Product Family Data Sheet Rev. 2.7 2018.12.12 1# Middle Power LED Series Flip Chip Package LM101A LM101A opens up a new world of lighting design with its high output and small form factors Features & Benefits Greater freedom of design with compact package size High degree of reliability with plastic-free structure Low thermal resistance High efficiency providing optimized solution Compact footprint (1.15 x 1.15 mm) 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 6 3. Typical Characteristics Graphs ----------------------- 15 4. Outline Drawing & Dimension ----------------------- 18 5. Reliability Test Items & Conditions ----------------------- 20 6. Soldering Conditions ----------------------- 21 7. Tape & Reel ----------------------- 22 8. Label Structure ----------------------- 24 9. Packing Structure ----------------------- 25 Precautions in Handling & Use ----------------------- 27 10. 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Operating Temperature Ta -40 ~ +85 C - Storage Temperature Tstg -40 ~ +120 C - LED Junction Temperature Tj 125 C - Forward Current IF 450 mA - Assembly Process Temperature - 260 <10 s - ESD (HBM) - 2 kV - Note: It is recommended minimum current 10mA in order to avoid un-even brightness, and may vary depending on circuit configuration. 4 b) Electro-optical Characteristics (IF = 150 mA, Ts = 85 C) Item Unit Rank Forward Voltage (VF) V 6E Bin Min. Typ. Max. 6A 2.7 - 2.9 AE 2.9 - 3.1 -10.0 - - 80 - - Reverse Voltage (@ -10 A) V Color Rendering Index (Ra) - Special CRI (R9) - 0 - - Thermal Resistance (junction to chip point) K/W - 2 - Beam Angle - 150 - 8 Note: Samsung maintains measurement tolerance of : Forward voltage = 0.1 V, Luminous flux = 5 %, CRI = 3, R9 = 6.5 5 c) Luminous Flux Characteristics Item CRI Nominal CCT (K) (IF = 150 mA, Ts = 85 C) SY SZ SA SB SC SD Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. 35 39 39 43 43 47 47 51 51 55 55 59 59 63 63 67 67 71 4000 5000 5700 6500 2700 3000 Flux (v) 3500 80 4000 5000 5700 6500 2700 90 SG Min. 3500 Luminous SF Max. 3000 70 SE Min. 3000 3500 Note: 1) The LM101A is tested in pulsed condition at rated test current (10 ms pulse width) 2) Calculated flux values are for reference only 3) Samsung maintains measurement tolerance of: luminous flux = 5 % 6 2. Product Code Information (IF = 150 mA, Ts = 85 C) 1 2 3 4 5 6 7 S C P 8 W T 7 Digit 1 2 3 4 Code Samsung Chip SCP 9 10 11 12 13 11 12 13 14 15 16 17 18 H P L 1 W L S 0 6 E Specification 8 Min. 80 9 Min. 90 W 2700 V 3000 U 3500 T 4000 R 5000 Q 5700 P 6500 Chip Shape T Square Chip Size (m) 78H 780x780x170m Product Purpose PL1 PoC for Lighting CCT (K) 14 10 Min. 70 CCT (K) 6 8 9 7 CRI 5 7 8 PKG Information 8 W 2700K V 3000K U 3500K T 4000K R 5000K Q 5700K P 6500K L Single Bin for MacAdam 5-step L(MacAdam 5-step Bin) U Single Bin for MacAdam 3-step U(MacAdam 3-step Bin) MacAdam Step 15 16 Luminous Flux (lm) S0 17 18 Forward Voltage (V) 6E Bin Code: 2.7~3.1 Bin Code: SY, SZ, SA, SB, SC, SD, SE, SF, SG 6A 2.7~2.9 AE 2.9~3.1 7 a) Luminous Flux Bins CRI (Ra) Min. (IF = 150 mA, Ts = 85 C) Nominal CCT (K) 3000 3500 4000 Product Code SCP7VT78HPL1VS06E SCP7UT78HPL1US06E SCP7TT78HPL1TS06E Flux Bin Flux Range (v, lm) SD 55 ~ 59 SE 59 ~ 63 SF 63 ~ 67 SD 55 ~ 59 SE 59 ~ 63 SF 63 ~ 67 SE 59 ~ 63 SF 63 ~ 67 SG 67 ~ 71 SE 59 ~ 63 SF 63 ~ 67 SG 67 ~ 71 SE 59 ~ 63 SF 63 ~ 67 SG 67 ~ 71 SE 59 ~ 63 SF 63 ~ 67 SG 67 ~ 71 70 5000 5700 6500 SCP7RT78HPL1RS06E SCP7QT78HPL1QS06E SCP7PT78HPL1PS06E Note: "" can be "L" (Single bin for MacAdam 5-step), "U" (Single bin for MacAdam 3-step) 8 a) Luminous Flux Bins CRI (Ra) Min. (IF = 150 mA, Ts = 85 C) Nominal CCT (K) 2700 3000 3500 80 4000 5000 5700 6500 Product Code SCP8WT78HPL1WS06E SCP8VT78HPL1VS06E SCP8UT78HPL1US06E SCP8TT78HPL1TS06E SCP8RT78HPL1RS06E SCP8QT78HPL1QS06E SCP8PT78HPL1PS06E Flux Bin Flux Range (v, lm) SB 47 ~ 51 SC 51 ~ 55 SD 55 ~ 59 SC 51 ~ 55 SD 55 ~ 59 SE 59 ~ 63 SC 51 ~ 55 SD 55 ~ 59 SE 59 ~ 63 SD 55 ~ 59 SE 59 ~ 63 SF 63 ~ 67 SD 55 ~ 59 SE 59 ~ 63 SF 63 ~ 67 SC 51 ~ 55 SD 55 ~ 59 SE 59 ~ 63 SC 51 ~ 55 SD 55 ~ 59 SE 59 ~ 63 Note: "" can be "L" (Single bin for MacAdam 5-step) "U" (Single bin for MacAdam 3-step) 9 a) Luminous Flux Bins CRI (Ra) Min. (IF = 150 mA, Ts = 85 C) Nominal CCT (K) 2700 90 3000 3500 Product Code SCP9WT78HPL1WS06E SCP9VT78HPL1VS06E SCP9UT78HPL1US06E Flux Bin Flux Range (v, lm) SY 35 ~ 39 SZ 39 ~ 43 SA 43 ~ 47 SY 35 ~ 39 SZ 39 ~ 43 SA 43 ~ 47 SZ 39 ~ 43 SA 43 ~ 47 SB 47 ~ 51 Note: "" can be "L" (Single bin for MacAdam 5-step), "U" (Single bin for MacAdam 3-step) 10 b) Color Bins (IF = 150 mA, Ts = 85 C) CRI Min. Nominal CCT (K) Product Code 3000 SCP7VT78HPL1V S06E 3500 4000 Color Rank Chromaticity Bins VL VL VU VU UL UL UU UU TL TL TU TU RL RL RU RU QL QL QU QU PL PL PU PU WL WL WU WU VL VL VU VU UL UL UU UU TL TL TU TU RL RL RU RU QL QL QU QU PL PL PU PU WL WL WU WU VL VL VU VU UL UL UU UU SCP7UT78HPL1US06E SCP7TT78HPL1TS06E 70 5000 5700 6500 2700 3000 3500 80 4000 5000 5700 6500 2700 90 3000 3500 SCP7RT78HPL1R S06E SCP7QT78HPL1Q S06E SCP7PT78HPL1P S06E SCP8WT78HPL1W S06E SCP8VT78HPL1V S06E SCP8UT78HPL1U S06E SCP8TT78HPL1T S06E SCP8RT78HPL1R S06E SCP8QT78HPL1Q S06E SCP8PT78HPL1PS06E SCP9WT78HPL1W S06E SCP9VT78HPL1V S06E SCP9UT78HPL1U S06E Note: "" can be "L" (Single bin for MacAdam 5-step), "U" (Single bin for MacAdam 3-step) 11 c) Voltage Bins Nominal CCT (K) (IF = 150 mA, Ts = 85 C) CRI Min. Product Code Voltage Rank Voltage Bin Voltage Range (V) 6A 2.7 ~ 2.9 AE 2.9 ~ 3.1 6E 12 d) Chromaticity Region & Coordinates (IF = 150 mA, Ts = 85 C) : "L" (Single bin for MacAdam 5-step) 13 d) Chromaticity Region & Coordinates (IF = 150 mA, Ts = 85 C) : "U" (Single bin for MacAdam 3-step) 14 d) Chromaticity Region & Coordinates CCT (K) MacAdam 3 step (U code) 5 step (L code) (IF = 150 mA, Ts = 85 C) Center point CIE x CIE y Major-axis Minor-axis Rotation a b 2700 0.4578 0.4101 0.0081 0.0042 53.70 3000 0.4338 0.4030 0.0083 0.0041 53.22 3500 0.4073 0.3917 0.0093 0.0041 54.00 4000 0.3818 0.3797 0.0094 0.0040 53.72 5000 0.3447 0.3553 0.0082 0.0035 59.62 5700 0.3287 0.3417 0.0075 0.0032 59.10 6500 0.3123 0.3282 0.0067 0.0029 58.57 2700 0.4578 0.4101 0.0135 0.0070 53.70 3000 0.4338 0.4030 0.0138 0.0068 53.22 3500 0.4073 0.3917 0.0155 0.0068 54.00 4000 0.3818 0.3797 0.0157 0.0067 53.72 5000 0.3447 0.3553 0.0137 0.0058 59.62 5700 0.3287 0.3417 0.0125 0.0053 59.10 6500 0.3123 0.3282 0.0112 0.0048 58.57 Note: Samsung maintains measurement tolerance of: Cx, Cy = 0.005 15 3. Typical Characteristics Graphs a) Spectrum Distribution (IF = 150 mA, Ts = 25 C) CCT: 2700 K CCT: 3000 K CCT: 4000 K CCT: 5000 K b) Forward Current Characteristics (Ts = 25 C) 16 c) Temperature Characteristics (IF = 150 mA) d) Color Shift Characteristics (Ts = 25 C, IF = 150 mA) e) Derating Curve Rth is measured after soldering of LED chip on the metal based substrate. *metal: aluminum (refer to page 17) 17 Beam Angle Characteristics (IF = 150 mA) Beam Angle Relative luminous intensity f) 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -60 -30 0 Angle () 30 60 90 18 4. Outline Drawing & Dimension 1. Tolerance is 0.10 mm 2. Do not place LEDs with pressure Ts Point & Measurement Method: Measure nearest point from the center of LED chip () as shown below. Distance between chip center and Ts point () = 3.5 mm Tj = Ts + Power x Thermal resistance at Ts (Rj-s) <Chip Pad> <PCB Land> 19 Precautions: 1) This LED chip PKG does not contain built-in ESD protection device. 2) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on the LEDs. Do not put stress on the LEDs during heating. 3) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LEDs characteristics should be carefully checked before and after such repair. 4) Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs. 20 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle Sample Size MSL Test 125 C 24 h drying 60 C, 60 % RH 120 h 260 C 10 sec 3 cycles 1 cycle 11 Room Temperature Life Test 25 C, Derated max current 1000 h 22 High Temperature Life Test 85 C, Derated max current 1000 h 22 High Temperature Humidity Life Test 85 C, 85 % RH, Derated max current 1000 h 22 Low Temperature Life Test -40 C, DC Derated max current 1000 h 22 Powered Temperature Cycle Test -45 C / 20 min 85 C / 20 min, sweep 100 min cycle on/off: each 5 min, Derated max current 100 cycles 22 Thermal Shock -45 C / 15 min 125 C / 15 min Hot plate 180 C 800 cycles 100 High Temperature Storage 120 C 1000 h 11 Low Temperature Storage -40 C 1000 h 11 5 times 5 R1: 10 R2: 1.5 ESD (HBM) C: 100 V: 2 kV Vibration Test 20~2000~20 Hz, 200 m/s2, sweep 4 min X, Y, Z 3 direction, each 1 cycle 4 cycles 11 Mechanical Shock Test 1500 g, 0.5 ms 5 cycles 11 b) Criteria for Judging the Damage Item Symbol Test Condition (Ts = 25 C) Limit Min Max Forward Voltage VF IF = Derated max current Init. Value * 0.9 Init. Value * 1.1 Luminous Flux v IF = Derated max current Init. Value * 0.7 Init. Value * 1.1 21 6. Soldering Conditions a) Reflow Conditions (Pb free) Reflow frequency: 2 times max. b) Manual Soldering Conditions Not more than 5 seconds @ max. 300 C, under soldering iron 22 7. Tape & Reel a) Taping Dimension (unit: mm) Anode Taping Direction 23 b) Reel Dimension Notes: 1) Quantity: The quantity/reel is 4,000 pcs 2) Cumulative Tolerance: 3) Packaging: Cumulative tolerance / 10 pitches is 0.2 mm P/N, Manufacturing data code no. and quantity are indicated on the aluminum packing bag 24 8. Label Structure a) Label Structure LM101A [CRI] [CCT] WLSC6A Model SCP8WT78HPL1WLS06E WLSC6A Bin Code IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /I/ 4,000 pcs Product Code IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot Number Note: Denoted product code and bin code above is only an example Bin Code: : Chromaticity bin : Luminous Flux bin : Forward Voltage bin (refer to page 10-14) (refer to page 7-9) (refer to page 11) b) Lot Number The lot number is composed of the following characters: LM101A [CRI] [CCT] WLSC6A SCP8WT78HPL1WLS06E WLSC6A IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /I/ 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / I / 4,000 pcs : Production site (G3: Shenzhen China, G4: Guangzhou China, GB: Nanchang China) : Product state : Year (Y: 2014, Z: 2015, A: 2016 ...) : Month : Day (1~9, A, B~V) : Product serial number : Reel number (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) (1~9, A, B, C) (001 ~ 999) (001 ~ 999) or (AAA ~ ZZZ) 25 9. Packing Structure a) Packing Process Reel LM101A [CRI] [CCT] WLSC6A SCP8WT78HPL1WLS06E WLSC6A IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /I/ 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Aluminum Vinyl Bag Outer Box Material: Paper (SW3B(A)) Size (mm) Type Note 7 inch L W H 295 5 290 5 260 5 Up to 7 reels max. Side Label LM101A [CRI] [CCT] WLSC6A SCP8WT78HPL1WLS06E WLSC6A IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /I/ 28,000 pcs H CHIP LED IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII W L 26 b) Aluminum Vinyl Packing Bag LM101A [CRI] [CCT] WLSC6A SCP8WT78HPL1WLS06E WLSC6A IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /I/ 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII c) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Bag 27 10. Precautions in Handling & Use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed by a sealed container with nitrogen gas injected (shelf life of sealed bags: 12 months, temperature ~40 C, ~90 % RH). 5) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 C / 60 % RH, or b. Stored at <10 % RH 6) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 7) Devices require baking before mounting, if humidity card reading is >60 % at 23 5 C. 8) Devices must be baked for 1 hour at 60 5 C, if baking is required. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 10) VoCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 11) Risk of sulfurization (or tarnishing) The LED from Samsung does not use a silver-plated lead frame but if the LED is attached in silver-plated substrate, the surface color of substrate may change to black (or dark colored) when it is exposed to sulfur (S), chlorine (Cl) or other halogen compound. Sulfurization of substrate may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit, It requires caution. Due to possible sulfurization of substrate, LED should not be used and stored together with oxidizing substances made of materials such as rubber, plain paper, lead solder cream, etc. Legal and additional information. About Samsung Electronics Co., Ltd. Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at news.samsung.com. US$216.7 billion. To discover more, please visit www.samsungled.com. Copyright (c) 2015 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com