3990251012 - Telit - Datasheet.Live

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

APPLICABILITY TABLE

PRODUCT

LN930

LN930-AP

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit

assumes no liability resulting from any inaccuracies or omissions in this document, or from

use of the information obtained herein. The information in this document has been carefully

checked and is believed to be entirely reliable. However, no responsibility is assumed for

inaccuracies or omissions. Telit reserves the right to make changes to any products described

herein and reserves the right to revise this document and to make changes from time to time

in content hereof with no obligation to notify any person of revisions or changes. Telit does

not assume any liability arising out of the application or use of any product, software, or

circuit described herein; neither does it convey license under its patent rights or the rights of

others.

It is possible that this publication may contain references to, or information about Telit

products (machines and programs), programming, or services that are not announced in your

country. Such references or information must not be construed to mean that Telit intends to

announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be,

include or describe copyrighted Telit material, such as computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve for

Telit and its licensors certain exclusive rights for copyrighted material, including the

exclusive right to copy, reproduce in any form, distribute and make derivative works of the

copyrighted material. Accordingly, any copyrighted material of Telit and its licensors

contained herein or in the Telit products described in this instruction manual may not be

copied, reproduced, distributed, merged or modified in any manner without the express

written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed

to grant either directly or by implication, estoppel, or otherwise, any license under the

copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a

product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual

may include copyrighted Telit and other 3rd Party supplied computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve for

Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer

programs, including the exclusive right to copy or reproduce in any form the copyrighted

computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW

computer programs contained in the Telit products described in this instruction manual may

not be copied (reverse engineered) or reproduced in any manner without the express written

permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products

shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any

license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied

SW, except for the normal non-exclusive, royalty free license to use that arises by operation

of law in the sale of a product.

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is

furnished by express license agreement only and may be used only in accordance with the

terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is

prohibited by law. No part of the software or documentation may be reproduced, transmitted,

transcribed, stored in a retrieval system, or translated into any language or computer language,

in any form or by any means, without prior written permission of Telit

High Risk Materi al s

Components, units, or third-party products used in the product described herein are NOT

fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control

equipment in the following hazardous environments requiring fail-safe controls: the operation

of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic

Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)

specifically disclaim any expressed or implied warranty of fitness for such High Risk

Activities.

Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or

service names are the property of their respective owners.

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

Contents

Introduction ......................................................................................................... 11

1.1 Scope .......................................................................................................................... 11

1.2 Purpose ...................................................................................................................... 11

1.3 Audience ..................................................................................................................... 11

1.4 Contact Information, Support .................................................................................... 11

1.5 Document Organization ............................................................................................. 12

1.6 Text Conventions ........................................................................................................ 12

1.7 Related Documents ................................................................................................... 12

M.2 Overview ........................................................................................................ 13

2.1 SKUs - 2G/3G/LTE M.2 Modules ................................................................................ 13

2.2 M.2 Module – Block Diagrams ................................................................................... 17

2.2.1 M.2 HN930 Module ......................................................................................................... 17

2.2.2 M.2 LN930-AP Module ................................................................................................... 19

2.2.3 M.2 LN930 Module ......................................................................................................... 20

2.3 Host Interface Signals ............................................................................................... 21

M.2 Module Interface Details ............................................................................... 26

3.1 Interprocessor Interface (IPC) ................................................................................... 26

3.1.1 USB 2.0 High-Speed – IPC Interface .............................................................................. 26

3.1.2 USB Super-speed IC (Reserved) .................................................................................... 28

3.2 (U)SIM Interface ......................................................................................................... 29

3.2.1 SIM Design Recommendations ...................................................................................... 29

3.3 GNSS Interface ........................................................................................................... 30

3.4 System Control Interface ........................................................................................... 32

3.4.1 Power On & Reset .......................................................................................................... 33

3.4.2 Host Radio Disable Operation ........................................................................................ 33

3.4.3 LED Interface – Status Indicator .................................................................................... 35

3.4.4 Wake on WWAN Signal ................................................................................................... 36

3.4.5 Dynamic Power Reduction ............................................................................................. 37

3.5 Tunable Antenna Control Interface ........................................................................... 39

3.6 In-Device Coexistence Interface ................................................................................ 40

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3.7 Power Supply Interface .............................................................................................. 42

3.8 Trace & Debug Interface ............................................................................................ 42

3.9 Configuration Pins ..................................................................................................... 43

3.10 Audio Pins (Reserved) ................................................................................................ 43

3.11 No Connect Pins ......................................................................................................... 45

3.12 Antenna Interface ...................................................................................................... 45

Development Tools ............................................................................................... 47

4.1 Carrier Board ............................................................................................................. 47

4.1.1 FlashTool........................................................................................................................ 48

4.1.2 PhoneTool ...................................................................................................................... 48

4.1.3 System Trace Tool .......................................................................................................... 49

4.1.4 RF Calibration ................................................................................................................ 49

4.1.5 Noise Profiling Scan Tool ............................................................................................... 50

Windows Software Components ........................................................................... 51

5.1 MBIM Toolkit .............................................................................................................. 54

5.1.1 Windows® 7 MBIM driver .............................................................................................. 54

5.1.2 GNSS UMDF driver for Windows® 7 and Windows® 8 ................................................. 54

5.1.3 M.2 module Firmware Update ....................................................................................... 54

5.1.4 End User Trace Tool....................................................................................................... 54

Linux/Chrome Software Architecture ................................................................... 55

6.1 Overview ..................................................................................................................... 55

6.2 CMUX Multiplexer ...................................................................................................... 56

6.3 USB 2.0 HS Features .................................................................................................. 57

6.4 USB Configuration ..................................................................................................... 57

6.4.1 Modem Connection ........................................................................................................ 57

6.4.2 Network Connection ...................................................................................................... 57

6.4.3 Default Configuration ..................................................................................................... 57

6.5 LPM ............................................................................................................................ 58

6.5.1 Suspend/Resume and Remote Wake-up ....................................................................... 58

6.5.2 Android Software Components ...................................................................................... 58

6.5.3 Chrome Software Components ...................................................................................... 59

Figure 16 Chrome Software Architecture .................................................................................... 60

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Operating Environment ........................................................................................ 61

Power Delivery Requirements .............................................................................. 62

8.1 Electrical Parameters (3.3 V Power Supply) ............................................................. 62

8.2 Electrical Parameters - Host Interface Signals ........................................................ 63

8.3 Power Consumption ................................................................................................... 64

Other Information ................................................................................................ 66

9.1 EMI/EMC and Platform Noise .................................................................................... 66

9.2 Platform Noise Mitigation - Adaptive Clocking ......................................................... 66

9.3 Thermal Monitoring ................................................................................................... 66

9.4 Seamless Roaming / Wifi Offload .............................................................................. 67

9.5 Conducted Transmit Power ....................................................................................... 67

9.6 Receiver Sensitivity .................................................................................................... 68

9.7 Antenna Recommendations ...................................................................................... 71

9.8 GNSS Sensitivity ......................................................................................................... 72

3GPP Compliance.............................................................................................. 73

WWAN Card Type 3042-S3-B ............................................................................. 74

11.1 Mechanical Dimensions ............................................................................................. 74

11.2 Land Pattern .............................................................................................................. 76

11.3 Antenna Connector Locations ................................................................................... 78

Safety Recommendations .................................................................................. 79

Conformity assessment issues.......................................................................... 80

13.1 1999/5/EC Directive ................................................................................................... 80

13.2 CE RF Exposure Compliance ..................................................................................... 82

13.3 R&TTE Regulation:..................................................................................................... 83

FCC/IC Regulatory notices ................................................................................ 84

14.1 Modification statement .............................................................................................. 84

14.2 Manual Information to the End User ......................................................................... 84

14.3 Interference statement .............................................................................................. 84

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14.4 FCC Class B digital device notice .............................................................................. 84

14.5 Radiation Exposure Statement .................................................................................. 85

14.6 End Product Labeling ................................................................................................ 85

Document History ............................................................................................. 86

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Figure 1 M.2 HSPA+ Block Diagram ................................................................................................................ 18

Figure 2 M.2 APAC LTE Module Block Diagram ............................................................................................ 19

Figure 3 M.2 LTE Module Block Diagram........................................................................................................ 20

Figure 4 Detailed Interconnection of M.2 LTE Modem RF Engine .................................................................. 21

Figure 5 PCI Express M.2 Module Interface ..................................................................................................... 22

Figure 6 GNSS Connections and Interface ........................................................................................................ 31

Figure 7 Typical LED Connection ..................................................................................................................... 36

Figure 8 Antenna Control – Connections Detail ................................................................................................ 39

Figure 9 In-Device Coexistence Architecture .................................................................................................... 40

Figure 10 RF Antenna – Coaxial Connector Location ....................................................................................... 46

Figure 11 M.2 Carrier Board .............................................................................................................................. 48

Figure 12 Windows 7 Software Architecture ..................................................................................................... 52

Figure 13 Windows 8 Software Architecture ..................................................................................................... 53

Figure 14 Linux Software Architecture ............................................................................................................. 55

Figure 15 Android Software Architecture .......................................................................................................... 59

Figure 16 Chrome Software Architecture .......................................................................................................... 60

Figure 17 WWAN Card 3042 Mechanical Dimensions .................................................................................... 74

Figure 18 WWAN Card 3042 Slot Key Details ................................................................................................. 75

Figure 19 WWAN Card Type 3042 Top-Side Mounting Land Pattern ............................................................. 76

Figure 20 WWAN Card 3042 Mid-plane Land Pattern with Slot Key Removed .............................................. 77

Figure 21 Antenna Connector Location ............................................................................................................. 78

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Table 1 M.2 Module - General Feature .............................................................................................................. 14

Table 2. M.2 Module - RF Band Support ......................................................................................................... 15

Table 3. M.2 Module - Data Services ................................................................................................................ 17

Table 4 M.2 Host Interface Signals .................................................................................................................... 22

Table 5 USB HS Interprocessor Communications In

ter

face .............................................................................. 27

Table 6 USB SSIC – ICP Inte rf ac e .................................................................................................................... 28

Table 7 (U)SIM Interface Signals ...................................................................................................................... 29

Table 8 X-GOLD™ Baseband to GNSS Interface Signals ................................................................................ 32

Table 9 GNSS Module Interface Signals ........................................................................................................... 32

Table 10 Power-on & Reset Signals .................................................................................................................. 33

Table 11 Radio Disable Signal........................................................................................................................... 34

Table 12 Host Radio Disable Interface (W_DISABLE#) .................................................................................. 35

Table 13 LED#1 Signal...................................................................................................................................... 36

Table 14 LED State Indicator ............................................................................................................................ 36

Table 15 Wake on WWAN Signal ..................................................................................................................... 37

Table 16 DPR#/ SAR Support Signal ................................................................................................................ 38

Table 17 Tunable Antenna Control Signals ....................................................................................................... 39

Table 18 Coexistence – Hardware Synchronization Signals .............................................................................. 41

Table 19 Power & Ground Signals .................................................................................................................... 42

Table 20 M.2 Configuration Pins ....................................................................................................................... 43

Table 21 Audio Signals (Future development) ................................................................................................. 43

Table 22 No Connect Pins ................................................................................................................................. 45

Table 23 Antenna Requirements ........................................................................................................................ 45

Table 24 Operating Environment ....................................................................................................................... 61

Table 25 M.2 Module Power Delivery Requirements - Ultrabook .................................................................... 62

Table 26 VBAT Power Delivery Requirements – Direct Connections (Tablet) ................................................ 62

Table 27 DC Specification for 3.3V Logic Signaling ........................................................................................ 63

Table 28 DC Specification for 1.8V Logic Signaling ........................................................................................ 63

Table 29 LTE Power Consumption .................................................................................................................... 64

Table 30 UMTS Power Consumption ................................................................................................................ 64

Table 31 GSM Power Consumption .................................................................................................................. 65

Table 32 Conducted Transmit Power – 2G ........................................................................................................ 67

Table 33 Conducted Transmit Power – 3G ........................................................................................................ 67

Table 34 Conducted Transmit Power – LTE ..................................................................................................... 68

Table 35 Rx Sensitivity - GSM .......................................................................................................................... 68

Table 36 Rx Sensitivity - UMTS ....................................................................................................................... 69

Table 37 Rx Sensitivity - LTE ........................................................................................................................... 69

Table 38 Antenna Recommendation .................................................................................................................. 71

Table 39 Antenna Recommendation - Bandwidth of Main & Diversity Antenna ............................................. 71

Table 40 GNSS Sensitivity ................................................................................................................................ 72

Table 40 Antenna Connector Assignment ......................................................................................................... 78

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

Introduction

This document is a techn ic a l speci ficat ion for Telit’s next generation form factor M.2 module

family. The next generation form factor M.2 module family is a natural transition from the

PCI Express Mini Card and Half Mini Card to a smaller form factor size.

The M.2 Card Type 3042 offers single sided component mounting, 75 pins (8 dedicated for

key), in a compact size (30 mm x 42 mm). A range of 2G/3G/4G (LTE) M.2 modules

supporting m ultiple operating system s and unique features in the WWAN Card Type 3042

form factor are av ailabl e.

1.1

Scope

The document will cover the features of the M.2 modules presently available. It will also

identify the M.2 module application interface along with hardware, software, reliability, and

mechanical specifications.

1.2

Purpose

The intent of this document is to provide design guidelines and information for each M.2

module.

In addition to the M.2 module family features and performance metrics, this document

describes the interface signals, operating conditions, physical and mechanical requirements of

the M.2 cards.

1.3

Audience

This document is intended for editors who are about to write or edit docum entation for Telit.

1.4

Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals,

contact Telit Tech n ica l Support Cen ter ( TTSC ) at:

TS-EMEA@telit.com

TS-NORTHAMERICA@telit.com

TS-LATINAMERICA@telit.com

TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations

on accessories and components visit:

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

http://www.telit.com

To register for product news and announcements or for product questions contact Telit

Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and

suggestions for improvem ents.

Telit appreciates feedback from the users of our information.

1.5

Document Organization

This document contains the following chapters (sample):

“Chapter 1: “Introduction” provides a scope for this document, target audience, contact and

support information, and text conventions.

“Chapter 2: “Chapt er two” gives an overview of the features of the product.

“Chapter 3: “Ch apt er three” describes in details the characteristics of the product.

“Chapter 6: “Conformity Assessment Issues” provides some fundamental hints about the

conformity assessment that the final application might need.

“Chapter 7: “Safety Recommendation” provides some safety recommendations that must be

follow by the customer in the design of the application that makes use of the AA99-XXX.

1.6

Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily

injury may occu r.

Caution or Warning – Alerts the user to important points about integrating the module, if

these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when

integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

1.7

Related Documents

• TBA

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

M.2 Overview

This section will provide an overview of the standard features of a M.2 Card, inform ation on

the various SKUs of 2G/3G/4G (LTE) M.2 modules along with a respective functional block

diagram of each SKU.

2.1

SKUs - 2G/3G/LTE M.2 Modules

There are five different M.2 modules available in the M.2 Card Type 3042 form factor:

• HN930 - HSPA+

• LN930-AP - APAC LTE

• LN930 - LTE

A comparison of the features, RF band Support, and data rates for the various M.2 modules is

shown in Table 1 through Table 3

LN930 M.2 Hardware User Guide

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Table 1 M.2 Modul e - General Feature

Feature

Description

Additional Information

M.2 module

HN930

LN930-AP

LN930

Mechanical

M.2 Card Type 3042

Slot B

30 mm x 42 mm

Pin count: 75

(67 usable, 8 slot) x x x

Operating

Voltage

3.3 V +/- 5%

x x x

Operating

Temperature

-10˚C to +55˚C – Normal

+55˚C to +70˚C –

Extended

xtreme - T his is the

surrounding air temperature of

the module inside the platform

whe n the card is full y operating

at worst case condition

x x x

Application

Interface

(75 pin card)

Interprocessor

Communications

USB 2.0 High-speed

x x x

USIM w/ Card Detect

SIM_CLK, SIM_RESET,

SIM_I O , SIM_PWR,

SIM_DETECT

x x x

M.2 Control

Full_Card_Power_On_Off

x x x

Reset#

x x x

W_DISABLE#

x x x

LED #1

DPR ( Body SAR)

x x x

Wake on WWAN

x x x

GNSS Disable

x x x

Global Positioning

(GPS/ GLONASS)

I2C_SCL, I2C_SDA, I2_IRQ,

CLKOUT, TX_BLANKING x x x

Antenna Tuning

(4) GPO (RF Transceiver)

- x x

RF Coexistence

(3) GPIO

- x x

RF Ante nna

Main & Diversity/ GNSS

Separate coax connectors

x x x

Debug

JTAG

x x x

ETM11

- x x

MIPI PTI

- x X

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Table 2. M.2 Module - RF Band Sup port

RF Band

UE Transmit

UE Receive

M.2 Module

HN930

LN930-AP

LN930

GSM

UMTS

LTE

GSM

UMTS

LTE

GSM

UMTS

LTE

001 I

1920 MHz -

1980 MHz

2110 MHz -

2170 MHz x x x x x

002 II

1850 MHz -

1910 MHz

1930 MHz -

1990 MHz x x x x x

003 III

1710 MHz -

1785 MHz

1805 MHz -

1880 MHz x x x x

004 IV

1710 MHz -

1755 MHz

2110 MHz -

2155 MHz x x x

005 V

824 MHz -

849 MHz

869 MHz -

894 MHz x x x x x

006 VI

830 MHz -

840 MHz

875 MHz -

885 MHz x

007 VII

2500 MHz -

2570 MHz

2620 MHz -

2690 MHz x

008 VIII

880 MHz -

915 MHz

925 MHz -

960 MHz x x x x x x x

009 IX

1749.9 MHz -

1784.9 MHz

1844.9 MHz -

1879.9 MHz x

010 X

1710 MHz -

1770 MHz

2110 MHz -

2170 MHz

011 XI

1427.9 MHz -

1447.9 MHz

1475.9 MHz -

1495.9 MHz x x

012 XII

699 MHz -

716 MHz

729 MHz -

746 MHz

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013 XIII

777 MHz -

787 MHz

746 MHz -

756 MHz x

014 XIV

788 MHz -

798 MHz

758 MHz -

768 MHz

017 XVII

704 MHz -

716 MHz

7734 MHz -

746 MHz x

018 XVIII

815 MHz -830

MHz

860 MHz -875

MHz x x

019 XIX

830 MHz -

845 MHz

875 MHz -

890 MHz x x x

020 XX

832 MHz -

862 MHz

791 MHz -

821 MHz x

021 XXI

1447.9 MHz -

1462.9 MHz

1495.9 MHz -

1510.9 MHz x

022 XXII

3410 MHz -

3490 MHz

3510 MHz -

3590 MHz

023 XXIII

2000 MHz -

2020 MHz

2180 MHz -

2200 MHz

024 XXIV

1626.5 MHz -

1660.5 MHz

1525 MHz -

1559 MHz

025 XXV

1850 MHz -

1915 MHz

1930 MHz -

1995 MHz

026 XXVI

814 MHz -

849 MHz

859 MHz -

894 MHz x

027 XXVII

806 MHz -

824 MHz

851 MHz -

869 MHz

028 XXVIII

703 MHz -

748 MHz

758 MHz -

803 MHz

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029 XXIX

1850 MHz -

1910 MHz

1710 MHz -

1755 MHz

716 MHz -

728 MHz

001 I

1920 MHz -

1980 MHz

2110 MHz -

2170 MHz

Table 3. M.2 Module - Data Services

Data Service

M.2 module

HN930

LN930-AP

LN930

GPRS Class 33: DL 85.6 kbps, UL 85.6 kbps

EDGE Class 33: DL 236.8 kbps, UL 236.8 kbps

WCDMA: DL 384 kbps, UL 384 kbps

HSPA+: DL 21 Mbps, UL 5.7 Mbps

HSPA+: DL 42 Mbps, UL 5.7 Mbps

LTE FDD: DL: 100 Mbps, UL 50 Mbps

LTE FDD: DL: 150 Mbps, UL 50 Mbps

Module supports DL 150 Mbps in LN930. This is only for generic SW and VZW SW, but not

for AT&T SW.

2.2

M.2 Module – Block Diagrams

2.2.1

M.2 HN930 Module

The M.2 HSPA+ module is Intel’s Next Generation Form Factor design based on Intel’s

XMM™6260 modem platform. The M.2 HSPA+ card is a dual-mode (UMTS/GSM) 3GPP

release 7 HSPA+ modem.

The M.2 HSPA+ module includes support at the 75 pin application interface for

M.2 Control, USB 2.0 HS, GNSS, and USIM. Antenna Tuning is not supported.

A block diagram of the M.2 HSPA+ module is shown in Figure 1.

LN930 M.2 Hardware User Guide

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Figure 1 M.2 HSPA+ Block Diagram

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2.2.2

M.2 LN930-AP Module

The M.2 APAC LTE module is another Intel design based on the XMM™7160 modem

platform. The module has a targeted area of operation in the Asia Pacific rim and offers 3G

and LTE datacard functionality, 2G Functionality is not supported.

The M.2 APC LTE module includes support at the 75 pin application interface for M.2

Control, USB 2.0 HS, GNSS, USIM and Antenna Tuning.

A block diagram of the M.2 APAC LTE module is shown in Figure 2.

Figure 2 M.2 APAC LTE Module Block Diagram

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2.2.3

M.2 LN930 Module

The M.2 LTE module is based on Intel’s XMM™7160 modem platform. The M.2 LTE

module is a triple-mode (2G, 3G, and 4G) 3GPP release 9 modem providing datacard

functionality.

The M.2 LTE module includes support at the 75 pin application interface for

M.2 Control, USB 2.0 HS, GNSS, USIM and Antenna Tuning.

A block diagram of the M.2 LTE module is shown in Figure 3.

Figure 3 M.2 LTE Module Block Diagram

A more detailed interconnect diagram of the RF Engine utilized on the M.2 LTE Module is

shown in Figure 4.

LN930 M.2 Hardware User Guide

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SMARTi

PMB5740

RD_H1

RD_H1X

RD_H3

RD_H3X

RD_M1

RD_M1X

RD_L1

RD_L1X

RD_L2

RD_L2X

RD_L4

RD_L4X

Clock and

Control

DigRF

VBAT

SD2_1V8

AFC_DAC

REF OSC

XO_SUP

VCTCXO

Measurement Unit

Battery

RFE_NTC

RFE_PADCDC_MI

XOX

Diversity

Receiver

Combined

Receiver

RX_H2

RX_H2X

RX_H3

RX_H3X

RX_H4

RX_H4X

RX_M1

RX_M1X

RX_M2

RX_M2X

RX_L1

RX_L1X

RX_L2

RX_L2X

RX_L4

RX_L4X

RFFE

RFFE_VIO

RFFE_SDATA

RFFE_SCLK

Transmitter

TQ_X

TQ_H

TQ_L

TP_H

TP_L

PA Control

PADACS

PADACF

PADACF_P

FBR

FBR_RF1

FBR_RF2

XGOLD

716

B1/B4

Diversity Switch &

Filter Module

Diversity

Antenna

RFE_RFFE_VIO

RFE_RFFE_SDATA

RFE_RFFE_SCLK

RFE_RFFE_VIO

RFE_RFFE_SCLK

RFE_RFFE_SDATA

Main Switch & Duplexer Module

B7 Duplexer

B7 Div Filter

B20 Div Filter

Coupler

Main

Antenna

RFE_RFFE_VIO

RFE_RFFE_SCLK

RFE_RFFE_SDATA

DCDC

RFE_TQ_H

RFE_TP_H

RFE_TP_L

RFE_TQ_L

B2/B25

VBAT

RFE_VCC1_ET

RFE_VDD_ET

B7 PA

RFE_PADCDC_MI

SCPA

RD_M2

RD_M2X

RD_L3

RD_L3X B20

RX_L3

RX_L3X

B2/B25

B5/B26

B13/B17

B20 Duplexer

B20

B2/B25

B5/B26

B13/B17

GSM_HB

GSM_LB

B5/B26

B20

B17

B13

RFE_PADACS

VBAT

RFFE CONTROL

VBAT

RFE_VBATAMP

Figure 4 Detailed Interconnection of M.2 LTE Modem RF Engine

2.3

Host Interface Signals

This section describes the signals available to the host processor at the 75 pin application

interface. Eight signals are eliminated by the notch on the host connector, leaving 67 usable

signals. A diagram of the M.2 module identifying the 75 pin interface is shown in Figure 5.

Note that the M.2 module has all components mounted on the top side. Odd pin numbers are on the top

side while even pins on the bottom side.

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Figure 5 PCI Express M.2 Module Interface

A complete description of all interface signals available at the host interface is listed in Table

4. Some features, such as GNSS and Antenna Tuning, are not available on every M.2 module.

On those modules, the signals at the application interface are not connected on the M.2

module.

Table 4 M.2 Host Interface Signals

Signal Name

I/O

Description

Supply

CONFIG_3 O Presence Indication:

WWAN M.2 Connects to GND

internally

3.3V

M.2 Supply Pin 3 .3 V

3.3 V

GND

Ground

3.3V

M.2 LTE Supply Pin 3 .3 V

3.3 V

GND

Ground

FULL_CARD_POWER_OFF#

Control s ignal to power On/Off

M.2.

1.8 V

USB D+

USB 2.0 HS DPLUS Signal

W_DISABLE#

Active low si g nal to Disable

Radio Opera tio n

3.3 V

USB D–

USB 2.0 HS DMINUS Signal

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LED#1

Open Drain, active low signal

used for add-in card to

provide sta tus

3.3 V

GND

Ground

SLOT KEY

AUDIO0 IO PCM Clock (I2S_CLK) 1.8 V

CONFIG_0 O Configuration Status.

Prese ntly no t conne c ted on

WWAN M.2 module.

AUDIO1 I PCM In (I2S_RX) 1.8 V

WAKE_WWAN#

Wake On WWAN

Use by M.2 to wake up host.

1.8 V

AUDIO2 O PCM Out (I2S_TX ) 1.8 V

DPR

Dynamic Powe r Reduction -

Body SAR control signal

1.8 V

GNSS_DISABLE#

Disable GNSS function

1.8 V

GND

Ground

AUDIO3 IO PCM Sync (I2S_WA0 ) 1.8 V

SSIC_RxN

SSIC Receive N

(Not Suppor te d)

UIM-RESET

SIM Reset (I)

1.8

V/3.0 V

SSIC_RxP

SSIC Receive P

(Not Suppor te d)

UIM-CLK

SI M Cl oc k ( I)

1.8

V/3.0 V

GND

Ground

UIM-DATA

SIM Data (I/O )

1.8

V/3.0 V

SSIC_TxN

SSIC Transmit N

(Not Suppor te d)

UIM-PWR

SIM power

1.8

V/3.0 V

SSIC_TxP

SSIC Trans m it P

(Not Supported)

N/C

Not connec te d internally on

M.2

GND

Ground

I2C_SCL

I2C C l oc k – GNSS Support

1.8 V

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N/C

Not connec te d internally on

M.2

I2C_SDA

I2C Data – GNSS Su p port

1.8 V

N/C

Not connec te d internally on

M.2

I2C_IRQ

GNSS Interrupt Request –

GNSS Support

1.8 V

GND

Ground

SYSCLK

26 MHz referen ce Cloc k

output for exte rnal GNSS

module

1.8 V

N/C

Not connec te d internally on

M.2

TX_BLANKING

GNSS Blank ing Signal used to

indicate 2G Tx burst and LTE

band 13 Tx burst.

1.8 V

N/C

Not connec te d internally on

M.2

N/C

Not connec te d internally on

M.2

GND

Ground

N/C

Not connec te d internally on

M.2

N/C

Not connec te d internally on

M.2

N/C

Not connec te d internally on

M.2

N/C

Not connec te d internally on

M.2

N/C

Not connec te d internally on

M.2

GND

Ground

N/C

Not connec te d internally on

M.2

ANTCTL0

RF Antenna Tuning Control

Signal 0

1.8 V

COEX3

Wireless Coexist ence between

WWAN and WiFi/BT

modules. IDC_LteDtxEnv

1.8 V

ANTCTL1

RF Antenna Tuning Control

Signal 1

1.8 V

COEX2

Wireless C oexistence between

WWAN and WiFi/BT

modules. IDC_CwsPriority

1.8 V

ANTCTL2

RF Antenna Tuning Control

Signal 2

1.8 V

COEX1

Wireless C oexistence between

WWAN and WiFi/BT

modules. IDC_LteFrameSync

1.8 V

ANTCTL3

RF Antenna Tuning Control

Signal 3

1.8 V

SIM DETECT

SIM Card Detection (I) (low

active).

• Pull-up resis to r o n WWAN

M.2 module

1.8 V

RESET#

Single control to reset WWAN

1.8 V

N/C

Not connec te d internally on

M.2

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CONFIG_1 O Configuration Status

WWAN M.2 Connects to GND

internally

3.3V

WWAN Supply Pin 3.3 V

GND

Ground

3.3V

WWAN Supply Pin 3.3 V

GND

Ground

3.3V

WWAN Supply Pin 3.3 V

CONFIG_2 O Configuration Status

WWAN M.2 Connects to GND

internally

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M.2 Module Interface Details

This section provides details on the various interfaces available M.2 modules.

3.1

Interprocessor Interface (IPC)

There are two inter face s on the M.2 host inter fac e that suppor t interp roce ssor comm un ications

(ICP); however, for the WWAN M.2 modules covered by the Product Description only the

USB 2.0 High-speed port will be supported.

The other ICP interface, USB Super-speed Inter-Chip (USB_SSIC), is not supported and the

signals should not be connected at the host.

The host processor, connected via an ICP interface, has access to the functions of the WWAN

card.

3.1.1

USB 2.0 High-Speed – IPC Interface

The USB 2.0 High-speed interface supports the followi ng dev ice classes: CDC-MBIM, CDC-

ACM, and CDC-NCM.

The USB Controller is compliant to the USB 2.0 Specification and with the Link Power

Management (LPM) Addendum. LPM introduces a new sleep state (L1) which significantly

reduces the transitional latencies between the defined power states; hence, improving the

responsiveness of the WWAN platform regarding connecting to the internet (Quick Connect).

• USB2.0 LPM L1 Support

• Support for OS assisted fast dormancy

• Selective Suspend support

• Very low power when in Selective Suspend:

 <4mw when connected to network (wake)

 <1 mW no wake

It supports High-speed (HS, 480 MBit/s); Full-speed (FS, 12 MBit/s) transfers. Low- speed

mode is not supported. Because there is not a separate USB-controlled voltage bus, USB

functions implemented on the M.2 module are expected to report as self-powered devices

General Features

• In device mode : High-speed (480 MBit/s) and Full-speed (12 MBit/s)

• In host mode: High-speed (480 MBit/s), Full-speed (12 MBit/s). Low-speed mode (1.5

Mbit/s) is not supported.

• Support for 16 bidirectional end points and channels including the end point 0.

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Table 5 USB HS Interprocessor Communications In

ter

face

Signal Name

Description

Direction

(WWAN)

Voltage

Level

USB_D+

USB Data Plus

I, O

Per USB 2.0

specification

USB_D–

USB Data

Minus

I, O

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3.1.2

USB Super-speed IC (Reserved)

The USB Super-speed IC (USB SSIC) solution is not supported by the WWAN M.2 modules

presented in this Product Description. It is set aside for future development. These signals

should be left un-connected on the host.

Table 6 USB SSIC – ICP Interfa ce

Signal Name

Description

Direction

(WWAN)

Operating

Voltage

Range

SSIC_RXN USB SS IC Receiver Signal N 29 O

Per SSIC

specification

SSIC_RXP USB SS I C Receiver Signal P 31 O

SSIC_TXN USB SSIC Transmitter Signal N 35 I

SSIC_TXP USB SSIC Transmitter Signal P 37 I

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3.2

(U)SIM Interface

The USIM interface is compatible with the ISO 7816-3 IC Card standard on the issues

required by the GSM 11.12 and GSM 11.18 standard.

Both 1.8 V and 3 V SIM Cards are supported.

A few comments on the SIM_DETECT signal

1. An external pull-up resistor is connected to SIM_DETECT on the WWAN M.2

module.

2. When a SIM is inserted, SIM_DETECT will be high.

3. When a SIM is removed or not present, SIM_DETECT will be low.

4. The host does not need to drive this signal. It can be tri-stated.

Table 7 (U)SIM Interface Signals

Signal Name

Description

Direction

(WWAN)

Voltage

Level

UIM_CLK

Clock SIM Card

1.8 V/ 3.0

UIM_DATA

Input/ Output SIM Card

I, O

1.8 V/3.0

UIM_RESET

Reset signal for SIM card

1.8 V/3.0

USIM_PWR

1.8 V/ 3 V S upp l y for SIM C a rd

1.8 V/3.0

SIM Detect

SIM Card Detection

1.8 V

3.2.1

SIM Design Recommendations

The following design guidelines are recommended for the SIM card socket mounted on the

host system :

• Length of the traces UIM_CLK, UIM_DATA, and UIM_RESET should not exceed

10 cm.

• UIM_D A TA is a sensitive open-drain bi-directional signal. It should not be mounted

beside the UIM_CLK signal for long distances. It is recommended to place the

UIM_RST trace between UIM_DATA and UIM_CLK to provide isolation. If the

traces are run a long distance, surround the UIM_DATA with ground to shield from

system noise and UIM_CLK.

• The rise time for UIM_DATA should not exceed 1 µs per the 3GPP specification.

High input capacitance may increase rise time and lead to certification failure.

o Keep UIM traces with low capacitance between each other and to GND

o An ESD component with high capacitance may increase rise time.

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o The pull-up current cannot be increased to speed up rise time, because the

pull-up current must not exceed 1 mA including any crosstalk.

o Pull-up current is defined by the 4.7 kΩ pull-up resistor (to USIM_PWR) on

the WWAN M.2 module, plus 200 µA from the baseband chip is

approximately 0.8 mA.

• Place a decoupling capacitor close to the SIM card socket.

3.3

GNSS Interface

Some M.2 modules incorporate GPS and GLONASS receivers with aGPS to support

Global Positioning.

For M.2 modules that feature GNSS support, see Table 1, the M.2 module incorporates the

CG1960 Single-Chip GNSS Device, which is a complete receiver for simultaneous reception

and processing of both GPS and GLONASS signals. It includes LNA, mixer, bandpass filter,

VCO, ALC, fractional-N frequency synthesizer, digital tunable filters, PGA stage, and multi-

bit ADCs. A UART interface is used by the

X-GOLD™ Communications Processor on the M.2 module to control the GNSS device. The

solution offers best-in-class acquisition and tracking sensitivity, TFF and accuracy.

The GNSS device supports several different power management modes which gives the

lowest possible energy usage per fix. The pre-calculated location data will be sent over the

USB host interface. In addition, the M.2 will produce GPS data when the system is in sleep

mode via an I2C interface to allow for applications to be available in low power modes.

GNSS General Features

• Autonomous GPS / GLONASS

• Assisted GPS Using SUPL 1.0/2.0

• MS Assisted positioning ( SET / NET Initiated )

• MS Based positioning ( SET / NET Initiated )

• SUPL 2.0 Feature Sets

• Version Negotiation

• Periodic Triggers

• Emergency Positioning

• Area Event Triggers (SET Init & NET Init)

• Application ID

• Enhanced Cell Id

• Multiple Location IDs

• Session Info Query

• Location Transfer to 3rd Party

• Notification Verification Based on Current Location

• Location Request to another SET

A diagram of the GNSS connections on the M.2 module is shown in Figure 6. This diagram

identifies the signals between the X-GOLD™ baseband and GNSS devices along with the

USB and GNSS signals available to the host at the card interface.

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Figure 6 GNSS Connections and Interface

A description of the signals between the X-GOLD™ baseband and the CG1960

interface are defined in Table 8.

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Table 8 X-GOLD™ Baseband to GNSS Interface Signals

Signal

Description

VBAT

Battery Supply

1.8V

1.8 V Supply provided from X-GOLD™ Baseband

UART

The data and control I/F between the X-GOLD™ baseband and the GNSS

device is over a 4 wire UART interface which include CTS/RTS handshaking.

PDB

X-GOLD™ baseband uses this signal to control Power-on/reset of the GNSS

device

LPO_CLK

X-GOLD™ baseband provides a permanently active 32 kHz clock to the GNSS

device

EXT_REF_CLK

X-GOLD™ baseband provides a 26 MHz clock to the GNSS device for

frequency aiding.

EXT_DUT_CLK

X-GOLD™ baseband provides this signal to notify the GNSS device of that

GSM Tx activity (PA Blanking)

EXT_FRM_SYNC

X-GOL D™ baseband provides a strobe signal to the GNSS device to allow fine

time assistance based on 3GPP cell timing.

The GNSS signals available to the host at the WWAN module interface to support

GNSS operation are shown in Table 9.

Table 9 GNSS Module Interface Signals

Signal Name

Description

Direction

(WWAN)

Voltage

Level

I2C_SCL

I2C Clock

I, O

1.8 V

I2C_SDA

I2C Data

I, O

1.8 V

I2C_IRQ

I2 C IRQ - Interrupt signal

1.8 V

SYSCLK

Synchronization Clock

1.8 V

TX_BLANKING

TX Blanking – Active High when M.2 is

transmitting.

1.8 V

GNSS_DISABLE#

GNSS Disable

• High: GNSS function is determine by AT

command.

• Low: GNSS function is disabled.

• GNSS_DISABLE# pin has a pull-up resistor

on the WWAN M.2 modul e

1.8 V

3.4

System Control Interface

The system control interface is used to control the power-up and reset of the WWAN

module. There are additional control signals to disable the radio, drive an LED as a status

indicator, an output to wake the host processor, and an input for body SAR.

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3.4.1

Power On & Reset

The host processor has two signals that can be used to power on and reset the modem.

Powering off the modem is accomplished through an AT command.

Table 10 Power-on & Reset Signals

Signal Name

Description

Direction

(WWAN)

Voltage

Level

FULL_CARD_POWER_ON_OFF

Modem power on: For Tablet based designs

only; this signal is used for power on-off

control of

X-GOLD™ Baseband IC.WWAN M.2

module

• Logic Low: M.2 Off

• Logic High: WWAN M.2 Power On

This pin has an internal pull-down resistor.

Ultrabook designs:

Ultrabook host should deliver a 1.8V signal

to turn on the module. If 1.8V is not feasible,

recommend using a 47kΩ series res is tor

connected to 3.3V.

1.8 V

RESET#

Reset the WWAN syst em. This signal is

used to reset the module.

This signal is part of the m odem rigo rou s

power-off p rocedur e. The host will first

assert this sig nal, fol lowed by assertion of:

• FULL_CARD_POWER_OFF# signal (for

Tablet)

• Switch off 3.3V regulator (for Ultrabook)

Asserting RESET first is to trigger PMU

internal state machine to run shutdown

sequences e.g. for SIM and external

memory controller (EMIC), before

switching off power supplies.

• Asynchronous, active low signal. When

active, the WWAN M.2 module will be

placed in a power–on reset condition.

RESET# pin has a pull-up resistor on the

WWAN M.2 module

1.8 V

3.4.2

Host Radio Disable Operation

An additional control signal is used to disable the radio on the module.

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Signal W_DISABLE# is provided to allow users to disable, via a system-provided switch,

the add-in card’s radio operation in order to meet public safety regulations or when

otherwise desired. Implementation of this signal is required for systems and all add—in

cards that implement radio frequency capabilities.

The W_DISABLE1 signal is an active low signal that when driven low by the system shall

disable radio operation. The assertion and de-assertion of the W_DISABLE# signal is

asynchronous to any system clock. All transients resulting from mechanical switches need to

be de-bounced by the host system and no further signal conditioning will be required. When

the W_DISABLE# signal is asserted, all radios attached to the add-in card shall be disabled.

When the W_DISABLE# is not asserted or in a high impedance state, the radio may transmit

if not disabled by other means such as software.

The operation of the W_DISABLE# Signal is:

Enable, ON (3.3V): The radio transmitter is to be made capable of transmitting.

Disable, OFF (low): The radio transmitter(s) is to be made incapable of transmitting.

Standard TTL signaling levels shall be used making it compatible with 1.8 V and 3.3 V

signaling.

W_DISABLE# pin has a pull-up resistor on the M.2 module.

Table 11 Radi o Disable Signal

Signal Name

Detailed Description

Direction

(WWAN)

Voltage

Level

W_DISABLE#

Disable Radio. This active low signal

allows the host to disable the M.2 radio

operation in order to meet public safety

regulations or when otherwise desired.

• Logic Low: M.2 Off

• Logic High: function is

determined by Software (AT

Command).

If this pin is left un-connected,

functionality is controlled by software.

Care should be taken not to activate this

pin unless there is a critical failure and

all other methods of regaining control

and/or communication with the M.2

module have failed.

Compatible

with

1.8 V/3.3

Standard TTL signaling levels shall be used.

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Table 12 Host Radio Disable Interface (W_DISABLE#)

Requirement

Detailed Description

Radio disable duration

On reception of a HW or SW disable signal, the WWAN module

will initiate within one second the mandatory cellular procedures

(which are dependent on current state) for disconnecting from

the cellular network. The time taken to complete the procedures

will be dependent on external factors including but not limited

to: 3G/4GPP specifications, network implementation, radio

conditions, etc. Once those procedures are complete, the WWAN

module will switch off the RF.

Radio enable duration

On reception of a hardware or software enable signal the

WWAN module will initiate within one second the mandatory

cellular procedures for connecting to the cellular network.

Radio enable during selective suspend

If radio is disabled due to W_DISABLE# assertion and WWAN

module is in selective suspend, then W_DISABLE# de-assertion

shall be detected by WWAN module and the module shall

initiate exit from selective suspend.

3.4.3

LED Interface – Status Indicator

An LED will be used to provide status indications to users via system provided

indicators.

LED#1 (pin 10) is an active low output signal intended to drive system-mounted LED

indicators. These signals shall be capable of sinking to ground a minimum of 9.0 mA at up to

a maximum VOL of 400 mV.

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Table 13 LED#1 Signal

Signal Name

Detailed Description

Direction

(WWAN)

Voltage

Level

LED#1

LED Status Indicator

O (OD)

3.3 V

Figure 7 is an example of how an LED indicator is typically connected in a platform/system

using 3.3 V. The series resistor can be adjusted to obtain the desired brightness.

Figure 7 Typical LED Connection

The indication protocol for the LED is shown in Table 14.

Table 14 LED State Indicator

State

Definition

Characteristics

WWAN

OFF

The LED is emitting no

Not

ON The LED is emitting light

in a stable non-flashing

state

- Powered registered but

not transmitting or

receiving

3.4.4

Wake on WWAN Signal

An output signal is available to wake the host system, WAKE_WWAN#. This is an active

low, open-drain output.

This output requires a pull-up resistor on the host system.

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Table 15 Wake on WWAN Signal

Signal Name

Detailed Description

Direction

(WWAN)

Voltage

Level

WAKE_WWAN# Used by M.2 module to wake the

host. Active Low, Open Drain output

23 O (OD) 3.0 V

3.4.5

Dynamic Power Reduction

With the arrival of Tablets and Ultrabook™ platforms where the antenna is in the base of the

unit, there is a significant issue passing Specific Absorption rate (SAR) requirements for

certification.

The WWAN M.2 module has the ability to configure RF TX power levels based on

proximity sensor input from the host.

A WWAN M.2 power control API is available to the host to dynamically reduce RF

transmit power levels of the WWAN module based on proximity sensor input from the

host.

The DPR# (Dynamic Power Reduction) signal is available on the host interface to assist in

meeting regulatory SAR (Specific Absorption Rate) requirements for RF exposure. The

signal is provided by a host system proximity sensor to the WWAN module to provide an

input trigger causing a reduction in the radio transmit output power.

In conjunction with the DPR signal, a full power control API is available to the host to

adjust the RF transmit power level of the WWAN module.

DPR pin has a pull-up resistor on the WWAN M.2 module.

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Table 16 DPR#/ SAR Support Signal

Signal Name

Detailed Description

Direction

(WWAN)

Voltage

Level

DPR# Dynamic Power reduction.

25 I 1.8 V

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3.5

Tunable Antenna Control Interface

In notebook platforms, since the WWAN antennas are usually located on the top of the lid,

there is a long RF mini-coax cable that can be up to 60 cm long between the antenna and

WWAN module, it is preferred to use switches/tunable components directly on the antenna

for antenna band switching/tuning to improve efficiency.

On select WWAN M.2 modules, four (4) GPOs are available on the host interface that can be

connected to an external antenna switch, to load the antenna with different impedances,

configuring the different frequency responses for the main antenna. A sample block diagram

depicting the antenna control signal connections to the antenna switch is shown in Figure 8.

Intel’s current antenna control solution offers an open loop control solution. The WWAN

M.2 modem expects the AP to provide the antenna profile detection and through a pre-

defined API, notify the WWAN M.2 modem with the correct antenna profile. The WWAN

M.2 modem then applies the proper antenna profile data accordingly.

Figure 8 Antenna Cont rol – Conne c t ion s Detail

The electrical specification for the antenna control GPIOs are shown in Table 17.

Table 17 Tunable Antenna Control Signals

Signal

Name

Description Smarti™ 4G Signal

Direction

(WWAN)

Voltage

Level

ANTCTL0

Antenna Control 0

GPO8

1.8V

ANTCTL1

Antenna Control 1

RFFE2 _ S D AT A/ GP O9

1.8V

ANTCTL2

Antenna Control 2

RFFE2_SCLK/ GPO10

1.8V

ANTCTL3

Antenna Control 3

RFFE2_VIO/ GPO11

1.8V

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3.6

In-Device Coexistence Interface

As more and more radios are added to PC Ultrabook™ and tablet platforms, the sources RF

interference increases significantly as multiple radios will have overlapping transmissions

and receptions. This problem will increase further as overlapping bands continue to be rolled

out; WIFI, BT, WWAN will all use overlapping band from 2300 MHz to 2600 MHz.

In-Device Coexistence is a feature which improves the user experi ence and m aximizes

throughput and Quality of Service of connectivity systems (WLAN, BT and GNSS) when

these radios are simultaneously running with the WWAN M.2 LTE modem.

A diagram of the In-Device Coexistence architecture is shown in Figure 6.

Application

Processor

apps

coexistence

interface

Connectivity Chi p

(WLAN/BT/GNSS)

NRT

Coexistence

interface

Coexistence

interface

X-GOLD™ 716

apps

coexistence

interface

NRT

Coexistence

interface

Coexistence

interface

CPU

NRT

coexistence

controller

LTE L1

coexistence

controller

Message –based I/ F)

IDC_CwsPriority

NRT Apps Coex I/F

Message –based I/ F)

NRT Coex I/F

IDC_LteFrameSync

IDC_LteDtxEnv

Figure 9 In-Device Coexistence Architecture

Seamless Co-running

In-Device-Coexistence primarily aims at avoiding interference between radio systems to

allow seamless co-running where LTE and WLAN/BT/GNSS ensuring their maximum

throughput and performance. To do so, a Non Real Time (NRT) coexistence controller is

implemented on the ARM™ CPU. The NRT coexistence controller central iz es LTE, WL AN ,

BT and GNSS information and performs interference avoidance mechanisms, selecting

interference-safe frequ en cy config urat ion s whenev er p ossible. The NRT coexistence

controller is also in charge of enabling some Real Time (RT) coexistence mechanisms when

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NRT mechanisms are not sufficient to guarantee seamless co-running of LTE and

connectivity systems (WLAN, BT, and GNSS).

Inter-system Synchronization

For the cases where co-running of LTE and connectivity systems cannot be achieved, a Real

Time (RT) coexistence controller is implemented in the LTE Layer-1 subsystem. The RT

coexistence controller is in cont rol of the RT coexistence interface, which is exposed to the

connectivity chip. The RT coexistence controller exploits real tim e information receiv ed from

the LTE Layer-1 subsystem and from the connectivity chip to coordinate LTE and

connectivity “in the air” activities. The coordination function protects LTE traffic while

optimizing the throughput and availability of WLAN/BT/GNSS. When operating in this mode,

the connectivity systems have reduced capability since they access the medium when LTE is

inactive, or when their respective operations do not impact each other sig nific ant l y .

The Non Real-Time mechanism implements a messaging based interface, formatted as AT

commands that are passed to the AP host over the IPC interface (USB). A simple piece of SW

residing on the AP host will tunnel the Non Real-Time messages between the BT/WLAN

device and M.2 module, translate AT commands to/from the BT/WLAN driver commands,

and maintain the states of the BT/ WLAN and M.2 LTE modem. The host software will also

be responsible for initializing the Real-Time mechanism.

The Real-Time mechanism consists of 3 GPIO signals which allow the synchronization of

multiple TX and RX events. The signals to support real Time coexistence are listed in Table

18.

If the coexistence signals are not used by the host system, they should not be

connected.

Table 18 Coexistence – Hardware Synchronization Signals

Signal

Name

Description

Direction

(WWAN)

Voltage Level

COEX3 IDC_LteDtxEnv - Synchronous signal

ndicating LTE UL gap. Envelop signal with

edges occurring 1ms before in-the-air gap

(raising and falling edges)

RT arbiter indicates to connectivity cores

when there is no LTE Tx (Envelope)

60 O 1.8 V

COEX2 IDC _CwsPriority - 0 : Low priority / 1 :

high priority CWS Indicates if the coming

activity is high priority

62 I 1.8 V

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COEX1 IDC_LteFrameSync - Synchronous signal

indicating LTE frame start.

Indicates LTE frame start to BT/WLAN

device. Can be used by BT to synch up

periodic activity with LTE timing

64 O 1.8 V

3.7

Power Supply Interface

The M.2 modules require the host to provide the 3.3 V power source. The voltage source is

expected to be available during the system’s stand-by/suspend state to support wake event

processing on the communications card.

The 3.3 V power and ground pins are listed in Table 19.

Section 8, Power Delivery Requirements, provides electrical requirements for the

power supply and I/O signals.

Table 19 Power & Ground Signals

Power Pins

Description

2, 4, 70, 72, 74

3.3 V Supply

3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73

Ground

3.8

Trace & Debug Interface

The USB port on the M.2 module will be used to support system tracing of the Protocol

stack. The USB HS and USB_SSIC ports can be used for software download, tracing, and

manufacturing testing

The JTAG & MIPI PTI1 ports are accessible on the module to support system debug. A

temporary cable assembly over flat flex should be assembled on bottom of the module and

lead out of the final product. The cable would not be mounted on the final product.

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3.9

Configuration Pins

There are 4 configuration pins on the M.2 module to assist the host identifying the presence

of an Add-In card in the socket.

On the M.2 module, pins CONFIG_0..3 are configured as shown in Table 20.

All configuration pins can be read and decoded by the host platform to recognize the

indicated module configuration and host interface supported. On the host side, each of the

CONFIG_0..3 signals needs to be fitted with a pull-up resistor.

Table 20 M.2 Configuration Pins

Signal Name

Description

Direction

(WWAN)

Voltage

Level

CONFIG_0 This sig na l is not connec te d to the WWAN M.2

module. 21 O -

CONFIG_1 Tied to Ground internally on the WWAN M.2

module. 69 O 0 V

CONFIG_2 Tied to Ground internally on the WWAN M.2

module. 75 O 0 V

CONFIG_3 Tied to Ground internally on the WWAN M.2

module. 1 O 0 V

3.10

Audio Pins (Reserved)

There are 4 signals on the host interface that are reserved to support a digital audio interface.

This is for future development, all existing WWAN M.2 modules do not support audio;

therefore, these signals should be left unconnected at the host to avoid any contention.

Table 21 Audi o Sig nal s (Fu ture develo pment)

Signal Name

Description

Direction

(WWAN)

Voltage

Level

AUDIO0 PCM Clock (I2S_CLK) 20 IO 1.8 V

AUDIO1 PCM In (I2S_RX) 22 I 1.8 V

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AUDIO2 PCM Out (I2S_ TX) 24 O 1.8 V

AUDIO3 PCM Sync (I2S_WA0) 28 IO 1.8 V

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3.11

No Connect Pins

The M.2 has several No Connect pins. The pins are not connected on the

M.2 module.

Table 22 No Connect Pins

Pins

Description

38, 41, 43, 47, 49, 50, 52, 53, 54, 55, 56, 58, 68

No Connect Pins

12, 13, 14, 15, 16, 17, 18, 19

Slot key

3.12

Antenna Interface

The M .2 module has space for six antenna connectors; yet, as a minimum, only two will be

populated to support a main Rx/Tx antenna and a secondary antenna that will be

multiplexed between the Diversity receiver and GPS receiver (if applicable). Further details

on the antenna connector assignment can be found in Section 11.3.

The antenna signals are not available at the host interface but have their own

connectors. A diagram on the M.2 module with the location of the RF connectors

appears in Figure 10.

Table 23 Antenna Requirements

Requirement

Detailed Description

Connection

to module

The connector of WWAN antenna cable is I-PEX MHF4 or equivalent

Multi-band

single antenna

Single antenna has to support all bands of WWAN module specified in the

Product Features.

Diversity

antenna

Diversity antenna has to support all bands WWAN module specified in the

Product Features in addition GPS/GLONAAS frequencies.

GPS Antenna

The GPS antenna will share the Diversity antenna connector.

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Figure 10 RF Antenna – Coaxial Connector Location

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Development Tools

Intel Mobile Communications provides a carrier development board to facilitate system test

and verification of the M.2 module. In addition, a set of comprehensive tools to enable rapid

integration and customization of the M.2 software is provided.

The hardware and software tools for M.2 development are summarized below.

4.1

Carrier Board

The M.2 Carrier Board, shown in Figure 11, is Intel Mobile Communications hardware

platform to facilitate the test and verification on the M.2 module. Once the M.2 module is

mounted on the Carrier board, the user has access to all necessary interfaces on the module

(host interface signals, debug and trace, and antenna) allowing full system test, debugging,

and diagnostics. The carrier board with a mounted WWAN M.2 module is shown in Figure

11. Carrier Board.

Note: The Main and Diversity antenna locations have been swapped on the FIH7160

PR3.2 and earlier modules.

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Figure 11 M.2 Carrier Board

4.1.1

FlashTool

Intel Mobile Communications provides a utility program called FlashTool for

downloading a binary image into the Flash memory of the M.2 module. The USB-HS port

or USIF on the platform is used for connection to a PC via a USB cable for flashing.

FlashTool is a Win32/64 application built on top of the dynamic link library,

Download.DLL.

4.1.2

PhoneTool

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PhoneTool is a development tool built on top of the so-called “production test dll,

DWDIO.dll”. PhoneTool can be used to fine tune the parameters of:

• Audio configuration and settings (if enabled on M.2 module)

• NV (Non-Volatile) memory

• RF power ramp

• Security data IMEI

• SIM

• Real Tim e Clock

It also includes interfaces for:

• AT Terminal for sending and receiving AT commands.

• DWDIO interface for manual access to the production test dll DWDIO.dll.

• Generic Test Interface (GTI) for RF calibration.

4.1.3

System Trace Tool

System Trace Tool (STT) allows capturing trace sub-streams from different sources on

the platform in one combined stream.

Depending on the trace interface bandwidth, the combined data stream can be sent either

over one of the standard communication interfaces (e.g. USB) or over a dedicated high-

speed MIPI trace interface.

Captured trace data includes standard 3GPP IPC messages, print statements inserted by

developers in the code, error messages, and core dump (crash) information. The actual

decoding of the trace data is done by pluggable decoder libraries, DLL’s and scripts,

which are specific to the version of the mobile station software from which the trace is

captured.

The STT application has a GUI (Graphical User Interface) which provides an easy to use

graphical interface to view, search and analyze trace data. It supports advanced message

filtering runs on all Microsoft Windows® platforms.

STT will become the only tool for trace analysis in the future, the legacy trace tools,

Mobile Analyser and Artemis, will be continue to be supported for the 2G/3G WWAN

M.2 HSPA+ module.

4.1.4

RF Calibration

XMMCalTool is a utility program that can be used for RF calibration. XMMCalTool

supports the following features:

• Optimized calibration

• 3G TX closed loop power control

• Parallel calibration 2G low/high band

• Non-signaling verification

• Industry leading fast sequenced test concept

• Supports parallel RX and TX verification

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• Proven Single-Ended BER for faster BER

• < 4 sec/per channel for 3G fast verification (BER, RSSI, TX, ILPC)

Tester supported: R&S CMU200, CMW500, and Agilent 8960

4.1.5

Noise Profiling Scan Tool

M.2 modules are marketed for use on Tablet, Ultrabook, and Laptop devices. OEM

vendors routinely offer multiple hardware configurations for the same base model, with

different processor speed, drive type, or display type, etc. Each configuration has a

different Radio Frequency emission profile with the possibility of introducing new

interference sources to a modem module.

The Noise Profiling Tool will measure, record down & plot graph of the RF noise level

present on each RX channel. This SW tool will switch on receiver port and sweep all

applicable RX channels on each band and each technology (WiFi, Bluetooth, GPS, and

GLONASS). This will allow OEM vendors to quickly know the noise jamming profile to the

modem module plugged in their devices.

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Windows Software Components

The following section describes the system architecture of Inter-Processor Communication on

a WWAN M.2 module when connected to a Microsoft Windows® based Host OS Windows®

7, Windows® 8.x.

The software components of a WWAN M.2 module running Windows® 7 and

Windows® 8 are depicted in Figure 12 and Figure 13 respectively.

In the Windows® 7 architecture:

• The Windows® 7 driver interfaces with the WWAN M.2 modem using a virtual

terminal connection over CDC-ECM.

• A Third party connection manager utilized

• Independent Hardware Vendor (IHV) provided MBIM driver

In the Windows® 8 architecture:

• Microsoft requirements:

o MBIM interfaces

o User Mode Driver Framework (UMDF) driver for GNSS, and Firmware

Update, Carrier Switching application.

o RTD3 support

For all Windows platforms:

• The WWAN M.2 module is exposed as a composite device

• GNSS will be supported through a serial interface

• When mobile broadband is disabled, GNSS will sti ll b e av ailable.

• The mobile network adapter driver will interface to the modem software through the

MBIM interface.

• All Intel specific features will be supported through MBIM.

• The connection manager provided with Win 8 OS and above will be used. For

• Win 7, the IHV provided connection manager is used.

• There will be an application layer to hide the differences in the mobile broadband API

between Win 7 and Win 8.

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Figure 12 Windows 7 Software Architecture

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Figure 13 Windows 8 Software Architecture

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5.1

MBIM Toolkit

5.1.1

Windows® 7 MBIM driver

In order to support both Windows® 8 and Windows® 7 (for corporate legacy applications),

with a single modem architecture, IMC will provide a kernel level driver implementing the

Mobile Broadband Interface Model. The driver is WHQL certified for Windows® 7.

5.1.2

GNSS UMDF driver for Windows® 7 and Windows® 8

IMC provides a GNSS "User mode" driver to enable GNSS Applications executing on

Windows PC/Tablet to communicate to the GNSS device located on the M.2 module. The

driver communicates to Modem module via AT commands over an ACM-CDC USB

channel.

5.1.3

M.2 module Firmware Update

This is a “user friendly” Windows GUI application enabling the consumer, whose Ultrabook

or tablet is hosting an Intel M.2 module, to update the firmware on WWAN module by

executing a graphical application based on .NET4 framework. The same application runs on

both Windows® 7 and Windows® 8 environments and its look & feel can be customized if

required.

This same application is used to upgrade the standard image flashed at the factory with one

that better fits the local Carrier. When a new SIM is inserted, the application will detect the

inserted SIM does not match the WWAN device firmware. It will then allow the user to

select and update the WWAN firmware with a suitable image reflecting the local network of

the Carrier.

5.1.4

End User Trace Tool

This is a Windows® 8 application allows a M.2 end user to collect debugging information

under guidance of a Customer Support operator. The log file can be sent to a Technical

support center and fed into an analysis tool, such as Intel’s Mobile Analyzer application, to

diagnose potential problems found in the field after module deployment.

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Linux/Chrome Software Architecture

The following section describes the system architecture of Inter-Processor Communication

on a M.2 module when connected to a Linux based Host OS (Android, Chrome, and Ubuntu).

The description is only concerned with the HS-USB port which is the only available

functional interprocessor communications (IPC) interface at run-time and takes into account

only the AT control plane and IP packets data connection. Audio packet exchange is outside

the scope of the current version of M.2.

6.1

Overview

Figure 14 illustrates the architecture of the IPC and its components.

Figure 14 Linux Software Architecture

The user data is transferred from/to the cellular protocol stack (C-PS) to the IPC via a

centralized memory manager. The centralized memory manager is called packet buffer

manager (PBM). The user data is routed along the data plane as IP packets using several

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logical channels. Each logical channel corresponds to a dedicated Packet Data Network

(PDN) connection.

There is no TCP/IP stack on the modem side in the data path from IPC over PBM to

C-PS handling IP address based routing.

The central packet buffer manager (PBM) provides a common packet buffer used between

IPC and PS. No copy operation of data is necessary between cellular PS and IPC. The HS-

USB interface provides a highly efficient data path via DMA with scatter/gather linked-list

processing.

The control plane is using at least one dedicated channel through Serial IO component (S-IO)

to the AT command handler. The interface towards the driver is called Universal Terminal

Adapter (UTA)-Terminal, while the interface towards application is called UTA-Serial

interface. The application in our case is the AT command handler called C-AT. The control

channel is using AT commands. A detailed list of all supported AT commands can be found

in a separate application note.

6.2

CMUX Multiplexer

In the context of an AT command based architecture, a SW multiplexer can be added. The

SW multiplexer of the 3GPP 27.010 protocol provides a number of logical channels (DLC)

which serve as AT terminals on Host PC side. These logical channels are mapped on-top of

one of the control channels of the specific physical IPC interface.

The 3GPP 27.010 multiplexer protocol is a data link protocol (layer-2 of the

OSI mo

which uses HDLC-like framing, virtual data channels, and channels’ control procedure. The

protocol is implemented according to 3GPP TS27.010. It allows software applications on the

Host processor to access the USB-HS port on M.2 in a concurrent way by emulating multiple

virtual communication channels. The MUX protocol controls the virtual channels and

conveys user data over the virtual channels.

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6.3

USB 2.0 HS Features

The USB 2.0 HS stack is used for communication with a PC in device role.

Additional details on the USB interface can be found in Section 3.1, Interprocessor Interface.

6.4

USB Configuration

The USB feature may be configured by the UTA_USB API. The user may define different

use cases, such as support of different numbers of CDC-ACM or CDC-NCM channels.

6.4.1

Modem Connection

Up to 3 CDC-ACM logical channels are available to be used as an interface for the

following functionality:

• AT commands

• 3GPP 27.010 Multiplexer

• Tracing

• Connection to test framework

The ACM channels are connected via UTA-Terminal to S-IO and from there via UTA-

Serial to the application on modem side.

6.4.2

Network Connection

Up to 4 CDC-NCM functions are available to be used as interface for network

connections servicing for up to four PDN connections.

The NCM channels are connected via the PBM driver interface to PBM and from there via

PBM service interfaces to the PTM component of C-PS.

6.4.3

Default Configuration

The default configuration is 3 CDC-ACM channels for control and trace and 4 CDC–

NCM channels for data connections. A specific configuration is set via the AT+XSIO

command. The detailed usage of the default configuration is:

• 1st ACM channel:: Modem Control Channel, Channel ID: USBCDC/0

• 2nd ACM channel:: Trace data, Channel ID: USBCDC/1

• 3rd ACM channel:: free, Channel ID: USBCDC/2

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• 1st - 4th NCM channel: data channel for PDN connection: Channel ID:

USBHS/NCM/0-3

6.5

LPM

The host computer can set the modem into USB sleep (L1) state (to save battery power)

whenever the link is idle. To return from sleep state the host computer performs

L1Resume. This can also be triggered by the modem using L1-Remote- Wake-up. The

sleep (L1) state is introduced by “USB 2.0 Link Power Management Addendum” and

allows fast state transitions between active and sleep states.

6.5.1

Suspend/Resume and Remote Wake-up

The PC can set the modem into USB suspend state (to save battery power) when no

communication takes place or when the PC is switched into standby mode. The suspend state

also can be triggered by X-GOLD™ Baseband device through a proprietary device initiated

selective suspend mechanism. The wake up is performed by Host Resume. The modem can

wake up the host computer from standby state using Remote Wake-up

6.5.2

Android Software Components

The software components of a WWAN M.2 module running the Android operating system is

shown Figure 15.

• Android version 15/16 will be supported.

• Intel Intrinsic Radio Interface Layer (RIL) will be used and supported via a USB

CDC-ACM driver.

• All Intel features will be supported via AT commands.

• Advanced Linux Sound Architecture (ALSA) will not be supported on data only

WWAN M.2 modules.

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Figure 15 Android Software Architecture

6.5.3

Chrome Software Components

A preliminary view of the software components of a WWAN M.2 module running the

Chrome operating system is shown in Figure 16. The architecture is still in development;

however, it is expected that:

• Intel Intrinsic Radio Interface Layer (RIL) will be used and supported via a USB

CDC-MBIM driver.

• All Intel features will be supported via MBIM commands.

• Advanced Linux Sound Architecture (ALSA) will not be supported on data only

WWAN M.2 modules.

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Figure 16 Chrome Software Architecture

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Operating Environment

Table 24 Operating Environment

Item

Description

Form Factor

Card Type 3042

Operating Temperature The module full operating temperature in compliance with 3GPP

specification shall be

-10 °C to +55 °C – Normal

+55 °C to +70 °C – Extreme

Extreme is the surrounding air temperature of the module inside the

platform when the card is fully operating at worst case condition.

We cannot guarantee the RF performance of the device, since

components might operate out of specification. On the RF side we are

using a mechanism called Progressive Power Reduction to limit the

PA output power at high operating temperature.

Storage Temperature

-40 °C (minus 40) to +70 °C (plus 70) non-operating.

Humidity

<85% humidity, non-condensing

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Power Delivery Requirements

8.1

Electrical Parameters (3.3 V Power Supply)

The M.2 modules utilize a single regulated power rail of 3.3 V provided by the host

platform. There is no other VDDIO like pin and the M.2 module is responsible for

generating its own I/O voltage source using the 3.3 V power rail. This

3.3 V voltage rail source on the platform should always be on and available during the

system’s stand-by/suspend state to support the wake event processing on the

communications card.

There are 5 power pins on the host interface, pins 2, 4, 70, 72, and 74.

The requirements of the regulated 3.3 V power supply provided by the host platform are

listed below.

Table 25 M.2 Module Power Delivery Requirements - Ultrabook

Requirement

Detailed Description

Supply voltage 3.3 V at the Card connector will be within 5% tolerance on the

motherboard.

Peak Current

The host board shall provide 2.5 A peak current.

Average Current

Average max current of 1.1 A will be supported.

Max in-rush current

Max module in-rush current of 5.1 A will be supported.

Power pin

connections

The power pins specified in WWAN card #’s, 2, 4, 70, 72, 74 will be connected

to 3.3 V supply and WWAN configuration pins 1, 69, and 75 will be connected

to ground.

For Tablet platforms, the 3.3 V regulated power rail can be replaced with a direct VBAT

connection. Key parameters for VBAT in a direct connection configuration are shown in

Table 26.

Table 26 VBAT Power Delivery Requirements – Direct Connections (Tablet)

Power Source

Vmin

Vmax

Cell Type

VBAT

3.135 V*

4.4 V

Once cell Li-Ion battery

(*) RF performance cannot be guaranteed below 3.135 V.

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8.2

Electrical Parameters - Host Interface Signals

Table 27 DC Specifica tion for 3.3V Logic Signaling

Symbol Parameter Condition Min Max Unit

+3.3V

Supply Voltage

3.135

3.465

Input High Voltage

2.0

3.6

Input Low Voltage

-0.5

0.8

Output Low Current for

Open-drain Signals

Not applicable to LED# and

DAS/DSS# pins

0.4 V

Output Low Current for

Open-drain Signals

Applies to the LED# pins

0.4 V

Input Leakage Current

0 V to 3.3 V

-10

+10

µA

LKG

Output Leakage Current

0 V to 3.3 V

-50

+50

µA

Input Pin Capacitance

OUT

Output Pin Capacitance

PULL-UP

Pull-up Resistance

kΩ

Table 28 DC Specification for 1.8V Logic Signaling

Symbol Parameter Condition Min Max Unit

DD18

Supply Voltage

1.7

1.9

Input High Voltage

0.7 *

VDD18

DD18

0.3

Input Low Voltage

-0.3

0.3 V

DD18

Output High Voltage

= -1 mA

VDD18 Min

DD18

0.45

Output Low Voltage

= 1 mA

VDD18 Min

0.45

Input Leakage Current

0 V to V

DD18

-10

+10

µA

LKG

Output Leakage Current

0 V to V

DD18

-50

+50

µA

Input Pin Capacitance

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8.3

Power Consumption

This section lists the power consumption targets.

Typical target values at Vsys = 3.3 V

Table 29 LTE Power Consumption

M.2 Power Consumption (*)

Transmit Power

LTE Use Case

Band

10 dBm

23 dBm

LTE UTP, Cat. 3, 20 MHz, 100 RB - (APAC SKU only)

1195 mW

2195 mW

LTE UTP, Cat. 3, 20 MHz, 100 RB - (APAC SKU only)

1175 mW

2356 mW

LTE UTP, Cat. 3, 10 MHz, 50 RB - (APAC SKU only)

1000 mW

2201 mW

LTE UTP, Cat. 3, 20 MHz, 100 RB - (APAC SKU only)

1175 mW

2244 mW

LTE UTP, Cat. 3, 10 MHz, 50 RB - (APAC SKU only)

1073 mW

2155 mW

LTE UTP, Cat. 3, 15 MHz, 75 RB - (APAC SKU only)

1122 mW

1911 mW

LTE UTP, Cat. 3, 15 MHz, 75 RB - (APAC SKU only)

1112 mw

1874 mW

LTE UTP, Cat. 3, 15 MHz, 75 RB - (APAC SKU only)

1208 mW

2270 mW

LTE UTP, Cat. 3, 100 Mbps/50 Mbps, 20 MHz – (APAC

not included)

1068 mW

2531 mW

LTE UTP, Cat. 3, max throughput, 10 MHz – (APAC not

included)

916 mW

2394 mW

LTE Use Case

Standby Power

LTE Stand-by current, DRX 1.28 s serv. Cell only 8 mW

(*) Applicable to modules:

• LN930

• LN930-AP

Table 30 UMTS Power Consumption

M.2 Power Consumption

Transmit Power

UMTS Use Case

(DC-HSDAP+ or HSDPA+)

Band

10 dBm

UMTS FTP, Cat. 24, RxDiv

(M.2 DC-HSDPA+) Band 1 988 mW

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UMTS FTP, Cat 14, QAM64

(M.2 DC-HSDPA+) Band 1 771 mW

UMTS FTP, Cat 14, QAM64

(M.2 HSDPA+) Band 1 813 mW

Standby Power

UMTS Stand-by current, DRX7, 16NB cells - 6 mW

UMTS Stand -by curre nt, DR X7, 16NB ce lls (HN930)

- 6.6 mW

Table 31 GSM Power Consumption

GSM Use Case

Band

Transmit Power

2UL, 1DL, PCL10 (*) GPRS 900 475 mW

2UL, 1DL, PCL5 (*) GPRS900 1482 mW

Standby Power

GSM Stand-by, DRX5, 16NB cells - 6 mW

GSM Stand-by, DRX5, 16NB cells (£) - 6.88 mW

(*) Applicable to modules: LN930, LN930-AP, HN930

(£) Applicable to module: HN930 (XMM™ 6260 based)

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Other Information

9.1

EMI/EMC and Platform Noise

The M.2 Data Card has shielding and noise filtering in place to ensure that the

WWAN module does not impact the operation of the host system.

The M.2 Data Card must also be able to tolerate platform noise caused by high order clock

harmonics from the host processor and associated support circuitry. It is required that the

noise levels (as measured at the antenna connector) in the operating frequencies of the M.2

Data Card be no greater than 5 dB as compared to the noise floor of the host system.

9.2

Platform Noise Mitigation - Adaptive Clocking

Wireless subsystems in mobile platforms are affected by platform related noise, even with the

best antenna and chassis design. This noise hampers the wireless radio performance,

sometimes severely. For platforms that incorporate wireless subsystems like WWAN, passing

the wireless operator certification is an important component of platform launch.

One of the key elements of platform noise, commonly referred to as RF interference, is LCD

display panel pixel clock and its harmonics. The pixel clock generates RF that translates

directly into noise picked up by platform wireless radios due to the close proximity of display

electronics and the integrated antennas in the system. Many of the panel vendors allow the

pixel clock to be “tweaked” (i.e. adapt the pixel clock) to shift the harmonics from interfering

with the wireless components in operating radio frequencies.

A radio’s receive performance could be improved by moving any harmonics of the graphics

pixel clock outside of the frequencies used by the wireless modules. This will be

accomplished by shifting the display pixel clock. Shifting the pixel clock is not expected to

affect the graphics quality or its performance. The display panel refresh rate will not be

changed.

To support crosstalk mitigation, the WWAN module provides an event indication to the host

when the channel frequency changes. On the event indication, the host would use the

frequency change information (i.e. Center Frequency, Bandwidth, and any other optional

information) through an API that would facilitate the facilitating the implementation of a

noise mitigation service.

9.3

Thermal Monitoring

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The M.2 Data Card includes a digital thermal sensor in order to monitor the temperature

of the WWAN Card. The firmware will support the extraction of temperature information

from the module and the configuration of auxiliary trip points.

The configuration of the thermal trip points and receipt of thermal data is available

through a WWAN power control API in order for the host to implement a power and

thermal management framework for the system.

9.4

Seamless Roaming / Wifi Offload

The WWAN M.2 module provides support for EAP methods; EAP-SIM, EAP-AKA, and

EAP-AKA’. These methods, which are used on WiFi authentication, require access to

WWAN SIM credentials to connect to WiFi Networks and offload from WWAN.

All necessary AT commen ds needed for the EAP-SIM f unctionality are supported. In addition,

all necessary commands need for the PIN entry, change, and lock/unlock are supported.

Through the API, the host can manage Wi-Fi Hotspot connectivity with Operator provisioned

Hotspot SSIDs and/or End-User provided SSIDs and seamlessly offload a data session from a

3G/4G connection to Wi-Fi hotspot connection after successful authentication of the device

and authorization of the end-user subscription using the SIM on the platform.

9.5

Conducted Transmit Power

Transmit power as measure at the WWAN antenna connector

Table 32 Conducted Transmit Power – 2G

Parameter

Condition

Requirement

Conducted Transmit Power 850 MHz/900 MHz 33 dBm +/- 3 db

1800 MHz/1900 MHz 30 dBm +/- 3 db

2G not supported for APAC SKU

Table 33 Conducted Transmit Power – 3G

HDPA+ / LTE LN930

Parameter

Condition

Requirement

Conducted Transmit Power

W-CDMA class 3

24 dBm + 1 db /- 3 db

LN930-AP (APAC SKU only)

Parameter

Condition

Requirement

Conducted Transmit Power

W-CDMA class 3

24 dBm + 1 db /- 3 db

1 Conducted transmit power as measured at the WWAN M.2 RF main antenna connector.

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Table 34 Conducted Transmit Power – LTE

HDPA+ / LTE LN930

Parameter

Condition

Requirement

Conducted Transmit Power

E-UTRA class 3

23 dBm + 0.5/- 1 db

LN930-AP (APAC SKU only)

Parameter

Condition

Requirement

Conducted Transmit Power

E_UTRA class 3

22.5 dBm + 0.5 /- 1 db

2 Conducted transmit power as measured at the WWAN M.2 RF main antenna connector.

9.6

Receiver Sensitivity

The reference sensitivity power level is the minimum mean power applied to both the WWAN

M.2 antenna ports at which the throughput shall meet or exceed the requirements for the

specified reference measurement channel.

Condition: Calibration voltage = 3.3V, 25C shielded room

Table 35 R x Sensitivity - GSM

Band Condition Min Rx Sensitivity Limit (dBm)

GSM850 GMSK -110

GSM900 GMSK -109

GSM1800 GMSK -109

GSM1900 GMSK -106

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Table 36 R x Sensitivity - UMTS

HDPA+ / LTE LN930

Band Condition Min Rx Sensitivity Limit (dBm)

1 BER<0.1% -107

2 BER<0.1% -106

4 BER<0.1% -107

5 BER<0.1% -107

8 BER<0.1% -107

LN930-AP (APAC SKU only)

Band Condition Min Rx Sensitivity Limit (dBm)

1 BER<0.1% -106

6 BER<0.1% -106

8 BER<0.1% -103

11 BER<0.1% -106

19 BER<0.1% -106

GSM not supported for LN930-AP

Main and Diversity ports are measured separately. Combining both antenna ports

increases sensitivity by 3 dB. Table 36 Rx Sensitivity – UMTS reflects both ports

combined.

Table 37 R x Sensitivity - LTE

HDPA+ / LTE LN930

EARFCN

LTE

Band Duplex Modulation Bandwidth

(Hz) Min Rx

Sensitivit

y Limit

(dBm)

Low

Channel Middle

Channel High Channel

FDD

QPSK

-96

320

550

FDD

QPSK

-95

650

920

1150

FDD

QPSK

-97

1250

1678

1900

FDD

QPSK

-96

2000

2110

2350

FDD

QPSK

-97

2450

2510

2600

FDD

QPSK

-96

2800

3100

3400

FDD

QPSK

-97

3525

3625

3750

FDD

QPSK

-97

5180

5230

5279

FDD

QPSK

-97

5780

5800

5890

FDD

QPSK

-97

5900

5925

5950

FDD

QPSK

-97

6050

6075

6100

FDD

QPSK

-94

6200

6300

6400

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LN930-AP (APAC SKU only)

EARFCN

LTE

Band Duplex Modulation Bandwidth

(Hz) Min Rx

Sensitivit

y Limit

(dBm)

Low

Channel Middle

Channel High Channel

FDD

QPSK

-96

320

550

FDD

QPSK

-96

1250

1678

1900

FDD

QPSK

-96

3525

3625

3750

FDD

QPSK

-96

3850

3975

4099

FDD

QPSK

-96

4800

4850

4899

FDD

QPSK

-97

5900

5925

5950

FDD

QPSK

-97

6050

6075

6100

FDD

QPSK

-96

6500

6525

6549

FDD

QPSK

-97

8740

8865

8989

• GSM not supported for APAC SKU

• Main and Diversity ports are measured separately. Combining both antenna ports

increases sensitivity by 3 dB. Table 36. Rx Sensitivity – UMTS reflects both ports

combined.

• Table 37 is a generic view that includes all LTE bands for Rx sensitivity. The APAC

SKU does not include LTE Bands 2, 4, 5, 7, 13, and 17.

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9.7

Antenna Recommendations

The following tables provide antenna guidance for the platform designer.

Table 38 Antenna Recommendation

Parameter Recommendation

Impedance

50 ohm

Antenna Shape

and Radiation

Pattern

Near Omni-dir ecti o na l in th e Horiz o n ta l pla n e is p ref e r red

Polarization

Predominantly vertical polarization and near Omni-Azimuth pattern are

desired;

H-polarization must not be eliminated ( indoor, diversity)

Input Power

33 dBm typical peak power GSM LB*

30 dBm typical peak power GSM HB*

24 dBm typical average power WCDMA

23 dBm typical average power LTE

*Not included for APAC SKU.

Table 39 Anten na Recomme ndation - Bandwidth of M a in & Di v ersity Antenn a

Band Center

Frequency Uplink (UL)

UE Tx Downlink

(DL) UE Rx Duplex

Mode Common

Name Bandwidth of

Main Antenna

(MHz)

Bandwidth of

Diversity Antenna

(MHz)

001 I (1) 2100 MHz

1920 MHz to

1980 MHz

2110 MHz to

2170 MHz

FDD IMT 250 60

002 II (2) 1900 MHz

1850 MHz to

1910 MHz

1930 MHz to

1990 MHz

FDD PCS 140 60

003 III (3) 1800 MHz

1710 MHz to

1785 MHz

1805 MHz to

1880 MHz

FDD DCS 170 75

004 IV (4) 1700 MHz

1710 MHz to

1755 MHz

2110 MHz to

2155 MHz

FDD AWS 445 45

005 V (5) 850 MHz

824 MHz to

849 MHz

869 MHz to

894 MHz

FDD CLR 70 25

006 VI (6) 850 MHz

830 MHz to

840 MHz

875 MHz to

885 MHz

FDD UMTS 800 55 10

007 VII (7) 2600 MHz

2500 MHz to

2570 MHz

2620 MHz to

2690 MHz

FDD IMT-E 190 70

008 VIII

(8)

900 MHz

880 MHz to

915 MHz

925 MHz to

960 MHz

FDD GSM 80 35

009 IX (9) 1800 MHz

1749.9 MHz to

1784.9 MHz

1844.9 MHz to

1879.9 MHz

FDD UMTS 1800 130 35

010 X (10) 1700 MHz

1710 MHz to

1770 MHz

2110 MHz to

2170 MHz

FDD

Extended

AWS

460 60

011 XI

(11) 1500 MHz 1427.9 MHz to

1447.9 MHz

1475.9 MHz

1495.9 MHz

FDD PDC 68 20

013 XIII

(13)

750 MHz

777 MHz to

787 MHz

746 MHz to

756 MHz

FDD

upper SMH

block C

41 10

017 XVII

(17) 700 MHz

704 MHz

716 MHz

734 MHz

746 MHz

FDD

lower SMH

blocks B/C

(subset of

42 12

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Band Center

Frequency Uplink (UL)

UE Tx Downlink

(DL) UE Rx Duplex

Mode Common

Name Bandwidth of

Main Antenna

(MHz)

Bandwidth of

Diversity Antenna

(MHz)

band 12)

018 XVIII

(18)

850 MHz

815 MHz to

830 MHz

860 MHz to

875 MHz

FDD

Japan lower

800

60 15

019 XIX

(19)

850 MHz

830 MHz to

845 MHz

875 MHz to

890 MHz

FDD

Japan upper

800

60 15

020 XX

(20)

800 MHz

832 MHz to

862 MHz

791 MHz to

821 MHz

FDD

EU's Digital

Dividend

71 30

021 XXI

(21) 1500 MHz 1447.9 MHz to

1462.9 MHz

1495.9 MHz

1510.9 MHz

FDD PDC 63 15.4

025 XXV

(25) 1900 MHz 1850 MHz to

1915 MHz

1930 MHz to

1995 MHz FDD

Extended

PCS

(superset of

band 2)

145 65

026 XXVI

(26)

850MHz

814 MHz to

849 MHz

859 MHz to

894 MHz

FDD ESM+CLR 80 35

027 XXVII

(27)

850MHz

806 MHz to

824 MHz

851 MHz to

869 MHz

FDD ESMR 63 18

028 XXVIII

(28)

750MHz

703 MHz to 728

MHz

758 MHz to

803 MHz

FDD APAC 700 100 45

GPS

1575.42 MHz

GPS L1

GLONASS

1602 MHz

GLONASS L1

• APAC SKU does not include RF Bands 7, 10, 13, 17, 20, 25, 26, 27, 28

9.8

GNSS Sensitivity

Table 40 GNSS Sensitivity

Parameter Min Limit (dBm)

Cold Start Sensitivity

-145

Hot Start Sensitivity

-155

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3GPP Compliance

M.2 module complies with the following listed test standards:

• 3GPP TS 31.121 USIM

• 3GPP TS 31.124USAT

• 3GPP TS51.010-1, 2G PS & RF & RRM

• 3GPP TS 51.010-4 2G SIMTK

• 3GPP TS34.121-1 3G RF & RRM

• 3GPP TS34.123-1 3G PS

• 3DPP TS36.124 LTE Radiated Emission

• 3GPP TS36.521-1 LTE RF

• 3GPP TS 36.521-3 LTE RRM

• 3GPP TS36.523-1 LTE PS

• ETSI TS 102 230 UICC

• OMA ETS SUPL v1.0 LBS SUPL

• OMA ETS SUPL v2.0 LBS SUPL

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WWAN Card Type 3042-S3-B

11.1

Mechanical Dimensions

The mechanical dimensions of WWAN Card Type 3042 are shown in Figure 17 and Figure 17.

The WWAN card is 30 mm x 42 mm. The height is 1.5 mm from the top of the PCB to the

top of the outside shield. There are a total of 75 pins; however 8 pins are lost to support the

slot+. All components are mounted on the Top side.

Figure 17 WWAN Card 3042 Mechanica l Dime nsions

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Figure 18 WWAN Card 3042 Slot Key Details

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11.2

Land Pattern

Figure 19 illustrates a typical land pattern for a top-mount connector with the key removed.

Figure 19 WWAN Card Type 3042 To p-Side Mo unting Land Pa t t e r n

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Figure 20 illustrates a typical mid-plane (in-line) land pattern with slot key removed.

Figure 20 WWAN Card 3042 Mid-pla ne Lan d P a ttern with Slot Key Removed

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11.3

Antenna Connector Locations

Figure 21 illustrates the locations for the main Rx/Tx antenna and the Diversity/GPS antenna.

Figure 21 Antenna Connector Location

Table 41 Antenna Connector Assignment

Antenna Interface

0 TBD

1 Diversity/ GPS

2 TBD

3 TBD

4 WWAN Main Tx/Rx

5 TBD

For M.2 M odu les pos it ions 1 and 4 are used. The other an ten na connectors a r e not

moun ted on the module.

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Safety Recommendations

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The

use of this product may be dangerous and has to be avoided in the following areas:

• Where it can interfere with other electronic devices in environments such as hospitals,

airports, aircrafts, etc.

• Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is

responsibility of the user to enforce the country regulation and the specific

environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty

validity. We recommend following the instructions of the hardware user guides for a correct

wiring of the product. The product has to be supplied with a stabiliz ed vol tag e source and the

wiring has to be conforming to the security and fire prevention regulations. The product has to

be handled with care, avoiding any contact with the pins because electrostatic discharges may

damage the product itself. Same cautions have to be taken for the SIM, checking carefully the

instruction for its use. Do not insert or remove the SIM when the product is in power saving

mode.

The system integrator is responsible of the functioning of the final product; therefore, care has

to be taken to the external components of the module, as well as of any project or installation

issue, because the risk of disturbing the GSM network or external devices or having impact

on the security. Should there be any doubt, please refer to the technical documentation and the

regulations in force. Every module has to be equipped with a proper antenna with specific

character is tics. The ant enna has

to be installed with care in order to avoid any interference with other electronic devices and

has to guarantee a minimum distance from the body (20 cm). In case of this requirement

cannot be satisfied, the system integrator has to assess the final product against the SAR

regulation.

The European Community provides some Directives for the electronic equipments

introduced on the market. All the relevant information’s are available on the European

Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipments is available,

while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

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Conformity assessment issues

The following chapters are related to the M.2 module on the EVK carrier board.

13.1

1999/5/EC Directive

The LN930 products portfolio has been evaluated against the essential requirements of the

1999/5/EC Directive.

Bulgarian

С настоящето Telit Communications S.p.A. декларира, че 2G/3G module отговаря на

съществените изисквания и другите приложими изисквания на Директива 1999/5/ЕС.

Czech

Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G module je ve shodě se základními

požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.

Danish

Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr 2G/3G module

overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.

Dutch

Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G module in

overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn

1999/5/EG.

English

Hereby, Telit Communications S.p.A., declares that this 2G/3G module is in compliance with

the essential requirements and other relevant provisions of Directive 1999/5/EC.

Estonian

Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G module vastavust direktiivi

1999/5/EÜ põh inõ u e te le ja n imetatud di re k ti iv is t tu lenev atele teistele asjakohastele sätetele.

German

Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G module in

Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen

Bestimmungen der Richtlinie 1999/5/EG befindet.

Greek

ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ Telit Communications S.p.A. ΔΗΛΩΝΕΙ ΟΤΙ 2G/3G module

ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ

ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999/5/ΕΚ.

Hungarian

Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G module megfelel a

vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.

Finnish

Telit Communications S.p.A. vakuuttaa täten että 2G/3G module tyyppinen laite on direktiivin

1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen.

French

Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G module est conforme

aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE.

Icelandic

Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G module er í samræmi við

grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC

Italian

Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G module è conforme ai

requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.

Latvian

Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G module atbilst Direktīvas 1999/5/EK

būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.

Lithuanian

Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G module atitinka esminius

reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.

Maltese

Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G module jikkonforma mal-

ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC.

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Norwegian

Telit Communications S.p.A. erklærer herved at utstyret 2G/3G module er i samsvar med de

grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF.

Polish

Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G module jest zgodny z

zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC

Portuguese

Telit Communications S.p.A. declara que este 2G/3G module está conforme com os requisitos

essenciais e outras disposições da Directiva 1999/5/CE.

Slovak

Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G module spĺňa základné požiadavky a

všetky príslušné ustanovenia Smernice 1999/5/ES.

Slovenian

Telit Communications S.p.A. izjavlja, da je ta 2G/3G modul v skladu z bistvenimi zahtevami in

ostalimi relevantnimi določili direktive 1999/5/ES.

Spanish

Por medio de la presente Telit Communications S.p.A. declara que el 2G/3G module cumple con

los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva

1999/5/CE.

Swedish

Härmed intygar Telit Communications S.p.A. att denna 2G/3G module står I överensstämmelse

med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv

1999/5/EG.

In order to satisfy the essential requirements of 1999/5/EC Directive, the LN930 is

compliant with the following standards:

RF spectrum use (R&TTE art. 3.2) EN 300 440-2 V1.4.1

EN 301 511 V9.0.2

EN 301 908-1 V6.2.1

EN 301 908-2 V5.2.1

EN 301 908-13 V5.2.1

EN 300 440-1 V1.6.1

EMC (R&TTE art. 3.1b) EN 301 489-1 V1.9.2

EN 301 489-3 V1.4.1

EN 301 489-7 V1.3.1

EN 301 489-24 V1.5.1

Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

EN 62311: 2008

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The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of

Directive 1999/5/EC has been followed with the involvement of the following Notified

Body:

Thus, the following marking is included in the product:

The full declaration of conformity can be found on the following address:

http://www.telit.com/

There is no restriction for the commercialization in all the countries of the European Union.

Final product integrating this module must be assessed against essential requirements of

the 1999/5/EC (R&TTE) Directive. It should be noted that assessment does not necessarily

lead to testing. Telit Communications S.p.A. recommends carrying out the following

assessments:

RF spectrum use (R&TTE art.

3.2)

It will depend on the antenna used on the final

product.

EMC (R&TTE art. 3.1b) Testing

Health & Safety (R&TTE art.

3.1a) Testing

Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety

(Art. 3.1a) essential requirements can be done against the essential requirements of the

EMC and the LVD Directives:

• Low Voltage Directive 2006/95/EC and product safety

• Directive EMC 2004/108/EC for conformity for EMC

13.2

CE RF Exposure Compliance

This device meets the EU requirements (1999/519/EC) and the International Commission on

Non-Ionizing Radiation Protection (ICNIRP) on the limitation of exposure of the general

public to electromagnetic fields by way of health protection.

To comply with the RF exposure requirements, this module must be installed in a host

platform that is intended to be operated in a minimum of 20 cm separation distance to the user.

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13.3

R&TTE Regulation:

In all cases assessment of the final product must be met against the Essential requirements of

the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any

relevant Article 3.3 requirements.

1. The Dipole antenna (gain: GPRS/EGPRS/WCDMA/LTE: 2dBi) was verified in the

conformity testing, and for compliance the antenna shall not be modified. A separate approval

is required for all other operating configurations, including different antenna configurations.

2. If any other simultaneous transmission radio is installed in the host platform together with

this module, or above restrictions cannot be kept, a separate RF exposure assessment and CE

equipment certification is required.

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FCC/IC Regulatory notices

14.1

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any changes

or modifications could void the user’s authority to operate the equipment.

Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit

la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de

l’appareil par l’utilisateur.

14.2

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how

to install or remove this RF module in the user’s manual of the end product which integrates

this module. The end user manual shall include all required regulatory information/warning as

show in this manual.

CAN ICES-3(B)/ NMB-3(B)

14.3

Interference statement

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt

RSS standard(s). Operation is subject to the following two conditions: (1) this device may not

cause interference, and (2) this device must accept any interference, including interference

that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils

radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)

l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter

tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre

le fonctionnement.

14.4

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part

15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses an d can radiate rad io frequ ency energy and, i f not installed

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

and used in accordance with the instructions, may cause harmful interference to radio communications. However,

there is no guarantee that interference will not occur in a particular installation. If this equipment does cause

harmful interference to radio or television reception, which can be determined by turning the equipment off and on,

the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the rec eiv ing antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver

is connected.

- Consult the dealer or an experienced radio/TV techn ic ian for help.

14.5

Radiation Exposure Statement

This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled

environment. This equipment should be installed and operated with minimum distance 20 cm

between the radiator & your body.

14.6

End Product Labeling

When the module is installed in the host device, the FCC/IC ID label must be visible through a

window on the final device or it must be visible when an access panel, door or cover is easily

re-moved. If not, a second label must be placed on the outside of the final device that contains

the following text: “Contains FCC ID: RI7LN930”, “Contains IC ID: 5131A-LN930”. The

grantee's FCC/IC ID can be used only when all FCC/IC compliance requirements are met.

This device is intended only for OEM integrators under the following conditions:

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) To comply with FCC/IC regulations limiting both maximum RF output power and human

exposure to RF radiation, the maximum antenna gain including cable loss in a mobile exposure

condition must not exceed:

。 5.0 dBi in Cellular band

。 3.0 dBi in PCS band

。 5.5 dBi in AWS band

。 5.0 dBi in 700 MHz band

。 5.0 dBi in 2500MHz band

In the event that these conditions cannot be met (for example certain laptop configurations or

co-lo cation with ano th e r tra n smitter), then the FC C /IC authorization is no longer considered

valid and the FCC/IC ID cannot be used on the final product. In these circumstances, the OEM

integrator will be responsible for re-evaluating the end product (including the transmitter) and

obtaining a separate FCC/IC authorization.

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

Document History

Revision

Date

Changes

2013-05-20

First issue

2013-07-09

• Update setting for Pin 21 on the host interface. This signal is not connected.

• Updated pin names of pins 1, 21, 69, and 75 in Table 4 and Table 19 to

simply reflect HW Configuration use.

• Updated Table 24 to indicate configuration pins 1, 69, and 75 are tied to

GND.

• Ren ame section 3.6 Coexistence Interfa ce to In-Device Coexistenc e

Interface. Additional information on the Inter-devi ce coex istence sup port was added.

• Updated sect ion 4.1.3 System Trace To o l Section.

• Updated Figur e 5 – RF Engi ne for WW SKU .

• Add further information USB LPM to USB section

• Added information on Seamless Roaming & Wifi Off-load – SIM_EAP,

SIM-AKA under Other Requirements

• Added information on Antenna Design Guidelines under Other

Requirements.

2013-07-29

RF bands updated

2013-08-26

Updating on RF bands

Upda ted se ction 3.5 and 3. 4.5

Upda ted tem p r an g e

2013-09-09

HN930-DC pr oduct was removed fr om portfolio

2013-09-15

Main & Diversity antenna positions have been swapped.

• Updated documentation a ccordingly, Figure 6 and Figure 10 .

• Updated WWAN M.2 Mechanical drawings, Figure 14 through Figure 17.

• Updated Card_power_ON_OFF descri ption for UltraBook in Table 9.

• Updated comments in Table 15 regarding the DPR#/SAR signal.

• Updated SIM DTECTED signal to indicat e an external pull-up.

• Updated Platform Block Diagrams to show DPR # signal is connec ted to an

EINT pin (not GPIO) on XGOLD.

•

Identified Audio Signals on host interface in Table 4. Previously these were

simpl y defined as Reserved.

• Updated VBAT requirements in Table 24 and Table 25.

2013-11-20

• Regulation sec tion was upd ated

• Adding support for UMTS Band 6 to M.2 APAC SKU (see Table 2).

•

Updated 3G RF Band support for APAC Module, supported bands are 1, 8,

11, and 19. (see Table 2)

• Added Measured Values for 2G/3G Rx Sensitivity Table 31 and Table 32.

• Upda te Meas ur ed Value and chang ed hea de r n am e in Rx Sensitivity LTE

Table 33

• Modified supply voltage lower spec for Ultra book in Table 24.

• Update Table 4, Table 6, Table 26 voltage levels for USB and SIM pi ns .

• Added LTE conditions and added Table 33.

2014-04-10

• Added SSIC to ICP interface. Updated RE S ET signal definiti on. Updated

Antenna figures.

• Updated Conducted Transmit Power requirement s, Tab l e 3 2.

• Section 2.2, Table 4

• Chang ed UIM signals pins 3 0 , 3 2, 3 4, 36

• Repl a ced das h w ith unde rscore in signal nam es.

• Changed supp ly volta ge for Antenna Tuning Signa l

(ANTCTL*) from (1.7 V – 2.6 V) to 1. 8 V.

• Section 3.5, Table 20 changed supply voltage for Antenna Tuning Signals

(ANTCTL*) from (1.7 V – 2.6 V) to 1. 8 V.

• Section 3.11, Table 25 correction to both no connect pins and key slot pins.

• Section 8.2, Table 27

o Chan ged the max volta ge to 3.0 V for WAKE_ W W AN# signal

o Chan ged Typ voltage and max voltage for the Antenna Tuning

Signals to 0/1.8 V and 2.3 V respectfully

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

• Correction in Section 11.3, fixed typo in sentence: For WWAN M.2

Modules, only posi tion s 1 and 4 are used.

• Updated table to only indicate minimum RX sensitivity limit.

• Updated Sect ion Conducted Transmit Power section.

• Added CAT 4: DL 150 Mbps, UL 50 Mbps to APAC LTE in Table 3

• Deleted LED Blink St atus in Table 14

• Updated Table 4 and Table 27

• Added Humidity Requirement

• Removed Quality & Reliability section since this is a requirement of the

ODM.

• Correction to: DPR signal includes pull-up, SSIC N/P pin locations, COEX

pin nam e s .

2014-06-24

• Added IC Canada certification wording.

• Section 3.2.1, SIM Design Recommendations - added new section

• Section 3.12, Antenna Interface changed connector of the WWAN antenna

cable to iPEX MHF4 from Hirose W.FLT

• Section 7, Table 24. Operating Environment changed description for

Operating Temperatur e to inc l ude ex t r eme temperature +55 °C to +70 °C

and ad ded additio na l descr ip t ion

• Section 8.2, delet ed Table 27. Electrical Parameters – Host Int erface

Signals and replaced it wi th:

o Table 27. DC Specification for 3.3 V Logic Signaling

o Table 28. DC Specification for 1.8 V Logic Signaling

• Section 8.3, Table 29. LTE Power Consumption

o Added additional LTE Use Cases for APAC SKU o nly - Bands

1, 3, 8, 9, 1 1, 1 8, 19, and 21

o Changed standby power to 8 mW

• Section 9.6, -

o Table 35. Rx Sensitivity – GSM - added note indicating that

GSM is not support ed for APAC SKU.

o Table 36. Rx Sensitivity – UMTS– added note in d icating that

the minimum limits reflects that the main and diversity ports are

combined.

o Table 37. Rx Sensitivity – LTE – added note indicating that the

8 LTE bands 2, 4, 5, 7, 1 3, 17, 20, a n d 26 is not supporte d fo r

AP AC SKU

• Sec tion 9.7, Ante nna Rec o m m endat ions

• Tabl e 38. Antenna Recom m e n da t ion, ad ded note i nd icati ng that the

first 2 recommendations for Inpu t Power are not supported for APAC

SKU.

• Table 39. Antenna Recommendation - Bandwidth of Main &

Diversity Antenna - a d ded not indicating that the fol lowing 9 RF

Bands 007, 010, 013, 017, 020, 025, 026, 027, and 028 are not

supported by the APAC SKU.

2014-11-18

• Replaced Requirement with Target in Table 32 to Table 37.

• Cha nges to Table 32 . Conducted Transmit Power – 2G

• Changes to Table 33. Conducted Transmit Power – 3G

• Cha nges to Table 34 . Conducted Transmit Power – LTE

• Cha nges to Table 35 . Rx Sensiti v ity – GSM

• Cha nges to Table 36 . Rx Sensiti v ity – UMTS

• Cha nges to Table 37 . Rx Sensiti v ity – LTE

•

Changes to Table 38. Antenna Recommendation

2014-12-21

• Added note to Table 3. WWAN M.2 Module – Data Services

• − The change is to describe we can support DL 150 Mbps in WW LTE

SKU. This is only for generic SW and VZW SW, but not for AT&T SW.

• Changes to Section 3.2 USIM Interface

• − Bullet number 2 and 3

• Changes to Section 3.2 USIM Interf ace

L is t num ber 2 and 3

• Changes to Table 4. WWAN M.2 Host Interface Signals pins 29, 31, 35,

and 37.

• Cha nges to Table 6. U SB SS IC - ICP Interfa ce

• Cha nges to Table 33 . Conducted Transmit Power – LTE

• Cha nges to Table 4. WWAN M.2 Host Interface Signals pins 29, 31, 35,

37, and 67.

•

Cha nges to Table 36 . Rx Sensiti v ity – LTE

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

• Added new table, Table 39. GNSS Sensitivity