© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
MLA Varistor Series RoHS
Description
The MLA Series family of transient voltage surge
suppression devices is based on the Littelfuse Multilayer
fabrication technology. These components are designed
to suppress a variety of transient events, including those
specified in IEC 61000-4-2 or other standards used for
Electromagnetic Compliance (EMC). The MLA Series is
typically applied to protect integrated circuits and other
components at the circuit board level.
The wide operating voltage and energy range make the
MLA Series suitable for numerous applications on power
supply, control and signal lines.
The MLA Series is manufactured from semiconducting
ceramics, and is supplied in a leadless, surface mount
package. The MLA Series is compatible with modern
reflow and wave soldering procedures.
It can operate over a wider temperature range than Zener
diodes, and has a much smaller footprint than plastic-
housed components.
Littelfuse Inc. manufactures other multilayer series
products. See the MLE Series data sheet for ESD
applications, MHS Series data sheet for high-speed ESD
applications, the MLN Series for multiline protection and
the AUML Series for automotive applications.
Features
• Halogen-Free and
RoHS compliant
• Leadless 0402,
0603, 0805, 1206
and 1210 chip sizes
• Multilayer ceramic
construction
technology
• -55°C to +125°C
operating temp. range
• Operating voltage
range VM(DC) =
5.5V to 120V
• Rated for surge
current (8 x 20µs)
• Rated for energy
(10 x 1000µs)
• Inherent bi-directional
clamping
• Standard low
capacitance
types available
• ESD rated to IEC
61000-4-2, Level 4: Air
Discharge 15KV and
Contact Discharge 8KV
Applications
• Suppression of
inductive switching
or other transient
events such as EFT
and surge voltage at
the circuit board level
• ESD protection for IEC
61000-4-2 (Level 4),
MIL-STD-883 method
3015.7, and other
industry specifications
(see also the MLE
or MLN Series)
• Provides on-board
transient voltage
protection for ICS
and transistors
• Used to help achieve
electromagnetic
compliance of
end products
• Replace larger surface
mount TVS Zeners in
many applications
Size Table
Metric EIA
1005 0402
1608 0603
2012 0805
3216 1206
3225 1210
Absolute Maximum Ratings
Continuous ML Series Units
Steady State Applied Voltage:
DC Voltage Range (VM(DC)) 3.5 to 120 V
AC Voltage Range (VM(AC)RMS) 2.5 to 107 V
Transient:
Non-Repetitive Surge Current, 8/20µs
Waveform, (ITM)4 to 500 A
Non-Repetitive Surge Energy,
10/10 0 0µs Waveform, (WTM)
0.02 to
2.5 J
Operating Ambient Temperature Range (TA)-55 to
+125 ºC
Storage Temperature Range (TSTG)-55 to
+150 ºC
Temperature Coefficient (αV) of Clamping
Voltage (VC) at Specified Test Current <0.01 %/º C
• For ratings of individual members of a series, see device ratings and specifications table.
Additional Information
Datasheet Samples
Resources
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Device Ratings and Specifications
Part Number
Maximum Ratings (125º C)Specifications (25ºC)
Maximum
Continuous
Working Voltage
Maximum Non-
repetitive Surge
Current (8/20µs)
Maximum Non-
repetitive Surge
Energy (10/1000µs)
Maximum Clamping
Voltage at 1A (or as
Noted) (8/20µs)
Nominal Voltage
at 1mA DC Test
Current
Typical
Capacitance
at f = 1MHz
VM(DC) VM(AC) ITM WTM VCVN(DC) Min VN(DC) Max C
(V) (V) (A) (J) (V) (V) (V) (pF)
V3.5MLA0603N53.5 2.5 30 0.100 13.0 3.7 7. 0 1270
V3.5MLA0805N 3.5 2.5 120 0.300 13.0 3.7 7. 0 1760
V3.5MLA0805LN 3.5 2.5 40 0.100 13.0 3.7 7. 0 1380
V3.5MLA1206N 3.5 2.5 10 0 0.300 13.0 3.7 7. 0 5800
V5.5MLA0402N 5.5 4.0 20 0.050 21.0 7. 1 10.8 220
V5.5MLA0402F85.5 4.0 20 0.050 21.0 7.1 10.8 220
V5.5MLA0402LN 5.5 4.0 20 0.050 39.0 15.9 21.5 70
V5.5MLA0402LF85.5 4.0 20 0.05 39 15.9 21.5 70
V5.5MLA0603N55.5 4.0 30 0.100 1 7. 5 7. 1 9.3 960
V5.5MLA0603LN45.5 4.0 30 0.100 1 7. 5 7. 1 9.3 450
V5.5MLA0603LF85.5 4.0 30 0.100 17.5 7.1 9.3 450
V5.5MLA0805N 5.5 4.0 120 0.300 1 7. 5 7. 1 9.3 1200
V5.5MLA0805LN 5.5 4.0 40 0.100 1 7. 5 7. 1 9.3 660
V5.5MLA1206N 5.5 4.0 150 0.400 1 7. 5 7. 1 9.3 2800
V9MLA0402N 9.0 6.5 20 0.050 30.0 11. 0 16.0 120
V9MLA0402F89.0 6.5 20 0.050 30.0 11.0 16.0 120
V9MLA0402LN 9.0 6.5 4 0.020 35.0 11. 0 16.0 33
V9MLA0402LF89.0 6.5 4 0.020 35.0 11.0 16.0 33
V9MLA0603N59.0 6.5 30 0.100 25.5 11. 0 16.0 490
V9MLA0603LN49.0 6.5 30 0.100 25.5 11. 0 16.0 360
V9MLA0603LF89.0 6.5 30 0.100 25.5 11.0 16.0 360
V9MLA0805LN 9.0 6.5 40 0.100 25.5 11. 0 16.0 320
V12MLA0805LN 12.0 9.0 40 0.100 29.0 14.0 18.5 220
V14MLA0402N 14.0 10.0 20 0.050 39.0 15.9 21.5 70
V14MLA0402F814.0 10.0 20 0.050 39.0 15.9 21.5 70
V14MLA0603N 14.0 10.0 30 0.100 34.5 15.9 21.5 80
V14MLA0603F814.0 10.0 30 0.100 34.5 15.9 21.5 180
V14MLA0805N 14.0 10.0 120 0.300 32.0 15.9 20.3 360
V14MLA0805LN 14.0 10.0 40 0.100 32.0 15.9 20.3 200
V14MLA1206N 14.0 10.0 150 0.400 32.0 15.9 20.3 800
V18MLA0402N 18.0 14.0 20 0.050 50.0 22.0 28.0 40
V18MLA0402F818.0 14.0 20 0.050 50.0 22.0 28.0 40
V18MLA0603N 18.0 14.0 30 0.100 50.0 22.0 28.0 60
V18MLA0603F818.0 14.0 30 0.100 50.0 22.0 28.0 120
V18MLA0805N 18.0 14.0 120 0.300 44.0 22.0 28.0 260
V18MLA0805LN 18.0 14.0 40 0.100 44.0 22.0 28.0 170
V18MLA1206N 18.0 14.0 150 0.400 44.0 22.0 28.0 1030
V18MLA1210N 18.0 14.0 500 2.500 44.0 at 2.5 22.0 28.0 2500
V18MLA1812N718.0 14.0 1000 2.900 44.0 at 5 22.0 28.0 4050
V26MLA0603N 26.0 20.0 30 0.100 60.0 31.0 38.0 55
V26MLA0603F826.0 20.0 30 0.100 60.0 31.0 38.0 110
V26MLA0805N 26.0 20.0 10 0 0.300 60.0 29.5 38.5 110
V26MLA0805LN 26.0 20.0 40 0.100 60.0 29.5 38.5 90
V26MLA1206N 26.0 20.0 150 0.600 60.0 29.5 38.5 630
V26MLA1210N 26.0 20.0 300 1.200 60.0 at 2.5 29.5 38.5 1250
V30MLA0603N 30.0 25.0 30 0.100 74.0 37.0 46.0 45
V30MLA0603F830.0 25.0 30 0.100 74.0 37.0 46.0 90
V30MLA0805LN 30.0 25.0 30 0.100 72.0 37.0 46.0 85
V30MLA1206N 30.0 25.0 180 1.000 67.0 35.0 43.0 400
V30MLA1210N 30.0 25.0 280 1.200 68.0 at 2.5 35.0 43.0 685
V30MLA1210LN 30.0 25.0 220 0.900 68.0 at 2.5 35.0 43.0 500
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
NOTES: 1 'L' suffix is a low capacitance and energy version; Contact your Littelfuse sales representative for custom capacitance requirements.
2 Typical leakage at 25ºC<25µA, maximum leakage 100µA at VM(DC); for 0402 size, typical leakage <5µA, maximum leakage <20µA at VM(DC).
3 Average power dissipation of transients for 0402, 0603, 0805, 1206 and 1210 sizes not to exceed 0.03W, 0.05W, 0.1W, 0.1W and 0.15W respectively.
4 Item is available as 'R' packing option only. All 0402 size items available as 'R' packaging option only. See Packaging section for additional information.
5 Item is available in 'H','T'and 'A' packing option only. All 0805, 1206 and 1210 parts come as 'H','T'and 'A' packing option only. See Packaging section for additional information.
6. The typical capacitance rating is the discrete component test result.
7. Item is available in "T" packing option only.
8. Item is available in "R" packing option only, and lead free.
Part Number
Maximum Ratings (125º C)Specifications (25ºC)
Maximum
Continuous
Working Voltage
Maximum Non-
repetitive Surge
Current (8/20µs)
Maximum Non-
repetitive Surge
Energy (10/1000µs)
Maximum Clamping
Voltage at 1A (or as
Noted) (8/20µs)
Nominal Voltage
at 1mA DC Test
Current
Typical
Capacitance
at f = 1MHz
VM(DC) VM(AC) ITM WTM VCVN(DC) Min VN(DC) Max C
(V) (V) (A) (J) (V) (V) (V) (pF)
V30MLA1812N730.0 25.0 800 3.700 65.0 at 5 35.0 43.0 1900
V33MLA1206N 33.0 26.0 180 0.800 75.0 38.0 49.0 390
V38MLA1812N738.0 30.0 800 4.500 77.0 at 5 43.0 52.0 1450
V42MLA1206N 42.0 30.0 180 0.800 92.0 46.0 60.0 345
V45MLA1812N745.0 35.0 500 4.000 90.0 at 5 50.4 61.6 1200
V48MLA1206N 48.0 40.0 180 0.900 100.0 54.5 66.5 185
V48MLA1210N 48.0 40.0 250 1.200 105.0 at 2.5 54.5 66.5 400
V48MLA1210LN 48.0 40.0 220 0.900 105.0 at 2.5 54.5 66.5 380
V56MLA1206N 56.0 40.0 180 1.000 120.0 61.0 77.0 180
V60MLA1210N 60.0 50.0 250 1.500 130.0 at 2.5 67.0 83.0 230
V68MLA1206N 68.0 50.0 180 1.000 140.0 76.0 90.0 130
V85MLA1210N 85.0 67.0 250 2.500 180.0 at 2.5 95.0 115.0 160
V120MLA1210N 120.0 107.0 125 2.000 260.0 at 2.5 135.0 165.0 70
Device Ratings and Specifications (Continue...)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Peak Current and Energy Derating Curve
When transients occur in rapid succession, the average
power dissipation is the energy (watt-seconds) per pulse
times the number of pulses per second. The power so
developed must be within the specifications shown
on the Device Ratings and Specifications Table for the
specific device. For applications exceeding 125°C ambient
temperature, the peak surge current and energy ratings
must be derated as shown below.
100
80
60
40
20
0
-55 50 60 70 80 90 100110 120130 140150
PERCENT OF RATED VALUE
AMBIENT TEMPERATURE ( oC)
FIGURE 1. PEAK CURRENT AND ENERGY
DERATING CURVE
T
1
T
2
100
50
0
O1TIME
PERCENT OF PEAK
VALUE
O1 = VIRTUAL ORIGIN OF WAVE
t1 = VIRTUAL FRONT TIME = 1.25 x t
(IMPULSE DURATION)
t = TIME FROM 10% TO 90% OF PEAK
t2 = VIRTUAL TIME TO HALF VALUE
EXAMPLE:
FOR AN 8/20 s CURRENT WAVEFORM
8s = t1 = VIRTUAL FRONT TIME
20 s = t2 = VIRTUAL TIME TO
HALF VALUE
FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM
FOR CLAMPING VOLTAGE
T
Peak Pulse Current Test Waveform for Clamping Voltage
Limit V-I Characteristic for V9MLA0402L
Limit V-I Characteristic for V5.5MLA0402 to V18MLA0402
1
10
100
1µA 10µA 100µA 1mA 10mA 1A 10A100A
V9MLA0402L
V5.5MLA0402L
Varistor Voltage (V)
MLA0402L Limit VI Curves
Current (A)
1
10
100
1µA 10µA 100µA 1mA 10mA 1A 10A100A
Current (A)
V18MLA0402
V14MLA0402
V9MLA0402
V5.5MLA0402
Varistor Voltage (V)
MLA0402 Limit VI Curves
01 = Virtual Origin of Wave
T = Time from 10% to 90% of Peak
T1 = Rise Time = 1.25 x T
T2 = Decay Time
Example - For an 8/20 µs Current Waveform:
8µs = T1 = Rise Time
20µs = T2 = Decay Time
Figure 1
Figure 2
Figure 3 Figure 4
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Limit V-I Characteristic for V3.5MLA1206 to V68MLA1206
Limit V-I Characteristic for V3.5MLA0805 to V26MLA0805
1
10
100
1000
10µA 100µA 1mA 10mA 100mA 1A 10A100A1000A
V5.5MLA0805
V3.5MLA0805
V14MLA0805
V18MLA0805
V26MLA0805
FIGURE 7. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805 TO V26MLA0805
Varistor Voltage (V)
Current (A)
Limit V-I Characteristic for V18MLA1210 to V120MLA1210
1
10
100
1000
10
µA
100
µA
1mA 10mA 100mA 1A 10A100A1000A
Current (A)
V68MLA1206
V56MLA1206
V42MLA1206
V33MLA1206
V26MLA1206
V18MLA1206
V14MLA1206
V5.5MLA1206
V3.5MLA1206
Varistor Voltage (V)
FIGURE 6. LIMIT V-1 CHARACTERISTIC FOR V3.5MLA1206 TO V68MLA1206
FIGURE 9. LIMIT V-I CHARACTERISTIC FOR V18MLA1210 TO V120MLA1210
1mA10µA 100µA
CURRENT (A)
10mA 100mA 1A 10A100A 1000A
MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
V60MLA1210
V85MLA1210
V120MLA1210
V48MLA1210, V48MLA1210L
V30MLA1210, V30MLA1210L
V26MLA1210
V18MLA1210
100
10
Varistor Voltage (V)
1000
1
Figure 7 Figure 8
Figure 9
Limit V-I Characteristic for V3.5MLA0603 to V30MLA0603 Limit V-I Characteristic for V3.5MLA0805L to V30MLA0805L
1
10
100
1000
10µA 100µA 1mA 10mA 100mA 1A 10A100A
V5.5MLA0805L
V3.5MLA0805L
V9MLA0805L
V12MLA0805L
V14MLA0805L
V18MLA0805L
V26MLA0805L
V30MLA0805L
FIGURE 6. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805L TO V30MLA0805L
Varistor Voltage (V)
Current (A)
1
10
100
1000
10
µA
100
µA
1mA 10mA 100mA 1A 10A100A
V30MLA0603
V26MLA0603
V18MLA0603
V14MLA0603
V9MLA0603, V9MLA0603L
V5.5MLA0603, V5.5MLA0603L
V3.5MLA0603
Varistor Voltage (V)
Current (A)
FIGURE 5. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0603 TO V30MLA0603
Figure 5 Figure 6
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Device Characteristics
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance modex (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100µA, typically 25µA;
for 0402 size below 20µA, typically 5µA.
100%
1E-9 1E-8
SUPPRESSOR CURRENT (ADC)
10%
1E-7 1E-6 1E-5 1E-4 1E-3 1E-2
25 50 75 100125oC
SUPPRESSOR VOLTAGE IN PERCENT OF
VNOM VALUE AT 25 oC (%)
FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC
CURVE IN THE LEAKAGE REGION
o
oo
o
Clamping Voltage Over Temperature (VC at 10A)
100
10
20
V26MLA1206
40 60 80 100120 140
TEMPERATURE (oC)
CLAMPING VO LTAG E (V)
V5.5MLA1206
0-20-40-60
FIGURE 12. CLAMPING VOLTAGE OVER TEMPERATURE
(VC AT 10A)
Typical Temperature Dependance of the Haracteristic
Curve in the Leakage Region
Speed of Response
The Multilayer Suppressor is a leadless device. Its
response time is not limited by the parasitic lead
inductances found in other surface mount packages.
The response time of the ZNO dielectric material is less
than 1ns and the MLA can clamp very fast dV/dT events
such as ESD. Additionally, in "real world" applications,
the associated circuit wiring is often the greatest
factor effecting speed of response. Therefore, transient
suppressor placement within a circuit can be considered
important in certain instances.
GRAINS
DEPLETION
FIRED CERAMIC
DIELECTRIC
REGION
METAL
ELECTRODES
DEPLETION
REGION
METAL END
TERMINATION
FIGURE 11. MULTILAYER INTERNAL CONSTRUCTION
Multilayer Internal Construction
Energy Absorption/Peak Current Capability
Energy dissipated within the MLA Series is calculated
by multiplying the clamping voltage, transient current
and transient duration. An important advantage of the
multilayer is its interdigitated electrode construction within
the mass of dielectric material. This results in excellent
current distribution and the peak temperature per energy
absorbed is very low. The matrix of semiconducting grains
combine to absorb and distribute transient energy (heat)
(see Speed of Response). This dramatically reduces peak
temperature; thermal stresses and enhances device
reliability.
As a measure of the device capability in energy and peak
current handling, the V26MLA1206A part was tested with
multiple pulses at its peak current rating (3A, 8/20µs). At
the end of the test,10,000 pulses later, the device voltage
characteristics are still well within specification.
100
10
0
V26MLA1206
2000 4000 6000 8000 10000 12000
NUMBER OF PULSES
VO LTAGE
FIGURE 13. REPETITIVE PULSE CAPABILITY
PEAK CURRENT = 3A
8/20 s DURATION, 30s BETWEEN PULSES
Repetitive Pulse Capability
Figure 10
Figure 11
Figure 12
Figure 13
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
The recommended solder for the MLA suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MLA chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50º C before cleaning.
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel Barrier Termination option (see
"N" suffix in Part Numbering System for ordering) for the
optimum Lead–free solder performance, consisting of a
Matte Tin outer surface plated on Nickel underlayer, plated
on Silver base metal.
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 15.WAVE SOLDER PROFILE
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
TIME (MINUTES)
300
250
200
150
100
50
0
0.0 0.5 1. 01.5 2.0 2.5 3.0 3.5 4.0 4.5
MAXIMUM WAVE 260°C
SECOND PREHEAT
FIRST PREHEAT
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
PREHEAT ZONE
RAMP RATE
<3˚C/s 60 - 150 SEC
> 217˚C
PREHEAT ZONE
PREHEAT DWELL
RAMP RATE
<2°C/s
MAXIMUM TEMPERATURE
230°C
TEMPERATURE °C
TIME (MINUTES)
250
200
150
100
50
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
40-80
SECONDS
ABOVE 183°C
TEMPERATURE °C
TEMPERATURE °C
TIME (MINUTES)
300
250
200
150
100
50
00 1.0 2.0 3.0 4.0 5.0 6.0 7. 0
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 15.WAVE SOLDER PROFILE
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
TIME (MINUTES)
300
250
200
150
100
50
0
0.0 0.5 1. 01.5 2.0 2.5 3.0 3.5 4.0 4.5
MAXIMUM WAVE 260°C
SECOND PREHEAT
FIRST PREHEAT
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
PREHEAT ZONE
RAMP RATE
<3˚C/s 60 - 150 SEC
> 217˚C
PREHEAT ZONE
PREHEAT DWELL
RAMP RATE
<2°C/s
MAXIMUM TEMPERATURE
230°C
TEMPERATURE °C
TIME (MINUTES)
250
200
150
100
50
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
40-80
SECONDS
ABOVE 183°C
TEMPERATURE °C
TEMPERATURE °C
TIME (MINUTES)
300
250
200
150
100
50
00 1.0 2.0 3.0 4.0 5.0 6.0 7. 0
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 15.WAVE SOLDER PROFILE
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
TIME (MINUTES)
300
250
200
150
100
50
0
0.0 0.5 1. 01.5 2.0 2.5 3.0 3.5 4.0 4.5
MAXIMUM WAVE 260°C
SECOND PREHEAT
FIRST PREHEAT
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
PREHEAT ZONE
RAMP RATE
<3˚C/s 60 - 150 SEC
> 217˚C
PREHEAT ZONE
PREHEAT DWELL
RAMP RATE
<2°C/s
MAXIMUM TEMPERATURE
230°C
TEMPERATURE °C
TIME (MINUTES)
250
200
150
100
50
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
40-80
SECONDS
ABOVE 183°C
TEMPERATURE °C
TEMPERATURE °C
TIME (MINUTES)
300
250
200
150
100
50
00 1.0 2.0 3.0 4.0 5.0 6.0 7. 0
Reflow Solder Profile
Wave Solder Profile
Lead–free Re-flow Solder Profile
Figure 14
Figure 15
Figure 16
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Product Dimensions (mm)
NOTE : Avoid metal runs in this area, parts not recommended for use in applications using
Silver (Ag) epoxy paste.
PAD LAYOUT DIMENSIONS
C
B
A
NOTE: Avoid metal runs in this area.
Parts not recommended for use in
applications using silver epoxy paste.
NOTE
CHIP LAYOUT DIMENSIONS
E
L
W
D
Dimension 1210 Size 1206 Size 0805 Size 0603 Size 0402 Size
IN MM IN MM IN MM IN MM IN MM
A0.160 4.06 0.160 4.06 0.120 3.05 0.100 2.54 0.067 1.70
B0.100 2.54 0.065 1.65 0.050 1.27 0.030 0.76 0.020 0.51
C0.040 1.02 0.040 1.02 0.040 1.02 0.035 0.89 0.024 0.61
D (max.) 0.113 2.87 0.071 1.80 0.043 1. 10 0.040 1. 0 0 0.024 0.60
E0.020
-/+0.010
0.50
-/+0.25
0.020
-/+0.010
0.50
-/+0.25
0.020 -/+
0.010
0.50 -/+
0.25
0.015
-/+0.008
0.4
-/+0.20
0.010
-/+0.006
0.25
-/+0.15
L0.125
-/+0.012
3.20
-/+0.30
0.125
-/+0.012
3.20
-/+0.30
0.079
-/+0.008
2.01
-/+0.20
0.063
-/+0.006
1.6
-/+0.15
0.039
-/+0.004
1.00
-/+0.10
W0.100
-/+0.012
2.54
-/+0.30
0.060
-/+0.011
1.60
-/+0.28
0.049
-/+0.008
1.25
-/+0.20
0.032
-/+0.060
0.8
-/+0.15
0.020
-/+0.004
0.50
-/+0.10
Part Numbering System
V18 1206
PACKING OPTIONS (see Packaging table for quantities)
DEVICE SIZE:
DEVICE FAMILY
Littelfuse TVS Device
X
MAXIMUM DC
WORKING VOLTAGE
MLA X X
CAPACITANCE OPTION
No Letter:Standard
L: Low Capacitance Version
END TERMINATION OPTION
MULTILAYER SERIES
DESIGNATOR N, F or No letter:
Nickel Barrier Option
(Matte Tin outer surface, plated on Nickel underlayer
plated on silver base metal)
T: 13in (330mm) Diameter Reel, Plastic Carrier Tape
H: 7in (178mm) Diameter Reel, Plastic Carrier Tape
R: 7in (178mm) Diameter Reel, Paper Carrier Tape
A: Bulk Pack
0201 = .024 inch x .012 inch (0.6 mm x 0.3 mm)
0402 = .04 inch x .02 inch (1.0 mm x 0.5 mm)
0603 = .063 inch x .031 inch (1.6 mm x 0.8 mm)
0805 = .08 inch x .08 inch (2.0 mm x 1.25 mm)
1206 = .126 inch x .063 inch (3.2 mm x 1.6 mm)
1210 = .126 inch x .1 inch (3.2 mm x 2.5 mm)
Packaging*
Device Size
Quantity
13” Inch Reel
("T" Option)
7” Inch Reel
("H" Option)
7” Inch Reel
("R" Option)
Bulk Pack
("A" Option)
1812 4,000 N/A N/A N/A
1210 8,000 2,000 N/A 2,000
1206 10,000 2,500 N/A 2,500
0805 10,000 2,500 N/A 2,500
0603 10,000 2,500 4,000 2,500
0402 N/A N/A 10,000 N/A
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
*NOTES:
1 V120MLA1210 standard shipping quantities are 1000 pieces per reel for the "H" option and 4000 pieces per reel for "T" option.
2 V3.5 MLA0603, V5.5MLA0603 and V9MLA0603 only available in "H," "T" and "A" packing options.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Tape and Reel Specifications
Symbol Description Dimensions in Millimeters
0402 Size 0603, 0805, 1206 & 1210 Sizes
A0Width of Cavity Dependent on Chip Size to Minimize Rotation.
B0Length of Cavity Dependent on Chip Size to Minimize Rotation.
K0Depth of Cavity Dependent on Chip Size to Minimize Rotation.
WWidth of Tape 8 -/+0.2 8 -/+0.3
FDistance Between Drive Hole Centers and Cavity Centers 3.5 -/+0.05 3.5 -/+0.05
EDistance Between Drive Hole Centers and Tape Edge 1.75 -/+0.1 1.75 -/+0.1
P1Distance Between Cavity Centers 2-/+0.05 4 -/+0.1
P2Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2 -/+0.1 2 -/+0.1
P0Axial Drive Distance Between Drive Hole Centers 4 -/+0.1 4 -/+0.1
D0Drive Hole Diameter 1.55 -/+0.05 1.55 -/+0.05
D1Diameter of Cavity Piercing N/A 1.05 -/+0.05
T1Top Tape Thickness 0.1 Max 0.1 Max
NOTES:
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
K0
t1
D0P0
D1
P1A0
P2
B0
F
E
W
For T and H Pack Options: PLASTIC CARRIER TAPE
For R Pack Options: EMBOSSED PAPER CARRIER TAPE
EMBOSSMENT
TOP TAPE 8mm
NOMINAL
PRODUCT
IDENTIFYING
LABEL
178mm
OR 330mm
DIA. REEL
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
