PRODUCT OVERVIEW

The AMD Embedded G-Series processor is the world’s rst

integrated circuit to combine a low-power CPU and a discrete-level

GPU into a single embedded Accelerated Processing Unit (APU).

This unprecedented level of graphics integration builds a new

foundation for high performance multi-media content delivery in a

small form factor and power efcient platform for a broad range of

embedded designs. Based on a power-optimized core, the

AMD Embedded G-Series platform delivers levels of performance

The AMD G-Series platform is a exible solution that in the same

package offers scalable choices for the level of CPU performance,

power efciency, and visual experience. The AMD G-T16R APU with

an average power of only 2.3 Watts2 enables very small form factor,

fan-less and portable applications. APU congurations are

available with single or dual x86 cores, at 4.5W, 9W or 18W

thermal design power (TDP), and two levels of graphics and video

performance. Each APU supports single or dual-independent high

resolution displays and exceptional multi-media capability with

hardware decode support for H.264, VC-1, MPEG2, WMV, DivX

controller hub is an alternative pairing choice with added features of

Gigabit Ethernet MAC, RAID (0/1/5/10) support with FIS-based

switching, and PCI local bus support.

HEADLESS EMBEDDED SYSTEMS

For deeply embedded headless systems, the AMD Embedded

G-Series CPU models T48L and T30L enable whisper-quiet

media servers and model T24L enables fanless design for factory

control systems.

FEATURES AND BENEFITS

A exible platform that in one package offers many choices

for power efciency, visual experience with high resolution,

and fully connected Internet experience with maximum

multi-media capability. Delivering unprecedented high denition

visual experience while still maintaining a low power design.

> DirectX® 11 support lets you enjoy awesome graphics performance,

stunning 3D visual effects and dynamic interactivity

> Advanced discrete-level GPU with OpenGL 4.0 and OpenCL™

1.1 support in an integrated device provides support to build the

additional power draw.

Enabling Innovative Small Form Factor Designs - Smaller foot

print and low power solution reduces overall system costs.

> The integration of the APU reduces the foot print of a traditional

three-chip platform to two chips, the APU and its companion

controller hub. This simplies the design, requiring fewer

board layers and a smaller power supply, thereby driving down

system costs.

Reduced Costs over the Product Life Cycle - A single, scalable

platform design that allows OEMs to reduce development costs,

development costs, simplify the supply chain and

reduce operational complexity.

> AMD’s embedded lifecycle, with planned availability of at

least 5 years, helps to ensure a long life for an OEM design.

1. When comparing the AMD Embedded G-Series T44R platform to the AMD Sempron™ 210U/780E platform running 3DMark™ 06. Internal testing of current vs. previous generation AMD processor-based

embedded systems as of October 13, 2010 showed more than 3X graphics performance-per-watt advantage for the current generation. Current system: AMD G-T44R APU (9W TDP), Inagua development

platform, 2 GB RAM, Windows® 7. Previous generation: AMD Sempron™ 2010U processor (15W TDP), MSI 9858 motherboard, 2 GB RAM, Windows 7. Graphics performance-per-watt calculated based on

3DMark™ 06 benchmark divided by solution thermal design power (TDP).

2. While running a Winbench 99 business graphics benchmark the AMD G-T16R APU consumed an average of 2.284W. I/O Controller Hub power is estimated based on the measured average power drawn

by the I/OCH of .965W during a run of 3DMark 06. System Conguration: AMD G-T16R APU (DVT) at 30°C, “Inagua” Development Board, 4GB 1.35V DDR3, Windows 7 Ultimate. EMB-26

APU FEATURES

> High speed device interconnect

> High performance integrated x86 core(s)

> Integrated cutting edge graphics processor

> High-bandwidth, low-latency integrated

memory controller

> Low-latency platform interface

X86 CORE ARCHITECTURE

> Single or dual x86 Processor

> Advanced Branch Prediction

> Secure Advanced Virtualization

GPU CORE ARCHITECTURE

> Dedicated graphics memory controller

- High efciency ring bus memory controller

- Direct connection to memory

> 2D Acceleration

- Highly-optimized 128-bit engine, capable

of processing multiple pixels per clock

> 3D Acceleration

- Full DirectX® 11 support, including full speed

each advanced video quality feature.

13. Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.

14. eDP translator option supporting 2048x1536 (HD 6310) or 1920x1200 (HD 6250) at 18 or 24 bpp.

15. Low voltage (1.35V) DDR3 is assumed for the 9W TDP processors. The use of 1.5V DDR3 will incur a power adder.

16. Conguration dependent. See product databook for congurations.

17. Models enabled by AMD Turbo CORE technology, up to 10% clock speed increase is planned. For CPU boost, only one processor core of a dual-core has boost enabled.

©2012 AMD, the AMD Arrow logo, AMD Sempron, Radeon and combinations thereof, are trademarks of Advanced Micro Devices. DirectX and Windows are registered trademarks of Microsoft Corporation in the U.S.

and/or other jurisdictions. HDMI is a trademark of HDMI Licensing, LLC. OpenCL is a trademark of Apple Inc. used by permission by Khronos. Adobe is a registered trademark of Adobe Systems Incorporated. PCIe and

PCI Express are registered trademarks of PCI-SIG. 3DMark is a trademark of Futuremark Corporation. Other names are for informational purposes only and may be trademarks of their respective owners. PID 49282I