TC74ACT244FW-ELP - TOSHIBA

February, 2015 − Rev. 8 1Publication Order Number:

MC74AC244/D

MC74AC244, MC74ACT244

Octal Buffer/Line Driver

with 3-State Outputs

The MC74AC244/74ACT244 is an octal buffer and line driver

designed to be employed as a memory address driver, clock driver and

bus oriented transmitter/receiver which provides improved PC board

density.

Features

•3−State Outputs Drive Bus Lines or Buffer Memory Address

Registers

•Outputs Source/Sink 24 mA

•′ACT244 Has TTL Compatible Inputs

•These are Pb−Free Devices

1920 18 17 16 15 14

21 34567

VCC

OE2

OE1GND

Pinout: 20−Lead Packages Conductors (Top View)

TRUTH TABLE

Inputs Outputs

OE1D(Pins 12, 14, 16, 18)

L L L

L H H

H X Z

NOTE: H = HIGH Voltage Level

L = LOW Voltage Level

X = Immaterial

Z = High Impedance

TRUTH TABLE

Inputs Outputs

OE2D(Pins 3, 5, 7, 9)

L L L

L H H

H X Z

NOTE: H = HIGH Voltage Level

L = LOW Voltage Level

X = Immaterial

Z = High Impedance

See general marking information in the device marking

section on page 5 of this data sheet.

DEVICE MARKING INFORMATION

SOIC−20W

DW SUFFIX

CASE 751D

TSSOP−20

DT SUFFIX

CASE 948E

www.onsemi.com

See detailed ordering and shipping information in the package

dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

MC74AC244, MC74ACT244

www.onsemi.com

MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V

VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V

VOUT DC Output Voltage (Referenced to GND) (Note 1) −0.5 to VCC +0.5 V

IIK DC Input Diode Current ±20 mA

IOK DC Output Diode Current ±50 mA

IOUT DC Output Sink/Source Current ±50 mA

ICC DC Supply Current, per Output Pin ±50 mA

IGND DC Ground Current, per Output Pin ±100 mA

TSTG Storage Temperature Range *65 to )150 _C

TLLead temperature, 1 mm from Case for 10 Seconds 260 _C

TJJunction Temperature Under Bias 140 _C

qJA Thermal Resistan ce (Note 2) SOIC

TSSOP 65.8

110.7

_C/W

MSL Moisture Sensitivity Level 1

FRFlammability Rating Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in

VESD ESD Withstand Voltage Human Body Model (Note 3)

Machine Model (Note 4)

Charged Device Model (Note 5)

> 2000

> 200

> 1000

ILatchup Latchup Performance Above VCC and Below GND at 85_C (Note 6) ±100 mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. IOUT absolute maximum rating must be observed.

2. The package thermal impedance is calculated in accordance with JESD 51−7.

3. Tested to EIA/JESD22−A114−A.

4. Tested to EIA/JESD22−A115−A.

5. Tested to JESD22−C101−A.

6. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Unit

VCC Supply Voltage ′AC 2.0 5.0 6.0 V

′ACT 4.5 5.0 5.5

VIN, VOUT DC Input Voltage, Output V oltage (Ref. to GND) 0 − VCC V

tr, tfInput Rise and Fall Time (Note 7)

′AC Devices except Schmitt Inputs

VCC @ 3.0 V − 150 −

VCC @ 4.5 V − 40 − ns/V

VCC @ 5.5 V − 25 −

tr, tfInput Rise and Fall Time (Note 8)

′ACT Devices except Schmitt Inputs

VCC @ 4.5 V − 10 − ns/V

VCC @ 5.5 V − 8.0 −

TAOperating Ambient Temperature Range −40 25 85 °C

IOH Output Current − High − − −24 mA

IOL Output Current − Low − − 24 mA

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

7. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.

8. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.

MC74AC244, MC74ACT244

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DC CHARACTERISTICS

Symbol Parameter VCC

(V)

74AC 74AC

Unit Conditions

TA = +25°CTA =

−40°C to +85°C

Typ Guaranteed Limits

VIH Minimum High Level Input Voltage 3.0

4.5

5.5

1.5

2.25

2.75

2.1

3.15

3.85

2.1

3.15

3.85

V VOUT = 0.1 V

or VCC − 0.1 V

VIL Maximum Low Level Input Voltage 3.0

4.5

5.5

1.5

2.25

2.75

0.9

1.35

1.65

0.9

1.35

1.65

V VOUT = 0.1 V

or VCC − 0.1 V

VOH Minimum High Level Output Voltage 3.0

4.5

5.5

2.99

4.49

5.49

2.9

4.4

5.4

2.9

4.4

5.4

VIOUT = −50 mA

3.0

4.5

5.5

−

2.56

3.86

4.86

2.46

3.76

4.76

V *VIN = VIL or VIH

−12 mA

IOH −24 mA

−24 mA

VOL Maximum Low Level Output Voltage 3.0

4.5

5.5

0.002

0.001

0.1

VIOUT = 50 mA

3.0

4.5

5.5

−

0.36

0.44

V *VIN = VIL or VIH

12 mA

IOL 24 mA

24 mA

IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mAVI = VCC, GND

IOZ Maximum 3−State Current 5.5 − ±0.5 ±5.0 mAVI (OE) = VIL, VIH

VI = VCC, GND

VO = VCC, GND

IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 mA VOHD = 3.85 V Min

ICC Maximum Quiescent Supply Current 5.5 − 8.0 80 mAVIN = VCC or GND

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.

AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)

Symbol Parameter VCC*

(V)

74AC 74AC

Unit Figure

No.

TA = +25°C

CL = 50 pF TA = −40°C to +85°C

CL = 50 pF

Min Typ Max Min Max

tPLH Propagation Delay

Data to Output 3.3

5.0 2.0

1.5 6.5

5.0 9.0

7.0 1.5

1.0 10.0

7.5 ns 3−5

tPHL Propagation Delay

Data to Output 3.3

5.0 2.0

1.5 6.5

5.0 9.0

7.0 2.0

1.0 10.0

7.5 ns 3−5

tPZH Output Enable Time 3.3

5.0 2.0

1.5 6.0

5.0 10.5

7.0 1.5

1.5 11.0

8.0 ns 3−7

tPZL Output Enable Time 3.3

5.0 2.5

1.5 7.5

5.5 10.0

8.0 2.0

1.5 11.0

8.5 ns 3−8

tPHZ Output Disable Time 3.3

5.0 3.0

2.5 7.0

6.5 10.0

9.0 1.5

1.0 10.5

9.5 ns 3−7

tPLZ Output Disable Time 3.3

5.0 2.5

2.0 7.5

6.5 10.5

9.0 2.5

2.0 11.5

9.5 ns 3−8

*Voltage Range 3.3 V is 3.3 V ±0.3 V.

*Voltage Range 5.0 V is 5.0 V ±0.5 V.

MC74AC244, MC74ACT244

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DC CHARACTERISTICS

Symbol Parameter VCC

(V)

74ACT 74ACT

Unit Conditions

TA = +25°CTA =

−40°C to +85°C

Typ Guaranteed Limits

VIH Minimum High Level Input Voltage 4.5

5.5 1.5

1.5 2.0

2.0 2.0

2.0 V VOUT = 0.1 V

or VCC − 0.1 V

VIL Maximum Low Level Input Voltage 4.5

5.5 1.5

1.5 0.8

0.8 0.8

0.8 V VOUT = 0.1 V

or VCC − 0.1 V

VOH Minimum High Level Output Voltage 4.5

5.5 4.49

5.49 4.4

5.4 4.4

5.4 VIOUT = −50 mA

4.5

5.5 −

−3.86

4.86 3.76

4.76

V *VIN = VIL or VIH

−24 mA

IOH −24 mA

VOL Maximum Low Level Output Voltage 4.5

5.5 0.001

0.001 0.1

0.1 0.1

0.1 VIOUT = 50 mA

4.5

5.5 −

−0.36

0.36 0.44

0.44

V *VIN = VIL or VIH

24 mA

IOL 24 mA

IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mAVI = VCC, GND

DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V

IOZ Maximum 3−State Current 5.5 − ±0.5 ±5.0 mAVI (OE) = VIL, VIH

VI = VCC, GND

VO = VCC, GND

IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 mA VOHD = 3.85 V Min

ICC Maximum Quiescent Supply Current 5.5 − 8.0 80 mAVIN = VCC or GND

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)

Symbol Parameter VCC*

(V)

74ACT 74ACT

Unit Figure

No.

TA = +25°C

CL = 50 pF TA = −40°C to +85°C

CL = 50 pF

Min Typ Max Min Max

tPLH Propagation Delay

Data to Output 5.0 2.0 6.5 9.0 1.5 10.0 ns 3−5

tPHL Propagation Delay

Data to Output 5.0 2.0 7.0 9.0 1.5 10.0 ns 3−5

tPZH Output Enable Time 5.0 1.5 6.0 8.5 1.0 9.5 ns 3−7

tPZL Output Enable Time 5.0 2.0 7.0 9.5 1.5 10.5 ns 3−8

tPHZ Output Disable Time 5.0 2.0 7.0 9.5 1.5 10.5 ns 3−7

tPLZ Output Disable Time 5.0 2.5 7.5 10.0 2.0 10.5 ns 3−8

*Voltage Range 5.0 V is 5.0 V ±0.5 V.

CAPACITANCE

Symbol Parameter Value Typ Unit Test Conditions

CIN Input Capacitance 4.5 pF VCC = 5.0 V

CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V

MC74AC244, MC74ACT244

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ORDERING INFORMATION

Device Package Shipping†

MC74AC244DWG

SOIC−20

(Pb−Free)

38 Units / Rail

MC74AC244DWR2G 1000 / Tape & Reel

MC74ACT244DWG 38 Units / Rail

MC74ACT244DWR2G 1000 / Tape & Reel

MC74AC244DTR2G TSSOP−20

(Pb−Free) 2500 / Tape & Reel

MC74ACT244DTR2G 2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MARKING DIAGRAMS

SOIC−20W TSSOP−20

244

ALYWG

A = Assembly Location

WL, L = Wafer Lot

YY, Y = Year

WW, W = Work Week

G or G= Pb−Free Package

(Note: Microdot may be in either location)

ACT

244

ALYWG

ACT244

AWLYYWWG

AC244

AWLYYWWG

MC74AC244, MC74ACT244

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PACKAGE DIMENSIONS

TSSOP−20

DT SUFFIX

CASE 948E−02

ISSUE C

DIM

MIN MAX MIN MAX

INCHES

6.60 0.260

MILLIMETERS

B4.30 4.50 0.169 0.177

C1.20 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.27 0.37 0.011 0.015

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

____

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION:

MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH OR GATE BURRS

SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

ÍÍÍÍ

110

1120

PIN 1

IDENT

−T−

0.100 (0.004)

DGH

SECTION N−N

JJ1

−W−

SEATING

PLANE

−V−

−U−

0.10 (0.004) V S

20X REFK

L/2

U0.15 (0.006) T

DETAIL E

0.25 (0.010)

DETAIL E

6.40 0.252

--- ---

U0.15 (0.006) T

7.06

16X

0.36 16X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

MC74AC244, MC74ACT244

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PACKAGE DIMENSIONS

SOIC−20W

DW SUFFIX

CASE 751D−05

ISSUE G

B20X

H10X

18X A1

SEATING

PLANE

hX 45_

0.25 M

0.25 S

DIM MIN MAX

MILLIMETERS

A2.35 2.65

A1 0.10 0.25

B0.35 0.49

C0.23 0.32

D12.65 12.95

E7.40 7.60

e1.27 BSC

H10.05 10.55

h0.25 0.75

L0.50 0.90

q0 7

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF B

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

UBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MC74AC244/D

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Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

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Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loc

Sales Representative

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