–1– ACCTB95E 201803-T
DETAILED FEATURES
ORDERING INFORMATION
For board-to-FPC
B02
High Current Connectors
Low 0.7 mm profile, high current capacity (10A), 4 signal pins
FEATURES
1. High current rating: 10A (5A/pin × 4 pins)
2. 4 signal pin type for wide range of control applications
3. High removal force while miniature and low profile
APPLICATIONS
Smartphones, tablet PCs and other mobile devices
High current rating: 10A (5A/pin × 4 pins) Miniature design provides space-saving benefits.
AXF
3:Socket
4:Header
Numberofpins
(PowerandSignalterminals)
(1digit)
8
Matedheight
2:0.7mm
7200
Currentcapacity
7:5.0A/powerterminal
Function
0:Nopolarity
0:(Fixed)
High current connectors B02
–2– ACCTB95E 201803-T
PRODUCT TYPES
Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Mated height Number of contacts Part number Packing
Socket Header Inner carton (1-reel) Outer carton
0.7mm 8 AXF382700 AXF482700 15,000 pieces 30,000 pieces
Item Specifications Conditions
Electrical
characteristics
Rated
current
Power contact 5.0A/pin contact
Signal contact 0.3A/pin contact
Rated voltage 30V AC/DC
Dielectric strength 150V AC for 1 minute No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 minute)
Contact resistance Max. 16mΩ (power terminal)
Max. 90mΩ (signal terminal)
According to the contact resistance measurement method of
JIS C 5402
Mechanical
characteristics
Composite insertion force Max. 40 N
Composite removal force Min. 10 N (initial)
Environmental
characteristics
Ambient temperature –55 to +85°C No icing. No condensation.
Soldering heat resistance The initial specification must be satisfied electrically
and mechanically
Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature –55 to +85°C (products only)
–40 to +50°C (emboss packing) No icing. No condensation.
Thermal shock resistance
(Header and socket mated)
5 cycles,
insulation resistance Min. 100MΩ,
contact resistance max. 16mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(Header and socket mated)
120 hours
insulation resistance Min. 100MΩ,
contact resistance max. 16mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to IEC60068-2-78
Temperature 40±2°C,
humidity 90 to 95% R.H.
Salt water spray resistance
(Header and socket mated)
24 hours
insulation resistance Min. 100MΩ,
contact resistance max. 16mΩ (power terminal)
max. 90mΩ (signal terminal)
Conformed to IEC60068-2-11
Temperature 35±2°C,
salt water concentration 5±1%
H2S resistance
(Header and socket mated)
48 hours
contact resistance Max. 16mΩ (power terminal)
Max. 90mΩ (signal terminal)
Conformed to JEIDA-38-1984
Temperature 40±2°C,
gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics Insertion and removal life
Mechanical life 30 times
Contact resistance Max. 16mΩ (power terminal)
Max. 90mΩ (signal terminal)
Composite removal force Min. 7 N
Repeated insertion and removal cycles of max. 200 times/
hour
Unit weight 8 pins Socket: 0.012 g
8 pins Header: 0.005 g
Part name Material Surface treatment
Molded portion LCP resin (UL94V-0) —
Contact and Post Copper alloy
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel
portions).
Soldering terminals Copper alloy
Sockets:
Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:
Base: Ni plating, Surface: Au plating (except the terminal tips)
Order Temperature (°C) Time (minutes)
1
2
3
4
–55
85
–55
0
−330
Max. 5
30
Max. 5
+3
0
0
−3
High current connectors B02
–3– ACCTB95E 201803-T
DIMENSIONS (Unit: mm)
Socket (Mated height: 0.7 mm)
Header (Mated height: 0.7 mm)
Socket and Header are mated
mark can be downloaded from: http://industrial.panasonic.com/ac/e/The CAD data of the products with a
External dimensions
※BecausethesolderingterminalYandZaretheunifiedstructure,theyareconnected
electrically.
Generaltolerance:±0.2
Dimension table
A B C D
8 4.85 2.00 4.25 3.52
Dimensions
Number
of pins
E
0.7mm 0.69
Dimensions
Mated height
External dimensions
Generaltolerance:±0.2
Dimension table
A B C
8 4.16 2.00 3.66
D
0.7mm 0.55
Dimensions
Number
of pins
Dimensions
Mated height
High current connectors B02
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EMBOSSED TAPE DIMENSIONS (Unit: mm)
Dimension table
Connector orientation with respect to embossed tape feeding direction
There is no indication on this product regarding top-bottom or left-right orientation.
Type/Mated height Number of pins Type of taping A B C Quantity per reel
Common for socket and headers
0.7mm 8 Tape I 16.0 7.5 17.4 15,000
Specifications for taping
In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.
Specifications for the plastic reel
In accordance with EIAJ ET-7200B.
Type
Direction
of tape progress
Common for B02
Socket Header
High current connectors B02
–5– ACCTB95E 201803-T
NOTES (Unit: mm)
Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
PC board and recommended metal mask patterns
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures are recommended patterns. Please use them as a
reference.
Socket (Mated height: 0.7 mm)
Recommended PC board pattern
(TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Power contact opening ratio: 86%)
(Terminal opening ratio: 81%)
(Metal-part opening ratio: 32%)
Header (Mated height: 0.7 mm)
Recommended PC board pattern
(TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Power contact opening ratio: 71%)
(Terminal opening ratio: 75%)
(Metal-part opening ratio: 100%)
Please refer to the latest product specifications when
designing your product.
–1– ACCTB48E 201803-T
For board-to-board/board-to-FPC
About safety remarks
Observe the following safety remarks to prevent accidents and injuries.
Regarding the design of devices and PC board patterns
Notes on Using Narrow pitch Connectors/
High Current Connectors
1) Do not use these connectors beyond the specification sheets.
The usage outside of specified rated current, dielectric strength,
and environmental conditions and so on may cause circuitry
damage via abnormal heating, smoke, and fire.
2) In order to avoid accidents, your thorough specification review
is appreciated. Please contact our sales office if your usage is
out of the specifications. Otherwise, Panasonic Corporation
cannot guarantee the quality and reliability.
3) Panasonic Corporation is consistently striving to improve
quality and reliability. However, the fact remains that electrical
components and devices generally cause failures at a given
statistical probability. Furthermore, their durability varies with
use environments or use conditions. In this respect, please
check for actual electrical components and devices under actual
conditions before use. Continued usage in a state of degraded
condition may cause the deteriorated insulation, thus result in
abnormal heat, smoke or firing. Please carry out safety design
and periodic maintenance including redundancy design, design
for fire spread prevention, and design for malfunction prevention
so that no accidents resulting in injury or death, fire accidents, or
social damage will be caused as a result of failure of the
products or ending life of the products.
1) When using the board to board connectors, do not connect a
pair of board with multiple connectors. Otherwise, misaligned
connector positions may cause mating failure or product
breakage.
2) With mounting equipment, there may be up to a ±0.2 to 0.3
mm error in positioning. Be sure to design PC boards and
patterns while taking into consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed on the body to aid in
positioning. When using these connectors, make sure that the
PC board is designed with positioning holes to match these tabs.
4) To ensure the required mechanical strength when soldering
the connector terminals, make sure the PC board meets
recommended PC board pattern design dimensions given.
5) PC board
Control the thicknesses of the cover lay and adhesive to prevent
poor soldering. This connector has no stand-off. Therefore,
minimize the thickness of the cover lay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch series, to prevent the
PC board from coming off during vibrations or impacts, and to
prevent loads from falling directly on the soldered portions, be
sure to design some means to fix the PC board in place.
Example) Secure in place with screws
When connecting PC boards, take appropriate measures to
prevent the connector from coming off.
7) When mounting connectors on a FPC
• When the connector soldered to FPC is mated or unmated,
solder detachment may occur by the force to the terminals.
Connector handling is recommended in the condition when the
reinforcing plate is attached to the backside of FPC where the
connector is mounted. The external dimension of the reinforcing
plate is recommended to be larger than the dimension of
“Recommended PC board pattern” (extended dimension of one
side is approximately 0.5 to 1.0 mm). The materials and
thickness of the reinforcing plate are glass epoxy or polyimide
(thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm).
• As this connector has temporary locking structure, the
connector mating may be separated by the dropping impact
depend on the size, weight or bending force of the FPC. Please
consider the measures at usage to prevent the mating
separation.
8) The narrow pitch connector series is designed to be compact
and thin. Although ease of handling has been taken into
account, take care when mating the connectors, as
displacement or angled mating could damage or deform the
connector.
Notes on Using Narrow pitch Connectors/High Current Connectors
–2– ACCTB48E 201803-T
Regarding the selection of the connector placement machine and the mounting
procedures
Regarding soldering
Reflow soldering
Hand soldering
1) Select the placement machine taking into consideration the
connector height, required positioning accuracy, and packaging
conditions.
2) Be aware that if the chucking force of the placement machine
is too great, it may deform the shape of the connector body or
connector terminals.
3) Be aware that during mounting, external forces may be
applied to the connector contact surfaces and terminals and
cause deformations.
4) Depending on the size of the connector being used, self
alignment may not be possible. In such cases, be sure to
carefully position the terminal with the PC board pattern.
5) The positioning bosses give an approximate alignment for
positioning on the PC board. For accurate positioning of the
connector when mounting it to the PC board, we recommend
using an automatic positioning machine.
6) In case of dry condition, please note the occurrence of static
electricity. The product may be adhered to the embossed carrier
tape or the cover tape in dry condition. Recommended humidity
is from 40 to 60%RH and please remove static electricity by
ionizer in manufacturing process.
1) Measure the recommended profile temperature for reflow
soldering by placing a sensor on the PC board near the
connector surface or terminals. (Please refer to the specification
for detail because the temperature setting differs by products.)
2) As for cream solder printing, screen printing is recommended.
3) When setting the screen opening area and PC board foot
pattern area, refer the recommended PC board pattern and
window size of metal mask on the specification sheet, and make
sure that the size of board pattern and metal mask at the base of
the terminals are not increased.
4) Please pay attentions not to provide too much solder. It
makes miss mating because of interference at soldering portion
when mating.
5) When mounting on both sides of the PC board and the
connector is mounting on the underside, use adhesives or other
means to ensure the connector is properly fixed to the PC board.
(Double reflow soldering on the same side is possible.)
6) The condition of solder or flux rise and wettability varies
depending on the type of solder and flux. Solder and flux
characteristics should be taken into consideration and also set
the reflow temperature and oxygen level.
7) Do not use resin-containing solder. Otherwise, the contacts
might be firmly fixed.
8) Soldering conditions
Please use the reflow temperature profile conditions
recommended below for reflow soldering. Please contact our
sales office before using a temperature profile other than that
described below (e.g. lead-free solder)
For products other than the ones above, please refer to the
latest product specifications.
9) The temperature profiles given in this catalog are values
measured when using the connector on a resin-based PC
board. When performed reflow soldering on a metal board (iron,
aluminum, etc.) or a metal table to mount on a FPC, make sure
there is no deformation or discoloration of the connector before
mounting.
10) Please contact our sales office when using a screen-printing
thickness other than that recommended.
1) Set the soldering iron so that the tip temperature is less than
that given in the table below.
Table A
2) Do not allow flux to spread onto the connector leads or PC
board. This may lead to flux rising up to the connector inside.
3) Touch the soldering iron to the foot pattern. After the foot
pattern and connector terminal are heated, apply the solder wire
so it melts at the end of the connector terminals.
4) Be aware that soldering while applying a load on the
connector terminals may cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and clean off any solder before use.
7) These connector is low profile type. If too much solder is
supplied for hand soldering, It makes miss mating because of
interference at soldering portion. Please pay attentions.
Product name Soldering iron temperature
SMD type connectors all products 300°C within 5 sec.
350°C within 3 sec.
Notes on Using Narrow pitch Connectors/High Current Connectors
–3– ACCTB48E 201803-T
Solder reworking
Handling single components
Precautions for mating
Cleaning flux from PC board
Handling the PC board
Storage of connectors
Other Notes
1) Finish reworking in one operation.
2) In case of soldering rework of bridges. Do not use
supplementary solder flux. Doing so may cause contact
problems by flux.
3) Keep the soldering iron tip temperature below the
temperature given in Table A.
1) Make sure not to drop or allow parts to fall from work bench.
2) Excessive force applied to the terminals could cause warping,
come out, or weaken the adhesive strength of the solder. Handle
with care.
3) Do not insert or remove the connector when it is not soldered.
Forcibly applied external pressure on the terminals can weaken
the adherence of the terminals to the molded part or cause the
terminals to lose their evenness.
This product is designed with ease of handling. However, in
order to prevent the deformation or damage of contacts and
molding, take care and do not mate the connectors as shown
right.
There is no need to clean this product.
If cleaning it, pay attention to the following points to prevent the
negative effect to the product.
1) Keep the cleaning solvent clean and prevent the connector
contacts from contamination.
2) Some cleaning solvents are strong and they may dissolve the
molded part and characters, so pure water passed liquid solvent
is recommended.
Handling the PC board after mounting the connector
When cutting or bending the PC board after mounting the
connector, be careful that the soldered sections are subjected to
excessive force.
1) To prevent problems from voids or air pockets due to heat of
reflow soldering, avoid storing the connectors in areas of high
humidity.
2) Depending on the connector type, the color of the connector
may vary from connector to connector depending on when it is
produced. Some connectors may change color slightly if
subjected to ultraviolet rays during storage. This is normal and
will not affect the operation of the connector.
3) When storing the connectors with the PC boards assembled
and components already set, be careful not to stack them up so
the connectors are subjected to excessive forces.
4) Avoid storing the connectors in locations with excessive dust.
The dust may accumulate and cause improper connections at
the contact surfaces.
1) Do not remove or insert the electrified connector (in the state
of carrying current or applying voltage).
2) Dropping of the products or rough mishandling may bend or
damage the terminals and possibly hinder proper reflow
soldering.
3) Before soldering, try not to insert or remove the connector
more than absolutely necessary.
4) When coating the PC board after soldering the connector to
prevent the deterioration of insulation, perform the coating in
such a way so that the coating does not get on the connector.
5) There may be variations in the colors of products from
different production lots. This is normal.
6) The connectors are not meant to be used for switching.
7) Product failures due to condensation are not covered by
warranty.
Notes on Using Narrow pitch Connectors/High Current Connectors
–4– ACCTB48E 201803-T
Regarding sample orders to confirm proper mounting
When ordering samples to confirm proper mounting with the
placement machine, connectors are delivered in 50-piece units
in the condition given right. Consult a sale representative for
ordering sample units.
Please refer to the latest product specifications when
designing your product.
