1#
Product Family Data Sheet Rev. 2.7 2018.12.12
Middle Power LED Series
Flip Chip Package
LM101A
LM101A opens up a new world of lighting design with its high output and small
form factors
Features & Benefits
Greater freedom of design with compact package size
High degree of reliability with plastic-free structure
Low thermal resistance
High efficiency providing optimized solution
Compact footprint (1.15 x 1.15 mm)
2
Table of Contents
1.
Characteristics
-----------------------
3
2.
Product Code Information
-----------------------
6
3.
Typical Characteristics Graphs
-----------------------
15
4.
Outline Drawing & Dimension
-----------------------
18
5.
Reliability Test Items & Conditions
-----------------------
20
6.
Soldering Conditions
-----------------------
21
7.
Tape & Reel
-----------------------
22
8.
Label Structure
-----------------------
24
9.
Packing Structure
-----------------------
25
10.
Precautions in Handling & Use
-----------------------
27
3
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Condition
Operating Temperature
Ta
-40 ~ +85
-
Storage Temperature
Tstg
-40 ~ +120
-
LED Junction Temperature
Tj
125
-
Forward Current
IF
450
-
Assembly Process Temperature
-
260
<10
-
ESD (HBM)
-
±2
-
Note: It is recommended minimum current 10mA in order to avoid un-even brightness, and may vary depending on circuit
configuration.
4
b) Electro-optical Characteristics (IF = 150 mA, Ts = 85 ºC)
Item
Unit
Rank
Bin
Min.
Typ.
Max.
Forward Voltage (VF)
V
6E
6A
2.7
-
2.9
AE
2.9
-
3.1
Reverse Voltage
(@ -10 μA)
V
-10.0
-
-
Color Rendering Index (Ra)
-
8
80
-
-
Special CRI (R9)
-
0
-
-
Thermal Resistance
(junction to chip point)
K/W
-
2
-
Beam Angle
º
-
150
-
Note: Samsung maintains measurement tolerance of : Forward voltage = ±0.1 V, Luminous flux = ±5 %, CRI = ±3, R9 = ±6.5
5
c) Luminous Flux Characteristics (IF = 150 mA, Ts = 85 ºC)
Note:
1) The LM101A is tested in pulsed condition at rated test current (10 ms pulse width)
2) Calculated flux values are for reference only
3) Samsung maintains measurement tolerance of: luminous flux = ±5 %
Item
CRI
Nominal
CCT (K)
SY
SZ
SA
SB
SC
SD
SE
SF
SG
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
35
39
39
43
43
47
47
51
51
55
55
59
59
63
63
67
67
71
Luminous
Flux (Φv)
70
3000
3500
4000
5000
5700
6500
80
2700
3000
3500
4000
5000
5700
6500
90
2700
3000
3500
6
2. Product Code Information (IF = 150 mA, Ts = 85 ºC)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
S
C
P
8
W
T
7
8
H
P
L
1
W
L
S
0
6
E
Digit
PKG Information
Code
Specification
1 2 3
Samsung Chip
SCP
4
CRI
7
Min. 70
8
Min. 80
9
Min. 90
5
CCT (K)
W
2700
V
3000
U
3500
T
4000
R
5000
Q
5700
P
6500
6
Chip Shape
T
Square
7 8 9
Chip Size (μm)
78H
780x780x170μm
10 11 12
Product Purpose
PL1
PoC for Lighting
13
CCT (K)
W
2700K
V
3000K
U
3500K
T
4000K
R
5000K
Q
5700K
P
6500K
14
MacAdam Step
L
Single Bin for MacAdam 5-step
L(MacAdam 5-step Bin)
U
Single Bin for MacAdam 3-step
U(MacAdam 3-step Bin)
15 16
Luminous Flux (lm)
S0
Bin
Code:
SY, SZ, SA, SB, SC, SD, SE, SF, SG
17 18
Forward Voltage (V)
6E
2.7~3.1
Bin
Code:
6A
2.7~2.9
AE
2.9~3.1
7
a) Luminous Flux Bins (IF = 150 mA, Ts = 85 ºC)
CRI (Ra)
Min.
Nominal CCT
(K)
Product Code
Flux Bin
Flux Range
(Φv, lm)
70
3000
SCP7VT78HPL1V☆S06E
SD
55 ~ 59
SE
59 ~ 63
SF
63 ~ 67
3500
SCP7UT78HPL1U☆S06E
SD
55 ~ 59
SE
59 ~ 63
SF
63 ~ 67
4000
SCP7TT78HPL1T☆S06E
SE
59 ~ 63
SF
63 ~ 67
SG
67 ~ 71
5000
SCP7RT78HPL1R☆S06E
SE
59 ~ 63
SF
63 ~ 67
SG
67 ~ 71
5700
SCP7QT78HPL1Q☆S06E
SE
59 ~ 63
SF
63 ~ 67
SG
67 ~ 71
6500
SCP7PT78HPL1P☆S06E
SE
59 ~ 63
SF
63 ~ 67
SG
67 ~ 71
Note: “☆” can be “L” (Single bin for MacAdam 5-step), “U” (Single bin for MacAdam 3-step)
8
a) Luminous Flux Bins (IF = 150 mA, Ts = 85 ºC)
CRI (Ra)
Min.
Nominal CCT
(K)
Product Code
Flux Bin
Flux Range
(Φv, lm)
80
2700
SCP8WT78HPL1W☆S06E
SB
47 ~ 51
SC
51 ~ 55
SD
55 ~ 59
3000
SCP8VT78HPL1V☆S06E
SC
51 ~ 55
SD
55 ~ 59
SE
59 ~ 63
3500
SCP8UT78HPL1U☆S06E
SC
51 ~ 55
SD
55 ~ 59
SE
59 ~ 63
4000
SCP8TT78HPL1T☆S06E
SD
55 ~ 59
SE
59 ~ 63
SF
63 ~ 67
5000
SCP8RT78HPL1R☆S06E
SD
55 ~ 59
SE
59 ~ 63
SF
63 ~ 67
5700
SCP8QT78HPL1Q☆S06E
SC
51 ~ 55
SD
55 ~ 59
SE
59 ~ 63
6500
SCP8PT78HPL1P☆S06E
SC
51 ~ 55
SD
55 ~ 59
SE
59 ~ 63
Note: “☆” can be “L” (Single bin for MacAdam 5-step) “U” (Single bin for MacAdam 3-step)
9
a) Luminous Flux Bins (IF = 150 mA, Ts = 85 ºC)
CRI (Ra)
Min.
Nominal CCT
(K)
Product Code
Flux Bin
Flux Range
(Φv, lm)
90
2700
SCP9WT78HPL1W☆S06E
SY
35 ~ 39
SZ
39 ~ 43
SA
43 ~ 47
3000
SCP9VT78HPL1V☆S06E
SY
35 ~ 39
SZ
39 ~ 43
SA
43 ~ 47
3500
SCP9UT78HPL1U☆S06E
SZ
39 ~ 43
SA
43 ~ 47
SB
47 ~ 51
Note: “☆” can be “L” (Single bin for MacAdam 5-step), “U” (Single bin for MacAdam 3-step)
10
b) Color Bins (IF = 150 mA, Ts = 85 ºC)
CRI
Min.
Nominal CCT
(K)
Product Code
Color Rank
Chromaticity Bins
70
3000
SCP7VT78HPL1V☆S06E
VL
VL
VU
VU
3500
SCP7UT78HPL1U☆S06E
UL
UL
UU
UU
4000
SCP7TT78HPL1T☆S06E
TL
TL
TU
TU
5000
SCP7RT78HPL1R☆S06E
RL
RL
RU
RU
5700
SCP7QT78HPL1Q☆S06E
QL
QL
QU
QU
6500
SCP7PT78HPL1P☆S06E
PL
PL
PU
PU
80
2700
SCP8WT78HPL1W☆S06E
WL
WL
WU
WU
3000
SCP8VT78HPL1V☆S06E
VL
VL
VU
VU
3500
SCP8UT78HPL1U☆S06E
UL
UL
UU
UU
4000
SCP8TT78HPL1T☆S06E
TL
TL
TU
TU
5000
SCP8RT78HPL1R☆S06E
RL
RL
RU
RU
5700
SCP8QT78HPL1Q☆S06E
QL
QL
QU
QU
6500
SCP8PT78HPL1P☆S06E
PL
PL
PU
PU
90
2700
SCP9WT78HPL1W☆S06E
WL
WL
WU
WU
3000
SCP9VT78HPL1V☆S06E
VL
VL
VU
VU
3500
SCP9UT78HPL1U☆S06E
UL
UL
UU
UU
Note: “☆” can be “L” (Single bin for MacAdam 5-step), “U” (Single bin for MacAdam 3-step)
11
c) Voltage Bins (IF = 150 mA, Ts = 85 ºC)
Nominal CCT
(K)
CRI
Min.
Product Code
Voltage Rank
Voltage Bin
Voltage Range
(V)
6E
6A
2.7 ~ 2.9
AE
2.9 ~ 3.1
12
d) Chromaticity Region & Coordinates (IF = 150 mA, Ts = 85 ºC) : “L” (Single bin for MacAdam 5-step)
13
d) Chromaticity Region & Coordinates (IF = 150 mA, Ts = 85 ºC) : “U” (Single bin for MacAdam 3-step)
14
d) Chromaticity Region & Coordinates (IF = 150 mA, Ts = 85 ºC)
MacAdam
CCT
(K)
Center point
Major-axis
Minor-axis
Rotation
CIE x
CIE y
a
b
Φ
3 step
(U code)
2700
0.4578
0.4101
0.0081
0.0042
53.70
3000
0.4338
0.4030
0.0083
0.0041
53.22
3500
0.4073
0.3917
0.0093
0.0041
54.00
4000
0.3818
0.3797
0.0094
0.0040
53.72
5000
0.3447
0.3553
0.0082
0.0035
59.62
5700
0.3287
0.3417
0.0075
0.0032
59.10
6500
0.3123
0.3282
0.0067
0.0029
58.57
5 step
(L code)
2700
0.4578
0.4101
0.0135
0.0070
53.70
3000
0.4338
0.4030
0.0138
0.0068
53.22
3500
0.4073
0.3917
0.0155
0.0068
54.00
4000
0.3818
0.3797
0.0157
0.0067
53.72
5000
0.3447
0.3553
0.0137
0.0058
59.62
5700
0.3287
0.3417
0.0125
0.0053
59.10
6500
0.3123
0.3282
0.0112
0.0048
58.57
Note: Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
15
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 150 mA, Ts = 25 ºC)
CCT: 2700 K CCT: 3000 K
CCT: 4000 K CCT: 5000 K
b) Forward Current Characteristics (Ts = 25 ºC)
16
c) Temperature Characteristics (IF = 150 mA)
d) Color Shift Characteristics (Ts = 25 ºC, IF = 150 mA)
e) Derating Curve
Rth is measured after soldering of LED chip on the metal based substrate.
*metal: aluminum (refer to page 17)
17
f) Beam Angle Characteristics (IF = 150 mA)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
-90 -60 -30 030 60 90
Relative luminous intensity
Angle (˚)
Beam Angle
18
4. Outline Drawing & Dimension
1. Tolerance is ±0.10 mm
2. Do not place LEDs with pressure
Ts Point & Measurement Method:
Measure nearest point from the center of LED chip (δ) as shown below.
Distance between chip center and Ts point (δ) = 3.5 mm
Tj = Ts + Power x Thermal resistance at Ts (Rj-s)
<PCB Land>
<Chip Pad>
19
Precautions:
1) This LED chip PKG does not contain built-in ESD protection device.
2) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on
the LEDs. Do not put stress on the LEDs during heating.
3) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics
should be carefully checked before and after such repair.
4) Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED
might cause catastrophic failure of the LEDs.
20
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test
Hour / Cycle
Sample Size
MSL Test
125 ºC 24 h drying → 60 ºC, 60 % RH 120 h
→ 260 ºC 10 sec 3 cycles
1 cycle
11
Room Temperature
Life Test
25 ºC, Derated max current
1000 h
22
High Temperature
Life Test
85 ºC, Derated max current
1000 h
22
High Temperature
Humidity Life Test
85 ºC, 85 % RH, Derated max current
1000 h
22
Low Temperature
Life Test
-40 ºC, DC Derated max current
1000 h
22
Powered Temperature
Cycle Test
-45 ºC / 20 min ↔ 85 ºC / 20 min, sweep
100 min cycle on/off: each 5 min, Derated max current
100 cycles
22
Thermal Shock
-45 ºC / 15 min ↔ 125 ºC / 15 min
→ Hot plate 180 ºC
800 cycles
100
High Temperature
Storage
120 ºC
1000 h
11
Low Temperature
Storage
-40 ºC
1000 h
11
ESD (HBM)
R1: 10 ㏁
R2: 1.5 ㏀
C: 100 ㎊
V: ±2 kV
5 times
5
Vibration Test
20~2000~20 Hz, 200 m/s2, sweep 4 min
X, Y, Z 3 direction, each 1 cycle
4 cycles
11
Mechanical Shock Test
1500 g, 0.5 ms
5 cycles
11
b) Criteria for Judging the Damage
Item
Symbol
Test Condition
(Ts = 25 ºC)
Limit
Min
Max
Forward Voltage
VF
IF = Derated max current
Init. Value * 0.9
Init. Value * 1.1
Luminous Flux
Φv
IF = Derated max current
Init. Value * 0.7
Init. Value * 1.1
21
6. Soldering Conditions
a) Reflow Conditions (Pb free)
Reflow frequency: 2 times max.
b) Manual Soldering Conditions
Not more than 5 seconds @ max. 300 ºC, under soldering iron
22
7. Tape & Reel
a) Taping Dimension
(unit: mm)
Taping Direction
Anode
23
b) Reel Dimension
Notes:
1) Quantity: The quantity/reel is 4,000 pcs
2) Cumulative Tolerance: Cumulative tolerance / 10 pitches is ±0.2 mm
3) Packaging: P/N, Manufacturing data code no. and quantity are indicated on the aluminum packing bag
24
Bin Code
Product Code
Lot Number
Model
8. Label Structure
a) Label Structure
Note: Denoted product code and bin code above is only an example
Bin Code:
ⓐⓑ: Chromaticity bin (refer to page 10-14)
ⓒⓓ: Luminous Flux bin (refer to page 7-9)
ⓔⓕ: Forward Voltage bin (refer to page 11)
b) Lot Number
The lot number is composed of the following characters:
①②③④⑤⑥⑦⑧⑨ / Iⓐⓑⓒ / 4,000 pcs
①②
: Production site (G3: Shenzhen China, G4: Guangzhou China, GB: Nanchang China)
③
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
④
: Year (Y: 2014, Z: 2015, A: 2016 …)
⑤
: Month (1~9, A, B, C)
⑥
: Day (1~9, A, B~V)
⑦⑧⑨
: Product serial number (001 ~ 999)
ⓐⓑⓒ
: Reel number (001 ~ 999) or (AAA ~ ZZZ)
SCP8WT78HPL1WLS06E WLSC6A
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑧⑨
/Iⓐⓑⓒ/ 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
WLSC6A
SCP8WT78HPL1WLS06E WLSC6A
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑧⑨
/Iⓐⓑⓒ/ 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
WLSC6A
LM101A [CRI] [CCT]
LM101A [CRI] [CCT]
25
9. Packing Structure
a) Packing Process
Material: Paper (SW3B(A))
Type
Size (mm)
Note
L
W
H
7 inch
295 ± 5
290 ± 5
260 ± 5
Up to 7 reels
max.
CHIP LED
①
H
W
L
Aluminum Vinyl Bag
Reel
① Side Label
Outer Box
WLSC6A
SCP8WT78HPL1WLS06E WLSC6A
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑧⑨/Iⓐⓑⓒ/ 28,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SCP8WT78HPL1WLS06E WLSC6A
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑧⑨
/Iⓐⓑⓒ/ 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
WLSC6A
LM101A [CRI] [CCT]
LM101A [CRI] [CCT]
26
b) Aluminum Vinyl Packing Bag
c) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Bag
SCP8WT78HPL1WLS06E WLSC6A
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑧⑨
/Iⓐⓑⓒ
/ 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
WLSC6A
LM101A [CRI] [CCT]
27
10. Precautions in Handling & Use
1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current
caused by slight shift of the voltage.
2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA
is recommended to use.
3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature.
4) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed by a sealed container with nitrogen gas injected (shelf life of sealed bags: 12
months, temperature ~40 ºC, ~90 % RH).
5) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
6) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
7) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
8) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause
damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase
in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
10) VoCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of
encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output)
from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of
materials used in luminaires and they must be carefully selected.
11) Risk of sulfurization (or tarnishing)
The LED from Samsung does not use a silver-plated lead frame but if the LED is attached in silver-plated substrate, the
surface color of substrate may change to black (or dark colored) when it is exposed to sulfur (S), chlorine (Cl) or other
halogen compound. Sulfurization of substrate may cause intensity degradation, change of chromaticity coordinates and,
in extreme cases, open circuit, It requires caution. Due to possible sulfurization of substrate, LED should not be used and
stored together with oxidizing substances made of materials such as rubber, plain paper, lead solder cream, etc.
Legal and additional information.
About Samsung Electronics Co., Ltd.
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Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand, product,
service names and logos are trademarks and/or registered trademarks of their
respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
www.samsungled.com