©2006 Fairchild Semiconductor Corporation 1www.fairchildsemi.com
BAV23S Rev. E
BAV23S Small Signal Diode
tm
September 2006
BAV23S
Small Signal Diode
Absolute Maximum Ratings * Ta = 25°C unless otherwise noted
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Thermal Characteristics
Electrical Characteristics TC = 25°C unless otherwise noted
Symbol Parameter Value Unit
VRRM Maximum Repetitive Reverse Voltage 250 V
IF(AV) Average Rectified Forward Current 200 mA
IFSM Non-repetitive Peak Forward Surge Current
Pulse Width = 1.0 microsecond
Pulse Width = 100 microsecond 9.0
3.0 A
A
TSTG Storage Temperature Range -55 to +150 °C
TJOperating Junction Temperature 150 °C
Symbol Parameter Value Unit
PDPower Dissipation 350 mW
RθJA Thermal Resistance, Junction to Ambient* 357 °C/W
Symbol Parameter Conditions Min. Max Units
VRBreakdown Voltage IR = 100µA250 V
VFForward Voltage IF = 100mA
IF = 200mA 1.0
1.25 V
V
IRReverse Leakage VR = 250V
VR = 250V, TA = 150°C100
100 nA
µA
trr Reverse Recovery Time IF = IR = 30mA, IRR = 3.0mA,
RL = 100Ω
50 ns
Connection Diagram
3
1
12
3
L30
2
1
2
3
SOT-23
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BAV23S Rev. E
BAV23S Small Signal Diode
Typical Performance Characteristics
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BAV23S Rev. E
BAV23S Small Signal Diode
Typical Performance Characteristics (Continued)
Figure 9. Power Derating Curve Figure 10. Average Rectified Curre nt(IO)
vs Ambient Temperature(TA)
Figure 11. Reverse Recovery Time vs
Reverse Recovery Current (Irr)
0 255075100125150
100
200
300
400
P - POWER DISSIPATION (mW)
TA - AM BIENT TEMPERATURE (oC) 0 25 50 75 100 125 150
0
50
100
150
200
250
300
IF - CURRENT (mA)
TA - AMBIENT TEMPERATURE (oC)
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BAV23S Rev. E
BAV23S Small Signal Diode
Mechanical Dimensions
SOT-23
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be an exhaustive list of all such trademarks.
BAV23S Small Signal Diode
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO
IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCH ILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE
OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE
RIGHTS OF OTHERS. THESE SPECIFI CATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITI ONS, SPE-
CIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEV ICES OR SYSTEMS W ITHOUT
THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant int o the body, or (b) support or sustain life , or
(c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected
to result in significant injury to the user.
2. A critical compone nt is any component of a life support device or system
whose failure to perform can be reasonably expected to cause the failu re
of the life support device or system, or t o affect it s safety or ef fectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In Design This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
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that has been discontinued by Fairchild semiconductor.
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