DC–20 GHZ MMIC SPDT NON-REFLECTIVE SWITCH
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.co m Website: www.filtronic.com
1
Preliminary Datasheet v2.2
FMS2027
FUNCTIONAL SCHEMATIC:
YPICAL APPLICATIONS: s
(ECM, ESM)
LECTRICAL SPECIFICATIONS (based on on-wafer meas urem ents ) :
FEATURES:
• Availab le in di e form
• Non-Reflective design
• Low Insertion loss 2.2 dB at 20GHz typical
• Very high isolation 40 dB at 20GHz typical
• Excellent low control voltage performance
GENERAL DESCRIPTION:
The FMS2027 is a low loss high isolation
broadband single pole single throw Gallium
Arsenide s witch d esign ed for us e in broad band
comm unications inst rum entation and electr onic
warfare applications. The die is fabricated
using the Filtronic FL05 0.5µm switch process
technology that offers leading edge
performance optimised for switch applications.
RFIN
RFO1 RFO2
T
• Broadband communication
• Instrumentation
• Electro nic war f ar e
EPARAMETER CONDITIONS MIN TYP MAX UNITS
Insertion Loss (DC al-10) GHz, Small Sign 1.4 dB
Insertion Loss (10-15) GHz, Small Signal 1.7 dB
Insertion Loss (15-20) GHz, Small Signal 2.2 dB
Isolation (DC-10) GHz, Small Signal 40 dB
Isolation (10-15) GHz, Small Signal 35 dB
Isolation (15-20) GHz, Small Signal 40 dB
Return state) Loss (on (DC-20) GHz, Small Signal 14 dB
Return Loss (of state) (DC-20) GHz, Small Signal 25 dB
Switching speed 50% control to 10% / 90% RF 10 ns
P1dB -5V control 25 dBm
ote: TAMBIENT = 25°C, Vctrl = 0V/-5V, ZIN = ZOUT = 50Ω
N
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.co m Website: www.filtronic.com
2
Preliminary Datasheet v2.2
FMS2027
ABSOLUTE MAXIMUM RATINGS:
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
PAD LAYOUT:
Note:
1Co-ordinates are referenced from the bottom left
hand corner of the die to the centre of bond pad
opening
2Only one control line A and one control line B
require connection
TRUTH TABLE:
Note: -5V ± 0.2V; 0V ± 0.2V
PARAMETER SYMBOL ABSOLUTE
MAXIMUM
Max Input Power Pin +38dBm
Control Voltage Vctrl +XV
Operating Temp Toper -40°C to +100°C
Storage Temp Tstor -55°C to +150°C
CONTROL LINE
RF PATH
A B RFIN-RFO1 RFIN-RFO2
-5V 0V ON OFF
0V -5V OFF ON
PAD
NAME DESCRIPTION
PIN
COORDINATES
(µm)
RFIN RFIN (653, 776)
RFO1 RFOUT1 (125, 333)
RFO2 RFOUT2 (125, 776)
AVA1 (125, 626)
AVA2 (504, 176)
AVA3 (807, 176)
AVA4 (1183, 776)
BVB1 (125, 776)
BVB2 (654, 176)
BVB3 (1183, 626)
RFIN
A
B
A B
RFO1 RFO2
A
B
A
DIE SIZE (µm) DIE THICKNESS
(µm) MIN. BOND PAD PITCH
(µm) MIN. BOND PAD OPENING
(µm x µm )
1910 x 1110 (pizza mask)
1300 x 800 (production mask)
100 150 96 x 96
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.co m Website: www.filtronic.com
3
Preliminary Datasheet v2.2
FMS2027
TYPICAL MEASURED PERFORMANCE ON WAFER:
Note: Measurement Conditions VCTRL= -5V (low) & 0V (high), TAMBIENT = 25°C unless otherwise stated
1 6 11 16 20
Frequency (G Hz )
Insertion Loss (dB)
-5
-4
-3
-2
-1
0
RFIN_RFO1
RFIN_RFO2
16111620
Frequenc y (GHz)
Isolation (dB)
-90
-80
-70
-60
-50
-40
-30
-20
-10
0RFIN_RFO1
RFIN_RFO2
161116
20
Frequency (GHz)
Ret urn Loss on Stat e (dB)
-40
-35
-30
-25
-20
-15
-10
-5
0
1 6 11 16 20
Fre quency (G Hz )
Return Loss off State (dB)
-40
-35
-30
-25
-20
-15
-10
-5
0
Lar ge si gna l me asur em en t
0
1
2
3
4
11 13 15 17 19 21 23 25 27
I nput Power (d Bm)
Loss(dB)
10GHz
20GHz
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.co m Website: www.filtronic.com
4
Preliminary Datasheet v2.2
FMS2027
PREFERRED ASSEMBLY INSTRUCTIONS:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The back of the die is metallised and the
recommended mounting method is by the use
of solder or conductive epoxy. If epoxy is
selected then it should be applied to the
attachment surface uniformly and sparingly to
avoid encroachment of epoxy on to the top
face of the die and ideally should not exceed
half the chip height. For automated dispense
Ablestick LMISR4 is recommended and for
manual dispense Ablestick 84-1 LMI or 84-1
LMIT are recommended. These should be
cured at a temperature of 150°C for 1 hour in
an oven especially set aside for epoxy curing
only. If possible the curing oven should be
flushed with dr y nitro gen .
This part has gold (Au) bond pads requiring
the use of gold (99.99% pure) bondwire. It is
recommended that 25.4µm diameter gold wire
be used. Thermosonic ball bonding is
preferred. A nominal stage temperature of
150°C and a bonding force of 40g has been
shown to give effective results for 25µm wire.
Ultrasonic energy shall be kept to a minimum.
For this bonding technique, stage temperature
should not be raised above 200°C and bond
force should not be raised above 60g.
Thermosonic wedge bonding and
thermocompression wedge bonding can also
be used to achieve good wire bonds.
Bonds should be made from the die first and
then to the mounting substrate or package.
The ph ysical len gth of the bond wir es should be
minimised especially when making RF or
ground connections.
HANDLING
PRECAUTIONS:
To avoid damage to the devices care should
be exercised during handling. Proper
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
handling, assembly, and testing. These
devices should be treated as Class 1A (0-500
V) as defined in JEDEC Standard No. 22-
A114. Further information on ESD control
measures can be found in MIL-STD-1686 and
MIL-HDBK-263.
APPLICATION NOTES & DESIGN DATA:
Applicat ion No tes and des ign data includ ing S-
parameters are available; please contact
Filtronic Compound Semiconductors Ltd.
DISCLAIMERS:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
ORDERING INFORMATION:
PART NUMBER DESCRIPTION
FMS2027-000 Die in Waff le - p a c k
(Gel-pak available on request)
