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1.1 Display type: TN
1.2 Display color*:
Display color: Blue-Black
Background: White
1.3 Polarizer mode: Reflective/Positive
1.4 Viewing Angle: 6:00
1.5 Driving Method: 1/16 Duty 1/5 Bias
1.6 Backlight: None
1.7 Display Fonts: 5 x 7 dots + Cursor (1 Character)
1.8 Controller: HCD66701A00
1.9 Data Transfer: 8 Bit Parallel
1.10 Operating Te mperature: 0----+50
Storage Temperature: -20----+60
1.11 Outline Dim ensions: Refer to outline drawing on next page
1.12 Dot Matrix: 16 Characters X 2 Lines
1.13 Dot Size: 0.55X0.50(mm)
1.14 Dot Pitch: 0.60X0.55 (mm)
1.15 Weight: 20g
1.16 PCB edtion: TM162AD P1-2
* Color tone is slightly changed by temperature and driving voltage.
2. Outline Drawing
4/6/01http://66.70.139.101/assetts/drawings/162ag.dwf
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Item Symbol Min. Max. Unit Remark
Power Supply Voltage V V -0.3 7.0
LCD Driving Voltage V-0.3 13.0
V
Operating Tem perature
Range T 0 +50
Storage Tem perature
Range T -20 +60
No
Condensation
0## '
6.1 Electrical characteristics
Item Symbol Min. Typ. Max. Unit
Supply Voltage
(Logic) V V 4.5 5.0 5.5 V
Supply Voltage
(LCD Drive) V - 4.7 - V
High V
V=5.0 0.7V - V+0.3 V
Input
Signal
Voltage Low V
V=5.0 -0.3 -
0.2 V V
Supply current
(Logic) I
V V =5.0 - 1.5 2.0
mA
Supply current
(LCD Drive) I - 0.40 0.6
mA
6.2 Interface Signals
Pin No. Symbol Level Description
1 Vss 0V Ground
2 Vcc 5.0V Power supply voltage for logic and LCD(+)
3 Vee 0.3V Power supply voltage for LCD(-)
4 RS H/L Selects registers
5 R/W H/L Selects read or write
6 E H/L Starts data read/w rite
7 DB0 H/L Data bit0
8 DB1 H/L Data bit1
9 DB2 H/L Data bit2
10 DB3 H/L Data bit3
11 DB4 H/L Data bit4
12 DB5 H/L Data bit5
13 DB6 H/L Data bit6
14 DB7 H/L Data bit7
" NC - No signal
NC - No signal
6.3 Interface Tim ing Chart
AC Characteristics (VCC = 2.7 to 5.5V, Ta = –30 to +75°C*3)
Write Operation
Item Symbol Min Typ Max Unit Test Condition
Enable cycle time tcycE
1000 — — ns
Enable pulse width (high level) PWEH 450 — —
Enable rise/fall time tEr, tEf ——25
Address set-up time (RS, R/W to E) tAS 40 — —
Address hold time tAH 20 — —
Data set-up time tDSW 195 — —
Data hold time tH10 — —
Read Operation
Item Symbol Min Typ Max Unit Test Condition
Enable cycle time tcycE
1000 — — ns
Enable pulse width (high level) PWEH 450 — —
Enable rise/fall time tEr, tEf ——25
Address set-up time (RS, R/W to E) tAS 40 — —
Address hold time tAH 20 — —
Data delay time tDDR — — 350
Data hold time tDHR 10 — —
Timing Characteristics
RS
R/W
E
DB0 to DB7
VIH1
VIL1 VIH1
VIL1
t
AS
t
AH
VIL1 VIL1
t
AH
PW
EH
t
Ef
VIH1
VIL1 VIH1
VIL1
t
Er
t
DSW H
t
VIH1
VIL1 VIH1
VIL1
t
cycE
VIL1
Valid data
Write Operation
RS
R/W
E
DB0 to DB7
VIH1
VIL1 VIH1
VIL1
t
AS
t
AH
VIH1 VIH1
t
AH
PW
EH
t
Ef
VIH1
VIL1 VIH1
VIL1
t
DDR DHR
t
t
Er
VIL1
VOH1
VOL1 VOH1
VOL1
Valid data
t
cycE
Read Operation
6.4 Instruction Code
Code Execution Time
(max) (when fcp or
Instruction RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Description fOSC is 320 kHz)
Clear
display 0000000001Clears entire display and
sets DDRAM address 0 in
address counter.
1.28 ms
Return
home 000000001—Sets DDRAM address 0 in
address counter. Also
returns display from being
shifted to original position.
DDRAM contents remain
unchanged.
1.28 ms
Entry mode
set 00000001I/DSSets cursor move direction
and specifies display shift.
These operations are
performed during data write
and read.
31 µs
Display
on/off
control
0000001DCBSets entire display (D)
on/off, cursor on/off (C), and
blinking of cursor position
character (B).
31 µs
Cursor or
display shift 000001S/CR/L——Moves cursor and shifts
display without changing
DDRAM contents.
31 µs
Function
set 00001DLNF——Sets interface data length
(DL), number of display
lines (L), and character font
(F).
31 µs
Set
CGRAM
address
0 0 0 1 ACG ACG ACG ACG ACG ACG Sets CGRAM address.
CGRAM data is sent and
received after this setting.
31 µs
Set
DDRAM
address
0 0 1 ADD ADD ADD ADD ADD ADD ADD Sets DDRAM address.
DDRAM data is sent and
received after this setting.
31 µs
Read busy
flag &
address
0 1 BF AC AC AC AC AC AC AC Reads busy flag (BF)
indicating internal operation
is being performed and
reads address counter
contents.
0 µs
Code Execution Time
(max) (when fcp or
Instruction RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Description fOSC is 320 kHz)
Write data
to CG or
DDRAM
1 0 Write data Writes data into DDRAM
or CGRAM. 31 µs
tADD = 4.7 µs*
Read data
from CG or
DDRAM
1 1 Read data Reads data from DDRAM
or CGRAM. 31 µs
tADD = 4.7 µs*
I/D = 1: Increment
I/D = 0: Decrement
S = 1: Accompanies display shift
S/C = 1: Display shift
S/C = 0: Cursor move
R/L = 1: Shift to the right
R/L = 0: Shift to the left
DL = 1: 8 bits, DL = 0: 4 bits
N = 1: 2 lines, N = 0: 1 line
F = 1: 5 × 10 dots, F = 0: 5 × 7 dots
BF = 1: Internally operating
BF = 0: Instructions acceptable
DDRAM: Display data
RAM
CGRAM: Character
generator RAM
ACG: CGRAM address
ADD: DDRAM address
(corresponds to
cursor address)
AC: Address counter
used for both DD and
CGRAM addresses
Execution time
changes when
frequency changes
Example:
When fcp or fOSC
is 270 kHz,
31 µs × = 37 µs
320
270
Note: — indicates no effect.
* After execution of the CGRAM/DDRAM data write or read instruction, the RAM address counter
is incremented or decremented by 1. The RAM address counter is updated after the busy flag
turns off. In Figure 10, tADD is the time elapsed after the busy flag turns off until the address
counter is updated.
Busy state
Busy signal
(DB7 pin)
Address counter
(DB0 to DB6 pins)
tADD
A A + 1
Note: t depends on the operation frequency
t = 1.5/(f or f ) seconds
ADD
ADD cp OSC
Figure 10 Address Counter Update
xxxx0000
xxxx0001
xxxx0010
xxxx0011
xxxx0100
xxxx0101
xxxx0110
xxxx0111
xxxx1000
xxxx1001
xxxx1010
xxxx1011
xxxx1100
xxxx1101
xxxx1110
xxxx1111
0000 0010 0011 0100 0101 0110 0111 1010 1011 1100 1101 1110 1111
Upper 4
Bits
Lower
4 Bits CG
RAM
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Note: The user can specify any pattern for character-generator RAM.
6.5 Character generator ROM(HCD66701A00)
1#
7.1 Optical Characteristics Ta=25
Item Symbol Condition Min. Typ. Max. Unit
=0 35 -- 10
Viewing Angle
C
=0 -30 -- 30
Deg
Contrast Ratio C =20
=0 3.0 - -
Turn
on T - - 150
Response
Time Turn
off T
=20
=0 - - 150
ms
7.2 Definition of Optical Characteristics
7.2.1 D e finition of Viewing Angle
Top Top
Bottom Bottom
7.2.2 D e finition of Contrast Ratio
Measuring Conditions:
1) Ambient Temperature: 25 ; 2) Frame frequency: 64Hz
7.2.3 D e finition of Response time
Turn on time: = + Turn off time:
= +
Measuring Condition:
1) Operating Voltage: 4.7V 2) Frame frequency: 64Hz
2##
8.1 Content of Reliability Test Ta=25
No. Test Item Content of Test Test condition
1
High Tem perature
Storage Endurance test applying the high
storage tem perature for a long time 60
96H
2 Low Temperature
Storage Endurance test applying the low
storage tem perature for a long time -20
96H
3 High Temperature
Operation
Endurance test applying the
electric stress (voltage current)
and the thermal stress to the
elem ent for a long time
50
96H
4 Low Temperature
Operation
Endurance test applying the
electric stress under low
tem perature for a long time
0
96H
5 High Temperature
/Humidity Storage
Endurance test applying the high
temperature and high humidity
storage for a long tim e
40
90%RH
96H
6 Temperature
Cycle
Endurance test applying the low
and high tem perature cycle
-20 25 60 25
30min 5min 30min 5min
1 cycle
-20 /60
10 cycles
7 Vibration Test
(package state) Endurance test applying the
vibration during transportation
10Hz~150Hz,
50m/s,
40min
8 Shock Test
(package state) Endurance test applying the shock
during transportation
Half- sine wave,
100m/s,
11ms
9 Atmospheric
Pressure Test
Endurance test applying the
atm ospheric pressure during
transportation by air
40kPa
16H
8.2 Failure Judgment Criterion
Test Item No.
Criterion
Item 1 2 3 4 5 6 7 8 9 Failure Judgem e nt Criterion
Basic
Specification Out of the basic Specification
Electrical
specification Out of the electrical
specification
Mechanical
Specification Out of the mechanical
specification
Optical
Characteristic Out of the optical specification
Note For test item refer to 8.1
Remark
Basic specification = Optical specification + Mechanical
specification
345*67**
Inspection
Examination
or Test At Ta=25
(unless otherwise stated) Min. Max. Unit IL AQL
External
Visual
Inspection
Under normal illumination
and eyesight condition, the
distance between eyes and
LCD is 25cm.
See Appendix A II
Major
1.0
Minor
2.5
Display
Defects
Under normal illumination
and eyesight condition,
display on inspection. See Appendix B II
Major
1.0
Minor
2.5
Note: Major defects: Open segment or common, Short, Serious damages, Leakage
Miner defects: Others
Sampling standard conforms to GB2828
$8' 5*+'#
10.1 Handling Precautions
10.1.1 The display panel is made of glass. Do not subject it to a mechanical
shock by dropping it from a high place, etc.
10.1.2 If the display panel is damaged and the liquid crystal substance inside it
leaks out, be sure not to get any in your mouth, if the substance comes
into contact with your skin or clothes, promptly wash it off using soap
and water.
10.1.3 Do not apply excessive force to the display surface or the adjoining areas
since this m a y cause the color tone to vary.
10.1.4 The polarizer covering the display surface of the LCD module is soft and
easily scratched. Handle this polarizer carefully.
10.1.5 If the display surface is contaminated, breathe on the surface and gently
wipe it with a soft dry cloth. If still not completely clear, moisten cloth
with one of the following solvents:
Isopropyl alcohol
Ethyl alcohol
Solvents other than those mentioned above may damage the polarizer.
Especially, do not use the following:
Water
Ketone
Aromatic solvents
10.1.6 D o not attempt to disassemble the LCD Module.
10.1.7 If the logic circuit power is off, do not apply the input signals.
10.1.8 To prevent destruction of the elements by static electricity, be careful to
maintain an optimum work environment.
a. Be sure to ground the body when handling the LCD Modules.
b. Tools required for assembly, such as soldering irons, must be properly
ground.
c. To reduce the amount of static electricity generated, do not conduct
assembly and other work under dry conditions.
d. The LCD Module is coated with a film to protect the display surface.
Be care when peeling off this protective film since static electricity may
be generated.
10.2 Storage precautions
10.2.1 When storing the LCD modules, avoid exposure to direct sunlight or to
the light of fluorescent lamps.
10.2.2 The LCD modules should be stored under the storage temperature range.
If the LCD modules will be stored for a long time, the recommend
condition is:
Temperature : 0 40
Relatively humidity: 80%
10.2.3 The LCD modules should be stored in the room without acid, alkali and
harmful gas.
10.3 The LCD modules should be no falling and violent shocking during
transportation, and also should avoid excessive press, water, damp and
sunshine.
/
Inspection item s and criteria for appearance defects
Items Contents Criteria
Leakage Not permitted
Rainbow According to the limit specimen
Wrong polarizer
attachment Not permitted
Not counted Max. 3 defects allowed Bubble between
polarizer and glass φ<0.3mm 0.3mm φ0.5mm
Polarizer
Scratches of
polarizer According to the limit specimen
Not counted Max. 3 spots allowed
X<0.2mm 0.2mm X0.5mm
Black spot
(in viewing
area)
X=(a+b)/2
Not counted Max. 3 lines allowed
Black line
(in viewing
area) a<0.02mm 0.02mm a0.05mm
b 2.0mm
Max. 3
spots
(lines)
allowed
Progressive
cracks
Not permitted
/-
Inspection item s and criteria for display defects
Items Contents Criteria
Open segment or open common Not permitted
Short Not permitted
Wr ong viewing angle Not permitted
Contrast radio uneven According to the limit specimen
Crosstalk According to the limit specimen
Not counted Max.3 dots allowed
X<0.1mm 0.1mm X0.2mm
X=(a+b)/2
Not counted Max.2 dots allowed
Pin holes
and cracks
in segment
(DOT)
A<0.1mm
0.1mm A0.2mm
D<0.25mm
Max.3
dots
allowed
Not counted Max.3 spots allowed
X<0.1mm 0.1mm X0.2mm
Black spot
(in viewing
area)
X=(a+b)/2
Not counted Max.3 lines allowed
Black line
(in viewing
area)
a<0.02mm 0.02mm a0.05mm
b 0.5mm
Max.3
spots
(lines)
allowed
