TFA9890 9.5 V boosted audio system with adaptive sound maximizer and speaker protection Rev. 01 -- 17 May 2013 Preliminary short data sheet 1. General description The TFA9890 is a high efficiency class-D audio amplifier with a sophisticated speaker boost and protection algorithm. It can deliver 7.2 W peak output power into an 8 speaker at a supply voltage of 3.6 V. The internal boost converter raises the supply voltage to 9.5 V, providing ample headroom for major improvements in sound quality. A safe working environment is provided for the speaker under all operating conditions. The TFA9890 maximizes acoustic output while ensuring diaphragm displacement and voice coil temperature do not exceed their rated limits. This function is based on a speaker box model that operates in all loudspeaker environments (e.g. free air, closed box or vented box). Furthermore, advanced signal processing ensures the quality of the audio signal is never degraded by unwanted clipping or distortion in the amplifier or speaker. Unlike competing solutions, the adaptive sound maximizer algorithm uses feedback to accurately calculate both the temperature and the excursion, allowing the TFA9890 to adapt to changes in the acoustic environment. Internal intelligent DC-to-DC conversion boosts the supply rail to provide additional headroom and power output. The supply voltage is only raised when necessary. This maximizes the output power of the class-D audio amplifier while limiting quiescent power consumption. The TFA9890 also incorporates advanced battery protection. By limiting the supply current when the battery voltage is low, it prevents the audio system from drawing excessive load currents from the battery, which could cause a system undervoltage. The advanced processor minimizes the impact of a falling battery voltage on the audio quality by preventing distortion as the battery discharges. The device features low RF susceptibility because it has a digital input interface that is insensitive to clock jitter. The second order closed loop architecture used in a class-D audio amplifier provides excellent audio performance and high supply voltage ripple rejection. The audio input interface is I2S and the control settings are communicated via an I2C-bus interface. The device also provides the speaker with robust protection against ESD damage. In a typical application, no additional components are needed to withstand a 15 kV discharge on the speaker. The TFA9890 is available in a 49-bump WLCSP (Wafer Level Chip-Size Package) with a 400 m pitch. TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 2. Features and benefits Sophisticated speaker-boost and protection algorithm that maximizes speaker performance while protecting the speaker: Fully embedded software, no additional license fee or porting required Total integrated solution that includes DSP, amplifier, DC-to-DC, sensing and more Adaptive excursion control - guarantees that the speaker membrane excursion never exceeds its rated limit Real-time temperature protection - direct measurement ensures that voice coil temperature never exceeds its rated limit Environmentally aware - automatically adapts speaker parameters to acoustic and thermal changes including compensation for speaker-box leakage Output power: 3.6 W (RMS) into 8 at 3.6 V supply voltage (THD = 1 %) Clip avoidance - DSP algorithm prevents clipping even with sagging supply voltage Bandwidth extension option to increase low frequency response Compatible with standard Acoustic Echo Cancellers (AECs) High efficiency and low power dissipation Wide supply voltage range (fully operational from 3 V to 5.5 V) Two I2S inputs to support two audio sources I2C-bus control interface (400 kHz) Dedicated speech mode with speech activity detector Speaker current and voltage monitoring (via the I2S-bus) for Acoustic Echo Cancellation (AEC) at the host Fully short-circuit proof across the load and to the supply lines Sample frequencies from 8 kHz to 48 kHz supported 3 bit clock/word select ratios supported (32x, 48x, 64x) Option to route I2S input direct to I2S output to allow a second I2S output slave device to be used in combination with the TFA9890 TDM interface supported (with limited functionality) Volume control Low RF susceptibility Input clock jitter insensitive interface Thermally protected 15 kV system-level ESD protection without external components `Pop noise' free at all mode transitions 3. Applications TFA9890_SDS Preliminary short data sheet Mobile phones Tablets Portable Navigation Devices (PND) Notebooks/Netbooks MP3 players and portable media players Small audio systems All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 2 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VBAT battery supply voltage on pin VBAT 3 - 5.5 V VDDD digital supply voltage on pin VDDD 1.65 1.8 1.95 V IBAT battery supply current on pin VBAT and in DC-to-DC converter coil; Operating modes with load; DC-to-DC converter in Adaptive Boost mode (no output signal, VBAT = 3.6 V, VDDD = 1.8 V) - 4 - mA Power-down mode - 1 - A IDDD digital supply current on pin VDDD; Operating modes; SpeakerBoost Protection activated - 20 - mA on pin VDDD; Operating modes; CoolFlux DSP bypassed - 6 - mA on pin VDDD; Power-down mode; BCK1 = WS1 = DATAI1 = BCK2 = WS2 = DATAI2 = DATAI3 = 0 V - 10 - A RL = 8 ; fs = 48 kHz - 3.6 - W RL = 8 ; fs = 32 kHz - 3.7 - W RMS output power Po(RMS) THD+N = 1 %; CLIP = 0 5. Ordering information Table 2. Ordering information Type number TFA9890UK Package Name Description Version WLCSP49 wafer level chip-size package; 49 bumps TFA9890UK TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 3 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 6. Block diagram VDDD ADS1 ADS2 VBAT INB G3 F2 F3 G2 E6, F6, G6 TFA9890 SCL G1 SDA F1 ADAPTIVE DC-to-DC CONVERTER RAM/ROM MEMORY I2C INTERFACE DATAI3 B3 E7, F7, G7 BST E5, F5, G5 GNDB A7, B7, C7 VDDP C6 OUTA A6 OUTB B5, B6 GNDP A5, B2, C2, C5, D2, D5, E2, F4, G4 GNDD REGISTERS DATAI1 A2 WS1 A1 I2S INPUT INTERFACE (x2) BCK1 B1 DATAI2 C1 M U X SPEAKER PROTECTION ALGORITHM AND VOLUME CONTOL (CoolFlux DSP) PWM CLASS-D AUDIO AMPLIFIER WS2 D1 BCK2 E1 ISEL DATAO A3 I2S OUTPUT INTERFACE M U X current sensing CURRENTSENSING PROCESSOR ADC I2SDOC TEMP SENSE RST B4 PROTECTION: OTP OVP UVP OCP IDP PLL VBAT SENSE Fig 1. A4 E3 D3 C3 C4 D4 E4 INT TEST2 TEST3 TEST4 TEST5 TEST6 TEST7 010aaa816 Block diagram TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 4 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 7. Pinning information 7.1 Pinning 1 2 3 4 5 6 bump A1 index area 7 G 2 3 4 5 6 7 A F B E C D D C E B F A G bump A1 index area 010aaa782 010aaa783 a. Bottom view Fig 2. 1 b. Transparent top view Bump configuration 1 2 3 4 5 6 7 A WS1 DATAI1 DATAO INT GNDD OUTB VDDP B BCK1 GNDD DATAI3 RST GNDP GNDP VDDP C DATAI2 GNDD TEST4 TEST5 GNDD OUTA VDDP D WS2 GNDD TEST3 TEST6 GNDD n.c. n.c. E BCK2 GNDD TEST2 TEST7 GNDB INB BST F SDA ADS1 ADS2 GNDD GNDB INB BST G SCL VBAT VDDD GNDD GNDB INB BST 010aaa807 Transparent top view Fig 3. TFA9890_SDS Preliminary short data sheet Bump mapping All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 5 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection Table 3. Pinning Symbol Pin Type Description WS1 A1 I digital audio word select input 1 DATAI1 A2 I digital audio data input 1 DATAO A3 O digital audio data output INT A4 O interrupt output GNDD A5 P digital ground OUTB A6 O inverting output VDDP A7 P power supply voltage BCK1 B1 I digital audio bit clock input 1 GNDD B2 P digital ground DATAI3 B3 I digital audio data input 3 RST B4 I reset input GNDP B5 P power ground GNDP B6 P power ground VDDP B7 P power supply voltage DATAI2 C1 I digital audio data input 2 GNDD C2 P digital ground TEST4 C3 O test signal input 4; for test purposes only, connect to PCB ground TEST5 C4 O test signal input 5; for test purposes only, connect to PCB ground GNDD C5 P digital ground OUTA C6 O non-inverting output VDDP C7 P power supply voltage WS2 D1 I digital audio word select input 2 GNDD D2 P digital ground TEST3 D3 O test signal input 3; for test purposes only, connect to PCB ground TEST6 D4 O test signal input 6; for test purposes only, connect to PCB ground GNDD D5 P digital ground n.c. D6 - not connected[1] n.c. D7 - not connected[1] BCK2 E1 I digital audio bit clock input 2 GNDD E2 P digital ground TEST2 E3 O test signal input 2; for test purposes only, connect to PCB ground TEST7 E4 O test signal input 7; for test purposes only, connect to PCB ground GNDB E5 P boosted ground INB E6 P DC-to-DC boost converter input BST E7 O boosted supply voltage output SDA F1 I/O I2C-bus data input/output ADS1 F2 I address select input 1 ADS2 F3 I address select input 2 GNDD F4 P digital ground GNDB F5 P boosted ground INB F6 P DC-to-DC boost converter input TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 6 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection Table 3. Pinning ...continued Symbol Pin Type Description BST F7 O boosted supply voltage output SCL G1 I I2C-bus clock input VBAT G2 P battery supply voltage sense input VDDD G3 P digital supply voltage GNDD G4 P digital ground GNDB G5 P boosted ground INB G6 P DC-to-DC boost converter input BST G7 O boosted supply voltage output [1] TFA9890_SDS Preliminary short data sheet Can be used to simplify routing to OUTA (see Figure 3). All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 7 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 8. Functional description The TFA9890 is a highly efficient mono Bridge Tied Load (BTL) class-D audio amplifier with a sophisticated SpeakerBoost protection algorithm. Figure 1 is a block diagram of the TFA9890. It contains three I2S input interfaces and one I2S output interface. One of I2S inputs DATAI1 and DATAI2 can be selected as the audio input stream. The third I2S input, DATAI3, is provided to support stereo applications. A `pass-through' option allows one of the I2S input interfaces to be connected directly to the I2S output. The pass-through option is provided to allow an I2S output slave device (e.g. a CODEC), connected in parallel with the TFA9890, to be routed directly to the audio host via the I2S output. The I2S output signal on DATAO can be configured to transmit the DSP output signal, amplifier output current information, DATAI3 Left or Right signal information or amplifier gain information. The gain information can be used to facilitate communication between two devices in stereo applications. A SpeakerBoost protection algorithm, running on a CoolFlux Digital Signal Processor (DSP) core, maximizes the acoustical output of the speaker while limiting membrane excursion and voice coil temperature to a safe level. The mechanical protection implemented guarantees that speaker membrane excursion never exceeds its rated limit, to an accuracy of 10 %. Thermal protection guarantees that the voice coil temperature never exceeds its rated limit, to an accuracy of 10 C. Furthermore, advanced signal processing ensures the audio quality remains acceptable at all times. The protection algorithm implements an adaptive loudspeaker model that is used to predict the extent of membrane excursion. The model is continuously updated to ensure that the protection scheme remains effective even when speaker parameter values change or the acoustic enclosure is modified. Output sound pressure levels are boosted within given mechanical, thermal and quality limits. An optional Bandwidth extension mode extends the low frequency response up to a predefined limit before maximizing the output level. This mode is suitable for listening to high quality music in quiet environments. The frequency response of the TFA9890 can be modified via ten fully programmable cascaded second-order biquad filters. The first two biquads are processed with 48-bit double precision; biquads 3 to 8 are processed with 24-bit single precision. At low battery voltage levels, the gain is automatically reduced to limit battery current. The output volume can be controlled by the SpeakerBoost protection algorithm or by the host application (external). In the latter case, the boost features of the SpeakerBoost protection algorithm must be disabled to avoid neutralizing external volume control. The SpeakerBoost protection algorithm output is converted into two pulse width modulated (PWM) signals which are then injected into the class-D audio amplifier. The 3-level PWM scheme supports filterless speaker drive. An adaptive DC-to-DC converter boosts the battery supply voltage in line with the output of the SpeakerBoost protection algorithm. It switches to Follower mode (VBST = VBAT; no boost) when the audio output voltage is lower than the battery voltage. TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 8 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 9. Internal circuitry Table 4. Pin Internal circuitry Symbol Equivalent circuit C1, C4, D1, DATAI2, TEST5, WS2, D3, E1, F2, TEST3, BCK2, ADS1, F3 ADS2 C1, C4, D1, D3, E1, F2, F3 ESD GNDD (E4) 010aaa788 A1, A2, A4, B1, B3, E3, G1 WS1, DATAI1, INT, BCK1, DATAI3, TEST2, SCL, VDDP (B6) ESD A1, A2, A4, B1, B3, E3, G1 ESD ESD GNDP (B7) GNDD (E4) 010aaa789 C3 TEST4 VDDD (E3) ESD C3 ESD GNDD (E4) 010aaa790 F1 SDA F1 ESD GNDD (E4) 010aaa791 A3 DATAO VDDD (E3) A3 ESD GNDD (E4) GNDP (B7) 010aaa792 TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 9 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection Table 4. Internal circuitry Pin Symbol A6, C6 OUTB, OUTA Equivalent circuit VDDP (B6) A6, C6 GNDP (B7) 010aaa787 E6, F6, G6 i.c. SENSE (E6) E6, F6, G6 GNDB (D7) 010aaa793 A5, B2, B5, B6, C2, C5, D2, D5, E2, E5, F4, F5, G4, G5 GNDP, GNDB, GNDD GNDD (A5, B2, C2, D2, D5, E2, F4, G4) GNDP (B5, B6, C5) GNDB (E5, F5, G5) 010aaa794 TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 10 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 10. I2C-bus interface and register settings The TFA9890 supports the 400 kHz I2C-bus microcontroller interface mode standard. The I2C-bus is used to control the TFA9890 and to transmit and receive data. The TFA9890 can only operate in I2C slave mode, as a slave receiver or as a slave transmitter. 10.1 TFA9890 addressing The TFA9890 is accessed via an 8-bit code (see Table 5). Bits 1 to 7 contain the device address. Bit 0 (R/W) indicates whether a read (1) or a write (0) operation has been requested. Four separate addresses are supported for stereo applications. Address selection is via pins ADS1 and ADS2. The levels on pins ADS1 and ADS2 determine the values of bits 1 and 2, respectively, of the device address, as detailed in Table 5. The generic address is independent of pins ADS1 and ADS2. Table 5. Address selection via pins ADS1 and ADS2 ADS2 pin voltage (V) ADS1 pin voltage (V) Address Function 0 0 01101000 for write mode 01101001 for read mode 01101010 for write mode 0 VDDD VDDD 0 01101011 for read mode 01101100 for write mode 01101101 for read mode for write mode VDDD VDDD 01101110 01101111 for read mode don't care don't care 00011100 (generic address) for write mode don't care don't care 00011101 (generic address) for read mode TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 11 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 11. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VBAT battery supply voltage on pin VBAT 0.3 +5.5 V VBST voltage on pin BST 0.3 +12 V VDDP power supply voltage on pin VDDP 0.3 +12 V VDDD digital supply voltage on pin VDDD 0.3 +1.95 V Tj junction temperature - +150 C Tstg storage temperature 55 +150 C Tamb ambient temperature 40 +85 C VESD electrostatic discharge voltage according to Human Body Model (HBM) 2 +2 kV according to Charge Device Model (CDM) 500 +500 V 12. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Typ Rth(j-a) thermal resistance from junction to ambient in free air; natural convection - 4-layer application board 40 TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 Unit K/W (c) NXP B.V. 2013. All rights reserved. 12 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 13. Characteristics 13.1 DC Characteristics Table 8. DC characteristics All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1]; RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VBAT battery supply voltage on pin VBAT 3 - 5.5 V IBAT battery supply current on pin VBAT and in DC-to-DC converter coil; Operating modes with load; DC-to-DC converter in Adaptive Boost mode (no output signal, VBAT = 3.6 V, VDDD = 1.8 V) - 4 - mA Power-down mode - 1 5 A VDDP power supply voltage on pin VDDP 3 - 9.5 V VDDD digital supply voltage on pin VDDD 1.65 1.8 1.95 V IDDD digital supply current on pin VDDD; Operating modes; SpeakerBoost Protection activated - 20 - mA on pin VDDD; Operating modes; CoolFlux DSP bypassed - 6 - mA on pin VDDD; Power-down mode; BCK1 = WS1 = DATAI1 = BCK2 = WS2 = DATAI2 = DATAI3 = 0 V - 10 - A 0.7VDDD - 3.6 V - - 0.3VDDD V Pins BCK1, WS1, DATA1, BCK2, WS2, DATAI2, DATAI3, ADS1, ADS2, SCL, SDA VIH HIGH-level input voltage VIL LOW-level input voltage Cin input capacitance ILI input leakage current [2] - - 3 pF 1.8 V on input pin - - 0.1 A Pins DATAO, INT, push-pull output stages VOH HIGH-level output voltage IOH = 4 mA - - VDDD 0.4 V VOL LOW-level output voltage IOL = 4 mA - - 400 mV Pins SDA, open drain outputs, external 10 k resistor to VDDD VOH HIGH-level output voltage IOH = 4 mA - - VDDD 0.4 V VOL LOW-level output voltage IOL = 4 mA - - 400 mV VDDP = 5.3 V - 200 - m Pins OUTA, OUTB RDSon drain-source on-state resistance Protection Tact(th_prot) thermal protection activation temperature 130 - 150 C Vovp(VBAT) overvoltage protection voltage on pin VBAT 5.5 - 6.0 V Vuvp(VBAT) undervoltage protection voltage on pin VBAT 2.3 - 2.5 V TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 13 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection Table 8. DC characteristics ...continued All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1]; RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified. Symbol Parameter IO(ocp) overcurrent protection output current Conditions Min Typ Max Unit 2 - - A 9.4 9.5 9.6 V DC-to-DC converter VBST voltage on pin BST DCVO = 111; Boost mode [1] LBST = boost converter inductance; RL = load resistance; LL = load inductance (speaker). [2] This parameter is not tested during production; the value is guaranteed by design and checked during product validation. TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 14 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 13.2 AC characteristics Table 9. AC characteristics All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1]; RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit RL = 8 ; fs = 48 kHz - 3.6 - W RL = 8 ; fs = 32 kHz - 3.7 - W RL = 8 ; fs = 48 kHz - 4.5 - W RL = 8 ; fs = 32 kHz - 4.6 - W - - 3 mV [2] - 72 - % [1] - 0.03 0.1 % - 50 - V - 66 - V - 100 - dB - 97 - dB - 75 - dB 256 - 384 kHz - - 2 ms fs = 8 kHz - - 27 ms fs = 48 kHz - - 6 ms Amplifier output power Po(RMS) RMS output power THD+N = 1 %; CLIP = 0 THD+N = 10 %; CLIP = 0 Amplifier output; pins OUTA and OUTB VO(offset) output offset voltage absolute value Amplifier performance po output power efficiency THD+N total harmonic distortion-plus-noise Po(RMS) = 100 mW; RL = 8 ; LL = 44 H Vn(o) output noise voltage Po(RMS) = 2.5 W; including DC-to-DC converter; 100 Hz audio signal A-weighted; DATAI1 = DATAI2 = 0 V CoolFlux DSP bypassed [2] CoolFlux DSP enabled S/N signal-to-noise ratio VO = 4.5 V (peak); A-weighted CoolFlux DSP bypassed [2] CoolFlux DSP enabled PSRR fsw power supply rejection ratio switching frequency Vripple = 200 mV (RMS); fripple = 217 Hz directly coupled to the frequency I2S input Amplifier power-up, power-down and propagation delays td(on) turn-on delay time PLL locked on BCK (IPLL = 0) fs = 8 kHz to 48 kHz PLL locked on WS (IPLL = 1) td(off) turn-off delay time - - 10 s td(mute_off) mute off delay time - 1 - ms td(soft_mute) soft mute delay time - 1 - ms tPD propagation delay CoolFlux bypassed fs = 8 kHz - - 3.2 ms fs = 48 kHz - - 600 s SpeakerBoost protection mode, tLookAhead = 2 ms TFA9890_SDS Preliminary short data sheet fs = 8 kHz - - 14 ms fs = 48 kHz - - 4 ms All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 15 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection Table 9. AC characteristics All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1]; RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Current-sensing performance S/N signal-to-noise ratio IO = 1.2 A (peak); A-weighted - 75 - dB Isense(acc) sense current accuracy IO = 0.5 A (peak) 3 - +3 % - 8 - kHz 20 - - H B bandwidth LL load inductance [2] [1] LBST = boost converter inductor; RL = load resistance; LL = load inductance (speaker). [2] This parameter is not tested during production; the value is guaranteed by design and checked during product validation. TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 16 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 13.3 I2S timing characteristics Table 10. I2S bus interface characteristics; see Figure 4 All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1]; RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit fs sampling frequency on pin WS [2] 8 - 48 kHz fclk clock frequency on pin BCK [2] 32fs - 64fs Hz WS edge to BCK HIGH [3] 10 - - ns 10 - - ns 10 - - ns 10 - - ns set-up time tsu DATA edge to BCK HIGH hold time th [3] BCK HIGH to WS edge BCK HIGH to DATA edge [1] LBST = boost converter inductance; RL = load resistance; LL = load inductance. [2] The I2S bit clock input (BCK) is used as a clock input for the DSP, as well as for the amplifier and the DC-to-DC converter. Note that both the BCK and WS signals must be present for the clock to operate correctly. [3] This parameter is not tested during production; the value is guaranteed by design and checked during product validation. BCK th tsu WS DATA 010aaa750 Fig 4. TFA9890_SDS Preliminary short data sheet I2S timing All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 17 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 13.4 I2C timing characteristics Table 11. I2C-bus interface characteristics; see Figure 5 All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1]; RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit fSCL SCL clock frequency - - 400 kHz tLOW LOW period of the SCL clock 1.3 - - s tHIGH HIGH period of the SCL clock rise time tr 0.6 - - s SDA and SCL signals [2] 20 + 0.1 Cb - - ns SDA and SCL signals [2] 20 + 0.1 Cb - - ns [3] 0.6 - - s tf fall time tHD;STA hold time (repeated) START condition tSU;STA set-up time for a repeated START condition 0.6 - - s tSU;STO set-up time for STOP condition 0.6 - - s tBUF bus free time between a STOP and START condition 1.3 - - s tSU;DAT data set-up time 100 - - ns tHD;DAT data hold time 0 - - s 0 - 50 ns - - 400 pF tSP pulse width of spikes that must be suppressed by the input filter Cb capacitive load for each bus line [4] [1] LBST = boost converter inductance; RL = load resistance; LL = load inductance. [2] Cb is the total capacitance of one bus line in pF. The maximum capacitive load for each bus line is 400 pF. [3] After this period, the first clock pulse is generated. [4] To be suppressed by the input filter. SDA tLOW tBUF tr tf tHD;STA tSP SCL tHD;STA P tHD;DAT tHIGH tSU;DAT S tSU;STA Sr tSU;STO P 010aaa225 Fig 5. TFA9890_SDS Preliminary short data sheet I2C timing All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 18 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 14. Application information 14.1 Application diagrams battery LBST 1.8 V 1 H CBST DATAO RST INT DATAI2 WS2 BCK2 DATAI3 E6, F6, G6 BST INB A2 D6 A1 B1 D7 TFA9890 C6 A3 n.c. n.c. OUTA B4 A6 A4 C1 D1 E1 B3 ADS1 F2 F3 E5 F5 B5 G5 B6 A5 B2 C2 C5 D2 D5 E2 F4 G4 OUTB speaker E4 D4 C4 E3 D3 TEST7 TEST6 TEST5 C3 TEST4 BCK1 E7, F7, G7 TEST3 I2S A7 B7 C7 TEST2 WS1 20 F G1 GNDD DATAI1 G2 GNDP SCL G3 F1 GNDB I2C 100 nF ADS2 SDA VBAT VDDD 100 nF BASEBAND PROCESSOR 10 F CVDDP VDDP CVBAT CVDDD 010aaa817 Fig 6. TFA9890_SDS Preliminary short data sheet Typical mono application (simplified) All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 19 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection LBST 1.8 V 1 H battery CBST BASEBAND PROCESSOR WS1 BCK1 DATAO RST INT DATAI2 WS2 BCK2 G1 E6, F6, G6 BST INB A2 D6 A1 B1 D7 TFA9890 C6 A3 n.c. n.c. OUTA B4 A6 A4 D1 E1 DATAI3 E5 F5 B5 G5 B6 B3 GNDB F3 ADS2 ADS1 F2 speaker A5 B2 C2 C5 D2 D5 E2 F4 G4 C1 OUTB E4 D4 C4 E3 D3 TEST7 TEST6 TEST5 C3 TEST4 I2S E7, F7, G7 TEST3 DATAI1 TEST2 SCL 10 F 20 F A7 B7 C7 GNDD I2C G2 G3 F1 GNDP SDA 100 nF CVDDP VDDP 100 nF CVBAT VBAT VDDD CVDDD LBST 1.8 V 1 H battery CBST INT DATAI2 WS2 BCK2 DATAI3 BST INB B1 D7 TFA9890 C6 A3 n.c. n.c. OUTA B4 A6 A4 C1 D1 E1 B3 1.8 V ADS1 F2 F3 E5 F5 B5 G5 B6 A5 B2 C2 C5 D2 D5 E2 F4 G4 OUTB speaker E4 D4 C4 E3 D3 TEST7 TEST6 TEST5 C3 TEST4 RST D6 A1 TEST3 DATAO E7, F7, G7 E6, F6, G6 TEST2 BCK1 A7 B7 C7 A2 GNDD WS1 10 F 20 F G1 GNDP DATAI1 GNDB SCL G2 G3 F1 ADS2 SDA 100 nF CVDDP VDDP 100 nF CVBAT VBAT VDDD CVDDD 010aaa818 Fig 7. Typical stereo application (simplified) TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 20 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection battery LBST 1.8 V INT DATAI2 WS2 BCK2 DATAI3 E6, F6, G6 BST INB A2 D6 A1 B1 D7 TFA9890 C6 A3 n.c. n.c. OUTA B4 A6 A4 C1 D1 E1 B3 ADS1 F2 F3 E5 F5 B5 G5 B6 A5 B2 C2 C5 D2 D5 E2 F4 G4 OUTB speaker E4 D4 C4 E3 D3 TEST7 TEST6 TEST5 C3 TEST4 RST E7, F7, G7 TEST3 DATAO A7 B7 C7 TEST2 data i/p 20 F G1 GNDD BCK1 bit clk. G2 GNDP I2S WS1 G3 F1 GNDB word sel. DATAI1 100 nF ADS2 data o/p SCL VBAT 100 nF SDA I2C VDDD AUDIO SOURCE 1 (I2S master) CBST 10 F CVDDP VDDP CVBAT CVDDD 1 H SECOND I2S SLAVE DEVICE (CODEC) data output AUDIO SOURCE 2 2 (I S master) data o/p word sel. I2S bit clk. data input 1 word select 1 data input 2 word select 2 bit clock 2 data i/p 010aaa819 Fig 8. Typical mono application with two audio sources and a second I2S slave device TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 21 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 14.2 Curves measured in reference design (demonstration board) All measurements were taken with VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H; RL = 4 ; LL = 20 H; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; CoolFlux DSP bypassed; default settings, unless otherwise specified. 010aaa825 102 THD+N (%) 010aaa826 1 THD+N (%) 10 (1) (2) (3) 1 (1) (2) 10-1 10-1 10-2 10-3 10-2 10-1 10-2 1 Po (W) 10 102 10 RL = 8 , VBAT = 3.6 V 103 104 fi (Hz) 105 RL = 8 , VBAT = 3.6 V (1) fi = 6 kHz. (1) Po = 100 mW (2) fi = 1 kHz. (2) Po = 500 mW (3) fi = 100 Hz. Fig 9. THD plus noise as a function of output power 010aaa831 12 VBST (V) 4 010aaa830 12 IBAT (A) 8 Fig 10. THD plus noise as a function of frequency VBST (V) 4 IBAT (V) 3.16 8 2.32 4 0 1.48 0 1.3 -4 0.64 -4 0.4 4 -8 -0.01 VBST IBAT -0.004 0.002 0.008 0.014 t (s) -0.2 0.02 a. fast ramp-up -8 -0.01 3.1 2.2 VBST IBAT -0.004 0.002 0.008 0.014 t (s) -0.5 0.02 b. immediate ramp-up Fig 11. DC-to-DC converter ramp-up behavior TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 22 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 010aaa827 1.4 G (dB) 010aaa828 7 Po (W) 5.6 0.7 4.2 (4) (3) (1) (2) 0 2.8 -0.7 1.4 -1.4 10 102 103 104 fi (Hz) 0 105 2 RL = 8 , VBAT = 3.6 V, Po = 500 mW 2.8 3.6 4.4 5.2 VBAT (V) 6 RL = 8 , fi = 1 kHz (1) THD+N = 10 %, no boost (Follower mode) (2) THD+N = 1 %, no boost (Follower mode) (3) THD+N = 10 %, boost on (4) THD+N = 1 %, boost on Fig 12. Normalized gain as a function of frequency Fig 13. Output power as a function of battery supply voltage 010aaa832 -10 PSRR (dB) -30 -50 -70 -90 -110 102 10 103 104 fripple (Hz) 105 RL = 8 , VBAT = 3.6 V, Vripple = 200 V(RMS) on VBAT Fig 14. PSRR as a function of ripple frequency TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 23 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 15. Package outline :/&63ZDIHUOHYHOFKLSVL]HSDFNDJH EXPSV[PP 7)$ ^ Q $ # $ ] $ Q Z# _ _\ ^ [ j # ^ Z$ $ # * ' = Z$ Q $ " Z# ; ] * > ? @ J !" $ # Q !## !*& !#& *!' *! !# !*" !#" *!*; #!<; !$& !*' !#' *!*' #!<' $ # \ [ !' #!' !;#= !*= !*= !*#= #!' !$= !' !# !"<= !#;= !#;= !#<= !""= !#'= !#'= !#"= Z$ Z# Z$ Z# ZOFVSBWIDBSR $*q*q; $*q=q$; <&< Fig 15. Package outline TFA9890 (WLCSP49) TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 24 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 16. Soldering of WLCSP packages 16.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this package. All NXP WLCSP packages are lead-free. 16.2 Board mounting Board mounting of a WLCSP requires several steps: 1. Solder paste printing on the PCB 2. Component placement with a pick and place machine 3. The reflow soldering itself 16.3 Reflow soldering Key characteristics in reflow soldering are: * Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 16) than a PbSn process, thus reducing the process window * Solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board * Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 12. Table 12. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 16. TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 25 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering description". 16.3.1 Stand off The stand off between the substrate and the chip is determined by: * The amount of printed solder on the substrate * The size of the solder land on the substrate * The bump height on the chip The higher the stand off, the better the stresses are released due to TEC (Thermal Expansion Coefficient) differences between substrate and chip. 16.3.2 Quality of solder joint A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. No failures have been found to be related to these voids. Solder joint inspection after reflow can be done with X-ray to monitor defects such as bridging, open circuits and voids. 16.3.3 Rework In general, rework is not recommended. By rework we mean the process of removing the chip from the substrate and replacing it with a new chip. If a chip is removed from the substrate, most solder balls of the chip will be damaged. In that case it is recommended not to re-use the chip again. TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 26 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon. The surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill removed. When a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. Apply flux on the bumps at the chip side as well as on the solder pads on the substrate. Place and align the new chip while viewing with a microscope. To reflow the solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering description". 16.3.4 Cleaning Cleaning can be done after reflow soldering. TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 27 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 17. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes TFA9890_SDS v.1 20130517 Preliminary data sheet - - TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 28 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TFA9890_SDS Preliminary short data sheet Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 29 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com TFA9890_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 -- 17 May 2013 (c) NXP B.V. 2013. All rights reserved. 30 of 31 TFA9890 NXP Semiconductors 9.5 V boosted audio system with adaptive sound maximizer and speaker protection 20. Contents 1 2 3 4 5 6 7 7.1 8 9 10 10.1 11 12 13 13.1 13.2 13.3 13.4 14 14.1 14.2 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 8 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 9 I2C-bus interface and register settings . . . . . 11 TFA9890 addressing . . . . . . . . . . . . . . . . . . . 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12 Thermal characteristics . . . . . . . . . . . . . . . . . 12 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13 DC Characteristics . . . . . . . . . . . . . . . . . . . . . 13 AC characteristics. . . . . . . . . . . . . . . . . . . . . . 15 I2S timing characteristics . . . . . . . . . . . . . . . . 17 I2C timing characteristics . . . . . . . . . . . . . . . . 18 Application information. . . . . . . . . . . . . . . . . . 19 Application diagrams . . . . . . . . . . . . . . . . . . . 19 Curves measured in reference design (demonstration board) . . . . . . . . . . . . . . . . . . 22 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 24 16 Soldering of WLCSP packages. . . . . . . . . . . . 25 16.1 Introduction to soldering WLCSP packages . . 25 16.2 Board mounting . . . . . . . . . . . . . . . . . . . . . . . 25 16.3 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 25 16.3.1 Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 16.3.2 Quality of solder joint . . . . . . . . . . . . . . . . . . . 26 16.3.3 Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 16.3.4 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 29 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 29 18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 30 19 Contact information. . . . . . . . . . . . . . . . . . . . . 30 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 May 2013 Document identifier: TFA9890_SDS