
Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/
AYL11, 12
ACCTB50E 201303-T
NOTES ON USING CONNECTOR FOR LED LIGHTING
■Safety precautions
Observe the following safety precautions to prevent accidents
and injuries.
1) The use of the connector outside of the specified rated current
and breakdown voltage ranges may cause abnormal heating,
smoke, and fire.
Never use the connector beyond the specified ranges of the
product.
2) In order to avoid accidents, make sure you have thoroughly
reviewed the specifications before use.
Consult us if you plan to use the product in a way not covered by
the specifications.
3) We are consistently striving to improve quality and reliability.
However, the fact remains that electrical components and
devices generally fail at a given statistical probability.
Furthermore, their durability varies depending on where and
how they are used. Please be sure to verify electrical
components and devices under actual conditions before use.
Continuously using them in a state of degraded performance
may cause deterioration in insulation performance, thus
resulting in abnormal heat generation, smoke generation, or fire.
To avoid that, we ask you to implement safe designs that include
redundancy, fire prevention, and malfunction prevention. Also,
please conduct periodic maintenance so that no accidents
resulting in injury or death, fire, or harm to society will be caused
as a result of product failure or service life.
■About receptacle
• PC board design
Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
• Connector mounting
When mounting, if there is too much suction nozzle pressure,
the molded and metal parts might deform and break.
Please check beforehand.
In case of dry condition, please care the occurrence of static
electricity.
The product may be adhered to the embossed carrier tape or
the cover tape in dry condition.
Recommended humidity is between 40 to 60 % and please
remove static electricity by ionizer in manufacturing scene.
• Soldering
1) Manual soldering.
• Since this connector is the low profile type the amount of solder
supplied should be closely monitored.
Too much solder during manual soldering may cause solder
creeping near the contacting part or contact failure.
• Make sure that the soldering iron tip is heated within the
temperature and time limits indicated in the specifications.
• Flux from the solder wire may adhere to the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces with a magnifying glass and clean off any flux
before use.
• Be aware that a load applied to the connector terminals while
soldering may displace the contact.
• Thoroughly clean the soldering iron tip.
2) Reflow soldering
• Screen-printing is recommended for printing paste solder.
• To determine the relationship between the screen opening area
and the PC board foot pattern area, refer to the diagrams in the
recommended patterns for PC boards and metal masks.
Make sure to use the terminal tip as a reference position when
setting.
• Too much solder may cause solder creeping near the
contacting part or contact failure.
• Consult us when using a screen-printing thickness other than
that recommended.
• Depending on the size of the connector being used, self
alignment may not be possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature profile is given in the
figure below
• The temperature is measured on the surface of the PC board
near the connector terminal.
• Certain solder and flux types may cause serious solder
creeping.
Solder and flux characteristics should be taken into
consideration when setting the reflow soldering conditions.
• Do not apply adhesive to secure the connector, because it can
affect the spring action of the contact.
• When coating the PC board after soldering the connector to
prevent the deterioration of insulation, perform the coating in
such a way so that the coating does not get on the connector.
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use a soldering iron with a
flat tip. Do not add flux, otherwise, the flux may creep to the
contact parts.
• Use a soldering iron whose tip temperature is within the
temperature range specified in the specifications.
0.40±0.03
2.40±0.03
0.40±0.03
0.05±0.03(0.05)
Note 3)
Note 3)
Note 2)
Note 2)
Note 2)
Note 1)
Note 2)
Note 1)
0.20±0.05
0.20±0.05
0.20±0.05
0.20±0.05
(Min. 1.84)
1.10±0.03
Unit: mm
11.92±0.05
Recommended PC board pattern (mounting pad layout)
(TOP VIEW)
2.32±0.03
1.10±0.03
Between PC board: Max. 1.00
Note 1) Pad area
Note 2) It is necessary to do the resist processing on the copper foil.
Note 3) These dimensions are applied when the insulation distance from the edge of the PC board is 1.5 mm.
Note 4) The open window area of solder screen is the same as pad area. (t = 0.12 mm (Screen thickness))
Te r minal Paste
solder
PC board
foot pattern
60 to 120 sec.
Preheating
Time
Te mperature Peak temperature
200°C
220°C
Upper limit (Soldering heat resistance)
260°C
230°C
180°C
150°C
70 sec.
25 sec.
Lower limit (Solder wettability)