®
Altera Corporation 957
Understanding
MAX 7000 Timing
May 1999, ver. 2 Application Note 94
A-AN-094-02
Introduction
Altera
®
devices provide performance that is consistent from simulation to
application. Before programming a device, you can determine the worst-
case timing delays for any design. You can calculate propagation delays
with either the MAX+PLUS
®
II Timing Analyzer or the timing models
given in this application note and the timing parameters listed in
individual device data sheets. Both methods yield the same results.
This application note defines internal and external timing parameters,
and illustrates the timing models for the MAX
®
7000 device family
(including MAX 7000E, MAX 7000S, MAX 7000A, MAX 7000AE, and
MAX 7000B devices).
Familiarity with device architecture and characteristics is assumed. Refer
to specific device or device family data sheets in this data book for
complete descriptions of the architectures, and for the specific values of
the timing parameters listed in this application note.
Internal Timing
Parameters
Within a device, the timing delays contributed by individual architectural
elements are called internal timing parameters, which cannot be
measured explicitly. All internal timing parameters are shown in italic
type. The following section defines the internal timing parameters for the
MAX 7000 device family and applies to all MAX 7000 devices unless
otherwise indicated.
t
IN
Dedicated input pad and buffer delay.
t
IN
represents the time
required for a dedicated input pin to drive the input signal into
the programmable interconnect array (PIA) or into the global
control array.
t
IO
I/O input pad and buffer delay. The
t
IO
delay applies to I/O
pins used as inputs.
t
IO
is the delay from the I/O pin to the PIA.
t
PIA
PIA delay. The delay incurred by routing a signal through the
PIA.
t
SEXP
Shared expander array delay. The delay of a signal through the
AND-NOT
structure of the shared expander product-term array
that is fed back into the logic array.
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AN 94: Understanding MAX 7000 Timing
t
PEXP
Parallel expander delay. The additional delay incurred by
adding parallel expander product terms to the macrocell
product terms. For each group of up to five parallel expanders
added to a single function, an additional
t
PEXP
delay is added to
the timing path.
t
GLOB
Global control delay. The delay from a dedicated input pin to
any global control function in a macrocell or I/O control block.
t
IOE
Internally generated output enable delay. The delay from an
internally generated signal on the PIA to the output enable of
the tri-state buffer.
t
LAC
Logic array control delay. The
AND
array delay for register
control functions such as preset, clear, and output enable.
t
IC
Array clock delay. The delay through a macrocell’s clock
product term to the register’s clock input.
t
EN
Register enable delay. The
AND
array delay from the PIA to the
register enable input.
t
CLR
Register clear time. The delay from the assertion of the register’s
asynchronous clear input to the time the register output
stabilizes at logical low.
t
PRE
Register preset time. The delay from the assertion of the
register’s asynchronous preset input to the time the register
output stabilizes at logical high.
t
LAD
Logic array delay. The time a logic signal requires to propagate
through a macrocell’s
AND-OR-XOR
structure.
t
RD
Register delay. The delay from the rising edge of the register’s
clock to the time the data appears at the register output.
t
SU
Register setup time, for data and enable signals before clock.
The time required for a signal to be stable at the register’s data
and enable inputs before the register clock’s rising edge to
ensure that the register correctly stores the input data.
t
H
Register hold time, for data and enable signals after clock. The
time required for a signal to be stable at the register’s data and
enable inputs after the register clock’s rising edge to ensure that
the register correctly stores the input data.
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t
FSU
Fast-input register setup time. When the fast-input register is
used,
t
FSU
is the time required for a signal to be stable at the
register’s data and enable inputs before the register clock’s
rising edge to ensure that the register correctly stores the input
data.
t
FH
Fast-input register hold time. When the fast-input register is
used,
t
FH
is the time required for a signal to be stable at the
register’s data and enable inputs after the register clock’s rising
edge to ensure that the register correctly stores the input data.
t
FIN
Fast input delay. The delay from the I/O pin to the macrocell
register when fast input registers are used.
t
COMB
Combinatorial buffer delay. The delay from the time when a
combinatorial logic signal bypasses the programmable register
to the time it becomes available at the macrocell output.
t
OD1
Output buffer and pad delay with the slow slew rate logic
option turned off and V
CCIO
= V
CCINT
.
t
OD2
Output buffer and pad delay with the
slow slew rate logic
option turned off and V
CCIO
= low voltage.
t
OD3
Output buffer and pad delay with the slow slew rate logic
option turned on.
t
XZ
Output buffer disable delay. The delay required for high
impedance to appear at the output pin after the output buffer’s
enable control is disabled.
t
ZX1
Output buffer enable delay with the slow slew rate
logic option
turned off and V
CCIO
= V
CCINT
. The delay required for the
output signal to appear at the output pin after the tri-state
buffer’s enable control is enabled.
t
ZX2
Output buffer enable delay with the slow slew rate logic option
turned off and V
CCIO
= low voltage. The delay required for the
output signal to appear at the output pin after the tri-state
buffer’s enable control is enabled.
t
ZX3
Output buffer enable delay with the slow slew rate logic option
turned on. The delay required for the output signal to appear at
the output pin after the tri-state buffer’s enable control is
enabled.
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t
LPA
Low-power adder. The delay associated with macrocells in
low-power operation. In low-power mode,
t
LPA
must be added
to the logic array delay (
t
LAD
), the register control delay (
t
LAC
,
t
IC
,
t
ACL
, or
t
EN
), and the shared expander delay (
t
SEXP
) paths.
External
Timing
Parameters
External timing parameters represent actual pin-to-pin timing
characteristics. Each external timing parameter consists of a combination
of internal timing parameters. The data sheet for each device gives the
values of the external timing parameters. These external timing
parameters are worst-case values, derived from extensive performance
measurements and ensured by testing. All external timing parameters are
shown in bold type. The following list defines external timing parameters
for MAX 7000 devices.
t
PD1
Dedicated input pin to non-registered output delay. The time
required for a signal on any dedicated input pin to propagate
through the combinatorial logic in a macrocell and appear at an
external device output pin.
t
PD2
I/O pin input to non-registered output delay. The time required
for a signal on any I/O pin input to propagate through the
combinatorial logic in a macrocell and appear at an external
device output pin.
t
PZX
Tri-state to active output delay. The time required for an input
transition to change an external output from a tri-state (high-
impedance) logic level to a valid high or low logic level.
t
PXZ
Active output to tri-state delay. The time required for an input
transition to change an external output from a valid high or low
logic level to a tri-state (high-impedance) logic level.
t
CLR
Time to clear register delay. The time required for a low signal to
appear at the external output, measured from the input
transition.
t
SU
Global clock setup time. The time that data must be present at
the input pin before the global (synchronous) clock signal is
asserted at the clock pin.
t
H
Global clock hold time. The time that data must be present at
the input pin after the global clock signal is asserted at the clock
pin.
t
FSU
Fast-input clock setup time. When the fast-input path is used,
t
FSU
is the time that data must be present at the input pin before
the global (synchronous) clock signal is asserted at the clock pin.
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t
FH
Fast-input clock hold time. When the fast-input path is used,
t
FH
is the time that data must be present at the input pin after
the global clock signal is asserted at the clock pin.
t
CO1
Global clock to output delay. The time required to obtain a valid
output after the global clock is asserted at the clock pin.
t
CNT
Minimum global clock period. The minimum period
maintained by a globally clocked counter.
t
ASU
Array clock setup time. The time data must be present at an
input pin before an array (asynchronous) clock signal is asserted
at the input pin.
t
AH
Array clock hold time. The time data must be present at an
input pin after an array clock signal is asserted at the input pin.
t
ACO1
Array clock to output delay. The time required to obtain a valid
output after an array clock signal is asserted at an input pin.
t
ACNT
Minimum array clock period. The minimum period maintained
by a counter when it is clocked by a signal from the array.
Timing Models
Timing models are simplified block diagrams that illustrate the
propagation delays through Altera devices. Logic can be implemented on
different paths. You can trace the actual paths used in your design by
examining the equations listed in the MAX+PLUS II Report File (
.rpt
) for
the project. You can then add up the appropriate internal timing
parameters to calculate the propagation delays through the device.
The MAX 7000 architecture has globally routed register clock, clear, and
tri-state buffer output enable signals. Two types of expander product
terms—shared and parallel—can be used to implement complex logic.
Each macrocell can be set for low-power operation to reduce power
dissipation in the device.
Figure 1 shows the timing model for MAX 7000 devices.
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Figure 1. MAX 7000 Device Timing Model
Notes:
(1) This parameter is available in MAX 7000E, MAX 7000S, MAX 7000A, MAX 7000AE, and MAX 7000B devices only.
(2) This parameter is not available in 44-pin devices.
Calculating
Timing Delays
You can calculate pin-to-pin timing delays for any device with the
appropriate timing model and internal timing parameters. Each external
timing parameter is calculated from a combination of internal timing
parameters. Figure 2 shows the external timing parameters for the
MAX 7000 device family. To calculate the delay for a signal that follows a
different path through the device, refer to the timing models shown in
Figure 1 to determine which internal timing parameters to add together.
Figure 2. External Timing Parameters (Part 1 of 3)
Logic Array
Delay
t
LAD
Input
Delay
t
IN
PIA
Delay
t
PIA
Shared
Expander Delay
t
SEXP
Global Control
Delay
t
GLOB
Internal Output
Enable Delay
(1)
t
IOE
Parallel
Expander Delay
t
PEXP
Fast Input
Delay
(1)
t
FIN
I/O
Delay
t
IO
Output
Delay
t
OD1
t
OD2 (2)
t
OD3 (1)
t
XZ
t
ZX1
t
ZX2 (2)
t
ZX3 (1)
Register
Delay
t
SU
t
H
t
PRE
t
CLR
t
RD
t
COMB
t
FSU
t
FH
Register
Control Delay
t
LAC
t
IC
t
EN
Combinatorial
Logic
Combinatorial Delay
Tri-State Enable/Disable Delay
Global
Control
t
ZX3
or
tPD1 =
t
IN
+
t
PIA
+
t
LAD
+
t
COMB
+
tPD2 =
t
IO
+
t
PIA
+
t
LAD
+
t
COMB
+(
t
OD1
t
OD1
or
t
OD2
t
OD2
or
or
t
OD2
t
OD3
or )
()
tPXZ ,tPZX =
t
IN
+
t
GLOB
+(
t
XZ
or
t
ZX1
t
ZX2
or )
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Figure 2. External Timing Parameters (Part 2 of 3)
Register Clear & Preset Time
Global
Control
tGCLR =
t
IN
+
t
GLOB
+
t
CLR
+
Combinatorial
Logic
Combinatorial
Logic
Setup Time
LAD GLOB
tSU = (
t
IN
+
t
PIA
+
t
) (
t
IN
+
t
) +
t
SU
Combinatorial
Logic
Hold Time
Combinatorial
Logic
Counter Frequency
tCNT =
t
RD
+
t
PIA
+
t
LAD
+
t
SU
tH= (
t
IN
+
t
GLOB
) (
t
IN
+
t
PIA
+
t
LAD
) +
t
H
tPRE,tCLR =
t
IN
+
t
PIA
+
t
LAC
+ )+
CLR
(
t
PRE
or
t
()
OD2
t
OD1
or
t
OD3
or
t
)
(
OD2
t
OD1
or
t
OD3
or
t
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Figure 2. External Timing Parameters (Part 3 of 3)
Combinatorial
Logic
Combinatorial
Logic
Asynchronous Setup Time
IC
tASU = (
t
IN
+
t
PIA
+
t
LAD
) (
t
IN
+
t
PIA
+
t
) +
t
SU
Asynchronous Hold Time
Combinatorial
Logic
Combinatorial
Logic
Clock-to-Output Delay
Array Clock-to-Output Delay
Combinatorial
Logic
+ + + ) +tAH = (
t
IN
t
PIA
+
t
IC
) – (
t
IN
t
PIA
t
LAD
t
H
tCO1 =
t
IN
+
t
GLOB
+
t
RD
+
OD2
(
t
OD1
or
t
OD3
or
t
)
tACO1 =
t
IN
+
t
PIA
+
t
IC
+
t
RD
+
OD2
(
t
OD1
or
t
OD3
or
t
)
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Examples The following examples show how to use internal timing parameters to
calculate the delays for real applications.
Example 1: First Bit of 7483 TTL Macrofunction
You can analyze the timing delays for macrofunctions that have been
subjected to minimization and logic synthesis. A MAX+PLUS II Report
File (.rpt) that includes the optional Equations Section lists the
synthesized logic equations for the project. These equations are structured
so you can quickly determine the logic implementation of any signal. For
example, Figure 3 shows part of a 7483 TTL macrofunction (a 4-bit full
adder). The Report File gives the following equations for s1, the least
significant bit of the adder:
s1 = OUTPUT (_LC021, VCC);
_LC021 = LCELL (_EQ026 $ C0);
_EQ026 = b1 & !a1
# !b1 & a1;
Figure 3. Adder Logic Timing for MAX 7000 Architecture
The s1 output is the output of macrocell 21 (_LC021), which contains
combinatorial logic. The combinatorial logic LCELL(_EQ026 $ C0)
represents the XOR of the intermediate equation _EQ026 and the carry-in,
c0. In turn, _EQ026 is logically equivalent to the XOR of inputs b1 and a1.
Therefore, the timing delay for s1 in MAX 7000 devices is as follows:
tIN + tPIA + tLAD + t COMB + tOD1
NOT
NOT
a1
b1
c0
s1
tLAD tCOMB tOD1
tIN tPIA
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Example 2: Second Bit of 7483 TTL Macrofunction
For complex logic that requires expanders (represented as _X<number> in
MAX+PLUS II Report Files), the expander array delay, tSEXP, is added to
the delay element. The second bit of the 7483 adder macrofunction, s2,
requires shared expanders. The equations are as follows:
s2 = _LC019;
_LC019 = LCELL(_EQ023 $ _EQ024 );
_EQ023 = _X029 & _X030 & _X031;
_X029 = EXP(!b1 & !a1);
_X030 = EXP(!b1 & !c0);
_X031 = EXP(!a1 & !c0);
_EQ024 = _X032 & _X033;
_X032 = EXP(!b2 & a2);
_X033 = EXP(b2 & a2);
Figure 4 shows how you can map the logic structure onto the MAX 7000
architecture with these equations. The timing delay for s2 in MAX 7000
devices is as follows:
tIN + tPIA + tSEXP + t LAD + t COMB + tOD1
Figure 4. Adder Equations Mapped to MAX 7000 Architecture
_X029
_X030
_X031
_X032
_X033
c0
a1
b1
a2
b2
s2
EXP
EXP
EXP
EXP
EXP
t
COMB
t
OD1
t
IN
t
PIA
t
LAD
t
SEXP
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Example 3: Second Bit of 7483 TTL Macrofunction with Parallel
Expanders
The MAX+PLUS II Compiler implements logic with parallel expanders if
the Parallel Expanders logic option is turned on when a project is
compiled for MAX 7000 devices. When parallel expanders are used, none
of the shareable expanders are used, so the timing delay for the s2 bit of
the 7483 becomes:
tIN + tPIA + tLAD + t PEXP + t COMB + tOD1
Example 4: First Bit of 7483 TTL Macrofunction in Low-Power
Mode
If a MAX 7000 device macrocell is set for low-power mode, you must add
the low-power adder delay to the total delay through that macrocell.
Thus, the s1 delay in Figure 3 becomes:
tIN + tPIA + tLPA + t LAD + t COMB + tOD1
Conclusion The MAX 7000 architecture has fixed internal timing delays that are
independent of routing. Therefore, you can determine the worst-case
timing delays for any design before programming a device. Total delay
paths can be expressed as the sums of internal timing delays. Timing
models illustrate the internal delay paths for devices and show how these
internal timing parameters affect each other. You can use the
MAX+PLUS II Timing Analyzer to automatically calculate delay paths, or
hand-calculate delay paths by adding the internal timing parameters for
an appropriate timing model. With the ability to predict worst-case timing
delays, you can be confident of a design’s in-system timing performance.
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