October 1992
AVIONICS APPLICATIONS
RF & MICROWAVE TRANSISTORS
.280 4LSL (S051)
epoxy sealed
.REFRACTORY/GOLD METALLIZATION
.EMITTER SITE BALLASTED
.∞:1 VSWR CAPABILITY
.LOW THERMAL RESISTANCE
.INPUT MATCHING
.OVERLAY GEOMETRY
.METAL/CERAMIC HERMETIC PACKAGE
.POUT =35 W MIN. WITH 10.7 dB GAIN
DESCRIPTION
The MSC81035MP is a medium power Class C
transistor designed specifically for pulsed L-Band
avionics applications. This device is a direct re-
placement for the MSC1035MP. MSC81035MP of-
fers improved saturated ouput power and collector
efficiency based on the test circuit described
herein.
Low RFthermal resistance and computerized auto-
matic wire bonding techniques ensure high relia-
bility and product consistency.
The MSC81035MP ishoused inthe IMPACpack-
age with internal input matching.
PIN CONNECTION
BRANDING
81035MP
ORDER CODE
MSC81035MP
ABSOLUTE MAXIMUM RATINGS (Tcase =25°C)
Symbol Parameter Value Unit
PDISS Power Dissipation* (TC≤100°C) 150 W
ICDevice Current* 3.0 A
VCC Collector-Supply Voltage* 55 V
TJJunction Temperature (Pulsed RF Operation) 250 °C
TSTG Storage Temperature −65 to +150 °C
RTH(j-c) Junction-Case Thermal Resistance* 1.0 °C/W
*Appliesonly to ratedRF amplifier operation
Note: Thermal Resistance determined by Infra-Red Scanning of Hot-Spot
Junction Temperature at ratedRF operating conditions.
MSC81035MP
1. Collector 3. Emitter
2. Base 4. Base
THERMAL DATA
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