Knowles Acoustics, a division of Knowles
Electronics, LLC. Revision: A
1 of 10
SPM0204HE5
Knowles Acoustics
1151 Maplewood Drive
Itasca, IL 60143
Enhanced RF Protected
“Mini” SiSonic™ Microphone Specification
Knowles Acoustics, a division of Knowles
Electronics, LLC. Revision: A
2 of 10
SPM0204HE5
1. DESCRIPTION AND APPLICATION
2. PART MARKING
3. TEMPERATURE RANGE
1.1 Description
“Mini” Surface Mount Silicon Microphone
with RF Protection
1.2 Application
Hand held telecommunication devices
3.1 Operating Temperature Range: -40°C to +100°C
3.2 Storage Temperature Range: -40°C to +100°C
Identification Number Convention
S 1 2 3
4 5 6
S: Manufacturing Location
“S” – Knowles Electronics Suzhou
Suzhou, China
“No Alpha Character” – Knowles Electronics Itasca
Itasca, IL USA
“E” – Engineering Samples
Digits 1 – 6: Job Identification Number
Identification
Number
Pin 1
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Electronics, LLC. Revision: A
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SPM0204HE5
4. ACOUSTIC & ELECTRICAL SPECIFICATIONS
5. FREQUENCY RESPONSE CURVE
dB
No Change Across Voltage
Range
Change in sensitivity over 3.6v
to 1.5v
Sensitivity Loss across
Voltage
dB
At 100dB SPL, THD < 1%
At 115dB SPL, THD = < 10%
Maximum Input Sound
Level
Omni-directionalDirectivity
dBA SPL
n/a35n/aA-weightedENL
Typical Input Referred
Noise
Max.Nom.Min.
V3.6n/a1.5VsSupply Voltage
dBn/a5955@ 1kHz (0dB=1V/Pa)S/NSignal to Noise Ratio
mA0.250n/a0.100across 1.5 to 3.6 voltsIDSS
Current Consumption
Ω300n/an/a@ 1kHz (0dB=1V/Pa)ZOUT
Output impedance
dB-38-42-46@ 1kHz (0dB=1V/Pa)SSensitivity
Unit
Limits
ConditionSymbol
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Electronics, LLC. Revision: A
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SPM0204HE5
6. MECHANICAL SPECIFICATIONS
FunctionPin #
Pin Output
Power4
Ground3
Ground2
Output1
mm0.150.84Port Hole
mm1.55
Acoustic Seal
I.D. (typical)
mm<0.1Coplanarity
mm0.251.32
Short Edge to
C.L. Port
mm0.251.88
Long Edge to
C.L. Port
grams0.07Weight
0.10
0.10
0.10
Tol. (+/-)
mm3.76Width
mm4.72Length
mm1.25Height
UnitsDim.Item
Note: (Tolerance +/-0.15mm unless otherwise specified)
"!
#%$&
4
3 2
1
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Electronics, LLC. Revision: A
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SPM0204HE5
7. RECOMMENDED CUSTOMER LAND PATTERN
8. RECOMMENDED SOLDER STENCIL PATTERN
N/A
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Electronics, LLC. Revision: A
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SPM0204HE5
9. RECOMMENDED INTERFACE CIRCUIT
External Gain (set by
customer) = -R1/R2
Dotted Section
Represents
SiSonic
Microphone +
-
+
Vref
R1
R2
Term. 4
Term. 3
Term. 2
Term. 1
••
•
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Electronics, LLC. Revision: A
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SPM0204HE5
10. PACKAGING DETAIL
No consecutive empty
pockets; No more than 3
empty pockets per reel. (Does
not include empty pockets for
leader/follower)
Empty
Units
Label applied to external
package and direct to reel.
Per JEDEC.
Label
800mm or minimum of 100
empty pockets
Leader
Length
Pin 1 Location
4,800
1,200
Quantity
per Reel
7”-2SPM0204HE5
13”-6SPM0204HE5
Reel
Diameter
SuffixModel Number
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Electronics, LLC. Revision: A
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SPM0204HE5
Notes:
1. Do not pull a vacuum over the port hole of the microphone. Pulling a
vacuum over the port hole can damage the device.
2. Do not board wash after the reflow process. Board washing and
cleaning agents can damage the device. Do not expose to ultrasonic
processing or cleaning.
3. Number of Reflow = recommend no more than 3 cycles.
(A) Packaging (reference SiSonic_Packaging_Spec.pdf)
(B) Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened
ESD moisture sensitive bag under maximum environmental conditions of 30ºC, 70% R.H.
(C) Exposure: Devices should not be exposed to high humidity, high temperature environment.
MSL (moisture sensitivity level) Class 2.
(D) Out of bag: Maximum of 90 days out of ESD moisture sensitive bag, assuming maximum
conditions of 30ºC/70% R.H.
11. SOLDER REFLOW PROFILE
12. ADDITIONAL NOTES
30 sec.260 C maximumPeak
100 sec.Above 230 CSolder Melt
120 sec.170 ~ 180 CPre-heat
Time (maximum)Temperature ProfileStage
170–180°C
Solder MeltPre-heat
260°C
230°C
100 sec.
120 sec.
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Electronics, LLC. Revision: A
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SPM0204HE5
Note: After test conditions are performed, the sensitivity of the microphone shall not deviate more
than 3dB from its initial value.
DescriptionTest
Microphone must operate after exposure to shock test of 10,000 G per IEC 68-2-27, Ea.
Microphone is tested to 5 passes through reflow oven, with microphone mounted
upside-down under conditions of 260ºC for 30 seconds maximum.
Tested to 8kV direct contact discharge to the case and tested to 2kV direct contact to
I/O terminals.
Microphone unit must operate under test condition: 4 cycles, from 20 to 2,000 Hz in
each direction (x,y,z), 48 minutes, using peak acceleration of 20 G (+20%, -0%). (MIL
883E, method 2007.2, A)
Tested under Bias at 85ºC/85% R.H. per JESD22-A101A-B
Microphone unit must operate within sensitivity specifications for 1,000 hours at –40ºC.
(IEC 68-2-1 Test Aa)
Microphone unit must operate within sensitivity specifications for 1,000 hours at 105ºC.
(IEC 68-2-2 Test Ba)
Microphone unit must maintain sensitivity after storage at –40ºC for 1,000 hours. (IEC
68-2-1 Test Aa)
Microphone unit must maintain sensitivity after storage at +105ºC for 1,000 hours. (IEC
68-2-2 Test Ba)
Microphone unit must operate when exposed to air-to-air thermal shock 100 cycles,
from –40ºC to +125ºC. (IEC 68-2-4),
Mechanical Shock
Reflow
Electrostatic Discharge
Low Temperature Storage
Test
High Temperature Storage
Test
Low Temperature Operating
Test
Vibration Test
Humidity Test
High Temperature Operating
Test
Thermal Shock
13. RELIABILITY SPECIFICATIONS
Knowles Acoustics, a division of Knowles
Electronics, LLC. Revision: A
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SPM0204HE5
14. SPECIFICATION REVISIONS
08-03-2006Specification ReleaseA
DateDetailed Specification ChangesRevision
The information contained in this literature is based on our experience to date and is believed to be reliable and it is subject to
change without notice. It is intended as a guide for use by persons having technical skill at their own discretion and risk. We do
not guarantee favorable results or assume any liability in connection with its use. Dimensions contained herein are for
reference purposes only. For specific dimensional requirements consult factory. This publication is not to be taken as a license
to operate under, or recommendation to infringe any existing patents. This supersedes and voids all previous literature.
