Flip-Chip (4 bumps) package
Top view
DIFF SE
GND
DIFF
Features
• 50 Ω nominal input / conjugate match to STMicroelectronics chips BlueNRG-134
WLCSP and BlueNRG-234 WLCSP
• Low insertion loss
• Low amplitude imbalance
• Low phase imbalance
• Ultraminiature footprint: < 1.2 mm2
• Extra low profile < 350 μm after reflow
• High RF performance
• RF BOM and area reduction
Applications
• 2.45 GHz impedance matched balun filter
• Optimized for STMicroelectronics chip set BlueNRG-134 and BlueNRG-234
WLCSP
• Wearable applications
Description
This device is an ultraminiature extra thin balun that integrates matching network and
harmonics filter.
Matching impedance has been customized for the BLUENRG-134 and BlueNRG-234
WLCSP from STMicroelectronics.
Based on IPD technology on high resistivity silicium it optimizes the RF performance.
STMicroelectronics qualified this product intended to be used in system in package
module based on standard reliability procedure. For more details, please contact ST
representatives.
It is the responsibility of the customer to perform qualification reliability verifications
as it is related to customer specific application, mission profile and module design,
process.
Product status link
BALF-NRG-02J5
50 Ω ultra thin balun with integrated harmonic filter / conjugate match balun to ST
BlueNRG-134 and BlueNRG-234
BALF-NRG-02J5
Datasheet
DS12630 - Rev 1 - July 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Figure 1. Application schematic
Table 1. Absolute ratings (limiting values)
Symbol Parameter
Value
Unit
Min. Typ. Max.
PIN Input power RFIN - 10 dBm
VESD
ESD ratings human body model (JESD22-A114-C), all I/O one at a time while others
connected to GND 2000 -
V
ESD ratings charge device model (JESD22-C101-C) 500 -
ESD ratings machine model, all I/O 200 -
TOP Operating temperature -40 - +105 °C
BALF-NRG-02J5
Characteristics
DS12630 - Rev 1 page 2/13
Table 2. Impedances (Tamb = 25 °C)
Symbol Parameter
Value
Unit
Min. Typ. Max.
ZDIFF Nominal differential impedance - matched - Ω
ZSE Nominal single ended impedance - 50 - Ω
Table 3. RF performance (Tamb = 25 °C)
Symbol Parameter
Value
Unit
Min. Typ. Max.
f Frequency range (bandwidth) 2400 2500 MHz
ILInsertion loss in bandwidth (differential mode) 1.35 1.65 dB
RLSE Single ended return loss in bandwidth (differential mode) 26 34 dB
RLDIFF Differential return loss in bandwidth 18 24 dB
H2 Second harmonic attenuation (differential mode) 37 47 dB
H3 Third harmonic attenuation (differential mode) 50 56 dB
H4 Fourth harmonic attenuation (differential mode) 45 50 dB
H5 Fifth harmonic attenuation (differential mode) 39 60 dB
H6 Sixth harmonic attenuation (differential mode) 37 46 dB
H7 Seventh harmonic attenuation (differential mode) 38 58 dB
φimb Phase imbalance -4.5 4.5 °
Aimb Amplitude imbalance -1.1 +1.1 dB
BALF-NRG-02J5
Characteristics
DS12630 - Rev 1 page 3/13
1.1 On-board measurements
Figure 2. Return loss on SE port (Tamb = 25 °C)
0(dB)
f(GHz)
-15
-20
-10
-5
-25
2.40 2.42 2.44 2.46 2.48 2.50
-35
-40
-30
-45
Figure 3. Return loss on DIFF port (Tamb = 25 °C)
0(dB)
f(GHz)
-15
-20
-10
-5
-25
2.40 2.42 2.44 2.46 2.48 2.50
-35
-40
-30
-45
Figure 4. Transmission (Tamb = 25 °C)
0(dB)
f(GHz)
0246810 12
-30
-40
-20
-10
-70
14
-50
-60
16 18 20
-80
Figure 5. Insertion loss (Tamb = 25 °C)
0(dB)
f(GHz)
-1.0
-0.5
2.40 2.42 2.44 2.46 2.48 2.50
-2.0
-1.5
-2.5
BALF-NRG-02J5
On-board measurements
DS12630 - Rev 1 page 4/13
Figure 6. H2 attenuation (Tamb = 25 °C)
0(dB)
f(GHz)
4.80 4.84 4.88 4.92
-30
-40
-20
-10
-70
-50
-60
4.96 5.00
-80
Figure 7. H3 attenuation (Tamb = 25 °C)
0(dB)
f(GHz)
7.20 7.26 7.32 7.38
-30
-40
-20
-10
-70
-50
-60
7.44 7.50
-80
Figure 8. H4 attenuation (Tamb = 25 °C)
0(dB)
f(GHz)
9.60 9.68 9.76 9.84
-30
-40
-20
-10
-70
-50
-60
9.92 10.00
-80
Figure 9. H5 attenuation (Tamb = 25 °C)
0(dB)
f(GHz)
12.0 12.1 12.2 12.3
-30
-40
-20
-10
-70
-50
-60
12.4 12.5
-80
Figure 10. H6 attenuation (Tamb = 25 °C)
0(dB)
f(GHz)
14.40 14.52 14.64 14.76
-30
-40
-20
-10
-70
-50
-60
14.88 15.00
-80
Figure 11. H7 attenuation (Tamb = 25 °C)
0(dB)
f(GHz)
16.80 16.94 17.08 17.22
-30
-40
-20
-10
-70
-50
-60
17.36 17.50
-80
BALF-NRG-02J5
On-board measurements
DS12630 - Rev 1 page 5/13
Figure 12. Amplitude imbalance (Tamb = 25 °C)
(dB)
f(GHz)
-0.5
0.0
2.40 2.42 2.44 2.46 2.48 2.50
-1.5
-1.0
-2.0
0.5
1.5
1.0
2.0
Figure 13. Phase imbalance (Tamb = 25 °C)
(deg)
f(GHz)
-1.5
-0.5
2.40 2.42 2.44 2.46 2.48 2.50
-3.5
-2.5
-4.5
0.5
2.5
1.5
3.5
4.5
BALF-NRG-02J5
On-board measurements
DS12630 - Rev 1 page 6/13
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1 Ultra thin Flip-Chip 4 bumps package information
• Epoxy meets UL94, V0
• Lead-free package
Figure 14. Ultra thin Flip-Chip 4 bumps package outline
X
Y
B
A
D
B1
B2
A1
BOTTOM VIEW SIDE VIEW
T
H
TOP VIEW
DIFF
DIFF
SE
GND
Table 4. Ultra thin Flip-Chip 4 bumps package mechanical data
Parameter Description Min. Typ. Max. Unit
X X dimension of the die 1355 1385 1415
µm
Y Y dimension of the die 825 855 885
A X pitch 1000
B Y pitch 400
A1 Distance from bump to edge of die on X axis 192.5
B1 Distance from bump to edge of die on Y axis 227.5
B2 Distance from bump to center of die on Y axis 200
D Bump diameter 202 227 252
T Substrate thickness 190 200 210
H Bump height 117 142 167
BALF-NRG-02J5
Package information
DS12630 - Rev 1 page 7/13
Figure 15. Recommended land pattern
BlueNRG
BALF-NRG-02J5
800 µm
50 Ω RF antenna
Clearance = 100µm
BALF-NRG-02J5
Ultra thin Flip-Chip 4 bumps package information
DS12630 - Rev 1 page 8/13
2.2 Ultra thin Flip-chip 4 bumps packing information
Figure 16. Marking
Note: More packing information is available in the application note:
• AN2348 Flip-Chip: “Package description and recommendations for use”
Figure 17. Flip Chip tape and reel specification
Ø D0 P0
User direction of unreeling
Note: Pocket dimensions are not on scale
Pocket shape may vary depending on package
Ø D1
F
P2P1
K0
W
Pin 1 located according to EIA-481
A0
B0
Table 5. Ultra thin Flip-Chip 4 bumps package mechanical data
Ref.
Dimensions
Millimeters
Min. Typ. Max.
A0 0.91 0.96 1.01
B0 1.44 1.49 1.54
BALF-NRG-02J5
Ultra thin Flip-chip 4 bumps packing information
DS12630 - Rev 1 page 9/13
Ref.
Dimensions
Millimeters
Min. Typ. Max.
P1 3.90 4.00 4.10
P0 3.90 4.00 4.10
Ø D0 1.40 1.50 1.60
Ø D1 0.15 0.20 0.25
F 3.45 3.50 3.55
K0 0.38 0.43 0.48
P2 1.95 2.00 2.05
W 7.90 8.00 8.30
Figure 18. Footprint - non solder mask defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Solder stencil opening:
220 µm recommended
Figure 19. Footprint - solder mask defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
Solder stencil opening:
220 µm recommended
BALF-NRG-02J5
Ultra thin Flip-chip 4 bumps packing information
DS12630 - Rev 1 page 10/13
3Ordering information
Figure 20. Ordering information scheme
BAL F - NRG - 02 J5
Balun
Integrated harmonic filter
Custom impedance
Design version
Package typpe
NRG = BlueNRG from STMicroelectronics
J5 = Flip Chip on HRSi ultra thin
Table 6. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
BALF-NRG-02J5 TP Flip-Chip 4 bumps 0.645 mg 5000 Tape and reel
BALF-NRG-02J5
Ordering information
DS12630 - Rev 1 page 11/13
Revision history
Table 7. Document revision history
Date Revision Changes
12-Jul-2018 1 Initial release.
BALF-NRG-02J5
DS12630 - Rev 1 page 12/13
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
BALF-NRG-02J5
DS12630 - Rev 1 page 13/13
