www.vishay.com For technical questions, contact: efi@vishay.com Document Number: 61078
48 Revision: 14-Mar-08
QFM
Vishay Electro-Films
Thin Film, Top-Contact Resistor
CHIP
RESISTORS
The QFM series tantulum nitride on quartz single-value
resistor chips offer a small size, wide ohmic value range and
excellent frequency response.
The QFMs tantalum nitride resistor material offers excellent
resistance to high moisture environments.
The QFMs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The QFMs are 100 % electrically tested and
visually inspected to MIL-STD-883.
FEATURES
•Wire bondable
•Small size, 0.020 inches square
•Resistance range: 1.0 Ω to 1 MΩ
•DC power rating: 25 mW
•Quartz substrate: < 0.1 pF shunt capacitance
•Resistor material: Tantalum nitride, self passivating
•Moisture resistant
APPLICATIONS
The QFM top-contact resistor chips are designed to handle substantial power loads in many types of hybrid packages. They are
ideally suited for this purpose because of their small size.
Product may not
be to scale
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
PROCESS CODE
CLASS H* CLASS K*
103 107
101 105
102 106
100 104
Aluminum terminations
*MIL-PRF-38534 inspection criteria
1 Ω
0.1 %
Tightest Standard Tolerance Available
± 25 ppm/°C
± 250 ppm/°C
± 50 ppm/°C
1 MΩ
± 100 ppm/°C
1 % 0.5 %
10 Ω30 Ω100 Ω200 kΩ430 kΩ620 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100 Ω - 250 kΩ
< 100 Ω or > 251 kΩ
- 35 dB typ.
- 20 dB typ.
Moisture Resistance, MIL-STD-202, Method 106 ± 0.5 % max. ΔR/R
Stability, 1000 h, + 125 °C, 125 mW ± (0.25 % + 0.01 Ω) max. ΔR/R
Operating Temperature Range- 55 °C to + 125 °C
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F ± 0.25 % max. ΔR/R
High Temperature Exposure, + 150 °C, 100 h ± 0.5 % max. ΔR/R
Dielectric Voltage Breakdown 200 V
Insulation Resistance 1012 min.
Operating Voltage100 V max.
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C) 25 mW
5 x Rated Power Short-Time Overload, + 25 °C, 5 s ± 0.25 % max. ΔR/R
Document Number: 61078 For technical questions, contact: efi@vishay.com www.vishay.com
Revision: 14-Mar-08 49
QFM
Thin Film, Top-Contact Resistor Vishay Electro-Films
CHIP
RESISTORS
CONFIGURATIONS in inches
SCHEMATIC
Options: Gold backing for eutectic die attach
Gold bonding pads, 15 kÅ minimum thickness
Consult Applications Engineer
0.004
0.016
0.004
TYPICAL RANGE
820 Ω - 1 MΩ
0.020
0.004
0.007
0.016
TYPICAL RANGE
1 Ω - 29 Ω
0.004
0.020
0.006
TYPICAL RANGE
30 Ω - 819 Ω
0.020
MECHANICAL SPECIFICATIONS in inches
PARAMETER
Chip Size 0.020 x 0.020 ± 0.003 (0.5 x 0.5 ± 0.076 mm)
Chip Thickness 0.010 ± 0.002 (0.254 ± 0.05 mm)
Chip substrate Material Quartz
Resistor Material Tantalum nitride, self-passivating
Bonding Pad Size 0.004 x 0.004 (0.10 x 0.10 mm) minimum
Number of Pads 2
Pad Material 10 kÅ minimum aluminum
Backing None, lapped quartz
ORDERING INFORMATION
Example: 100 % visual, 10 kΩ, ± 1 %, ± 100 ppm/°C TCR, aluminum pads, class H visual inspection
W
INSPECTION/
PACKAGING
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample, commercial visually
inspected parts loaded in matrix
trays (4 % AQL)
QFM
PRODUCT
FAMILY
102
PROCESS
CODE
See Process Code
table
1000
RESISTANCE
VALUE
Use the first 4 digits
of the resistance
1
MULTIPLIER
CODE
D = 0.0001
C = 0.001
B = 0.01
A = 0.1
0 = 1
1 = 10
2 = 100
3 = 1000
4 = 10 000
F
TOLERANCE
CODE
B = 0.1 %
C = 0.2 %
D = 0.5 %
F = 1.0 %
G = 2.0 %
H = 2.5 %
J = 5.0 %
K = 10 %
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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therein, which apply to these products.
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