©2005 Fairchild Semiconductor Corporation
1
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October 2005
FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
FODM3010, FODM3011, FODM3012, FODM3021,
FODM3022, FODM3023
4-Pin Full Pitch Mini-Flat Package Random-Phase Triac
Driver Output Optocouplers
Features
■
Compact 4-pin surface mount package (2.4 mm maximum
standoff height)
■
Peak blocking voltage
250V (FODM301X)
400V (FODM302X)
■
Available in tape and reel quantities of 500 and 2500.
■
Applicable to Infrared Ray reflow (230°C max, 30 seconds.)
■
BSI, CSA and VDE certifications pending
■
UL (File# E90700) certified
Applications
■
Industrial controls
■
Traffic lights
■
Vending machines
■
Solid state relay
■
Lamp ballasts
■
Solenoid/valve controls
■
Static AC power switch
■
Incandescent lamp dimmers
■
Motor control
Description
The FODM301X and FODM302X series consists of a GaAs
infrared emitting diode driving a silicon bilateral switch housed
in a compact 4-pin mini-flat package. The lead pitch is 2.54 mm.
They are designed for interfacing between electronic controls
and power triacs to control resistive and inductive loads for
115V/240V operations.
Package Dimensions
0.287 (7.29)
0.248 (6.30)
0.020 (0.51)
0.012 (0.30)
0.169 (4.29)
0.154 (3.91)
0.173 (4.40)
TYP
0.035 (0.89)
0.012 (0.30)
0.008 (0.20)
0.000 (0.0)
0.100 (2.54) TY
0.026 (0.66)
P
0.033 (0.85)
0.026 (0.65)
0.094 (2.39)
0.079 (2.01)
PIN 1
NOTE
All dimensions are in inches (millimeters)
1
2
4
3
MAIN
TERMINAL
MAIN
TERMINAL
ANODE
CATHODE
2
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Absolute Maximum Ratings
(T
A
= 25°C unless otherwise specified)
Electrical Characteristics
(T
A
= 25°C)
Individual Component Characteristics
Transfer Characteristics
(T
A
= 25°C)
Isolation Characteristics
* All typicals at T
A
= 25°C
Note
1. Test voltage must be applied within dv/dt rating.
2. This is static dv/dt. See Figure 1 for test circuit Commutating dv/dt is function of the load-driving thyristor(s) only.
3. All devices are guaranteed to trigger at an I
F
value less than or equal to max I
FT
. Therefore, recommended operating I
F
lies
between max I
FT
(15 mA for FODM3010 and FODM3021, 10 mA for FODM3011 and FODM3022, 5 mA for FODM3012 and
FODM3023) and absolute max I
F
(60 mA).
Parameter Symbol Value Units
TOTAL PACKAGE
Storage Temperature T
STG
-40 to +125 °C
Junction Temperature T
J
125 °C
Operating Temperature T
OPR
-40 to +100 °C
EMITTER
Continuous Forward Current I
F (avg)
60 mA
Peak Forward Current (1 µs pulse, 300 pps.) I
F (pk)
1A
Reverse Input Voltage V
R
3V
Power Dissipation (No derating required over operating temp. range) P
D
100 mW
DETECTOR
On-State RMS Current I
T(RMS)
70 mA (RMS)
Off-State Output Terminal Voltage FODM3010/1/2 V
DRM
250 V
FODM3021/2/3 400
Power Dissipation (No derating required over operating temp. range) P
D
300 mW
Parameter Test Conditions Symbol Device Min Typ* Max Unit
EMITTER
Input Forward Voltage I
F
= 10 mA V
F
All 1.20 1.5 V
Reverse Leakage Current V
R
= 3 V, T
A
= 25°C I
R
All 0.01 100 µA
DETECTOR
Peak Blocking Current Either Direction Rated V
DRM
, I
F
= 0 (note 1) I
DRM
All 2 100 nA
Peak On-State Voltage Either Direction I
TM
= 100mA peak V
TM
All 1.7 3 V
Critical Rate of Rise of Off-State Voltage I
F
= 0 (Figure 8, note 2) dV/dt All 10 V/µs
DC Characteristics Test Conditions Symbol Device Min Typ* Max Unit
LED Trigger Current Main Terminal
Voltage = 3V (note 3)
I
FT
FODM3010 15 mA
FODM3021
FODM3011 10
FODM3022
FODM3012 5
FODM3023
Holding Current, Either Direction I
H
All 300 µA
Characteristic Test Conditions Symbol Device Min Typ* Max Unit
Steady State Isolation Voltage (1 Minute) V
ISO
All 3750 VRMS
3
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Performance Curves
Fig. 1 LED Forward Voltage vs. Forward Current Fig. 2 Leakage Current vs. Ambient Temperature
Fig. 3 Holding Current vs. Ambient Temperature Fig. 4 Trigger Current vs. Ambient Temperature
IF - FORWARD CURRENT (mA)
110100
VF - FORWARD VOLTAGE (V)
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.8
1.7
TA
= -40°C
TA
= 25°C
TA
= 100°C
TA - AMBIENT TEMPERATURE (°C)
-40 -20 0 20 406080100
IDRM - LEAKAGE CURRENT (nA)
0.1
1
10
100
1000
VDRM = 600V
TA - AMBIENT TEMPERATURE (°C)
-40 -20 100
IH
- HOLDING CURRENT (NORMALIZED)
0.1
1.0
10
020406080
NORMALIZED TO TA = 25°C
TA - AMBIENT TEMPERATURE (°C)
-40 -20 0 20 40 60 80
IFT - TRIGGER CURRENT (NORMALIZED)
0.8
0.6
0.8
1.0
1.2
1.4
1.6
VTM = 3V
NORMALIZED TO TA = 25°C
100
4
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Performance Curves
Fig. 7 On-State Characteristics
VTM - ON-STATE VOLTAGE (V)
-4 -3 -2 -1 0 1 2 3 4
ITM - ON-STATE CURRENT (mA)
-800
-600
-400
-200
0
200
400
600
800
TA = 25°C
Fig. 5 LED Current Required to Trigger vs. LED Pulse Width Fig. 6 Off-State Output Terminal Voltage vs. Ambient Temperature
PWIN
- LED TRIGGER PULSE WIDTH (°C)
110100
IFT - LED TRIGGER CURRENT (NORMALIZED)
0
2
4
6
8
10
12
T
A
IN >> 100µsNORMALIZED TO PW
A
T= 25°CA
NORMALIZED TO T = 25°C
TA - AMBIENT TEMPERATURE (°C)
VDRM
- OFF-STATE OUTPUT TERMINAL VOLTAGE
(NORMALIZED)
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
-40 -20
020406080100
5
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Performance Curves
Figure 8. Static dv/dt Test Circuit
Figure 9. Resistive Load
Vdc
400V (FODM302X)
250V (FODM301X)
R = 10 kΩ
CTEST
X100
SCOPE
PROBE
PULSE
INPUT MERCURY
WETTED
RELAY
252 V (FODM302X)
158 V (FODM301X)
0 VOLTS
APPLIED VOLTAGE
WAVEFORM
Vmax =
dv/dt = 0.63 Vmax = 252
RTEST
D.U.T.D.U.T.
τRC
τRC τRC
Figure 10. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)
VCC
Rin 1
2
4
3
0.1 µF
180
C1
2.4k
ZL
120 V
60 Hz
MOC3010
MOC3011
MOC3012
VCC
Rin 1
2
4
3
120 V
60 Hz
180
RL
FODM3010
FODM3011
FODM3012
400 V (FODM302X)
= 250 V (FODM301X)
(FODM302X)
= 158
τRC (FODM301X)
1. The mercury wetted relay provides a high speed
repeated pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current,
then removing the current. The variable RTEST allows the
dv/dt to be gradually increased until the D.U.T. continues
to trigger in response to the applied voltage pulse, even
after the LED current has been removed. The dv/dt is
then decreased until the D.U.T. stops triggering. τRC is
measured at this point and recorded.
NOTE: This optoisolator should not be used to drive a load directly. It is
intended to be a trigger device only.
6
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Figure 12. Typical Application Circuit
VCC
Rin 1
2
4
3
0.05 µF
0.01 µF
LOAD
360
39
470
240
VAC
HOT
GROUND
FODM3021
FODM3022
FODM3023
Figure 11. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)
Rin
VCC
1
2
4
3
0.2 µF
180
C1
1.2 k
ZL
120 V
60 Hz
FODM3010
FODM3011
FODM3012
In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side.
The 39 ohm resistor and 0.01 µF capacitor are for snubbing of the triac, and the 470 ohm resistor and 0.05 mF capacitor
are for snubbing the coupler. These components may or may not be necessary depending upon the particular and load
used.
7
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Ordering Information
Marking Information
Option Description
V VDE Approved
R1 Tape and Reel (500 units)
R2 Tape and Reel (2500 units)
R3 Tape and Reel (500 units; unit 180° rotated)
R4 Tape and Reel (2500 units; unit 180° rotated)
R1V Tape and Reel (500 units) and VDE Approved
R2V Tape and Reel (2500 units) and VDE Approved
R3V Tape and Reel (500 units; unit 180° rotated) and VDE Approved
R4V Tape and Reel (2500 units; unit 180° rotated) and VDE Approved
1
2
6
4
35
Definitions
1Fairchild logo
2Device number
3VDE mark (Note: Only appears on parts ordered with VDE option –
See order entry table)
4 One digit year code
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
3011
XVM
YY
8
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
D
D
W
Kt
d
1
0PP
A
P
0
B0
0
2
E
F
W
1
0
R1
Reel Diameter
R2
Devices Per Reel
Max. Component Rotation or Tilt
Cover Tape Thickness
Cover Tape Width
Pocket Hole Dia.
Pocket Dimension
Pocket Location
Sprocket Hole Location
Sprocket Hole Dia.
Sprocket Hole Pitch
Tape Thickness
Pocket Pitch
Tape Width
Symbol
Description
R1
R2
B
d
W
1
D
K
0
1
0
E
A
P
0
P
F
2
D
P
0
0
t
W
178 mm (7")
330 mm (13")
Dimensions (mm)
12.00±0.4
7.30±0.20
20˚ max
500
1.55±0.20
2.30±0.20
0.065±0.02
9.20
1.75±0.20
8.00±0.20
2.00±0.20
5.50±0.20
4.40±0.20
1.55±0.20
4.00±0.20
0.30±0.20
2.54 Pitch
2500
9
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Footprint Drawing for PCB Layout
Recommended Infrared Reflow Soldering Profile
0.024
(
0.61
)
0.100
(
2.54
)
0.060
(
1.52
)
0.310
(
7.87
)
0.190
(
4.83
)
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended
(heating)
to 30 s
to 60 s
90 s
Time (s)
Package Surface Temperature T (°C)
150 s 60 s
180°C
230°C (peak temperature)
210°C
10
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
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Across the board. Around the world.™
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Programmable Active Droop™
