding of bit fields LEVxV in Registers PVCyCONz Code Voltage Level Notes1) 000B-011B - out of valid operation range 100B 1.35 V LEV1V: reset request 101B 1.45 V LEV2V: interrupt request2) 110B - 111B - out of valid operation range 1) The indicated default levels for LEV1V and LEV2V are selected automatically after a power-on reset. 2) Due to variations of the tolerance of both the Embedded Voltage Regulators (EVR) and the PVC levels, this interrupt can be triggered inadvertently, even though the core voltage is within the normal range. It is, therefore, recommended not to use this warning level. Data Sheet 78 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.6 Flash Memory Parameters The XE162xN is delivered with all Flash sectors erased and with no protection installed. The data retention time of the XE162xN's Flash memory (i.e. the time after which stored data can still be retrieved) depends on the number of times the Flash memory has been erased and programmed. Note: These parameters are not subject to production test but verified by design and/or characterization. Note: Operating Conditions apply. Table 24 Flash Parameters Parameter Symbol NPP SR Parallel Flash module program/erase limit depending on Flash read activity Values Unit Min. Typ. Max. - - 21) - 1 2) - Flash erase endurance for security pages NSEC SR 10 - - Flash wait states3) NWSFLAS 1 - - 2 - - 3 - - 4 - H SR NFL_RD 1 NFL_RD> 1 cycles tRET 20 years fSYS 8 MHz fSYS 13 MHz fSYS 17 MHz fSYS> 17 MHz - 4) Note / Test Condition Erase time per sector/page tER CC - 7 8.0 ms Programming time per page tPR CC - 34) 3.5 ms Data retention time tRET CC 20 - - years NDD SR 32 NER SR - - - - 15.000 cycles tRET 5 years; Valid for Flash module 1 (up to 64 kbytes) - 1.000 Drain disturb limit Number of erase cycles NER 1,000 cycl es - cycles cycles tRET 20 years 1) The unused Flash module(s) can be erased/programmed while code is executed and/or data is read from only one Flash module or from PSRAM. The Flash module that delivers code/data can, of course, not be erased/programmed. Data Sheet 79 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 2) Flash module 1 can be erased/programmed while code is executed and/or data is read from Flash module 0. 3) Value of IMB_IMBCTRL.WSFLASH. 4) Programming and erase times depend on the internal Flash clock source. The control state machine needs a few system clock cycles. This increases the stated durations noticably only at extremely low system clock frequencies. Access to the XE162xN Flash modules is controlled by the IMB. Built-in prefetch mechanisms optimize the performance for sequential access. Flash access waitstates only affect non-sequential access. Due to prefetch mechanisms, the performance for sequential access (depending on the software structure) is only partially influenced by waitstates. Data Sheet 80 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.7 AC Parameters These parameters describe the dynamic behavior of the XE162xN. 4.7.1 Testing Waveforms These values are used for characterization and production testing (except pin XTAL1). Output delay Output delay Hold time Hold time 0.8 V DDP 0.7 V DDP Input Signal (driven by tester) 0.3 V DDP 0.2 V DDP Output Signal (measured) Output timings refer to the rising edge of CLKOUT. Input timings are calculated from the time, when the input signal reaches V IH or V IL, respectively. MCD05556C Figure 17 Input Output Waveforms VLoad + 0.1 V Timing Reference Points V Load - 0.1 V V OH - 0.1 V V OL + 0.1 V For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs, but begins to float when a 100 mV change from the loaded V OH /V OL level occurs (IOH / IOL = 20 mA). MCA05565 Figure 18 Data Sheet Floating Waveforms 81 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.7.2 Definition of Internal Timing The internal operation of the XE162xN is controlled by the internal system clock fSYS. Because the system clock signal fSYS can be generated from a number of internal and external sources using different mechanisms, the duration of the system clock periods (TCSs) and their variation (as well as the derived external timing) depend on the mechanism used to generate fSYS. This must be considered when calculating the timing for the XE162xN. Phase Locked Loop Operation (1:N) fI N f SYS TCS Direct Clock Drive (1:1) fI N f SYS TCS Prescaler Operation (N:1) fI N f SYS TCS M C_XC2X_CLOCKGEN Figure 19 Generation Mechanisms for the System Clock Note: The example of PLL operation shown in Figure 19 uses a PLL factor of 1:4; the example of prescaler operation uses a divider factor of 2:1. The specification of the external timing (AC Characteristics) depends on the period of the system clock (TCS). Data Sheet 82 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Direct Drive When direct drive operation is selected (SYSCON0.CLKSEL = 11B), the system clock is derived directly from the input clock signal CLKIN1: fSYS = fIN. The frequency of fSYS is the same as the frequency of fIN. In this case the high and low times of fSYS are determined by the duty cycle of the input clock fIN. Selecting Bypass Operation from the XTAL11) input and using a divider factor of 1 results in a similar configuration. Prescaler Operation When prescaler operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY = 1B), the system clock is derived either from the crystal oscillator (input clock signal XTAL1) or from the internal clock source through the output prescaler K1 (= K1DIV+1): fSYS = fOSC / K1. If a divider factor of 1 is selected, the frequency of fSYS equals the frequency of fOSC. In this case the high and low times of fSYS are determined by the duty cycle of the input clock fOSC (external or internal). The lowest system clock frequency results from selecting the maximum value for the divider factor K1: fSYS = fOSC / 1024. 4.7.2.1 Phase Locked Loop (PLL) When PLL operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY = 0B), the on-chip phase locked loop is enabled and provides the system clock. The PLL multiplies the input frequency by the factor F (fSYS = fIN x F). F is calculated from the input divider P (= PDIV+1), the multiplication factor N (= NDIV+1), and the output divider K2 (= K2DIV+1): (F = N / (P x K2)). The input clock can be derived either from an external source at XTAL1 or from the onchip clock source. The PLL circuit synchronizes the system clock to the input clock. This synchronization is performed smoothly so that the system clock frequency does not change abruptly. Adjustment to the input clock continuously changes the frequency of fSYS so that it is locked to fIN. The slight variation causes a jitter of fSYS which in turn affects the duration of individual TCSs. 1) Voltages on XTAL1 must comply to the core supply voltage VDDIM. Data Sheet 83 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters The timing in the AC Characteristics refers to TCSs. Timing must be calculated using the minimum TCS possible under the given circumstances. The actual minimum value for TCS depends on the jitter of the PLL. Because the PLL is constantly adjusting its output frequency to correspond to the input frequency (from crystal or oscillator), the accumulated jitter is limited. This means that the relative deviation for periods of more than one TCS is lower than for a single TCS (see formulas and Figure 20). This is especially important for bus cycles using waitstates and for the operation of timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter is negligible. The value of the accumulated PLL jitter depends on the number of consecutive VCO output cycles within the respective timeframe. The VCO output clock is divided by the output prescaler K2 to generate the system clock signal fSYS. The number of VCO cycles is K2 x T, where T is the number of consecutive fSYS cycles (TCS). The maximum accumulated jitter (long-term jitter) DTmax is defined by: DTmax [ns] = (220 / (K2 x fSYS) + 4.3) This maximum value is applicable, if either the number of clock cycles T > (fSYS / 1.2) or the prescaler value K2 > 17. In all other cases for a timeframe of T x TCS the accumulated jitter DT is determined by: DT [ns] = DTmax x [(1 - 0.058 x K2) x (T - 1) / (0.83 x fSYS - 1) + 0.058 x K2] fSYS in [MHz] in all formulas. Example, for a period of 3 TCSs @ 33 MHz and K2 = 4: Dmax = (220 / (4 x 33) + 4.3) = 5.97 ns (Not applicable directly in this case!) D3 = 5.97 x [(1 - 0.058 x 4) x (3 - 1) / (0.83 x 33 - 1) + 0.058 x 4] = 5.97 x [0.768 x 2 / 26.39 + 0.232] = 1.7 ns Example, for a period of 3 TCSs @ 33 MHz and K2 = 2: Dmax = (220 / (2 x 33) + 4.3) = 7.63 ns (Not applicable directly in this case!) D3 = 7.63 x [(1 - 0.058 x 2) x (3 - 1) / (0.83 x 33 - 1) + 0.058 x 2] = 7.63 x [0.884 x 2 / 26.39 + 0.116] = 1.4 ns Data Sheet 84 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Acc. jitter DT ns 9 fSYS = 33 MHz fSYS = 66 MHz fVCO = 66 MHz 8 7 f VCO = 132 MHz 6 5 4 3 2 1 0 Cycles T 1 20 40 60 80 100 MC_XC2X_JITTER Figure 20 Approximated Accumulated PLL Jitter Note: The specified PLL jitter values are valid if the capacitive load per pin does not exceed CL = 20 pF. The maximum peak-to-peak noise on the pad supply voltage (measured between VDDPB pin 64 and VSS pin 1) is limited to a peak-to-peak voltage of VPP = 50 mV. This can be achieved by appropriate blocking of the supply voltage as close as possible to the supply pins and using PCB supply and ground planes. PLL frequency band selection Different frequency bands can be selected for the VCO so that the operation of the PLL can be adjusted to a wide range of input and output frequencies: Data Sheet 85 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 25 System PLL Parameters Parameter Symbol Values Min. VCO output frequency 4.7.2.2 Unit Note / Test Condition Typ. Max. fVCO CC 50 - 110 MHz VCOSEL= 00b; VCOmode= controlled 10 - 40 MHz VCOSEL= 00b; VCOmode= free running 100 - 160 MHz VCOSEL= 01b; VCOmode= controlled 20 - 80 MHz VCOSEL= 01b; VCOmode= free running Wakeup Clock When wakeup operation is selected (SYSCON0.CLKSEL = 00B), the system clock is derived from the low-frequency wakeup clock source: fSYS = fWU. In this mode, a basic functionality can be maintained without requiring an external clock source and while minimizing the power consumption. 4.7.2.3 Selecting and Changing the Operating Frequency When selecting a clock source and the clock generation method, the required parameters must be carefully written to the respective bit fields, to avoid unintended intermediate states. Many applications change the frequency of the system clock (fSYS) during operation in order to optimize system performance and power consumption. Changing the operating frequency also changes the switching currents, which influences the power supply. To ensure proper operation of the on-chip EVRs while they generate the core voltage, the operating frequency shall only be changed in certain steps. This prevents overshoots and undershoots of the supply voltage. To avoid the indicated problems, recommended sequences are provided which ensure the intended operation of the clock system interacting with the power system. Please refer to the Programmer's Guide. Data Sheet 86 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.7.3 External Clock Input Parameters These parameters specify the external clock generation for the XE162xN. The clock can be generated in two ways: * * By connecting a crystal or ceramic resonator to pins XTAL1/XTAL2. By supplying an external clock signal - This clock signal can be supplied either to pin XTAL1 (core voltage domain) or to pin CLKIN1 (IO voltage domain). If connected to CLKIN1, the input signal must reach the defined input levels VIL and VIH. If connected to XTAL1, a minimum amplitude VAX1 (peak-to-peak voltage) is sufficient for the operation of the on-chip oscillator. Note: The given clock timing parameters (t1 ... t4) are only valid for an external clock input signal. Note: Operating Conditions apply. Table 26 External Clock Input Characteristics Parameter Symbol Values Min. Oscillator frequency XTAL1 input current absolute value XTAL11) Max. fOSC SR 4 - 40 MHz Input= Clock Signal 4 - 16 MHz Input= Crystal or Ceramic Resonator - - 20 A 6 - - ns 6 - - ns - 8 8 ns - 8 8 ns 0.3 x - - V - - V - - V - 1.7 V |IIL| CC VDDIM 0.4 x VDDIM 0.5 x VDDIM Input voltage range limits for signal on XTAL1 Data Sheet Note / Test Condition Typ. t1 SR Input clock low time t2 SR t3 SR Input clock rise time Input clock fall time t4 SR Input voltage amplitude on VAX1 SR Input clock high time Unit VIX1 SR -1.7 + VDDIM 87 fOSC 4 MHz; fOSC< 16 MHz fOSC 16 MHz; fOSC< 25 MHz fOSC 25 MHz; fOSC 40 MHz 2) V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 1) The amplitude voltage VAX1 refers to the offset voltage VOFF. This offset voltage must be stable during the operation and the resulting voltage peaks must remain within the limits defined by VIX1. 2) Overload conditions must not occur on pin XTAL1. t1 VOFF t3 0.9 VAX1 0.1 VAX1 VAX1 t2 t4 tOSC = 1/fOSC MC_ EXTCLOCK Figure 21 External Clock Drive XTAL1 Note: For crystal or ceramic resonator operation, it is strongly recommended to measure the oscillation allowance (negative resistance) in the final target system (layout) to determine the optimum parameters for oscillator operation. The manufacturers of crystals and ceramic resonators offer an oscillator evaluation service. This evaluation checks the crystal/resonator specification limits to ensure a reliable oscillator operation. Data Sheet 88 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.7.4 Pad Properties The output pad drivers of the XE162xN can operate in several user-selectable modes. Strong driver mode allows controlling external components requiring higher currents such as power bridges or LEDs. Reducing the driving power of an output pad reduces electromagnetic emissions (EME). In strong driver mode, selecting a slower edge reduces EME. The dynamic behavior, i.e. the rise time and fall time, depends on the applied external capacitance that must be charged and discharged. Timing values are given for a capacitance of 20 pF, unless otherwise noted. In general, the performance of a pad driver depends on the available supply voltage VDDP. Therefore the following tables list the pad parameters for the upper voltage range and the lower voltage range, respectively. Note: These parameters are not subject to production test but verified by design and/or characterization. Note: Operating Conditions apply. Table 27 is valid under the following conditions: VDDP 5.5 V; VDDPtyp. 5 V; VDDP 4.5 V Table 27 Standard Pad Parameters for Upper Voltage Range Parameter Maximum output driver current (absolute value)1) Nominal output driver current (absolute value) Data Sheet Symbol IOmax Values Unit Note / Test Condition 4.0 mA Driver_Strength = Medium - 10 mA Driver_Strength = Strong - - 0.5 mA Driver_Strength = Weak - - 1.0 mA Driver_Strength = Medium - - 2.5 mA Driver_Strength = Strong - - 0.1 mA Driver_Strength = Weak Min. Typ. Max. - - - CC IOnom CC 89 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 27 Parameter Standard Pad Parameters for Upper Voltage Range (cont'd) Symbol Rise and Fall times (10% - tRF CC 90%) Values Min. Typ. Max. - - 23 + 0.6 x Unit Note / Test Condition ns CL 20 pF; CL 100 pF; CL - - Driver_Strength = Medium 11.6 + ns 0.22 x CL - - 4.2 + 0.14 x Driver_Strength = Strong ; Driver_Edge= Medium ns CL - - - 20.6 + ns 0.22 x 212 + 1.9 x CL CL 20 pF; CL 100 pF; Driver_Strength = Strong ; Driver_Edge= Sharp CL - CL 20 pF; CL 100 pF; CL 20 pF; CL 100 pF; Driver_Strength = Strong ; Driver_Edge= Slow ns CL 20 pF; CL 100 pF; Driver_Strength = Weak 1) An output current above |IOXnom| may be drawn from up to three pins at the same time. For any group of 16 neighboring output pins, the total output current in each direction (IOL and -IOH) must remain below 50 mA. Data Sheet 90 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 28 Standard Pad Parameters for Lower Voltage Range Parameter Maximum output driver current (absolute value)1) Nominal output driver current (absolute value) Data Sheet Symbol IOmax Values Unit Note / Test Condition 2.5 mA Driver_Strength = Medium - 10 mA Driver_Strength = Strong - - 0.5 mA Driver_Strength = Weak - - 1.0 mA Driver_Strength = Medium - - 2.5 mA Driver_Strength = Strong - - 0.1 mA Driver_Strength = Weak Min. Typ. Max. - - - CC IOnom CC 91 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 28 Parameter Standard Pad Parameters for Lower Voltage Range (cont'd) Symbol Rise and Fall times (10% - tRF CC 90%) Values Min. Typ. Max. - - 37 + 0.65 x Unit Note / Test Condition ns CL 20 pF; CL 100 pF; CL - - 24 + 0.3 x Driver_Strength = Medium ns CL - - 6.2 + 0.24 x Driver_Strength = Strong ; Driver_Edge= Medium ns CL - - 34 + 0.3 x - 500 + 2.5 x CL CL 20 pF; CL 100 pF; Driver_Strength = Strong ; Driver_Edge= Sharp ns CL - CL 20 pF; CL 100 pF; CL 20 pF; CL 100 pF; Driver_Strength = Strong ; Driver_Edge= Slow ns CL 20 pF; CL 100 pF; Driver_Strength = Weak 1) An output current above |IOXnom| may be drawn from up to three pins at the same time. For any group of 16 neighboring output pins, the total output current in each direction (IOL and -IOH) must remain below 50 mA. Data Sheet 92 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.7.5 Synchronous Serial Interface Timing The following parameters are applicable for a USIC channel operated in SSC mode. Note: These parameters are not subject to production test but verified by design and/or characterization. Note: Operating Conditions apply. Table 29 is valid under the following conditions: CL= 20 pF; SSC= master ; voltage_range= upper Table 29 USIC SSC Master Mode Timing for Upper Voltage Range Parameter Symbol Values Unit Min. Typ. Max. tSYS - - - ns Slave select output SELO t1 CC active to first SCLKOUT transmit edge 81) Slave select output SELO t2 CC inactive after last SCLKOUT receive edge 61) tSYS - - - ns t3 CC -6 - 9 ns Receive data input setup t4 SR time to SCLKOUT receive edge 31 - - ns t5 SR -4 - - ns Data output DOUT valid time Data input DX0 hold time from SCLKOUT receive edge Note / Test Condition 1) tSYS = 1 / fSYS Table 30 is valid under the following conditions: CL= 20 pF; SSC= master ; voltage_range= lower Data Sheet 93 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 30 USIC SSC Master Mode Timing for Lower Voltage Range Parameter Symbol Values Unit Min. Typ. Max. tSYS - - - ns Slave select output SELO t1 CC active to first SCLKOUT transmit edge 101) Slave select output SELO t2 CC inactive after last SCLKOUT receive edge 91) tSYS - - - ns t3 CC -7 - 11 ns Receive data input setup t4 SR time to SCLKOUT receive edge 40 - - ns t5 SR -5 - - ns Data output DOUT valid time Data input DX0 hold time from SCLKOUT receive edge Note / Test Condition 1) tSYS = 1 / fSYS Table 31 is valid under the following conditions: CL= 20 pF; SSC= slave ; voltage_range= upper Table 31 USIC SSC Slave Mode Timing for Upper Voltage Range Parameter Symbol Values Unit Min. Typ. Max. t10 SR 7 - - ns Select input DX2 hold after t11 SR last clock input DX1 receive edge1) 7 - - ns t12 SR 7 - - ns Select input DX2 setup to first clock input DX1 transmit edge1) Receive data input setup time to shift clock receive edge1) Data Sheet 94 Note / Test Condition V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 31 USIC SSC Slave Mode Timing for Upper Voltage Range (cont'd) Parameter Symbol Values Unit Min. Typ. Max. Data input DX0 hold time from clock input DX1 receive edge1) t13 SR 5 - - ns Data output DOUT valid time t14 CC 7 - 33 ns Note / Test Condition 1) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and receive data input (bits DXnCR.DSEN = 0). Table 32 is valid under the following conditions: CL= 20 pF; SSC= slave ; voltage_range= lower Table 32 USIC SSC Slave Mode Timing for Lower Voltage Range Parameter Symbol Values Unit Min. Typ. Max. t10 SR 7 - - ns Select input DX2 hold after t11 SR last clock input DX1 receive edge1) 7 - - ns Receive data input setup time to shift clock receive edge1) t12 SR 7 - - ns Data input DX0 hold time from clock input DX1 receive edge1) t13 SR 5 - - ns Data output DOUT valid time t14 CC 8 - 41 ns Select input DX2 setup to first clock input DX1 transmit edge1) Note / Test Condition 1) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and receive data input (bits DXnCR.DSEN = 0). Data Sheet 95 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Master Mode Timing t1 Select Output SELOx t2 Inactive Inactive Active Clock Output SCLKOUT Receive Edge First Transmit Edge Last Receive Edge Transmit Edge t3 t3 Data Output DOUT t4 Data Input DX0 t4 t5 Data valid t5 Data valid Slave Mode Timing t10 Select Input DX2 Clock Input DX1 t11 Inactive Inactive Active Receive Edge First Transmit Edge t12 Data Input DX0 t12 t13 Data valid t 14 Last Receive Edge Transmit Edge t 13 Data valid t14 Data Output DOUT Transmit Edge: with this clock edge, transmit data is shifted to transmit data output. Receive Edge: with this clock edge, receive data at receive data input is latched . Drawn for BRGH.SCLKCFG = 00B. Also valid for for SCLKCFG = 01B with inverted SCLKOUT signal. USIC_SSC_TMGX.VSD Figure 22 USIC - SSC Master/Slave Mode Timing Note: This timing diagram shows a standard configuration where the slave select signal is low-active and the serial clock signal is not shifted and not inverted. Data Sheet 96 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters 4.7.6 Debug Interface Timing The debugger can communicate with the XE162xN either via the 2-pin DAP interface or via the standard JTAG interface. Debug via DAP The following parameters are applicable for communication through the DAP debug interface. Note: These parameters are not subject to production test but verified by design and/or characterization. Note: Operating Conditions apply. Table 33 is valid under the following conditions: CL= 20 pF; voltage_range= upper Table 33 DAP Interface Timing for Upper Voltage Range Parameter Symbol DAP0 clock period1) DAP0 high time 1) DAP0 low time DAP0 clock rise time DAP0 clock fall time DAP1 setup to DAP0 rising edge t11 SR t12 SR t13 SR t14 SR t15 SR t16 SR Values Unit Min. Typ. Max. 25 - - ns 8 - - ns 8 - - ns - - 4 ns - - 4 ns 6 - - ns DAP1 hold after DAP0 rising edge t17 SR 6 - - ns DAP1 valid per DAP0 clock period2) t19 CC 17 20 - ns Note / Test Condition 1) See the DAP chapter for clock rate restrictions in the Active::IDLE protocol state. 2) The Host has to find a suitable sampling point by analyzing the sync telegram response. Table 34 is valid under the following conditions: CL= 20 pF; voltage_range= lower Data Sheet 97 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 34 DAP Interface Timing for Lower Voltage Range Parameter Symbol DAP0 clock period1) t11 SR t12 SR t13 SR t14 SR t15 SR t16 SR DAP0 high time 1) DAP0 low time DAP0 clock rise time DAP0 clock fall time DAP1 setup to DAP0 rising edge Values Unit Min. Typ. Max. 25 - - ns 8 - - ns 8 - - ns - - 4 ns - - 4 ns 6 - - ns DAP1 hold after DAP0 rising edge t17 SR 6 - - ns DAP1 valid per DAP0 clock period2) t19 CC 12 17 - ns Note / Test Condition 1) See the DAP chapter for clock rate restrictions in the Active::IDLE protocol state. 2) The Host has to find a suitable sampling point by analyzing the sync telegram response. t11 0.9 VD D P 0.5 VD D P t1 2 t1 5 t1 3 t14 0.1 VD D P MC_DAP0 Figure 23 Data Sheet Test Clock Timing (DAP0) 98 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters DAP0 t1 6 t1 7 DAP1 MC_ DAP1_RX Figure 24 DAP Timing Host to Device t1 1 DAP1 t1 9 MC_ DAP1_TX Figure 25 DAP Timing Device to Host Note: The transmission timing is determined by the receiving debugger by evaluating the sync-request synchronization pattern telegram. Debug via JTAG The following parameters are applicable for communication through the JTAG debug interface. The JTAG module is fully compliant with IEEE1149.1-2000. Note: These parameters are not subject to production test but verified by design and/or characterization. Note: Operating Conditions apply. Table 35 is valid under the following conditions: CL= 20 pF; voltage_range= upper Table 35 JTAG Interface Timing for Upper Voltage Range Parameter TCK clock period TCK high time Data Sheet Symbol t1 SR t2 SR Values Unit Min. Typ. Max. 50 - - ns 16 - - ns 99 Note / Test Condition 1) V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 35 JTAG Interface Timing for Upper Voltage Range (cont'd) Parameter Symbol Values Min. Typ. Unit Max. 16 - - ns - - 8 ns - - 8 ns 6 - - ns t7 SR 6 - - ns TDO valid from TCK falling t8 CC edge (propagation delay)2) - 25 29 ns TDO high impedance to valid output from TCK falling edge3)2) t9 CC - 25 29 ns TDO valid output to high impedance from TCK falling edge2) t10 CC - 25 29 ns TDO hold after TCK falling t18 CC edge2) 5 - - ns TCK low time TCK clock rise time TCK clock fall time TDI/TMS setup to TCK rising edge TDI/TMS hold after TCK rising edge t3 SR t4 SR t5 SR t6 SR Note / Test Condition 1) Under typical conditions, the JTAG interface can operate at transfer rates up to 20 MHz. 2) The falling edge on TCK is used to generate the TDO timing. 3) The setup time for TDO is given implicitly by the TCK cycle time. Table 36 is valid under the following conditions: CL= 20 pF; voltage_range= lower Table 36 JTAG Interface Timing for Lower Voltage Range Parameter Symbol TCK clock period t1 SR t2 SR t3 SR t4 SR t5 SR t6 SR TCK high time TCK low time TCK clock rise time TCK clock fall time TDI/TMS setup to TCK rising edge Data Sheet Values Unit Min. Typ. Max. 50 - - ns 16 - - ns 16 - - ns - - 8 ns - - 8 ns 6 - - ns 100 Note / Test Condition V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters Table 36 JTAG Interface Timing for Lower Voltage Range (cont'd) Parameter Symbol Values Unit Min. Typ. Max. t7 SR 6 - - ns TDO valid from TCK falling t8 CC edge (propagation delay)1) - 32 36 ns TDO high impedance to valid output from TCK falling edge2)1) t9 CC - 32 36 ns TDO valid output to high impedance from TCK falling edge1) t10 CC - 32 36 ns TDO hold after TCK falling t18 CC edge1) 5 - - ns TDI/TMS hold after TCK rising edge Note / Test Condition 1) The falling edge on TCK is used to generate the TDO timing. 2) The setup time for TDO is given implicitly by the TCK cycle time. t1 0.9 VD D P 0.5 VD D P t2 t5 t3 t4 0.1 VD D P MC_ JTAG_ TCK Figure 26 Data Sheet Test Clock Timing (TCK) 101 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Electrical Parameters TCK t6 t7 t6 t7 TMS TDI t9 t8 t1 0 TDO t18 Figure 27 Data Sheet MC_JTAG JTAG Timing 102 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Package and Reliability 5 Package and Reliability The XE166 Family devices use the package type PG-LQFP (Plastic Green - Low Profile Quad Flat Package). The following specifications must be regarded to ensure proper integration of the XE162xN in its target environment. 5.1 Packaging These parameters specify the packaging rather than the silicon. Table 37 Package Parameters (PG-LQFP-64-6) Parameter Symbol Limit Values Min. Unit Notes Max. Exposed Pad Dimension Ex x Ey - 5.6 x 5.6 mm - Power Dissipation PDISS RJA - 0.8 W - - 40 K/W No thermal via1) 37 K/W 4-layer, no pad2) 25 K/W 4-layer, pad3) Thermal resistance Junction-Ambient 1) Device mounted on a 4-layer board without thermal vias; exposed pad not soldered. 2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not soldered. 3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered to the board. Note: To improve the EMC behavior, it is recommended to connect the exposed pad to the board ground, independent of the thermal requirements. Board layout examples are given in an application note. Package Compatibility Considerations The XE162xN is a member of the XE166 Family of microcontrollers. It is also compatible to a certain extent with members of similar families or subfamilies. Each package is optimized for the device it houses. Therefore, there may be slight differences between packages of the same pin-count but for different device types. In particular, the size of the Exposed Pad (if present) may vary. If different device types are considered or planned for an application, it must be ensured that the board layout fits all packages under consideration. Data Sheet 103 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Package and Reliability H 0.5 0.08 C 64x C SEATING COPLANARITY PLANE 7.5 +0.07 0.2 -0.03 0.6 0.15 0.08 M A-B D C 64x 12 10 Bottom View 0.2 A-B D 64x 1) Ex 0.2 A-B D H 4x Ox D Exposed Diepad Oy Ey 10 B 12 A 1) 0.5 x 45 0...7 -0.06 0.15 +0.05 1.6 MAX. 1.4 0.05 0.10.05 STAND OFF Package Outlines 64 1 1 64 Index Marking Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side PG-LQFP-64-6, -8, -12-PO V13 Figure 28 PG-LQFP-64-6 (Plastic Green Thin Quad Flat Package) All dimensions in mm. You can find complete information about Infineon packages, packing and marking in our Infineon Internet Page "Packages": http://www.infineon.com/packages Data Sheet 104 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Package and Reliability 5.2 Thermal Considerations When operating the XE162xN in a system, the total heat generated in the chip must be dissipated to the ambient environment to prevent overheating and the resulting thermal damage. The maximum heat that can be dissipated depends on the package and its integration into the target board. The "Thermal resistance RJA" quantifies these parameters. The power dissipation must be limited so that the average junction temperature does not exceed 150 C. The difference between junction temperature and ambient temperature is determined by T = (PINT + PIOSTAT + PIODYN) x RJA The internal power consumption is defined as PINT = VDDP x IDDP (switching current and leakage current). The static external power consumption caused by the output drivers is defined as PIOSTAT = ((VDDP-VOH) x IOH) + (VOL x IOL) The dynamic external power consumption caused by the output drivers (PIODYN) depends on the capacitive load connected to the respective pins and their switching frequencies. If the total power dissipation for a given system configuration exceeds the defined limit, countermeasures must be taken to ensure proper system operation: * * * * Reduce VDDP, if possible in the system Reduce the system frequency Reduce the number of output pins Reduce the load on active output drivers Data Sheet 105 V1.5, 2013-02 XE162FN, XE162HN XE166 Family / Value Line Package and Reliability 5.3 Quality Declarations The operation lifetime of the XE162xN depends on the operating temperature. The life time decreases with increasing temperature as shown in Table 39. Table 38 Quality Parameters Parameter Symbol Operation lifetime tOP CC VHBM Table 39 Unit Note / Test Condition Min. Typ. Max. - - 20 a See Table 39 - - 2 000 V EIA/JESD22A114-B MSL CC - - 3 - JEDEC J-STD-020C ESD susceptibility according to Human Body SR Model (HBM) Moisture sensitivity level Values Lifetime dependency from Temperature Operating Time Operating Temperature 20 a TJ 110C TJ = 120C TJ = 125C TJ = 130C TJ = 140C TJ = 150C 95 500 h 68 500 h 49 500 h 26 400 h 14 500 h Data Sheet 106 V1.5, 2013-02 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG