www.vishay.com For technical questions, contact: ff2bresistors@vishay.com Document Number: 61000
40 Revision: 07-Mar-08
SFP
Vishay Electro-Films
Thin Film Top-Contact Resistor
with Part Mark
CHIP
RESISTORS
The SFP series single-value resistor chips offer a small size,
wide ohmic value range and excellent power capacity.
The SFPs are part marked with resistance value allowing
user the ability to visually determine the resistance value of
the chip.
The SFPs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology.
The SFPs are 100 % electrically tested and visually
inspected to MIL-STD-883.
FEATURES
•Wire bondable
•Part marked - 5 digits
•Small size: 0.022 inches square
•Resistance range: 1 Ω to 1 MΩ
•DC power rating: 250 mW
•Oxidized silicon substrate for good power dissipation
•Resistor material: Tantalum nitride, self passivating
•Moisture resistant
APPLICATIONS
Vishay EFI SFP small resistor chips are widely used in hybrid packages where space is limited and chip value marking is
important for identification. The die is part marked with the resistance value. Wire bonding is made to the two pads on the top of
the chip.
Values above 1M available
Product may not
be to scale
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
PROCESS CODE
CLASS H* CLASS K*
103 108
102 107
101 106
100 105
* MIL-PRF-38534 inspection criteria
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100 Ω - 250 kΩ
< 100 Ω or > 251 kΩ
- 35 dB typ.
- 20 dB typ.
Moisture Resistance, MIL-STD-202
Method 106 ± 0.5 % max. ΔR/R
Stability, 1000 h, + 125 °C, 125 mW ± 0.25 % max. ΔR/R
Operating Temperature Range - 55 °C to + 125 °C
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F ± 0.25 % max. ΔR/R
High Temperature Exposure, + 150 °C, 100 h ± 0.5 % max. ΔR/R
Dielectric Voltage Breakdown 200 V
Insulation Resistance 1012 min.
Operating Voltage 100 V max.
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C) 250 mW
5 x Rated Power Short-Time Overload, + 25 °C, 5 s ± 0.25 % max. ΔR/R
1 Ω 30 Ω 200 k Ω 430 k Ω
0.1 %
Tightest Standard Tolerance Available
± 50 ppm/°C
± 250 ppm/°C
± 100 ppm/°C
± 25 ppm/°C
10 Ω 100 Ω 620 k Ω 1 M Ω
1 % 0.5 %
Document Number: 61000 For technical questions, contact: ff2bresistors@vishay.com www.vishay.com
Revision: 07-Mar-08 41
SFP
Thin Film Top-Contact Resistor
with Part Mark Vishay Electro-Films
CHIP
RESISTORS
DIMENSIONS in inches
SCHEMATIC STANDARD MARKING - 5 DIGITS
XXXX X
Four significant digits of value Multiplier
C = 0.001
B = 0.01
A = 0.1
0 = 0
1 = 10
2 = 100
3 = 1000
Options: Gold backing for eutectic die attach
Gold bonding pads, 15 kÅ minimum thickness
Consult Applications Engineer
TYPICAL RANGE
1 kΩ - 1 MΩ
PART MARK
PART MARK
0.004
0.022
0.018
0.005
TYPICAL RANGE
30 Ω - 199 Ω
PART MARK
PART MARK
TYPICAL RANGE
< 30 Ω
PART MARK
PART MARK
TYPICAL RANGE
200 Ω - 1 kΩ
PART MARK
PART MARK
MECHANICAL SPECIFICATIONS in inches
PARAMETER
Chip Size 0.022 x 0.022 ± 0.003 (0.558 x 0.558 ± 0.05 mm)
Chip Thickness 0.010 ± 0.002 (0.254 ± 0.05 mm)
Chip Substrate Material Oxidized silicon, 10 kÅ minimum SiO2
Resistor Material Tantalum nitride, self-passivating
Bonding Pad Size 0.004 x 0.004 (0.10 x 0.10 mm)
Number of Pads 2
Pad Material 25 kÅ minimum aluminum
Backing None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100 % visual, 10 kΩ, ± 1 %, ± 250 ppm/°C TCR, aluminum pads, class H visual inspection
W
INSPECTION
/PACKAGING
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample, commercial
visually inspected parts loaded in
matrix trays (4 % AQL)
SFP
PRODUCT
FAMILY
100
PROCESS
CODE
See Process Code
table
1000
RESISTANCE
VALUE
Use first 4 digits
of the resistance
1
MULTIPLIER
CODE
B = 0.01
A = 0.1
0 = 1
1 = 10
2 = 100
3 = 1000
4 = 10000
F
TOLERANCE
CODE
B = 0.1 %
C = 0.2 %
D = 0.5 %
F = 1.0 %
G = 2.0 %
H = 2.5 %
J = 5.0 %
K = 10 %
*Coating standard
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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therein, which apply to these products.
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