2015-11-30 Infrared Emitter (850 nm) and green GaP-LED (570 nm) Version 1.3 SFH 7251 Features: * SMT package with IR emitter (850 nm) and green emitter (570 nm) * Suitable for SMT assembly * Available on tape and reel * Emitter and detector can be controlled separately Applications * Data transmission * Remote control * Infrared interface Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Ordering Information Type: Package: Ordering Code SFH 7251 SMT Multi TOPLED(R) Q65111A5040 2018-10-18 1 Version 1.3 SFH 7251 Maximum Ratings Parameter Symbol Values Unit Operating and storage temperature range Top; Tstg -40 ... 100 C Reverse voltage VR 5 V ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2 kV Thermal resistance junction - ambient, mounted on PC-board (FR4) 1) page 14 RthJA 700 K/W Forward current IF (DC) 70 mA Surge current (tp 10 s, D = 0) IFSM 0.7 A Power consumption Ptot 140 mW Thermal resistance junction - ambient, mounted on PC-board (FR4) 2) page 14 RthJA 500 K/W Forward current IF (DC) 50 mA Surge current (tp 10 s, D = 0) IFSM 0.1 A Power consumption Ptot 135 mW Thermal resistance junction - ambient, mounted on PC-board (FR4) 2) page 14 RthJA 500 K/W Emitter 1 Emitter 2 Note: The stated maximum ratings refer to one chip, unless otherwise specified. Characteristics (TA = 25 C) Parameter Symbol Values Unit Emitter 1 Peak wavelength (IF = 70 mA, tp = 20 ms) (typ) peak 860 nm Centroid wavelength (IF = 70 mA, tp = 20 ms) (typ) centroid 850 nm Spectral bandwidth at 50% of Imax (IF = 70 mA, tp = 20 ms) (typ) 30 nm Half angle (typ) 60 2018-10-18 2 Version 1.3 SFH 7251 Parameter Symbol Values Unit 0.2 x 0.2 mm x mm Dimensions of active chip area (typ) LxW Rise and fall time of Ie ( 10% and 90% of Ie max) (IF = 70 mA, RL = 50 ) (typ) tr, tf Forward voltage (IF = 70 mA, tp = 20 ms) Forward voltage (IF = 500 mA, tp = 100 s) 12 ns (typ (max)) VF 1.6 ( 2) V (typ (max)) VF 2.4 ( 3) V IR Reverse current (VR = 5 V) not designed for A reverse operation Total radiant flux (IF = 70 mA, tp = 20 ms) (typ) e 40 mW Radiant intensity (IF = 70 mA, tp = 20 ms) (typ) Ie, typ 12 mW/sr Radiant intensity in axial direction (IF = 70 mA, tp = 20 ms) (min) Ie, min 6.3 mW / sr Temperature coefficient of Ie or e (IF = 70 mA, tp = 20 ms) (typ) TCI -0.5 %/K Temperature coefficient of VF (IF = 70 mA, tp = 20 ms) (typ) TCV -0.7 mV / K Temperature coefficient of wavelength (IF = 70 mA, tp = 20 ms) (typ) TC 0.3 nm / K Peak emission wavelength (IF = 20 mA, tp = 20 ms) (typ) peak 572 nm Dominant wavelength (IF = 20 mA, tp = 20 ms) (typ) dom 570 nm Spectral bandwidth at 50% of Imax (IF = 20 mA, tp = 20 ms) (typ) 14 nm Half angle (typ) 60 Dimensions of active chip area (typ) LxW Rise and fall times of Ie ( 10% and 90% of Ie max) (IF = 20 mA, RL = 50 ) (typ) tr / tf Forward voltage (IF = 20 mA, tp = 20 ms) Reverse current (VR = 12 V) Emitter 2 2018-10-18 0.3 x 0.3 mm x mm 400 ns (typ (max)) VF 2.1 ( 2.5) V (typ (max)) IR 0.2 ( 10) A 3 Version 1.3 SFH 7251 Parameter Symbol Values Unit Luminous intensity (min) IV > 63 mcd Temperature coefficient of Ie or e (IF = 20 mA, tp = 20 ms) (typ) TCI -1.2 %/K Temperature coefficient of VF (IF = 20 mA, tp = 20 ms) (typ) TCV -1.3 mV / K Temperature coefficient of wavelength (IF = 20 mA, tp = 20 ms) (typ) TC 0.3 nm / K Temperature coefficient of dom (IF = 20 mA, tp = 20 ms) (typ) TC dom 0.11 nm / K Diagrams Emitter 1 Relative Spectral Emission 3) page 14 (typ) Irel = f(), TA = 25C Radiant Intensity 3) page 14 Ie / Ie(70 mA) = f(IF), single pulse, tp = 25 s, TA= 25C OHF04406 101 OHF04132 100 Ie I rel % I e (70 mA) 80 100 5 60 10-1 5 40 10-2 20 0 700 5 750 800 850 10-3 0 10 nm 950 2018-10-18 5 10 1 5 10 2 mA IF 4 10 3 Version 1.3 SFH 7251 Forward Current 3) page 14 IF = f(VF), single pulse, tp = 100 s, TA= 25C Max. Permissible Forward Current IF, max = f(TA) IF OHF03732 80 mA IF 70 OHF03826 100 A 10-1 60 5 50 10-2 40 5 30 10-3 20 5 10 0 0 20 40 60 80 10-4 100 C 120 Permissible Pulse Handling Capability IF = f(tp), TA = 25 C, duty cycle D = parameter IF 0.7 A 0.6 0.5 0.4 0.3 0.2 OHF03733 t D = TP tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0.1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 2018-10-18 0 0.5 1 1.5 2 2.5 V 3 VF TA 5 Version 1.3 SFH 7251 Diagrams Emitter 2 Relative Spectral Emission 3) page 14 Irel = f (); TA = 25 C; IF = 20 mA Irel [%] 1.0 SFH 7251 0.8 0.6 0.4 0.2 0.0 520 540 560 580 600 620 [nm] Relative Luminous Intensity 3) page 14 Iv / Iv(20 mA) = f(IF), TA = 25 C Max. Permissible Forward Current IF, max = f(TA) IF OHF05628 60 mA 50 40 30 20 10 0 0 20 40 60 80 C 100 TA 2018-10-18 6 Version 1.3 SFH 7251 Forward Current 3) page 14 IF = f(VF), single pulse, tp = 100 s, TA= 25C Permissible Pulse Handling Capability IF = f(tp), TA = 25 C, duty cycle D = parameter 0.12 A IF 0.10 0.09 0.08 0.07 OHF05629 t D = TP tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 0.06 0.05 0.04 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp Package Outline Dimensions in mm (inch). 2018-10-18 7 Version 1.3 SFH 7251 Pinning Pin Description 1 Cathode Emitter 1 (850nm) 2 Anode Emitter 1 (850nm) 3 Cathode Emitter 2 (570nm) 4 Anode Emitter 2 (570nm) Package SMT Multi TOPLED Approximate Weight: 34 mg Recommended Solder Pad Dimensions in mm (inch). 2018-10-18 8 Version 1.3 SFH 7251 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 150 200 s 300 250 t OHA04612 Profile Feature Profil-Charakteristik Symbol Symbol Pb-Free (SnAgCu) Assembly Minimum Ramp-up rate to preheat*) 25 C to 150 C Time tS TSmin to TSmax tS 60 Ramp-up rate to peak*) TSmax to TP Recommendation Maximum 2 3 100 120 2 3 Unit Einheit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 C Time within 5 C of the specified peak temperature TP - 5 K tP 20 30 s 3 6 K/s 10 Ramp-down rate* TP to 100 C 480 Time 25 C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 2018-10-18 C 9 s Version 1.3 SFH 7251 Taping 2.9 (0.114) 4 (0.157) 8 (0.315) Cathode/Collector Marking 1.75 (0.069) 2 (0.079) 3.5 (0.138) 4 (0.157) 3.6 (0.142) 1.5 (0.059) OHAY0536 Dimensions in mm (inch). Tape and Reel 8 mm tape with 2000 pcs. on 180 mm reel, 8000 pcs. on 330 mm reel W1 D0 P0 A N F W E 13.0 0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 2018-10-18 10 Version 1.3 SFH 7251 Tape dimensions [mm] Tape dimensions in mm W P0 P1 P2 D0 E F 8 + 0.3 / -0.1 4 0.1 2 0.05 or 4 0.1 2 0.05 1.5 0.1 1.75 0.1 3.5 0.05 Reel dimensions [mm] Reel dimensions in mm A W Nmin W1 W2max 180 8 60 8.4 + 2 14.4 A W Nmin W1 W2max 330 8 60 8.4 + 2 14.4 Reel dimensions in mm Barcode-Product-Label (BPL) Dry Packing Process and Materials Moisture-sensitive label or print L VE el LE see . lab e H) nk, (R bla cod If y bar . dit RH mi % hu e /60 ve ed ag C ati rar ck rel 30 _ < inf pa % of to ak 90 urs d ). < ns (pe or urs d Ho de , cte itio urs Ho an bje ing co C 72 nd Ho urs 5 te 48 C su ss e Ho co ce 24 6 da e y 40 be tim C e th < tor ll pro tim or ). 23 tim e at t wi ntC or l wi fac Flo tim s at or ca at re. Flo d tha ale el or nth nti Flo uiv du if: rea es l 4 5 Flo lab mo ide ce eq low g, l ve vic is be or de 24 tin en l 5a6 pro ve Le de , e te co , g: ve l un wh Le ke r se da ure ba ed low ba Le ve mo % ba e al d ure Le ist en ref e e 10 tim ure se for ist > ale op se for , Mo se 3 ist ure is or . , is ha se Mo nk be ist nk rd g -03 Mo in n Flo r-p RH g, bla Mo ba TD po If blathi % kin Ca life s (if ar t. wi 10 ba tor J-S thi, va p. elf Ye ar ks _ < e icat me , C 1 Ye ee urs Sh terlow tem ted at ed uir > 1 W Ho un Af Indno uir DE dy 1. d e 4 8 ref reqy is 2. JE bo e Mo ore tim 16 req : C/ e es dit2b a) St tim or mi IP ed or g is tim e vic b) or e Hu Flo en tim or De 2a kin nc te Flo a) op or 3. b) baere Flo da e l 1 2 Flo If al ref tim ve l 4. se d l 2a3 ve Le g an ve l Le Ba te ure Le ve ure Le ist Da ure ist Mo ist ure Mo ist Mo Mo Barcode label N s VE RS ainITI TO ntNSUC TIO U g coSEND CO Ais baRE TU MI CThIS SE MO TO OP M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 AM Desiccant OSR OHA00539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC. 2018-10-18 11 Version 1.3 SFH 7251 Transportation Packing and Materials Barcode label el . H) 8 D) Y DE M R 18 + Q -1 -1 P P: OU GR D/ C: 00 21 99 8 (9 21 20 : TY : (Q 5 14 2 T LO T) (1 : NO M DE + Q -1 R 18 P -1 G RO UP : (G ) C: 99 D/ (Q )Q TY : SR AM 20 00 O 21 u M 00 (9 D) n d 21 o : 34 NO 5 14 2 em H 12 S TC H O D (X ) PR NO O : (1 T) 11 00 LO T (6 P) NO : 12 BA 3G O S R ic A 01 ct pto o rs 44 Muster Y Bi n2 : P- n3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: (X ) PR OD C M u L lt S iT Y O T67 P L 6 E Bi D Bi n1 )Q on M du O ct pto or s R A 34 ic O S NO NO (6 P) : 12 S 3G BA TC H em H 12 . RH 0% /6 C 01 44 (R ty idi m e ag _ < s ur s ). ur s Ho de ur s Ho co 72 Ho ur te 48 e Ho 24 6 da e 40 be ry tim C e Th STSE r th < ll pr tim cto ). r OI oo 23 wi nt tim e at l wi fa r M TO Fl oo tim s at at ale C at e. ica Fl th oo r th ur el OP nt Fl oo on es uiv if: read ed l 4 5 Fl , lab m ide eq low l oc ve vic is ingen be or de 24 l 5a6 pr ve Le de nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo Le ve tu re m % ba e ba al d Le r en re tu re e re 10 ois tim se fo tu re ale op se fo > , M r se ois 3 is , is ha se M ois tu nk be oo . 03 nk g rd M ois in r-p bla in Fl RH g, DM ba po If blath % kin Ca life is (if . ar ST p. wi 10 baator et Jelf r th va Ye ar ks s m _ < m ed 1 Ye ee ur d, C iredic t Sh te w, te at nt > 1 W Ho Af flody qu In no ire DE 1. e 4 8 ou re ed is re qu JE ty 2. bo e M or tim 16 re C/ : e es idi 2b r a) St tim mor is IP ed r oo tim e vic b) g e r Hu Fl en oo tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 2 Fl If al re tim ve l 4. se d l 2a3 ve Le g an ve l Le re Ba te Le ve tu re Le tu Da ois re tu re M ois M ois tu M ois M 11 00 bla r ba d re lat ra ck re 30 Nns IVEORS inf pa % k ai IT of to 90 ea d ntNS CT < ns (p TIO or d , cteg DU itio U g EcoSE an bje C sin nd ON 5 C su es Ais ba IC co UR M oc 00 see lab e nk, cod If hu ive ) L E V LE (G M u L lt S iT Y O T67 P L 6 Muster E Bi D Bi n1 Bi n2 : Pn3 : Q- 1: 1- 20 M 20 2 L Te 2a 22 m 3 24 0 p ST Ad 26 0 C R 0 C R0 dit ion C R PA 77 al RT CK TE VA XT R: Barcode label Packing Sealing label Dimensions of transportation box in mm Width Length Height 200 5?352 5 195 5?352 5 30 5?33 5 2018-10-18 12 OHA02044 Version 1.3 SFH 7251 Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.?If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. ?By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2018-10-18 13 Version 1.3 SFH 7251 Glossary 1) both chips on 2) only one chip on 3) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2018-10-18 14 Version 1.3 SFH 7251 ? Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. 2018-10-18 15