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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54HC14
,
SN74HC14
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
SNx4HC14 Hex Schmitt-Trigger Inverters
1
1 Features
1 Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up to 10 LSTTL Loads
Low Power Consumption, 20-μA Max ICC
Typical tpd = 11 ns
±4-mA Output Drive at 5 V
Low Input Current of 1 μA Max
On Products Compliant to MIL-PRF-38535,
All Parameters Are Tested Unless Otherwise
Noted. On All Other Products, Production
Processing Does Not Necessarily Include Testing
of All Parameters.
2 Applications
Microwave Oven
Mice
Printers
AC Inverter Drives
UPS
AC Servo Drives
Other Motor Drives
3 Description
The SNx4HC14 are Schmitt-trigger devices that
contain six independent inverters. They perform the
Boolean function Y = A in positive logic.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SNJ54HC14J CDIP (14) 7.62 mm x 19.94 mm
SNJ54HC14W CFP (14) 7.11 mm x 9.11 mm
SNJ54HC14FK LCCC (20) 8.89 mm x 8.89 mm
SN74HC14D SOIC (14) 6.00 mm x 8.65 mm
SN74HC14DB SSOP (14) 367.00 mm x 367.00 mm
SN74HC14N PDIP (14) 7.94 mm x 10.35 mm
SN74HC14NS SO (14) 7.80 mm x 10.20 mm
SN74HC14PW TSSOP (14) 6.40 mm x 5.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
2
SN54HC14
,
SN74HC14
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation Feedback Copyright © 1982–2016, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 5
6.7 Operating Characteristics.......................................... 5
6.8 Typical Characteristics.............................................. 6
7 Parameter Measurement Information .................. 7
8 Detailed Description.............................................. 8
8.1 Overview................................................................... 8
8.2 Functional Block Diagram......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes.......................................... 8
9 Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
9.2 Typical Application.................................................... 9
10 Power Supply Recommendations ..................... 10
11 Layout................................................................... 11
11.1 Layout Guidelines ................................................. 11
11.2 Layout Example .................................................... 11
12 Device and Documentation Support................. 12
12.1 Documentation Support ........................................ 12
12.2 Related Links ........................................................ 12
12.3 Receiving Notification of Documentation Updates 12
12.4 Community Resources.......................................... 12
12.5 Trademarks........................................................... 12
12.6 Electrostatic Discharge Caution............................ 12
12.7 Glossary................................................................ 12
13 Mechanical, Packaging, and Orderable
Information........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (February 2016) to Revision J Page
Changed " Y = A" to "Y = A" throughout ................................................................................................................................ 1
Added The SNx4HC14 to Description section ....................................................................................................................... 1
Deleted Device Comparison Table section ............................................................................................................................ 1
Added Receiving Notification of Documentation Updates section ....................................................................................... 12
Changes from Revision H (September 2015) to Revision I Page
Changed part number from SN54HC08 to SN54HC14 in Switching Characteristics table.................................................... 5
Changed part number from SN74HC08 to SN74HC14 in Switching Characteristics table.................................................... 5
Changes from Revision G (January 2014) to Revision H Page
Added Applications................................................................................................................................................................. 1
Added Military Disclaimer to Features list.............................................................................................................................. 1
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision F (December 2010) to Revision G Page
Updated document to new TI data sheet format - no specification changes......................................................................... 1
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
6Y
NC
5A
NC
5Y
2A
NC
2Y
NC
3A
1Y
1A
NC
4Y
4A
V
6A
3Y
GND
NC
CC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
VCC
6A
6Y
5A
5Y
4A
4Y
3
SN54HC14
,
SN74HC14
www.ti.com
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation FeedbackCopyright © 1982–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
SN54HC14 J or W Package
SN74HC14 D, DB, N, NS, or PW Package
14-Pin CDIP, CFP, SOIC, SSOP, PDIP, SO, or TSSOP
Top View
SN54HC14 FK Package
20-Pin LCCC
Top View
(1) NC No internal connection
Pin Functions
PIN
I/O DESCRIPTION
NAME
CDIP, CFP,
SOIC, SSOP,
PDIP, SO,
TSSOP
LCCC
1A 1 2 I Channel 1 input
1Y 2 3 O Channel 1 output
2A 3 4 I Channel 2 input
2Y 4 6 O Channel 2 output
3A 5 8 I Channel 3 input
3Y 6 9 O Channel 3 output
GND 7 10 Ground
4Y 8 12 O Channel 4 output
4A 9 13 I Channel 4 input
5Y 10 14 O Channel 5 output
5A 11 16 I Channel 5 input
6Y 12 18 O Channel 6 output
6A 13 19 I Channel 6 input
VCC 14 20 Power supply
NC(1)
1
No internal connection
5
7
11
15
17
4
SN54HC14
,
SN74HC14
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation Feedback Copyright © 1982–2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 7 V
IIK Input clamp current(2) VI< 0 or VI> VCC ±20 mA
IOK Output clamp current(2) VO< 0 ±20 mA
IOContinuous output current VO= 0 to VCC ±25 mA
Continuous current through VCC or GND ±50 mA
TjJunction temperature 150 °C
Tstg Storage temperature –65 150
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating
CMOS Inputs, SCBA004.
6.3 Recommended Operating Conditions
See note(1).SN54HC14 SN74HC14 UNIT
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 2 5 6 2 5 6 V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
TAOperating free-air temperature –55 125 –40 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1) SNx4HC14
UNITD (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 86 96 80 76 113 °C/W
5
SN54HC14
,
SN74HC14
www.ti.com
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation FeedbackCopyright © 1982–2016, Texas Instruments Incorporated
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TA= 25°C SN54HC14 SN74HC14 UNIT
MIN TYP MAX MIN MAX MIN MAX
VT+
2 V 0.7 1.2 1.5 0.7 1.5 0.7 1.5
V4.5 V 1.55 2.5 3.15 1.55 3.15 1.55 3.15
6 V 2.1 3.3 4.2 2.1 4.2 2.1 4.2
VT
2 V 0.3 0.6 1 0.3 1 0.3 1
V4.5 V 0.9 1.6 2.45 0.9 2.45 0.9 2.45
6 V 1.2 2 3.2 1.2 3.2 1.2 3.2
VT+ VT
2 V 0.2 0.6 1.2 0.2 1.2 0.2 1.2
V4.5 V 0.4 0.9 2.1 0.4 2.1 0.4 2.1
6 V 0.5 1.3 2.5 0.5 2.5 0.5 2.5
VOH VI= VIH or VIL
IOH = –20 μA
2 V 1.9 1.998 1.9 1.9
V
4.5 V 4.4 4.499 4.4 4.4
6 V 5.9 5.999 5.9 5.9
IOH = –4 mA 4.5 V 3.98 4.3 3.7 3.84
IOH = –5.2 mA 6 V 5.48 5.8 5.2 5.34
VOL VI= VIH or VIL
IOL = 20 μA
2 V 0.002 0.1 0.1 0.1
V
4.5 V 0.001 0.1 0.1 0.1
6 V 0.001 0.1 0.1 0.1
IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33
IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33
IIVI= VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI= VCC or 0, IO= 0 6 V 2 40 20 μA
Ci2 V to 6 V 3 10 10 10 pF
6.6 Switching Characteristics
over operating free-air temperature range, CL= 50 pF (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT) TO
(OUTPUT) VCC TA= 25°C SN54HC14 SN74HC14 UNIT
MIN TYP MAX MIN MAX MIN MAX
tpd A Y 2 V 55 125 190 155 ns4.5 V 12 25 38 31
6 V 11 21 22 26
ttY2 V 38 75 110 95 ns4.5 V 8 15 22 19
6 V 6 13 19 16
6.7 Operating Characteristics
TA= 25°C PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per inverter No load 20 pF
Temperature
TPD (ns)
-100 -50 0 50 100 150
11.5
12
12.5
13
13.5
14
14.5
D001
6
SN54HC14
,
SN74HC14
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation Feedback Copyright © 1982–2016, Texas Instruments Incorporated
6.8 Typical Characteristics
Figure 1. TPD vs Temperature at 4.5 V, 25°C Figure 2. TPD vs VCC at 25°C
From Output
Under Test
C = 50 pF
(see Note A)
L
LOAD CIRCUIT
Test
Point
VOLTAGE WAVEFORMS
INPUT RISE AND FALL TIMES
Input 90%
90%
50% 50%
10% 10%
tf
tr
0 V
VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
tPLH
tPLH
tPHL
tPHL
Input
In-Phase
Output
Out-of-Phase
Output
90%
90%
90%
50%
10% 10%
10%
50%
50%
50%
50%
tf
tf
tr
90%
10%
50%
tr
VCC
VOL
VOH
VOH
0 V
VOL
7
SN54HC14
,
SN74HC14
www.ti.com
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation FeedbackCopyright © 1982–2016, Texas Instruments Incorporated
7 Parameter Measurement Information
Figure 3. Load Circuit and Voltage Waveforms
A Y
8
SN54HC14
,
SN74HC14
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation Feedback Copyright © 1982–2016, Texas Instruments Incorporated
8 Detailed Description
8.1 Overview
These Schmitt-trigger devices contain six independent inverters. They perform the Boolean function Y = A in
positive logic.
Schmitt-trigger inputs are designed to provide a minimum separation between positive and negative switching
thresholds. This allows for noisy or slow inputs that would cause problems such as oscillation or excessive
current draw with normal CMOS inputs.
8.2 Functional Block Diagram
Figure 4. Logic Diagram (Positive Logic)
8.3 Feature Description
The wide operating range of the device allows it to be used in a variety of systems that use different logic levels.
The outputs can drive up to 10 LSTTL loads each. The device has very low power consumption, with 20-μA Max
ICC. Typical propagation delay is also low at 11 ns. The balanced drive outputs can source or sink 4 mA at 5-V
VCC. The input leakage current is 1 μA Max.
8.4 Device Functional Modes
Table 1 lists the functional modes of the SNx4HC14.
Table 1. Function Table (Each Inverter)
INPUTS
AOUTPUT
Y
H L
L H
1A 1Y
C1
R12A 2Y
INPUT OUTPUT
9
SN54HC14
,
SN74HC14
www.ti.com
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation FeedbackCopyright © 1982–2016, Texas Instruments Incorporated
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SNx4HC14 are Schmitt-trigger input CMOS devices that can be used for a multitude of inverting buffer type
functions. The application shown in Figure 5 takes advantage of the Schmitt-trigger inputs to produce a delay for
a logic output.
9.2 Typical Application
Figure 5. Simplified Application Schematic
9.2.1 Design Requirements
This device uses CMOS technology. Take care to avoid bus contention because it can drive currents that would
exceed maximum limits. Parallel output drive can create fast edges into light loads so consider routing and load
conditions to prevent ringing.
9.2.2 Detailed Design Procedure
This circuit is designed around an RC network that produces a slow input to the second inverter. The RC time
constant, τ, is calculated from: τ= R×C
The delay time for this circuit is between 1.2τand 0.42τ. The delay is consistent for each device, but because the
switching threshold is only guaranteed between a minimum and maximum value, the output pulse length varies
between the devices. These values were calculated by using the minimum and maximum guaranteed VT+ values.
The resistor value should be chosen such that the maximum current from and to the SNx4HC14 is 4 mA.
Recommended input conditions:
Schmitt-trigger inputs allow for slow inputs.
Specified high and low levels. See (VIH and VIL)inRecommended Operating Conditions.
Recommended output conditions:
Load currents should not exceed 4 mA per output.
VC
VOUT
4.5
2.5
t0 + 2t0 t0 + 52
5.0
4.0
1.5
2.0
1.0
0.5
3.5
3.0
Voltage (V)
Time
0.0 t0 + 22t0 + 32t0 + 42
VT+
VT+ Typical
Max Delay Time = 1.202
Min Delay Time = 0.422
10
SN54HC14
,
SN74HC14
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation Feedback Copyright © 1982–2016, Texas Instruments Incorporated
Typical Application (continued)
9.2.3 Application Curve
Figure 6. Ideal Capacitor Voltage and Output Voltage With Positive Switching Threshold Range
Representation
10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power
disturbance. For devices with a single supply, TI recommends a 0.1-µF capacitor. If there are multiple VCC
terminals, then TI recommends a 0.01-µF or 0.022-µF capacitor for each power terminal. Multiple bypass
capacitors can be paralleled to reject different frequencies of noise. Frequencies of 0.1 μF and 1 μF are
commonly used in parallel. The bypass capacitor should be installed as close as possible to the power terminal
for best results.
11
SN54HC14
,
SN74HC14
www.ti.com
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation FeedbackCopyright © 1982–2016, Texas Instruments Incorporated
11 Layout
11.1 Layout Guidelines
When using multiple bit logic devices, inputs should never float. In many cases, functions or parts of functions of
digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only
three of the four buffer gates are used. Such input pins should not be left unconnected because the undefined
voltages at the outside connections result in undefined operational states. All unused inputs of digital logic
devices must be connected to a high or low bias to prevent them from floating. The logic level that should be
applied to any particular unused input depends on the function of the device. Generally they will be tied to GND
or VCC whichever makes more sense or is more convenient. Floating outputs is generally acceptable, unless the
part is a transceiver.
11.2 Layout Example
Figure 7. Layout Recommendation
12
SN54HC14
,
SN74HC14
SCLS085J DECEMBER 1982REVISED OCTOBER 2016
www.ti.com
Product Folder Links: SN54HC14 SN74HC14
Submit Documentation Feedback Copyright © 1982–2016, Texas Instruments Incorporated
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
Implications of Slow or Floating CMOS Inputs, SCBA004
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
SN54HC05 Click here Click here Click here Click here Click here
SN74HC05 Click here Click here Click here Click here Click here
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8409101VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8409101VC
A
SNV54HC14J
5962-8409101VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8409101VD
A
SNV54HC14W
84091012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84091012A
SNJ54HC
14FK
8409101CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409101CA
SNJ54HC14J
8409101DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409101DA
SNJ54HC14W
JM38510/65702BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65702BCA
JM38510/65702BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65702BDA
M38510/65702BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65702BCA
M38510/65702BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65702BDA
SN54HC14J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC14J
SN74HC14D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14DBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74HC14DRG3 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14DT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14DTG4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14N ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN N / A for Pkg Type -40 to 85 SN74HC14N
SN74HC14NE4 ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC14N
SN74HC14NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14PW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14PWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14PWT ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SN74HC14PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC14
SNJ54HC14FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84091012A
SNJ54HC
14FK
SNJ54HC14J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409101CA
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54HC14J
SNJ54HC14W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409101DA
SNJ54HC14W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC14, SN54HC14-SP, SN74HC14 :
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 4
Catalog: SN74HC14, SN54HC14
Automotive: SN74HC14-Q1, SN74HC14-Q1
Military: SN54HC14
Space: SN54HC14-SP
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC14DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HC14DR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1
SN74HC14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC14DRG3 SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1
SN74HC14DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC14DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC14PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC14PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC14PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC14PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Oct-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC14DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74HC14DR SOIC D 14 2500 364.0 364.0 27.0
SN74HC14DR SOIC D 14 2500 367.0 367.0 38.0
SN74HC14DR SOIC D 14 2500 333.2 345.9 28.6
SN74HC14DRG3 SOIC D 14 2500 364.0 364.0 27.0
SN74HC14DRG4 SOIC D 14 2500 333.2 345.9 28.6
SN74HC14DT SOIC D 14 250 367.0 367.0 38.0
SN74HC14PWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74HC14PWR TSSOP PW 14 2000 364.0 364.0 27.0
SN74HC14PWRG4 TSSOP PW 14 2000 367.0 367.0 35.0
SN74HC14PWT TSSOP PW 14 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Oct-2016
Pack Materials-Page 2