DATA SH EET
Product specification
Supersedes data of 1997 Nov 05 1998 Jan 30
DISCRETE SEMICONDUCTORS
BLS2731-110
Microwave power transistor
1998 Jan 30 2
Philips Semiconductors Product specification
Microwave power transistor BLS2731-110
FEATURES
Suitable for short and medium pulse applications
Internal input and output matching networks for an easy
circuit design
Emitter ballasting resistors improve ruggedness
Gold metallization ensures excellent reliability
Interdigitated emitter-base structure provides high
emitter efficiency
Multicell geometry improves power sharing and reduces
thermal resistance.
APPLICATIONS
Common base class-C pulsed power amplifiers for radar
applications in the 2.7 to 3.1 GHz band.
DESCRIPTION
NPN silicon planar epitaxial microwave power transistor in
a 2-lead rectangular flange package with a ceramic cap
(SOT423A) with the common base connected to the
flange.
PINNING - SOT423A
PIN DESCRIPTION
1 collector
2 emitter
3 base; connected to flange
Fig.1 Simplified outline.
d
book, halfpage
1
2
3
3
MBK052
QUICK REFERENCE DATA
RF performance at Th=25°C in a common base class-C test circuit.
MODE OF OPERATION f
(GHz) VCB
(V) PL
(W) Gp
(dB) ηC
(%)
Pulsed class-C 2.7 to 3.1 40 >110 >7 >35
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
1998 Jan 30 3
Philips Semiconductors Product specification
Microwave power transistor BLS2731-110
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
Note
1. Equivalent thermal impedance under pulsed microwave operating conditions.
CHARACTERISTICS
Tj=25°C unless otherwise specified.
APPLICATION INFORMATION
RF performance at Th=25°C in a common base test circuit.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter 75 V
VCES collector-emitter voltage RBE =0 75 V
VEBO emitter-base voltage open collector 2V
I
CM peak collector current tp100 µs; δ≤10% 12 A
Ptot total power dissipation tp= 100 µs; δ= 10%; Tmb =25°C500 W
Tstg storage temperature 65 +200 °C
Tjoperating junction temperature 200 °C
Tsld soldering temperature up to 0.2 mm from ceramic cap; t 10 s 235 °C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Zth j-h thermal impedance from junction to heatsink tp= 100 µs; δ= 10%; note 1 0.24 K/W
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V(BR)CBO collector-base breakdown voltage IC= 30 mA; open emitter 75 V
V(BR)CES collector-emitter breakdown voltage IC= 30 mA; VBE =0 75 V
I
CBO collector leakage current VCB =40V; I
E=0 3mA
I
CES collector leakage current VCE =40V; V
BE =0 6mA
I
EBO emitter leakage current VEB = 1.5 V; IC=0 0.6 mA
hFE DC current gain VCE =5V; I
C= 3 A 40 100
MODE OF OPERATION f
(GHz) VCE
(V) PL
(W) GP
(dB) ηC
(%)
Class-C; tp= 100 µs; δ= 10% 2.7 to 3.1 40 110 735
2.7 to 2.9 40 typ. 130 typ. 8 typ. 42
2.9 to 3.1 40 typ. 120 typ. 7.5 typ. 40
1998 Jan 30 4
Philips Semiconductors Product specification
Microwave power transistor BLS2731-110
Fig.2 Power gain and efficiency as functions of
frequency; typical values.
VCE = 40 V; class-C; tp= 100 µs; δ= 10%.
handbook, halfpage
2.7 2.8 2.9
Gp
(dB)
Gp
3.1
f (GHz)
10
0
8
3
6
4
2
ηC
(%)
ηC
50
0
40
30
20
10
MBK284
VCE = 40 V; class-C; tp= 100 µs; δ= 10%.
Fig.3 Load power as a function of drive power;
typical values.
handbook, halfpage
10 12 14 20
PL
(W)
PD (W)
18
140
0
40
20
120
16
2.9 GHz 2.7 3.1
100
80
60
MBK285
Fig.4 Input impedance as function of frequency
(series components); typical values.
VCB = 40 V; class-C; PL= 110 W.
handbook, halfpage
2.6
12
8
4
02.8 3 3.2
MGM538
f (GHz)
Zi
()
ri
xi
Fig.5 Load impedance as function of frequency
(series components); typical values.
VCB = 40 V; class-C; PL= 110 W.
handbook, halfpage
2.6 2.8 3 3.2
8
4
4
8
0
MGM539
f (GHz)
ZL
()
XL
RL
1998 Jan 30 5
Philips Semiconductors Product specification
Microwave power transistor BLS2731-110
Fig.6 Component layout for 2.7 to 3.1 GHz class-C test circuit.
Dimensions in mm.
The components are located on one side of the copper-clad printed-circuit board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by through metallization.
handbook, full pagewidth
MGM540
input output
40
30 30
L5
L4
L6 L3 L9 C1
L12
L13 L14
L10
C2 RC
L11
L2
L1
L8 C3
L7
1998 Jan 30 6
Philips Semiconductors Product specification
Microwave power transistor BLS2731-110
List of components
Notes
1. American Technical Ceramics type 100A or capacitor of same quality.
2. The striplines are on double-clad printed-circuit board with Duroid dielectric (εr= 2.2); thickness = 0.38 mm.
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE No.
C1, C2 multilayer ceramic chip
capacitor; note 1 100 pF
C3 multilayer ceramic chip
capacitor 100 nF
RC multilayer ceramic chip
capacitor in series with SMD
resistor
100 nF + 5
L1 stripline; note 2 length 4.5 mm
width 10 mm
L2 stripline; note 2 length 2.5 mm
width 16.4 mm
L3 stripline; note 2 length 8.3 mm
width 1 mm
L4 stripline; note 2 length 8 mm
width 1.5 mm
L5 stripline; note 2 length 2 mm
width 8.9 mm
L6 stripline; note 2 length 12.7 mm
width 1.2 mm
L7 stripline; note 2 length 4.5 mm
width 10 mm
L8 stripline; note 2 length 2.5 mm
width 24.4 mm
L9 stripline; note 2 length 4.4 mm
width 1 mm
L10 stripline; note 2 length 5.2 mm
width 1 mm
L11 stripline; note 2 length 9.3 mm
width 1 mm
L12 stripline; note 2 length 2.5 mm
width 6 mm
L13 stripline; note 2 length 7.8 mm
width 1.2 mm
L14 stripline; note 2 length 7.5 mm
width 1.2 mm
1998 Jan 30 7
Philips Semiconductors Product specification
Microwave power transistor BLS2731-110
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT423A 97-04-01
0 5 10 mm
scale
SOT423A
DIMENSIONS (mm are the original dimensions)
D
D1
q
U1
A
U2E1E
p
b
H
1
3
2
Q
F
c
Flanged hermetic ceramic package; 2 mounting holes; 2 leads
UNIT Q
cD E
1
EFHp q
mm 0.16
0.10
b
9.53
9.27 10.29
10.03
12.02
11.76 8.82
8.56
D1
12.83
12.57 1.58
1.46 19.18
18.92 3.43
3.17 16.64
16.38 22.99
22.73
U2
U1
9.91
9.65
A
5.58
5.04 3.42
2.88
1998 Jan 30 8
Philips Semiconductors Product specification
Microwave power transistor BLS2731-110
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1998 Jan 30 9
Philips Semiconductors Product specification
Microwave power transistor BLS2731-110
NOTES
1998 Jan 30 10
Philips Semiconductors Product specification
Microwave power transistor BLS2731-110
NOTES
1998 Jan 30 11
Philips Semiconductors Product specification
Microwave power transistor BLS2731-110
NOTES
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Printed in The Netherlands 125108/00/04/pp12 Date of release: 1998 Jan 30 Document order number: 9397 750 03234