Flangeless Attenuators
Model RFP-50-XXAF
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating Suggested Mounting Procedures
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
2. Position device on mounting surface and solder in place
using an indalloy type or an SN63 type solder.
3. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210°C).
Specifications
PART NUMBER ATTENUATION (dB) TOL. (+/-dB) POWER (WATTS) VSWR FREQ. (GHz)
RFP-50-1AF 1 0.5 50 1.50:1 2.0
RFP-50-2AF 2 0.5 50 1.30:1 2.0
RFP-50-3AF 3 0.5 50 1.30:1 2.0
RFP-50-4AF 4 0.5 50 1.20:1 2.0
RFP-50-5AF 5 0.5 50 1.20:1 2.0
RFP-50-6AF 6 0.5 50 1.20:1 2.0
RFP-50-9AF 9 0.5 50 1.20:1 2.0
RFP-50-10AF 10 0.5 50 1.25:1 2.0
RFP-50-20AF 20 0.5 50 1.20:1 2.5
RFP-50-30AF 30 0.5 50 1.20:1 1.0
THAN LEAD.
WITH LEAD.
THAN LEAD.
MIN.
THAN LEAD.