Phycomp Product specification
General purpose chip resistors
sizes 1206, 0805, 0603 and 0402 RC01/11/21/31
5%
2003 Jul 24 Rev.11 12 www.yageo.com
TESTS AND REQUIREME NTS
Essentially all tests are carried out in
accordance with the schedule of
“IEC publication 60115-8”, category
LCT/UCT/56 (rated temperature
range: Lower Category
Temperature, Upper Category
Temperature; damp heat, long term,
56 days). The testing also covers the
requirements specified by EIA and
EIAJ.
The tests are carried out in
accordance with IEC publication
60068, “Recommended basic
climatic and mechanical robustness
testing procedure for electronic
components” and under standard
atmospheric conditions according to
“IEC 60068-1”, subclause 5.3.
Unless otherwise specified the
following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45% to 75%
Air pressure: 86 kPa to 106 kPa
(860 mbar to 1060 mbar).
In Table 4 the tests and
requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-8 and
60068” ; a short description of the
test procedure is also given. In some
instances deviations from the IEC
recommendations were necessary
for our method of specifying.
All soldering tests are performed
with mildly activat ed flux.
Table 4 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
Tests in accordance with the schedule of IEC publication 60115-8
4.4.1 visual
examination no holes; clean surface;
no damage
4.4.2 dimensions
(see Fig.14) gauge (mm) see Table 3
applied voltage (+0/−10%)
R < 10 Ω: 0.1 V
10 Ω ≤ R < 100 Ω: 0.3 V
100 Ω ≤ R < 1 kΩ: 1 V
1 kΩ ≤ R < 10 kΩ: 3 V
10 kΩ ≤ R < 100 kΩ: 10 V
100 kΩ ≤ R < 1 MΩ: 25 V
4.5 resistance
R ≥ 1 MΩ: 50 V
R − Rnom: max. ±5%
4.18 20 (Tb) resistance to
soldering heat unmounted chips;
10 ±1 s; 260 ±5 °C no visible damage
RC01, RC11, RC21 ∆R/R max.: ±(0.5% + 0.05 Ω)
RC31 ∆R/R max.: ±(1% + 0.05 Ω)
4.29 45 (Xa) component
solvent
resistance
isopropyl alcohol or H2O followed
by brushing in accordance with
“MIL 202 F”
no visible damage
4.17 20 (Ta) solderability unmounted chips completely
immersed for 2 ±0.5 s in a
solder bath at 235 ±2 ° C
good tinning
(≥95% covered);
no visible damage