MOSFET MetalOxideSemiconductorFieldEffectTransistor CoolMOSTMP6 600VCoolMOSTMP6PowerTransistor IPL60R360P6S DataSheet Rev.2.0 Final PowerManagement&Multimarket 600VCoolMOSTMP6PowerTransistor IPL60R360P6S 1Description ThinPAK5x6 CoolMOSTMisarevolutionarytechnologyforhighvoltagepower MOSFETs,designedaccordingtothesuperjunction(SJ)principleand pioneeredbyInfineonTechnologies.CoolMOSTMP6seriescombinesthe experienceoftheleadingSJMOSFETsupplierwithhighclassinnovation. TheoffereddevicesprovideallbenefitsofafastswitchingSJMOSFET whilenotsacrificingeaseofuse.Extremelylowswitchingandconduction lossesmakeswitchingapplicationsevenmoreefficient,morecompact, lighterandcooler. Features *ExtremelylowlossesduetoverylowFOMRdson*QgandEoss *Veryhighcommutationruggedness *Easytouse/drive *Pb-freeplating,Halogenfreemoldcompound *QualifiedforindustrialgradeapplicationsaccordingtoJEDEC(J-STD20 andJESD22) Applications PFCstages,hardswitchingPWMstagesandresonantswitchingPWM stagesfore.g.PCSilverbox,Adapter,LCD&PDPTV,Lighting,Server, TelecomandUPS. Pleasenote:ForMOSFETparallelingtheuseofferritebeadsonthegate orseperatetotempolesisgenerallyrecommended. Table1KeyPerformanceParameters Parameter Value Unit VDS @ Tj,max 650 V RDS(on),max 0.36 Qg,typ 22 nC ID,pulse 30 A Eoss@400V 3 J Body diode di/dt 500 A/s Type/OrderingCode Package Marking IPL60R360P6S ThinPAK 5x6 SMD 60P6360 Final Data Sheet 2 RelatedLinks see Appendix A Rev.2.0,2014-07-08 600VCoolMOSTMP6PowerTransistor IPL60R360P6S TableofContents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Final Data Sheet 3 Rev.2.0,2014-07-08 600VCoolMOSTMP6PowerTransistor IPL60R360P6S 2Maximumratings atTj=25C,unlessotherwisespecified Table2Maximumratings Parameter Symbol Continuous drain current1) Values Unit Note/TestCondition 11.3 7.1 A TC = 25C TC = 100C - 30 A TC=25C - - 247 mJ ID =2.1A; VDD = 50V EAR - - 0.37 mJ ID =2.1A; VDD = 50V Avalanche current, repetitive IAR - - 2.1 A - MOSFET dv/dt ruggedness dv/dt - - 100 V/ns VDS=0...480V Gate source voltage VGS -20 -30 - 20 30 V static; AC (f>1 Hz) Power dissipation (non FullPAK) Ptot - - 89.3 W TC=25C Operating and storage temperature Tj,Tstg -40 - 150 C - Continuous diode forward current IS - - 9.8 A TC=25C IS,pulse - - 29.7 A TC = 25C dv/dt - - 15 V/ns VDS=0...400V,ISD<=IS,Tj=25C dif/dt - - 500 A/s VDS=0...400V,ISD<=IS,Tj=25C Min. Typ. Max. ID - - Pulsed drain current2) ID,pulse - Avalanche energy, single pulse EAS Avalanche energy, repetitive 2) Diode pulse current 3) Reverse diode dv/dt 3) Maximum diode commutation speed 3Thermalcharacteristics Table3Thermalcharacteristics(nonFullPAK) Parameter Symbol Thermal resistance, junction - case RthJC Values Unit Note/TestCondition Min. Typ. Max. - - 1.4 C/W - Thermal resistance, junction - ambient RthJA - 35 62 Device on 40mm*40mm*1.5 epoxy PCB FR4 with 6cm2 (one layer 70m C/W thick) copper area for drain connection and cooling. PCB is vertical without blown air. Soldering temperature, wavesoldering only allowed at leads - - 260 C Tsold reflow MSL1 1) Limited by Tj max. Maximum duty cycle D=0.75 Pulse width tp limited by Tj,max 3) VDClink=400V;VDS,peak