MIL SPECS WHE D MM 0000125 0034274 SST MMILS TT | INCH~POUND | Le MIL-S-19500/478E 25 October 1993 SUPERSEDING ~ MIL-S-19500/478D , 20 May 1992 The documentation and process conversion measures necessary to comply with this revision shatl be completed by 25 February 1994 ee" MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, POWER RECTIFIER, FAST RECOVERY TYPES 1N5812, 1N5814, 1N5816, AND R VERSIONS JAN, JANTX, JANTXV, JANC, AND JANS This specification is approved for use by all Depart- ments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for silicon, fast recovery power rectifier diodes. Four levels of product assurance are provided for each device type as specified in MIL-S-19500. One product assurance level is provided for die. 1.2 Physical dimensions. See 3.3 (00-4) 1.3 Maximum ratings. | | | | | | | Types | VR | VRWM | Io 1/ | IFSM | trr | | | | |Tc = +700C | Te = +100C | | | | | | | tp= 8.3 ms | | | | | | | | | | | | | | | | | | Vide | V_(pk) | A_dc | Adc | ns | | | | | | | | 1N5812, R | 50. | 50 | 20 | 400 | 35] | | | | | | | | 1N5814, R | 100 | 100 | 20 | 400 | 35 | | | | | | | | | 1N5816, R | 150 | 150 | 20 | 400 | 35 | | | | | | | i 1/ Derate linearly, 250 mA/C from +100C to +150C, and 300 mA/C above +150C. Storage temperature: TsTg = -65C to +175C. Operating temperature: Ty = -65C to +175C. Barometric pressure reduced (altitude operation): 8 mmHg. ResC = 1.5C/W maximum. i ] [Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be | jof use in improving this document should be addressed to: Commander, Defense Electronics Supply | [Center, ATTN: DESC-ECT, 1507 Wilmington Pike, Dayton, OH 45444-5270 by using the Standardization | [Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. | { i AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.MIL NOTES: ON OU EW SPECS WHE F Mm pon0tesS O934e75 4ab MEMNILS MIL~S-19500/478E 003 110.08) {SEE NOTE 3) [O06 }(0 15) (SEE NOTE 3) ED PITCH cine-4l gt eles ay rye ff F ~~ DD TERM 2 Ny re- Go (SEE NOTE 5) |. ee N CATHODE (SEE NOTE @} MS SEATING PLANE itr Dimensions Notes Inches Millimeters Min Max Min Max c .250 6.35 4 C4 .018 .065 0.46 4.65 oD .265 426 6.74 10.76 E 424 437 10.77 17.10 E1 .075 175 1.91 4.44 E2 .060 .175 1.53 4.44 6 G . 300 - 405 7.62 10.28 G4 .600 -800 15.42 20.32 am . 163 - 189 4.14 4.80 N 422 -453 10.72 11.50 N4 -078 1.98 7 aT . 066 -103 1.68 2.62 Dimensions are in inches. Metric equivalents are given for general information only. Metric equivalents are in parentheses. Angular orientation and contour of this terminal is undefined. Pitch diameter .190-32 UNF-2A (coated) - .1697 (4.310 mm). Chamfer or undercut on one or both ends of the, hexagonal portions is optional. Length of incomplete or undercut threads of oM . Anode for R suffix devices. FIGURE 1. Physical dimensions (DO-4).MIL SPECS UE D MM 0000125 003427b 322 MMILS NIL-S-19900/478E a (A-version) | | | | Dimensions L | Ltr | | | ' | Inches | Millimeters 1 | | | | | | | Min | Max | Min | Max | | | | | | LA | -130 | 133. | 3.30 | 3.3? i | | | | | | |B | 2114 | 117 1 2.89 | 2.97 L | | | { [ | 009 | .010 | 0.228 | 0.254 | NOTES: 4. Or mensions are in inches. 2. Metric equivalents are given for general information only. 3. The physical characteristics of the die are: Metallization {front (anode), back (cathade)} consists of: Ag thickness = 3,000 A minimum, NI thickness = 1,500 A minimum, Cr thickness = 800 A minimum 4. Requirements in accordance with MIL-S-15000 (appendix H) are performed in a 00-4 package (see 6.5). FIGURE 2. Physical dimensions JANC die dimensions (A-version).MIL SPECS UE D M@ 0000125 0034277 269 MENILS NOTES: MIL -S -19500/478t || nn ni - B (B-version) | | | l Dimensions { Ltr | | | i i Inches | Millimeters | | | | Min | Max | Min | Max ' | | | | | LA l .130 | -143 | 3.30 | 3.37 l | | | | | | 1B | .194 | .133- | 2.89 | 2.97} | | | | | | L. | .009 | -010 | 0.228 | 0.254 | Dimensions are in inches. Metric equivalents are given for general information only. The physical characteristics of the die are: Metailization {front (anode), back (cathode)} consists of: Aq thickness = 3,000 A minimum, NI thickness = 1,500 A minimum, Cr thickness = 800 A minimum, Optionally Ti thickness = 300 A minimum. Requirements in accordance with MIL-S-15000 (appendix H) are performed in a DO-4 package (see 6.5). FIGURE 3. Physical dimensions JANC die dimensions (B-version).MIL SPECS WUE D MM 0000125 0034278 175 MMMILS MIL-S-19500/478E 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those Listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 - Semiconductor Devices, General Specification for. STANDARD FEDERAL FED-STD-H28 - Screw-thread Standards for Federal Services. MILITARY MIL-STD-750 ~- Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Building 4D, 700 Robkins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable Laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Detail specification. The individual item requirements shall be in accordance with MIL-S-19500 and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shail be as specified in MIL-S-19500. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-S-19500 and on figure 1 (DO-4) and figures 2 and 3 (JANC) herein, With approval of the qualifying activity, this device is authorized to contain organic material for JANS as specified in MIL-S-19500. 3.3.1. Lead formation and finish. Lead finish shall be solderable in accordance with MIL~$-19500, MIL-STD-750, and as specified herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). 3.3.2 Polarity. The polarity shall be indicated by a graphic symbol with the arrow pointing toward the cathode end. The reversed units shall also be marked with an R following the Last digit in the type number. 3.4 Marking. Marking shall be in accordance with MIL-S-19500. At the option of the manufacturer, the following marking may be omitted from the body of the diode: a. Country of origin. b. Manufacturer's identification.MIL SPECS GUE D MM 0000125 0034279 O31 MEMILS MIL-S-19500/478E 4. QUALITY ASSURANCE PROVISIONS 4.1 sampling and inspection. Sampling and inspection shatl be 1n accordance with MIL-S-19500, and as specified herein. 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19500, and as specified in group E herein. Tests in either polarity shall -be sufficient to obtain qualification approval of both polarities. 4.2.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-S-19500, and table II herein. 4.3 Screening CJANS, JANTX, and JANTXV Levels only). Screening shall be in accordance with table II of MIL-S-19500, and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. | | | | Screen (see table II | Measurement | | of MIL-S-19500) | | | | | JANS Level | JANTX and JANTXV Levels | | | | | Vv |Surge, see 4.3.2 Surge, see 4.3.2 | | [Thermal impedance, see 4.3.3 [Thermal impedance, see 4.3.3 | | | | | 4 |Not applicable INot applicable | | | | | | | 9 2/ |VF2 and Ip4 Not applicable | | | | | |MIL-STD-750, method 1038, | | | 10 [test condition A; t = 96 hours Not_applicable | | | | | 11 2/ |Subgroup 2 of table I herein; | | |VF2 and IR4 [VF2 and Ir1 | | |AVe2 s +0.05 V (pk) | | [AIR] $ +2.5 pA (de) or +100 percent of | | Linitial value, whichever is greater. | | |Burn-in, see 4.3.4, | | | 12 |MIL-STD-750, method 1038, Burn-in, see 4.3.4 | | |test condition A | | | | | 13 |Subgroups 2 and 3 of table I herein; Subgroup 2 of table I herein; | | | AVe2 = +0.05 V (pk) | AVe2 = +0.05 V (pk) | | | Alrg1 = 2.5 yA de or 100 percent of | Allegis 2.5 pA de or #100 { | | initial value, whichever is greater. [| percent of initial value, { | [| whichever is greater. f 1/ Surge shall precede thermal response. These tests shall be performed anytime after screen 3 and before screen 10. / 1Ig1 measurement shall not be indicative of an open condition. / Thermal impedance need not be repeated. 4.3.1 Screening JANC. Screening shall be in accordance with MIL-S-19500 (appendix H). As a minimum, die shall be 100 percent probed per Table I, subgroup 2 herein for Ip4 and V(gR)1 only. Ve1 and V2 shall be performed on a sample of 10 pieces mounted on a 00-4 (or equivalent) package. 4.3.2 Surge current. Surge current, see MIL-STD-750, method 4066. Trsm = 400 A, 6 surges, tp = 8.3 ms or rectangular pulse of equivalent Irms,3 surges. Io 0 A, Vays 2 0 V, duty factor 1 percent minimum Ta = +25C.MIL SPECS WUE D MM O0001e5 O034e60 853 MANILS MIL-S-19500/478E 4.3.3 Thermal impedance Zojx measurements for screening. The ZoJjx measurements shall be performed in accordance with MIL-STD-750, method 3101. The maximum Limit (not to exceed the group A, subgroup 2 Limit) for Zoyx tf screening (table IL of MIL-S-19500) shall be derived by each vendor by means of statistical process control. When the process has exhibited control and capability, the capability data shall be used to establish the fixed screening Limit. In addition to screening, once a fixed Limit has been established, monitor all future sealing lots using a random five piece sample from each lot to be plotted on the applicable X, R chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the Line and held for Engineering evaluation and disposition. 4.3.4 Burn-in. Burn-in conditions for all quality levels are as follows: MIL-STD-750, method 1038, test condition A; Tc = +125C; Vr= 0.8 to 0.85 rated Va de (see 1.3), t = 48 hours. 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-19500. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500 and table I herein. The following test conditions shall be used for ZeJx,group A inspection: a. Ip2 rated Io b. tH = 250 ms c. 10 mA s Im s 100 mA d. tup= 250 ws (maximum) 4.4.2 Group B inspection. Group 8 inspection shall be conducted in accordance with the conditions specified for subgroup testing in table IVa (JANS) and table IVb (JAN, JANTX and JANTXV) of MIL-S-19500, and as follows. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps and footnotes of table III herein. 4.4.2.1 Group B inspection, table [Va (JANS) of MIL-S-19500. Subgroup Method Condition B3 4066 Te = +100C; to < 8.3 ms; Va= rated Vp (see 1.3) six 1/120 s surges; 1 surge/minute maximum. Ifsm = 400 A dc, Ig = 20 A de B4 1037 2,000 cycles, 25 percent rated Ig < Io applied < rated Io (see 4.5.2). B5 1027 If = 20 A Avg at Ta= +125C, for 340 hours, or adjusted as required by the chosen Ta to give an average lot Ty = +175C; f = 60 Hz Vp = VRwm (pk) (see 1.3). B6 4081 or Rojc = 1.5C/W; tH 2 20 seconds; heating current (Iq) 2 rated 310110; tup <= 250 ys; measurement current 10 mA s IMs 100 mA. 87 1018 10 devices, c = 0. 4.4.2.2 Group B inspection, table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500. Subgroup Method Condition B2 4066 Tc = +100C; to < 8.3 ms; VR = rated VR (see 1.3) six 1/120 s surges; 1 surge/minute maximum. Ipsy = 400 A dc, Ig = 20 A de B3 1036 Ip > 0.25 Ig (see 4.5.2) 2000 cycles B5 Not applicable. 86 1032 Te = +175C.MIL SPECS WHE D MM 0000125 00354281 79T MMILS MIL-S~19500/478E 4.4.3 Group inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500, and as follows. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table III herein. Subgroup Method Condition C2 2036 Terminal strength: Test condition A; weight = 10 pounds; t = 15 s. Bending stress: Test condition F, method 8; weight = 3 pounds; t = 15 s, Lead torque: Test condition 01; torque = 10 ounce-inches; t = 15 s. Stud torque: Test condition 02; torque = 10 pound-inches; t = 15 s. c3 2016 500 G's c6 1036 Ip > 0.25 Ip (see 4.5.2); 6,000 cycles 4.5 Methods of inspection. Methods of inspection shalt be as specified in the appropriate tables and as follows. 4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. 4.5.2 OC intermittent operation Life. A cycle shall consist of an "on" period, when forward current is applied suddenly, not gradually, to the device for the time necessary to achieve an increase (delta) case temperature of +85C +15C, -5C followed by an "off" period, when the current is suddenly removed for cooling, the case through a similar delta temperature. Auxiliary (forced) cooling is permitted during the "off" period only. Forward current and/or on time, within specific limits, and "off" time may be adjusted to achieve the delta case temperature. Heat sinks shail only be used if and to the degree necessary to maintain test samples within the desired delta temperature tolerance. The heating time shall be such that 30 s < theating < 180 s. The forward current may be steady-state dc, full-wave rectified dc, or the equivalent halt-sine wave dc, of the specified value. The test duration shall be the specified number of cycles. Within the time interval of 50 cycles before and 500 cycles after the termination of the test, the sample units shall be removed from the specified test conditions and allowed to reach room ambient conditions. Specified end-point measurements for qualification and quality conformance inspections shall be completed within 96 hours after removal of sample units from the specified test conditions. Additional readings may be taken at the discretion of the manufacturer. 4.5.3 Reverse recovery time. The reverse recovery time shall be measured in the circuit of figure 4 or equivalent. Care should be exercised to minimize stray inductances in the test circuit and to ensure that the total resistance of the reverse current loop can be adjusted sufficiently low that more than 1 ampere will flow if not blocked by the diode being tested. The circuit and the pulsed reverse voltage source shall be adjusted to achieve the following characteristics of the waveform. a. The di/dt shall be the specified value between the forward 0.5 ampere point and the reverse 0.2 ampere point. b. The peak reverse current, Ip shall be adjusted to 1.0 ampere prior to measuring the device. The reverse-recovery time shalt then be determined from the current waveform as shown on figure 5.MIL SPECS 44E D MM 0000125 0034282 beb MENILS MIL-S-19500/478E TABLE I. Group A inspection. | | | | | | Inspection 1/ | MIL-STD-750 | Symbol | Limits | Unit | 5 | | | | | | | [Method | Conditions | [| Min | Max | | | | | | | | Subgroup 1 | ! | | ! | \Visual and mechanical | 2071 | | | | | | examination | | | | | | | | | | | | | jp emez | Lt td |Thermal 1m 2dance | 3101 |See 4.4.1 | ZeJX | J7.35 [C/W | | | | | | | | Forward voltage | 4011 [tp < 8.3 ms, duty cycle < 2 | | | | | | [percent pulse | | | | | | [Ip = 10 A (pk) \Ve1- | | .860 |V de | | [Ip = 20 A (pk) |Ve2 | | .950 |V tpk> | | | | | | }Reverse current | 4016 |DC method {IR1 | | 10 {yA de | | [VR = rated Vp (see 1.3) | | | | | | | | | | | |Breakdown voltage | 4021 |Ip= 100 pA de |VCBR)1 | | | | | | | | | | | 1N5812, 1N5812R | | | | 60 | |V de | 1N5814, 1N5814R | | | {| 110 | |V de | 1N5816, 1N5816R | | | | 160 | |v de | | | | | | | | Manes fo | en {High temperature | [Tc = +100C | | | | | operation | | | | | | | | | | | | | Reverse current | 4016 |DC method, Vp= rated Vp | Ire | | 1.00 {mA de | | |(see 1.3) | | I | | | | | | | Forward voltage | 4011 [Ipm = 10 A (pk), duty cycle |VF3 | | .780 jV (pk) | | |< 2 percent (pulsed); | | | | | | [tp < 8.3 ms | | | | | | | | | |Low temperature | |Ta = -65C | | | | operation | | | | | | | | | | | | | | Forward voltage | 4017 |Ipm = 10 A (pk), duty cycle Veg | | 1.05 [ (pk) | | |< 2 percent (pulsed); | | | | wait ae |Sreakdown voltage | 4021 [IR = 100 yA de IV(BRI2 | | | | | | | | | | | 1N5812, 1NS5812R i | | | 50 | |v de | 1N5814, 1NS814R | | | | 100 | lV de | 1NS816, 1N5816R | | | | 150 | lv de | | | | | | | See footnote at end of table.MIL SPECS HOE D MM O0001e5 0034283 Sbe MBNILS MIL-S-19500/478E TABLE I. Group A inspection - Continued. | | | | | | | Inspection 1/ | MIL-STD-750 | Symbol | Limits | Unit | | | | | | | | | [Method | Conditions | | Min | Max | | | Subgroup 4 | | | | | | : | | | |Reverse recovery time | 4031 |Test condition B4& [ter | | 35 Ins | | | [Ip = IR= 1 A de (pk) | | | | | | | [IREc)= 0.1 A; di/dt = | | | | | | {85 A/us minimum; (see 4.5.3) | | | | | | | | | | | Junction capacitance | 4001 [Vp= 10 V, f = 1 MHz [Cy | {| 300 = |pF | | | IVsig = 50 mV (p-p) maximum | | | | | | | | | | | | | |Forward recovery | 4026 |tp> 20 ns, tr = 8 ns; IVER | J 2.2 |V (pk) | voltage | jig = 1,000 ma | | | | | | | | | | | | | |Forward recovery time | 4026 |Iig= 1,000 ma [tfr | | 15 [ns | | | | | | | | | | Subgroups 5, 6, and 7 | | | i | | | | | | | | | | | {Not applicable [ | | | I | l 1/ For sampling plan, see MIL-S~19500. TABLE II. Group E inspection (atl quality levels) for qualification only. | | | [| | | Inspection | MIL-STD~750 |Qualification | | | | | conformance | | [Method | Conditions Linspection (LTPD) | | Subgroup 1 | | | 10 | | | | | | {Thermal shock (glass strain) | 1056 |OC to +100C, 100 cycle | | | | | | | {Electrical measurements | {See table III, steps 1, 2, and 3. | | | | | | | Subgroup 2 | | | 5 | | | | | |Steady-state dc blocking | 1038 |Test condition A, except in | | | life | Jaccordance with 4.3.4; | | | | {1,000 hours. | | | | | | | jElectrical measurements | |See table L1I, steps 1 and 2. | | | | | | | Subgroup 3 | | | | | | | | | [Not applicable | | | | | | | | | | Subgroup 4 | | | 10 | | | | | | |Thermal resistance | 3101) [Rese = 1.5C/W maximum; | | | jor 4081 [IH = rated Io; tH > 20 seconds | | | [Im between 10 mA and 100 mA | | | [tuo < 250 ys; | | | | | | | Subgroup 5 | | | | | | | | | [Not applicable L | L | 10MIL SPECS HUE D Mm Foon Be passeae UTS MMMILS MIL-S-19500/478E TABLE III. Groups A, 8, and C electrical end-point inspection measurements. | MIL-STD-750 Method | Conditions Step Inspection | | | | | | | | | | | | Forward voltage | 4011 |Ip = 10 A (pk) | | |pulsed; tp < 8.3 ms | | |duty cycle = 2 | | [percent maximum | | | | | 4016 |DC method | | |VR= rated VR | | | (see 1.3) | | | | | | | 2. |Reverse current | : 3101 |See 4.4.1 | 1/ The electrical measurements for table IVa (JANS) of MIL-S-19500 are as follows: 3. |Thermal impedance | + } | | | 1 | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Subgroups 3, 4, and 5, see table III herein, steps 1, 2, and 3. 2/ The electrical measurements for table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500 are as follows: a. Subgroup 2, see table III herein, steps 1, 2, and 3. b. Subgroups 3 and 6, see table III herein, steps 1 and 2. 3/ The electrical measurements for table V of MIL-S-19500 are as follows: Subgroups 2, 3, and 6, see table III herein, steps 1 and 2. 11MIL SPECS W4E D M@ 0000305 0034285 335 MENILS MIL-S-19500/478E SYNC PULSE TO INTERRUPT } I DURING REVERSE PULSE 4 . \ | HT 002 uF (4) VWiyta CONSTANT CURRENT PULSE SUPPLY FOR GENERATOR (SEE NOTE 2) Ig FOR Ip: ni Z gut LOM Zhyt FAST ty CVR t+} OSCILLOSCOPE (+) (SEE (SEE NOTE 11 NOTE 3) NOTES: 1. Oscilloscope: Rise time < 3 ns; input imped ance = 50 ohms minimum. 2. Pulse generator: Rise time < 8 ns; source impedance 50 ohms maximum. (Tektronix 109, or equal). 3. Current viewing resistor: Noninductive coaxial type with resistance matched to pulse generator impedance. A 50-ohm, 40 ns charge line may be used. FIGURE 4. Reverse recovery time test circuit. SET TI FOR 5 ME BASE ns/cm FIGURE 5. Reverse recovery time characteristic waveform. 12MIL SPECS WHE D MM 0000125 0034286 271 MEMILS MIL-S-19500/478E 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-S-19500. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents must specify the following: a. Title, number, and date of the specification. b. Issue of DODISS to be cited in the solicitation, and if required, the specific issue of individual documents referenced (see 2.1.1 and 2.2). c. Lead finish (see 3.3.1). d. Type number and quality (JAN) level. 6.3 Substitution information. Devices covered by this specification are substitutable for the manufacturer's and user's Part or Identifying Number (PIN). This information in no way implies that manufacturer's PIN's are suitable as a substitute for the military PIN. 6.5 Suppliers of JANC die. The qualified JANC suppliers with the applicable letter version (example JANCAINS812) will be identified on the QPL. | JANC ordering information | | | PIN |__Manufacturer | | | | | | 59377 11961. | | | | 1N5812 | A1NS812 | BINS812 | | 1N5814 | AINS814 | BINS814 | [.1N5816 | A1N5816 | B1N5816 L 6.4 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Custodians: Preparing activity: Army - ER Navy - EC Navy - EC Air Force - 17 Agent: NASA - NA DLA - ES Review activities: (Project 5961-1546) Army - AR, MI, SM Navy - AS, CG, MC Air Force - 19, 85, 99 DLA - ES 13