ZL50115/16/17/18/19/20 32, 64 and 128 Channel CESoP Processors Data Sheet Features October 2009 Ordering Information General * Circuit Emulation Services over Packet (CESoP) transport for MPLS, IP and Ethernet networks * On chip timing & synchronization recovery across a packet network * On chip dual reference Stratum 4 DPLL (Stratum 3 Holdover accuracy) * Grooming capability for Nx64 Kbps trunking * Fully compatible with Zarlink's ZL50110, ZL50111, ZL50112 and ZL50114 CESoP processors ZL50115GAG 324 Ball PBGA trays, bake ZL50116GAG 324 Ball PBGA trays, bake ZL50117GAG 324 Ball PBGA trays, bake ZL50118GAG 324 Ball PBGA trays, bake ZL50119GAG 324 Ball PBGA trays, bake ZL50120GAG 324 Ball PBGA trays, bake ZL50115GAG2 324 Ball PBGA** trays, bake ZL50116GAG2 324 Ball PBGA** trays, bake ZL50117GAG2 324 Ball PBGA** trays, bake ZL50118GAG2 324 Ball PBGA** trays, bake ZL50119GAG2 324 Ball PBGA** trays, bake ZL50120GAG2 324 Ball PBGA** trays, bake **Pb Free Tin/Silver/Copper dry dry dry dry dry dry dry dry dry dry dry dry pack pack pack pack pack pack pack pack pack pack pack pack -40C to +85C Customer Side TDM Interfaces Circuit Emulation Services * & & & & & & & & & & & & Supports ITU-T recommendation Y.1413 and Y.1453 * Up to 4 T1/E1, 1 J2 or 1 T3/E3 ports * H.110, H-MVIP, ST-BUS backplane * Structured, synchronous CESoP with clock recovery * Unstructured, asynchronous CESoP, with integral per stream clock recovery * 100 Mbps MII Fast Ethernet (ZL50118/19/20 only) (may also be used as a second provider side packet interface) Clocks Backplane TDM In te rfa c e ( L I U , F r a m e r , B a c k p la n e ) P e r P o rt D C O fo r C lo c k R e c o v e r y M u lt i- P r o t o c o l P acket P r o c e s s in g E n g in e PW , RTP, UDP, IP v 4 , IP v 6 , M P L S , E C ID , V L A N , U s e r D e f in e d , O t h e r s Dual P acket In te rfa c e MAC ( M II , G M I I , T B I ) O n C h ip P a c k e t M e m o r y ( J it t e r B u f f e r C o m p e n s a t io n f o r 1 2 8 m s o f P a c k e t D e la y V a r ia t io n ) D u a l R e fe re n c e DPLL H o s t P ro c e s s o r In te r fa c e JT A G 3 2 - b it M o t o r o la c o m p a t ib le P Q I I (R) Figure 1 - ZL50115/16/17/18/19/20 High Level Overview 1 Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2004-2009, Zarlink Semiconductor Inc. All Rights Reserved. or Customer Side Packet Interfaces 1000 Mbps GMII/TBI Gigabit Ethernet Supports MEF8 and MFA 8.0.0 100 Mbps MII Fast Ethernet * H.110, H-MVIP, ST-BUS backplanes Direct connection to LIUs, framers, backplanes 4 T1/E1 or 1 J2/T3/E3 ports * Fast Ethernet Up to 128 bi-directional 64 Kbps channels Supports IETF RFC4553 and RFC5086 100 Mbps MII * * ZL50115/16/17/18/19/20 Data Sheet Provider Side Packet Interfaces * 100 Mbps MII Fast Ethernet or 1000 Mbps GMII/TBI Gigabit Ethernet System Interfaces * Flexible 32 bit Motorola host interface * On-chip packet memory with jitter buffer compensation for over 128 ms of packet delay variation Packet Processing Functions * Flexible, multi-protocol packet encapsulation including IPv4, IPv6, RTP, MPLS, L2TPv3, ITU-T Y.1413, IETF CESoPSN, IETF SAToP and user programmable * Packet re-sequencing to allow lost packet detection and re-ordering * Four classes of service with programmable priority mechanisms (WFQ and SP) using egress queues * Programmable classification of incoming packets at layers 2 through 5 * Wire speed processing of all packets regardless of classification providing low latency * Supports up to 128 separate CESoP connections across the Packet Switched Network Applications * Circuit Emulation Services over Packet Networks * Leased Line support over packet networks * TDM over Cable * TDM over WiFi (802.11x) * TDM over WiMAX (802.16) * Fibre To The Premises G/E-PON * Layer 2 VPN services * Customer-premise and Provider Edge Routers and Switches * Ethernet and IP based IADs 2 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet Table of Contents 1.0 Changes Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.0 Device Line Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.0 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.0 Physical Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.0 External Interface Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.1 TDM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.1.1 TDM stream connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.1.2 TDM Signals common to ZL50115/16/17/18/19/20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4.2 PAC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.3 Packet Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 4.4 CPU Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4.5 System Function Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4.6 Test Facilities. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4.6.1 Administration, Control and Test Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4.6.2 JTAG Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4.7 Miscellaneous Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4.8 Power and Ground Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4.9 Internal Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 4.10 No Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 4.11 Device ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.0 Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 5.1 Leased Line Provision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 5.2 Remote Concentrator Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 5.3 FTTP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 5.4 Wireless - WiFi or WiMAX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 5.5 Digital Loop Carrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 5.6 Integrated Access Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 6.0 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 6.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 6.2 Data and Control Flows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 6.3 SYSTEM_CLK Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 6.4 TDM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 6.4.1 TDM Interface Block. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 6.4.2 Structured TDM Port Data Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 6.4.3 TDM Clock Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 6.4.3.1 Synchronous TDM Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 6.4.3.2 Asynchronous TDM Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 6.5 Payload Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 6.5.1 Structured Payload Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 6.5.1.1 Payload Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.5.2 Unstructured Payload Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.6 Protocol Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 6.7 Packet Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 6.8 Packet Reception . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 6.9 TDM Formatter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 6.10 Ethernet Traffic Aggregation (ZL50118/19/20 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 7.0 Clock Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 7.1 Differential Clock Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 7.2 Adaptive Clock Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 8.0 System Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 8.1 Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 3 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet Table of Contents 8.2 Loopback Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 8.3 Host Packet Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 8.4 Loss of Service (LOS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 8.5 Power Up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 8.6 JTAG Interface and Board Level Test Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 8.7 External Component Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 8.8 Miscellaneous Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 8.9 Test Modes Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 8.9.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 8.9.1.1 System Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 8.9.1.2 System Tri-State Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 8.9.2 Test Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 8.9.3 System Normal Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 8.9.4 System Tri-state Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 9.0 DPLL Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 9.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 9.1.1 Locking Mode (normal operation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 9.1.2 Holdover Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 9.1.3 Freerun Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 9.1.4 Powerdown Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 9.2 Reference Monitor Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 9.3 Locking Mode Reference Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 9.4 Locking Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 9.5 Locking Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 9.6 Lock Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 9.7 Jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 9.7.1 Acceptance of Input Wander . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 9.7.2 Intrinsic Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 9.7.3 Jitter Tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 9.7.4 Jitter Transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 9.8 Maximum Time Interval Error (MTIE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 10.0 Memory Map and Register Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 11.0 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 12.0 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 12.1 TDM Interface Timing - ST-BUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 12.1.1 ST-BUS Slave Clock Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 12.1.2 ST-BUS Master Clock Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 12.2 TDM Interface Timing - H.110 Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 12.3 TDM Interface Timing - H-MVIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 12.4 TDM LIU Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 12.5 PAC Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 12.6 Packet Interface Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 12.6.1 MII Transmit Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 12.6.2 MII Receive Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 12.6.3 GMII Transmit Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 12.6.4 GMII Receive Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 12.6.5 TBI Interface Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 12.6.6 Management Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 12.7 CPU Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 12.8 System Function Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 12.9 JTAG Interface Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 13.0 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 4 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet Table of Contents 14.0 Design and Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 14.1 High Speed Clock & Data Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 14.1.1 GMAC Interface - Special Considerations During Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 14.1.2 TDM Interface - Special Considerations During Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 14.1.3 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 14.2 CPU TA Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 15.0 Reference Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 15.1 External Standards/Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 15.2 Zarlink Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 16.0 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 5 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet List of Figures Figure 1 - ZL50115/16/17/18/19/20 High Level Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2 - ZL50115 Package View and Ball Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 3 - ZL50116 Package View and Ball Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 4 - ZL50117 Package View and Ball Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 5 - ZL50118 Package View and Ball Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 6 - ZL50119 Package View and Ball Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 7 - ZL50120 Package View and Ball Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 8 - Leased Line Services Over a Circuit Emulation Link. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 9 - Remote Concentrator Unit using CESoP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Figure 10 - EPON using CESoP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Figure 11 - Wi-Fi and WiMAX using CESoP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Figure 12 - Digital Loop Carrier using CESoP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Figure 13 - Integrated Access Device Using CESoP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Figure 14 - ZL50115/16/17/18/19/20 Family Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Figure 15 - ZL50115/16/17/18/19/20 Data and Control Flows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Figure 16 - Synchronous TDM Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Figure 17 - ZL50115/16/17/18/19/20 Packet Format - Structured Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Figure 18 - Channel Order for Packet Formation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Figure 19 - ZL50115/16/17/18/19/20 Packet Format - Unstructured Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Figure 20 - Differential Clock Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Figure 21 - Adaptive Clock Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Figure 22 - Powering Up the ZL5011x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Figure 23 - Jitter Transfer Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Figure 24 - Jitter Transfer Function - Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Figure 25 - TDM ST-BUS Slave Mode Timing at 8.192 Mbps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Figure 26 - TDM ST-BUS Slave Mode Timing at 2.048 Mbps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Figure 27 - TDM Bus Master Mode Timing at 8.192 Mbps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Figure 28 - TDM Bus Master Mode Timing at 2.048 Mbps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Figure 29 - H.110 Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Figure 30 - TDM - H-MVIP Timing Diagram for 16 MHz Clock (8.192 Mbps) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Figure 31 - TDM-LIU Structured Transmission/Reception . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Figure 32 - MII Transmit Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Figure 33 - MII Receive Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Figure 34 - GMII Transmit Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Figure 35 - GMII Receive Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Figure 36 - TBI Transmit Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Figure 37 - TBI Receive Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Figure 38 - Management Interface Timing for Ethernet Port - Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Figure 39 - Management Interface Timing for Ethernet Port - Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Figure 40 - CPU Read - MPC8260 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Figure 41 - CPU Write - MPC8260. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Figure 42 - CPU DMA Read - MPC8260 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Figure 43 - CPU DMA Write - MPC8260 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Figure 44 - JTAG Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Figure 45 - JTAG Clock and Reset Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Figure 46 - ZL50115/16/17/18/19/20 Power Consumption Plot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Figure 47 - CPU_TA Board Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 6 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet List of Tables Table 1 - Capacity of Devices in the ZL50115/16/17/18/19/20 Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 2 - ZL50115/16/17/18/19/20 Ball Signal Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table 3 - TDM Interface Stream Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 4 - TDM Interface Common Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table 5 - PAC Interface Package Ball Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table 6 - Packet Interface Signal Mapping - MII to GMII/TBI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 7 - MII Management Interface Package Ball Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 8 - MII Port 0 Interface Package Ball Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 9 - MII Port 1 Interface Package Ball Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 10 - CPU Interface Package Ball Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 11 - System Function Interface Package Ball Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Table 12 - Administration/Control Interface Package Ball Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Table 13 - JTAG Interface Package Ball Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table 14 - Miscellaneous Inputs Package Ball Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table 15 - Power and Ground Package Ball Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Table 16 - Internal Connections Package Ball Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 17 - Miscellaneous Inputs Package Ball Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 18 - Device ID Ball Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 19 - Standard Device Flows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Table 20 - TDM Services Offered by the ZL50115/16/17/18/19/20 Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Table 21 - Some of the TDM Port Formats Accepted by the ZL50115/16/17/18/19/20 Family . . . . . . . . . . . . . . . 50 Table 22 - DMA Maximum Bandwidths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Table 23 - Test Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Table 24 - DPLL Input Reference Frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Table 25 - TDM ST-BUS Master Timing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Table 26 - TDM H.110 Timing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Table 27 - TDM H-MVIP Timing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Table 28 - TDM - LIU Structured Transmission/Reception. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Table 29 - PAC Timing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Table 30 - MII Transmit Timing - 100 Mbps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Table 31 - MII Receive Timing - 100 Mbps. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Table 32 - GMII Transmit Timing - 1000 Mbps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Table 33 - GMII Receive Timing - 1000 Mbps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Table 34 - TBI Timing - 1000 Mbps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Table 35 - MAC Management Timing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Table 36 - CPU Timing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Table 37 - System Clock Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Table 38 - JTAG Interface Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 7 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 1.0 Data Sheet Change Summary The following table captures the changes from the March 2009 issue. Page 1 Item MEF logo Change Added MEF logo to show MEF 18 certification. The following table captures the changes from the May 2008 issue. Page 50 Item Change Section 6.3 Replaced ZLAN-143 with ZL5011x Design Manual section "3.6 System Clock Block". Section 6.5 and Section 6.8 Replaced ZLAN-202 with ZL5011x Design Manual section "13.1 Understanding forceDelete". 60 Section 8.4 Replaced ZLAN-159 with ZL5011x Design Manual section "3.1.1 Connection to LIU. 81 Section 12.6.5 Replaced ZLAN-239 with ZL5011x Design Manual section "7.1.3.1 TBI Interface Timing" 92 Section 15.1 Removed reference to IETF PWE3 draft-ietf-l2tpext-l2tp-base-02" 52 & 55 The following table captures the changes from the February 2006 issue. Page Item Change 1, 2 and 11 Standard Updated IETF RFC number and standards in general 1, 51,62, 63 and 66 Stratum 3 DPLL Updated the description for Stratum 3 DPLL 1,10, 11, 27, 28 and 49 STS-1 stream Remove STS-1 stream 31 Section 4.3 Include more detailed description for the packet interface 49 Section 6 Add a note about jumbo packets 50 Section 6.4 Include a paragraph to clarify the support for structure and unstructure modes at the same time 53 Section 6.5 Include more detailed description for the Payload Assembly 55 Section 6.5.2 Add a note at the end of the section 56 Section 6.9 Include more detailed description for the TDM formatter 57 Section 7 Include more detailed description for Clock Recovery 57 Section 7.1 Include more detailed description for Differential Clock Recovery 58 Section 7.2 Updated the description of Adaptive Clock Recovery 60 Section 8.5 Update Power Up Sequence 80 Section 12.6.3 Updated values for tDV, tEV and tER in Table 32 8 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Page Item Data Sheet Change 82 Section 12.6.5 Updated TXD[9:0] output delay 83 Section 12.6.6 Updated Section 12.6.6 Management Interface Timing (M_MDIO hold time and Figure 39) 85 CPU_TS_ALE and CPU_TA Added mode details in Figure 40 and Figure 41 Added the CPU_TA assertion time The following table captures the changes from the July 2005 issue. Page 39, 40 Item Section 4.5 and Section 4.6.2 Change Added external pull-up/pull-down resistor recommendations for SYSTEM_RST, SYSTEM_DEBUG, JTAG_TRST, JTAG_TCK. The following table captures the changes from the April 2005 issue. Page 50 Item Section 6.3 Change Added Section 6.3 SYSTEM_CLK Considerations. The following table captures the changes from the January 2005 issue. Page Item Change Clarified data sheet to indicate ZL5011x supports clock recovery in both synchronous and asynchronous modes of operation. 85 Figure 42 Inverted polarity of CPU_DREQ0 and CPU_DREQ1 to conform with default MPC8260. Polarity of CPU_DREQ and CPU_SDACK remains programmable through API. 85 Figure 43 Inverted polarity of CPU_DREQ0 and CPU_DREQ1 to conform with default MPC8260. Polarity of CPU_DREQ and CPU_SDACK remains programmable through API. The following table captures the changes from the November 2004 issue. Page 39 Item Section 4.6.1 Change Added 5 kohm pulldown recommendation to GPIO signals. 9 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 2.0 Data Sheet Device Line Up There are six products within the ZL5011x family, with capacities as shown in Table 1. Product Number Provider Side Packet Interface TDM Interface Customer Side Packet Interface ZL50115 1 T1 or 1 E1 stream or 1 MVIP/ST-BUS stream at 2.048 Mbps or 1 H.110/H-MVIP/ST-BUS streams at 8.192 Mbps (Maximum of 32 DS0 or Nx64 kbps channels) 100 Mbps MII or 1000 Mbps GMII/TBI None ZL50116 2 T1 or 2 E1 streams or 2 MVIP/ST-BUS streams at 2.048 Mbps or 1 H.110/H-MVIP/ST-BUS streams at 8.192 Mbps (Maximum of 64 DS0 or Nx64 kbps channels) 100 Mbps MII or 1000 Mbps GMII/TBI None ZL50117 4 T1 or 4 E1 streams or 1 J2, 1 T3 or 1 E3 or 4 MVIP/ST-BUS streams at 2.048 Mbps or 1 H.110/H-MVIP/ST-BUS streams at 8.192 Mbps 100 Mbps MII or 1000 Mbps GMII/TBI None ZL50118 1 T1 or 1 E1 stream or 1 MVIP/ST-BUS stream at 2.048 Mbps or 1 H.110/H-MVIP/ST-BUS streams at 8.192 Mbps (Maximum of 32 DS0 or Nx64 kbps channels) 100 Mbps MII or 1000 Mbps GMII/TBI 100 Mbps MII ZL50119 2 T1 or 2 E1 streams or 2 MVIP/ST-BUS streams at 2.048 Mbps or 1 H.110/H-MVIP/ST-BUS streams at 8.192 Mbps (Maximum of 64 DS0 or Nx64 kbps channels) 100 Mbps MII or 1000 Mbps GMII/TBI 100 Mbps MII ZL50120 4 T1 or 4 E1 streams or 1 J2, 1 T3 or 1 E3 or 4 MVIP/ST-BUS streams at 2.048 Mbps or 1 H.110/H-MVIP/ST-BUS streams at 8.192 Mbps 100 Mbps MII or 1000 Mbps GMII/TBI 100 Mbps MII Table 1 - Capacity of Devices in the ZL50115/16/17/18/19/20 Family 10 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 2.0 Data Sheet Description The ZL5011x family (ZL50115, ZL50116, ZL50117, ZL50118, ZL50119, ZL50120) of CESoP processors are highly functional TDM to Packet bridging devices. The ZL5011x provides both structured and unstructured circuit emulation services (CESoP) for T1 and E1 streams across a packet network based on MPLS, IP or Ethernet. The ZL50117/20 also supports unstructured J2, T3 and E3. The circuit emulation features in the ZL5011x supports the ITU Recommendation Y.1413 and Y.1453, as well as the CESoP standards from the Metro Ethernet Forum (MEF) and the MPLS and Frame Relay Alliance. The ZL5011x also supports IETF RFC4553 and RFC5086. The ZL50118/19/20 provides a customer side 100 Mbps MII port to aggregate data traffic with voice traffic to the provider side 1000 Mbps GMII/TBI port, thereby eliminating the need for an external Ethernet switch. The ZL5011x incorporates a range of powerful clock recovery mechanisms for each TDM stream, allowing the frequency of the source clock to be faithfully generated at the destination, enabling greater system performance and quality. Timing is carried using RTP or similar protocols, and both adaptive and differential clock recovery schemes are included, allowing the customer to choose the correct scheme for the application. An externally supplied clock may also be used to drive the TDM interface of the ZL5011x. The ZL5011x incur very low latency for the data flow, thereby increasing QoS when carrying voice services across the Packet Switched Network. Voice, when carried using CESoP, which typically has latencies of less than 10 ms, does not require expensive processing such as compression and echo cancellation. The ZL5011x are cost effective devices aimed at the low density applications such as customer premise routers, IADs, ePON termination and Broadband DLCs. For network systems, the ZL5011x is fully compatible and interoperable with the ZL50110/11/12/14 family. The ZL5011x is capable of assembling user-defined packets of TDM traffic from the TDM interface and transmitting them out the packet interfaces using a variety of protocols. The ZL5011x supports a range of different packet switched networks, including Ethernet VLANs, IP and MPLS. The devices also supports four different classes of service on packet egress, allowing priority treatment of TDM-based traffic. This can be used to help minimize latency variation in the TDM data. The ZL5011x can support up to 4 protocol stacks at the same time, provided that each protocol stack can be uniquely identified by a mask & match approach. Packets received from the packet interfaces are parsed to determine the egress destination, and are appropriately queued to the TDM interface, they can also be forwarded to the host interface, or back toward the packet interface. Packets queued to the TDM interface can be re-ordered based on sequence number, and lost packets filled in to maintain timing integrity. The ZL5011x includes on-chip memory sufficient for all applications, thereby reducing system costs, board area, power, and design complexity. A comprehensive evaluation system is available upon request from your local Zarlink representative or distributor. This system includes the CESoP processor, various TDM interfaces and a fully featured evaluation software GUI that will run on a Windows PC. 11 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 3.0 Physical Specification The ZL5011x will be packaged in a PBGA device. Features: * Body Size: 23 mm x 23 mm (typ) * Ball Count: 324 * Ball Pitch: 1.00 mm (typ) * Ball Matrix: 22 x 22 * Ball Diameter: 0.60 mm (typ) * Total Package Thickness: 2.03 mm (typ) 12 Zarlink Semiconductor Inc. Data Sheet ZL50115/16/17/18/19/20 Data Sheet ZL50115 Package view from TOP side. Note that ball A1 is non-chamfered corner. 1 2 3 4 5 6 7 8 9 10 11 12 13 M0_GTX_C M0_TXEN DEVICE_ID CPU_DATA[CPU_DATA[GND LK [4] 28] 24] 14 15 CPU_DATA[ GND 23] 16 17 18 19 20 21 22 A VDD_IO NC M0_TXCLK M0_RXD[7] M0_RXD[6] M0_RXD[4] M0_COL B NC VDD_IO GND NC NC M0_CRS M0_RXD[0] M0_RBC1 M0_RBC0 M0_TXER GND C NC GND VDD_IO NC NC NC M0_RXDV M0_RXD[3] M0_RXD[1] M0_RXCLK M0_TXD[7] M0_TXD[4] M0_TXD[0] VDD_IO D NC NC NC VDD_IO NC M0_RXER VDD_IO E NC M0_GIGABI NC T_LED F NC NC G M_MDIO DEVICE_ID M0_LINKU VDD_IO [0] P_LED VDD_IO H M_MDC GND NC VDD_COR E CPU_DATA[CPU_DATA[CPU_DATA[ IC 10] 1] 4] J NC NC NC VDD_COR E GND GND GND GND GND GND VDD_COR CPU_DATA[CPU_DATA[ CPU_IREQ E 5] 3] 0 K NC NC NC VDD_IO GND GND GND GND GND GND GND L GND AUX_CLKO AUX_CLKI VDD_COR E GND GND GND GND GND GND CPU_CLK GND M NC NC NC VDD_IO GND GND GND GND GND GND GND CPU_TS_A CPU_WE LE CPU_OE N NC NC NC VDD_COR E GND GND GND GND GND GND VDD_IO CPU_ADD CPU_CS R[22] CPU_ADDR [19] P NC GND VDD_IO VDD_COR E GND GND GND GND GND GND VDD_COR CPU_ADD CPU_ADDR CPU_ADDR E R[17] [18] [21] R NC NC TDM_CLKI[ NC 0] GND CPU_ADD CPU_ADDR CPU_ADDR R[11] [13] [20] T NC NC TDM_FRMI VDD_IO _REF VDD_IO VDD_IO U TDM_STI[0]VDD_IO GND TDM_CLKi S VDD_COR JTAG_TMS CPU_ADDR CPU_ADDR E [15] [12] V TDM_STO[ TDM_CLKO TDM_CLKO TDM_CLKi 0] [0] _REF P DEVICE_ID JTAG_TCK CPU_ADDR CPU_ADDR [3] [10] [9] M0_TXD[5] M0_TXD[3] M0_TXD[2] NC VDD_IO CPU_DATA[ CPU_DATA[ CPU_DATA[CPU_DATA[CPU_DATA[CPU_SDAC VDD_IO 19] 12] 9] 8] 7] K1 CPU_DATA[CPU_DATA[ CPU_DATA[CPU_DATA[GND 27] 22] 20] 13] VDD_IO CPU_TA CPU_DATA[NC 31] GND CPU_DRE Q1 M0_RXD[5] VDD_COR M0_RXD[2] M0_REFCL M0_TXD[6] M0_TXD[1] VDD_COR VDD_COR VDD_IO E K E E CPU_DATA[CPU_DATA[VDD_IO 29] 26] M0_ACTIV VDD_COR VDD_IO E_LED E NC CPU_DATA[CPU_ADDR CPU_DATA[ 25] [23] 6] CPU_DATA[CPU_DATA[CPU_DATA[ CPU_DATA[ 30] 21] 15] 14] DEVICE_ID VDD_COR [1] E VDD_COR CPU_DATA[CPU_DATA[ CPU_DATA[ E 18] 17] 16] W IC TDM_CLKI TDM_FRM VDD_IO _REF O_REF VDD_IO VDD_COR VDD_IO E VDD_IO VDD_COR PLL_SEC E IC_GND GND SYSTEM_C VDD_COR GPIO[9] LK E VDD_IO GPIO[15] Y IC GND VDD_IO IC IC VDD_COR IC E IC PLL_PRI IC IC_GND IC GND AA IC VDD_IO GND VDD_IO VDD_IO IC GND A1VDD_PL IC L1 IC AB VDD_IO IC IC IC GND IC IC IC GPIO[3] GPIO[0] DEVICE_ID VDD_IO [2] CPU_IREQ CPU_DATA[ CPU_DATA[ 1 11] 0] CPU_DATA[IC 2] CPU_DRE Q0 CPU_SDAC IC_VDD_IO K2 CPU_ADDR CPU_ADDR [14] [16] JTAG_TDO CPU_ADDR CPU_ADDR [4] [8] GND GPIO[8] GPIO[14] TEST_MOD JTAG_TRS IC_GND E[1] T VDD_IO GND CPU_ADDR [7] SYSTEM_D SYSTEM_R GPIO[1] EBUG ST GPIO[2] GPIO[7] GPIO[12] TEST_MOD JTAG_TDI IC_GND E[0] GND VDD_IO CPU_ADDR [6] GPIO[4] GPIO[10] GPIO[11] GPIO[13] TEST_MOD IC_GND E[2] GPIO[5] GPIO[6] Figure 2 - ZL50115 Package View and Ball Positions 13 Zarlink Semiconductor Inc. CPU_ADD CPU_ADD CPU_ADDR VDD_IO R[2] R[3] [5] ZL50115/16/17/18/19/20 Data Sheet ZL50116 Package view from TOP side. Note that ball A1 is non-chamfered corner. 1 2 3 4 5 6 7 8 9 10 11 12 13 M0_GTX_C M0_TXEN DEVICE_ID CPU_DATA[CPU_DATA[GND LK [4] 28] 24] 14 15 CPU_DATA[ GND 23] 16 17 18 19 20 21 22 A VDD_IO NC M0_TXCLK M0_RXD[7] M0_RXD[6] M0_RXD[4] M0_COL B NC VDD_IO GND NC NC M0_CRS M0_RXD[0] M0_RBC1 M0_RBC0 M0_TXER GND C NC GND VDD_IO NC NC NC M0_RXDV M0_RXD[3] M0_RXD[1] M0_RXCLK M0_TXD[7] M0_TXD[4] M0_TXD[0] VDD_IO D NC NC NC VDD_IO NC M0_RXER VDD_IO E NC M0_GIGABI NC T_LED F NC NC G M_MDIO DEVICE_ID M0_LINKU VDD_IO [0] P_LED VDD_IO H M_MDC GND NC VDD_COR E CPU_DATA[CPU_DATA[CPU_DATA[ IC 10] 1] 4] J NC NC NC VDD_COR E GND GND GND GND GND GND VDD_COR CPU_DATA[CPU_DATA[ CPU_IREQ E 5] 3] 0 K NC NC NC VDD_IO GND GND GND GND GND GND GND L GND AUX_CLKO AUX_CLKI VDD_COR E GND GND GND GND GND GND CPU_CLK GND M NC NC NC VDD_IO GND GND GND GND GND GND GND CPU_TS_A CPU_WE LE CPU_OE N NC NC NC VDD_COR E GND GND GND GND GND GND VDD_IO CPU_ADD CPU_CS R[22] CPU_ADDR [19] P NC GND VDD_IO VDD_COR E GND GND GND GND GND GND VDD_COR CPU_ADD CPU_ADDR CPU_ADDR E R[17] [18] [21] R NC TDM_STI[1]TDM_CLKI[ TDM_STO[ 0] 1] T M0_TXD[5] M0_TXD[3] M0_TXD[2] NC VDD_IO CPU_DATA[ CPU_DATA[ CPU_DATA[CPU_DATA[CPU_DATA[CPU_SDAC VDD_IO 19] 12] 9] 8] 7] K1 CPU_DATA[CPU_DATA[ CPU_DATA[CPU_DATA[GND 27] 22] 20] 13] VDD_IO CPU_TA CPU_DATA[NC 31] GND CPU_DRE Q1 M0_RXD[5] VDD_COR M0_RXD[2] M0_REFCL M0_TXD[6] M0_TXD[1] VDD_COR VDD_COR VDD_IO E K E E CPU_DATA[CPU_DATA[VDD_IO 29] 26] M0_ACTIV VDD_COR VDD_IO E_LED E NC CPU_DATA[CPU_ADDR CPU_DATA[ 25] [23] 6] CPU_DATA[CPU_DATA[CPU_DATA[ CPU_DATA[ 30] 21] 15] 14] DEVICE_ID VDD_COR [1] E VDD_COR CPU_DATA[CPU_DATA[ CPU_DATA[ E 18] 17] 16] CPU_IREQ CPU_DATA[ CPU_DATA[ 1 11] 0] CPU_DATA[IC 2] CPU_DRE Q0 CPU_SDAC IC_VDD_IO K2 GND CPU_ADD CPU_ADDR CPU_ADDR R[11] [13] [20] TDM_CLKI[ TDM_CLKO TDM_FRMI VDD_IO 1] [1] _REF VDD_IO VDD_IO U TDM_STI[0]VDD_IO TDM_CLKi S VDD_COR JTAG_TMS CPU_ADDR CPU_ADDR E [15] [12] V TDM_STO[ TDM_CLKO TDM_CLKO TDM_CLKi 0] [0] _REF P DEVICE_ID JTAG_TCK CPU_ADDR CPU_ADDR [3] [10] [9] GND W IC TDM_CLKI TDM_FRM VDD_IO _REF O_REF VDD_IO VDD_COR VDD_IO E VDD_IO VDD_COR PLL_SEC E IC_GND GND SYSTEM_C VDD_COR GPIO[9] LK E VDD_IO GPIO[15] Y IC GND VDD_IO IC IC VDD_COR IC E IC PLL_PRI IC IC_GND IC GND AA IC VDD_IO GND VDD_IO VDD_IO IC GND A1VDD_PL IC L1 IC AB VDD_IO IC IC IC GND IC IC IC GPIO[3] GPIO[0] DEVICE_ID VDD_IO [2] CPU_ADDR CPU_ADDR [14] [16] JTAG_TDO CPU_ADDR CPU_ADDR [4] [8] GND GPIO[8] GPIO[14] TEST_MOD JTAG_TRS IC_GND E[1] T VDD_IO GND CPU_ADDR [7] SYSTEM_D SYSTEM_R GPIO[1] EBUG ST GPIO[2] GPIO[7] GPIO[12] TEST_MOD JTAG_TDI IC_GND E[0] GND VDD_IO CPU_ADDR [6] GPIO[4] GPIO[10] GPIO[11] GPIO[13] TEST_MOD IC_GND E[2] GPIO[5] GPIO[6] Figure 3 - ZL50116 Package View and Ball Positions 14 Zarlink Semiconductor Inc. CPU_ADD CPU_ADD CPU_ADDR VDD_IO R[2] R[3] [5] ZL50115/16/17/18/19/20 Data Sheet ZL50117 Package view from TOP side. Note that ball A1 is non-chamfered corner. 1 2 3 4 5 6 7 8 9 10 11 12 13 M0_GTX_C M0_TXEN DEVICE_ID CPU_DATA[CPU_DATA[GND LK [4] 28] 24] 14 15 CPU_DATA[ GND 23] 16 17 18 19 20 21 22 A VDD_IO NC M0_TXCLK M0_RXD[7] M0_RXD[6] M0_RXD[4] M0_COL B NC VDD_IO GND NC NC M0_CRS M0_RXD[0] M0_RBC1 M0_RBC0 M0_TXER GND C NC GND VDD_IO NC NC NC M0_RXDV M0_RXD[3] M0_RXD[1] M0_RXCLK M0_TXD[7] M0_TXD[4] M0_TXD[0] VDD_IO D NC NC NC VDD_IO NC M0_RXER VDD_IO E NC M0_GIGABI NC T_LED F NC NC G M_MDIO DEVICE_ID M0_LINKU VDD_IO [0] P_LED VDD_IO H M_MDC GND NC VDD_COR E CPU_DATA[CPU_DATA[CPU_DATA[ IC 10] 1] 4] J NC NC NC VDD_COR E GND GND GND GND GND GND VDD_COR CPU_DATA[CPU_DATA[ CPU_IREQ E 5] 3] 0 K NC NC NC VDD_IO GND GND GND GND GND GND GND L GND AUX_CLKO AUX_CLKI VDD_COR E GND GND GND GND GND GND CPU_CLK GND M TDM_CLKI[ TDM_STO[ TDM_STI[3]VDD_IO 3] 3] GND GND GND GND GND GND GND CPU_TS_A CPU_WE LE CPU_OE N TDM_STO[ TDM_CLKO TDM_STI[2]VDD_COR 2] [3] E GND GND GND GND GND GND VDD_IO CPU_ADD CPU_CS R[22] CPU_ADDR [19] P TDM_CLKI[ GND 2] GND GND GND GND GND GND VDD_COR CPU_ADD CPU_ADDR CPU_ADDR E R[17] [18] [21] R TDM_CLKO TDM_STI[1]TDM_CLKI[ TDM_STO[ [2] 0] 1] GND CPU_ADD CPU_ADDR CPU_ADDR R[11] [13] [20] T TDM_CLKI[ TDM_CLKO TDM_FRMI VDD_IO 1] [1] _REF VDD_IO VDD_IO U TDM_STI[0]VDD_IO TDM_CLKi S VDD_COR JTAG_TMS CPU_ADDR CPU_ADDR E [15] [12] V TDM_STO[ TDM_CLKO TDM_CLKO TDM_CLKi 0] [0] _REF P DEVICE_ID JTAG_TCK CPU_ADDR CPU_ADDR [3] [10] [9] M0_TXD[5] M0_TXD[3] M0_TXD[2] NC VDD_IO CPU_DATA[ CPU_DATA[ CPU_DATA[CPU_DATA[CPU_DATA[CPU_SDAC VDD_IO 19] 12] 9] 8] 7] K1 CPU_DATA[CPU_DATA[ CPU_DATA[CPU_DATA[GND 27] 22] 20] 13] VDD_IO CPU_TA CPU_DATA[NC 31] GND CPU_DRE Q1 M0_RXD[5] VDD_COR M0_RXD[2] M0_REFCL M0_TXD[6] M0_TXD[1] VDD_COR VDD_COR VDD_IO E K E E CPU_DATA[CPU_DATA[VDD_IO 29] 26] M0_ACTIV VDD_COR VDD_IO E_LED E NC CPU_DATA[CPU_DATA[CPU_DATA[ CPU_DATA[ 30] 21] 15] 14] DEVICE_ID VDD_COR [1] E VDD_IO GND CPU_DATA[CPU_ADDR CPU_DATA[ 25] [23] 6] VDD_COR CPU_DATA[CPU_DATA[ CPU_DATA[ E 18] 17] 16] VDD_COR E W IC TDM_CLKI TDM_FRM VDD_IO _REF O_REF VDD_IO VDD_COR VDD_IO E VDD_IO VDD_COR PLL_SEC E IC_GND GND SYSTEM_C VDD_COR GPIO[9] LK E VDD_IO GPIO[15] Y IC GND VDD_IO IC IC VDD_COR IC E IC PLL_PRI IC IC_GND IC GND AA IC VDD_IO GND VDD_IO VDD_IO IC GND A1VDD_PL IC L1 IC AB VDD_IO IC IC IC GND IC IC IC GPIO[3] GPIO[0] DEVICE_ID VDD_IO [2] CPU_IREQ CPU_DATA[ CPU_DATA[ 1 11] 0] CPU_DATA[IC 2] CPU_DRE Q0 CPU_SDAC IC_VDD_IO K2 CPU_ADDR CPU_ADDR [14] [16] JTAG_TDO CPU_ADDR CPU_ADDR [4] [8] GND GPIO[8] GPIO[14] TEST_MOD JTAG_TRS IC_GND E[1] T VDD_IO GND CPU_ADDR [7] SYSTEM_D SYSTEM_R GPIO[1] EBUG ST GPIO[2] GPIO[7] GPIO[12] TEST_MOD JTAG_TDI IC_GND E[0] GND VDD_IO CPU_ADDR [6] GPIO[4] GPIO[10] GPIO[11] GPIO[13] TEST_MOD IC_GND E[2] GPIO[5] GPIO[6] Figure 4 - ZL50117 Package View and Ball Positions 15 Zarlink Semiconductor Inc. CPU_ADD CPU_ADD CPU_ADDR VDD_IO R[2] R[3] [5] ZL50115/16/17/18/19/20 Data Sheet ZL50118 Package view from TOP side. Note that ball A1 is non-chamfered corner. 1 2 3 4 A VDD_IO B M1_TXD[2] VDD_IO C M1_TXD[3] GND D M1_RXD[1] M1_RXD[0] M1_RXD[2] E M1_RXD[3] M0_GIGABI M1_TXCLK M1_RXER T_LED F NC 5 6 7 8 9 10 11 12 M1_TXEN M0_TXCLK M0_RXD[7] M0_RXD[6] M0_RXD[4] M0_COL M0_GTX_C M0_TXEN DEVICE_ID CPU_DATA[CPU_DATA[ LK [4] 28] 24] GND M1_TXD[0] M1_TXD[1] M0_CRS M0_RXD[0] M0_RBC1 M0_RBC0 M0_TXER VDD_IO M1_RXCLK M1_COL VDD_IO GND 13 14 15 GND CPU_DATA[ 23] GND VDD_IO 17 18 19 20 VDD_IO GND VDD_IO CPU_DATA[ M1_LINKU CPU_DATA[CPU_DATA[ VDD_IO 31] P_LED 29] 26] M0_RXD[5] VDD_COR M0_RXD[2] M0_REFCL M0_TXD[6] M0_TXD[1] VDD_COR VDD_COR E K E E 21 22 CPU_DATA[CPU_DATA[CPU_DATA[CPU_DATA[CPU_DATA[ CPU_SDAC VDD_IO 19] 12] 9] 8] 7] K1 M0_TXD[5] M0_TXD[3] M0_TXD[2] M1_ACTIV CPU_DATA[CPU_DATA[CPU_DATA[CPU_DATA[ E_LED 27] 22] 20] 13] M1_TXER M0_RXDV M0_RXD[3] M0_RXD[1] M0_RXCLK M0_TXD[7] M0_TXD[4] M0_TXD[0] M1_RXDV M0_RXER 16 VDD_IO M0_ACTIV VDD_COR E_LED E VDD_IO CPU_TA GND CPU_DRE Q1 VDD_IO CPU_DATA[CPU_ADDR CPU_DATA[ 25] [23] 6] CPU_DATA[CPU_DATA[ CPU_DATA[ CPU_DATA[ 30] 21] 15] 14] M1_CRS DEVICE_ID VDD_COR [1] E VDD_COR CPU_DATA[ CPU_DATA[ CPU_DATA[ E 18] 17] 16] G M_MDIO DEVICE_ID M0_LINKU [0] P_LED VDD_IO VDD_IO CPU_IREQ CPU_DATA[ CPU_DATA[ 1 11] 0] H M_MDC GND NC VDD_COR E J NC NC NC VDD_COR E GND GND GND GND GND GND K NC NC NC VDD_IO GND GND GND GND GND GND GND CPU_DATA[ 2] L GND GND GND GND GND GND GND CPU_CLK GND M NC NC NC VDD_IO GND GND GND GND GND GND GND N NC NC NC VDD_COR E GND GND GND GND GND GND VDD_IO P NC GND VDD_IO VDD_COR E GND GND GND GND GND GND R NC NC TDM_CLKI[ 0] NC GND CPU_ADD CPU_ADDR CPU_ADDR R[11] [13] [20] T NC NC TDM_FRMI _REF VDD_IO VDD_IO VDD_IO CPU_ADDR CPU_ADDR [14] [16] GND CPU_DATA[CPU_DATA[ CPU_DATA[ 10] 1] 4] AUX_CLKO AUX_CLKI VDD_COR E IC VDD_COR CPU_DATA[ CPU_DATA[ CPU_IREQ E 5] 3] 0 IC CPU_SDAC IC_VDD_IO K2 CPU_TS_A CPU_WE LE CPU_ADD R[22] CPU_DRE Q0 CPU_OE CPU_CS CPU_ADDR [19] VDD_COR CPU_ADD CPU_ADDR CPU_ADDR E R[17] [18] [21] U TDM_STI[0] VDD_IO TDM_CLKi S VDD_COR JTAG_TMS CPU_ADDR CPU_ADDR E [15] [12] V TDM_STO[ TDM_CLKO TDM_CLKO TDM_CLKi 0] [0] _REF P DEVICE_ID JTAG_TCK CPU_ADDR CPU_ADDR [3] [10] [9] W IC TDM_CLKI TDM_FRM _REF O_REF VDD_IO VDD_IO VDD_COR E VDD_IO VDD_IO Y IC GND AA IC AB VDD_IO VDD_COR PLL_SEC E VDD_IO IC IC VDD_COR E IC IC PLL_PRI IC VDD_IO GND VDD_IO VDD_IO IC GND A1VDD_PL L1 IC IC IC IC IC GND IC IC IC GPIO[0] GPIO[3] IC_GND GND IC_GND IC SYSTEM_C VDD_COR LK E GND SYSTEM_D SYSTEM_R GPIO[1] EBUG ST GPIO[4] GPIO[5] GPIO[6] GPIO[9] VDD_IO GPIO[15] DEVICE_ID VDD_IO [2] GND GPIO[8] GPIO[14] TEST_MOD JTAG_TRS E[1] T IC_GND VDD_IO GPIO[2] GPIO[7] GPIO[12] TEST_MOD JTAG_TDI E[0] IC_GND GND GPIO[10] GPIO[11] GPIO[13] TEST_MOD IC_GND E[2] Figure 5 - ZL50118 Package View and Ball Positions 16 Zarlink Semiconductor Inc. JTAG_TDO CPU_ADDR CPU_ADDR [4] [8] GND CPU_ADDR [7] VDD_IO CPU_ADDR [6] CPU_ADD CPU_ADD CPU_ADDR VDD_IO R[2] R[3] [5] ZL50115/16/17/18/19/20 Data Sheet ZL50119 Package view from TOP side. Note that ball A1 is non-chamfered corner. 1 2 3 4 A VDD_IO B M1_TXD[2] VDD_IO C M1_TXD[3] GND D M1_RXD[1] M1_RXD[0] M1_RXD[2] E M1_RXD[3] M0_GIGABI M1_TXCLK M1_RXER T_LED F NC 5 6 7 8 9 10 11 12 M1_TXEN M0_TXCLK M0_RXD[7] M0_RXD[6] M0_RXD[4] M0_COL M0_GTX_C M0_TXEN DEVICE_ID CPU_DATA[CPU_DATA[ LK [4] 28] 24] GND M1_TXD[0] M1_TXD[1] M0_CRS M0_RXD[0] M0_RBC1 M0_RBC0 M0_TXER VDD_IO M1_RXCLK M1_COL VDD_IO GND 13 14 15 GND CPU_DATA[ 23] GND VDD_IO 17 18 19 20 VDD_IO GND VDD_IO CPU_DATA[ M1_LINKU CPU_DATA[CPU_DATA[ VDD_IO 31] P_LED 29] 26] M0_RXD[5] VDD_COR M0_RXD[2] M0_REFCL M0_TXD[6] M0_TXD[1] VDD_COR VDD_COR E K E E 21 22 CPU_DATA[CPU_DATA[CPU_DATA[CPU_DATA[CPU_DATA[ CPU_SDAC VDD_IO 19] 12] 9] 8] 7] K1 M0_TXD[5] M0_TXD[3] M0_TXD[2] M1_ACTIV CPU_DATA[CPU_DATA[CPU_DATA[CPU_DATA[ E_LED 27] 22] 20] 13] M1_TXER M0_RXDV M0_RXD[3] M0_RXD[1] M0_RXCLK M0_TXD[7] M0_TXD[4] M0_TXD[0] M1_RXDV M0_RXER 16 VDD_IO M0_ACTIV VDD_COR E_LED E VDD_IO CPU_TA GND CPU_DRE Q1 VDD_IO CPU_DATA[CPU_ADDR CPU_DATA[ 25] [23] 6] CPU_DATA[CPU_DATA[ CPU_DATA[ CPU_DATA[ 30] 21] 15] 14] M1_CRS DEVICE_ID VDD_COR [1] E VDD_COR CPU_DATA[ CPU_DATA[ CPU_DATA[ E 18] 17] 16] G M_MDIO DEVICE_ID M0_LINKU [0] P_LED VDD_IO VDD_IO CPU_IREQ CPU_DATA[ CPU_DATA[ 1 11] 0] H M_MDC GND NC VDD_COR E J NC NC NC VDD_COR E GND GND GND GND GND GND K NC NC NC VDD_IO GND GND GND GND GND GND GND CPU_DATA[ 2] L GND GND GND GND GND GND GND CPU_CLK GND M NC NC NC VDD_IO GND GND GND GND GND GND GND N NC NC NC VDD_COR E GND GND GND GND GND GND VDD_IO P NC GND VDD_IO VDD_COR E GND GND GND GND GND GND R NC CPU_DATA[CPU_DATA[ CPU_DATA[ 10] 1] 4] AUX_CLKO AUX_CLKI VDD_COR E IC VDD_COR CPU_DATA[ CPU_DATA[ CPU_IREQ E 5] 3] 0 IC CPU_SDAC IC_VDD_IO K2 CPU_TS_A CPU_WE LE CPU_ADD R[22] CPU_DRE Q0 CPU_OE CPU_CS CPU_ADDR [19] VDD_COR CPU_ADD CPU_ADDR CPU_ADDR E R[17] [18] [21] TDM_STI[1] TDM_CLKI[ TDM_STO[ 0] 1] CPU_ADD CPU_ADDR CPU_ADDR R[11] [13] [20] VDD_IO VDD_IO CPU_ADDR CPU_ADDR [14] [16] T TDM_CLKI[ TDM_CLKO TDM_FRMI 1] [1] _REF U TDM_STI[0] VDD_IO TDM_CLKi S VDD_COR JTAG_TMS CPU_ADDR CPU_ADDR E [15] [12] V TDM_STO[ TDM_CLKO TDM_CLKO TDM_CLKi 0] [0] _REF P DEVICE_ID JTAG_TCK CPU_ADDR CPU_ADDR [3] [10] [9] W IC Y IC GND AA IC AB VDD_IO GND TDM_CLKI TDM_FRM _REF O_REF VDD_IO GND VDD_IO VDD_IO VDD_COR E VDD_IO VDD_IO VDD_COR PLL_SEC E VDD_IO IC IC VDD_COR E IC IC PLL_PRI IC VDD_IO GND VDD_IO VDD_IO IC GND A1VDD_PL L1 IC IC IC IC IC GND IC IC IC GPIO[0] GPIO[3] IC_GND GND IC_GND IC SYSTEM_C VDD_COR LK E GND SYSTEM_D SYSTEM_R GPIO[1] EBUG ST GPIO[4] GPIO[5] GPIO[6] GPIO[9] VDD_IO GPIO[15] DEVICE_ID VDD_IO [2] GND GPIO[8] GPIO[14] TEST_MOD JTAG_TRS E[1] T IC_GND VDD_IO GPIO[2] GPIO[7] GPIO[12] TEST_MOD JTAG_TDI E[0] IC_GND GND GPIO[10] GPIO[11] GPIO[13] TEST_MOD IC_GND E[2] Figure 6 - ZL50119 Package View and Ball Positions 17 Zarlink Semiconductor Inc. JTAG_TDO CPU_ADDR CPU_ADDR [4] [8] GND CPU_ADDR [7] VDD_IO CPU_ADDR [6] CPU_ADD CPU_ADD CPU_ADDR VDD_IO R[2] R[3] [5] ZL50115/16/17/18/19/20 Data Sheet ZL50120 Package view from TOP side. Note that ball A1 is non-chamfered corner. 1 2 3 4 A VDD_IO B M1_TXD[2] VDD_IO C M1_TXD[3] GND D M1_RXD[1] M1_RXD[0] M1_RXD[2] E M1_RXD[3] M0_GIGABI M1_TXCLK M1_RXER T_LED F NC 5 6 7 8 9 10 11 12 M1_TXEN M0_TXCLK M0_RXD[7] M0_RXD[6] M0_RXD[4] M0_COL M0_GTX_C M0_TXEN DEVICE_ID CPU_DATA[CPU_DATA[ LK [4] 28] 24] GND M1_TXD[0] M1_TXD[1] M0_CRS M0_RXD[0] M0_RBC1 M0_RBC0 M0_TXER VDD_IO M1_RXCLK M1_COL VDD_IO GND 13 14 15 GND CPU_DATA[ 23] GND VDD_IO 17 18 19 20 VDD_IO GND VDD_IO CPU_DATA[ M1_LINKU CPU_DATA[CPU_DATA[ VDD_IO 31] P_LED 29] 26] M0_RXD[5] VDD_COR M0_RXD[2] M0_REFCL M0_TXD[6] M0_TXD[1] VDD_COR VDD_COR E K E E 21 22 CPU_DATA[CPU_DATA[CPU_DATA[CPU_DATA[CPU_DATA[ CPU_SDAC VDD_IO 19] 12] 9] 8] 7] K1 M0_TXD[5] M0_TXD[3] M0_TXD[2] M1_ACTIV CPU_DATA[CPU_DATA[CPU_DATA[CPU_DATA[ E_LED 27] 22] 20] 13] M1_TXER M0_RXDV M0_RXD[3] M0_RXD[1] M0_RXCLK M0_TXD[7] M0_TXD[4] M0_TXD[0] M1_RXDV M0_RXER 16 VDD_IO M0_ACTIV VDD_COR E_LED E VDD_IO CPU_TA GND CPU_DRE Q1 VDD_IO CPU_DATA[CPU_ADDR CPU_DATA[ 25] [23] 6] CPU_DATA[CPU_DATA[ CPU_DATA[ CPU_DATA[ 30] 21] 15] 14] M1_CRS DEVICE_ID VDD_COR [1] E VDD_COR CPU_DATA[ CPU_DATA[ CPU_DATA[ E 18] 17] 16] G M_MDIO DEVICE_ID M0_LINKU [0] P_LED VDD_IO VDD_IO CPU_IREQ CPU_DATA[ CPU_DATA[ 1 11] 0] H M_MDC GND NC VDD_COR E J NC NC NC VDD_COR E GND GND GND GND GND GND K NC NC NC VDD_IO GND GND GND GND GND GND GND CPU_DATA[ 2] L GND GND GND GND GND GND GND CPU_CLK GND CPU_DATA[CPU_DATA[ CPU_DATA[ 10] 1] 4] AUX_CLKO AUX_CLKI VDD_COR E IC VDD_COR CPU_DATA[ CPU_DATA[ CPU_IREQ E 5] 3] 0 IC CPU_DRE Q0 CPU_SDAC IC_VDD_IO K2 M TDM_CLKI[ TDM_STO[ TDM_STI[3] VDD_IO 3] 3] GND GND GND GND GND GND GND N TDM_STO[ TDM_CLKO TDM_STI[2] VDD_COR 2] [3] E GND GND GND GND GND GND VDD_IO P TDM_CLKI[ 2] GND GND GND GND GND GND R TDM_CLKO TDM_STI[1] TDM_CLKI[ TDM_STO[ [2] 0] 1] T TDM_CLKI[ TDM_CLKO TDM_FRMI 1] [1] _REF U TDM_STI[0] VDD_IO TDM_CLKi S VDD_COR JTAG_TMS CPU_ADDR CPU_ADDR E [15] [12] V TDM_STO[ TDM_CLKO TDM_CLKO TDM_CLKi 0] [0] _REF P DEVICE_ID JTAG_TCK CPU_ADDR CPU_ADDR [3] [10] [9] GND W IC Y IC GND AA IC AB VDD_IO VDD_IO GND TDM_CLKI TDM_FRM _REF O_REF VDD_COR E VDD_IO VDD_COR E VDD_IO VDD_IO VDD_COR PLL_SEC E VDD_IO IC IC VDD_COR E IC IC PLL_PRI IC VDD_IO GND VDD_IO VDD_IO IC GND A1VDD_PL L1 IC IC IC IC IC GND IC IC IC GPIO[0] GPIO[3] IC_GND GND IC_GND IC SYSTEM_C VDD_COR LK E GND SYSTEM_D SYSTEM_R GPIO[1] EBUG ST GPIO[4] GPIO[5] GPIO[6] Zarlink Semiconductor Inc. CPU_CS CPU_ADDR [19] GND CPU_ADD CPU_ADDR CPU_ADDR R[11] [13] [20] VDD_IO VDD_IO CPU_ADDR CPU_ADDR [14] [16] GPIO[9] VDD_IO GPIO[15] DEVICE_ID VDD_IO [2] GND GPIO[8] GPIO[14] TEST_MOD JTAG_TRS E[1] T IC_GND VDD_IO GPIO[2] GPIO[7] GPIO[12] TEST_MOD JTAG_TDI E[0] IC_GND GND GPIO[10] GPIO[11] GPIO[13] TEST_MOD IC_GND E[2] Figure 7 - ZL50120 Package View and Ball Positions 18 CPU_ADD R[22] CPU_OE VDD_COR CPU_ADD CPU_ADDR CPU_ADDR E R[17] [18] [21] VDD_IO VDD_IO CPU_TS_A CPU_WE LE JTAG_TDO CPU_ADDR CPU_ADDR [4] [8] GND CPU_ADDR [7] VDD_IO CPU_ADDR [6] CPU_ADD CPU_ADD CPU_ADDR VDD_IO R[2] R[3] [5] ZL50115/16/17/18/19/20 Ball # ZL50115 Signal Name ZL50116 Signal Name ZL50117 Signal Name ZL50118 Signal Name ZL50119 Signal Name Data Sheet ZL50120 Signal Name Variant A1 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All A10 DEVICE_ID[4] DEVICE_ID[4] DEVICE_ID[4] DEVICE_ID[4] DEVICE_ID[4] DEVICE_ID[4] All A11 CPU_DATA[28] CPU_DATA[28] CPU_DATA[28] CPU_DATA[28] CPU_DATA[28] CPU_DATA[28] All A12 CPU_DATA[24] CPU_DATA[24] CPU_DATA[24] CPU_DATA[24] CPU_DATA[24] CPU_DATA[24] All A13 GND GND GND GND GND GND All A14 CPU_DATA[23] CPU_DATA[23] CPU_DATA[23] CPU_DATA[23] CPU_DATA[23] CPU_DATA[23] All A15 GND GND GND GND GND GND All A16 CPU_DATA[19] CPU_DATA[19] CPU_DATA[19] CPU_DATA[19] CPU_DATA[19] CPU_DATA[19] All A17 CPU_DATA[12] CPU_DATA[12] CPU_DATA[12] CPU_DATA[12] CPU_DATA[12] CPU_DATA[12] All A18 CPU_DATA[9] CPU_DATA[9] CPU_DATA[9] CPU_DATA[9] CPU_DATA[9] CPU_DATA[9] All A19 CPU_DATA[8] CPU_DATA[8] CPU_DATA[8] CPU_DATA[8] CPU_DATA[8] CPU_DATA[8] All A20 CPU_DATA[7] CPU_DATA[7] CPU_DATA[7] CPU_DATA[7] CPU_DATA[7] CPU_DATA[7] All A21 CPU_SDACK1 CPU_SDACK1 CPU_SDACK1 CPU_SDACK1 CPU_SDACK1 CPU_SDACK1 All A22 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All A2 NC NC NC M1_TXEN M1_TXEN M1_TXEN ZL50118/19/20 A3 M0_TXCLK M0_TXCLK M0_TXCLK M0_TXCLK M0_TXCLK M0_TXCLK All A4 M0_RXD[7] M0_RXD[7] M0_RXD[7] M0_RXD[7] M0_RXD[7] M0_RXD[7] All A5 M0_RXD[6] M0_RXD[6] M0_RXD[6] M0_RXD[6] M0_RXD[6] M0_RXD[6] All A6 M0_RXD[4] M0_RXD[4] M0_RXD[4] M0_RXD[4] M0_RXD[4] M0_RXD[4] All A7 M0_COL M0_COL M0_COL M0_COL M0_COL M0_COL All A8 M0_GTX_CLK M0_GTX_CLK M0_GTX_CLK M0_GTX_CLK M0_GTX_CLK M0_GTX_CLK All A9 M0_TXEN M0_TXEN M0_TXEN M0_TXEN M0_TXEN M0_TXEN All B1 NC NC NC M1_TXD[2] M1_TXD[2] M1_TXD[2] ZL50118/19/20 B10 M0_TXER M0_TXER M0_TXER M0_TXER M0_TXER M0_TXER All B11 GND GND GND GND GND GND All B12 M0_TXD[5] M0_TXD[5] M0_TXD[5] M0_TXD[5] M0_TXD[5] M0_TXD[5] All B13 M0_TXD[3] M0_TXD[3] M0_TXD[3] M0_TXD[3] M0_TXD[3] M0_TXD[3] All B14 M0_TXD[2] M0_TXD[2] M0_TXD[2] M0_TXD[2] M0_TXD[2] M0_TXD[2] All B15 NC NC NC M1_ACTIVE_LED M1_ACTIVE_LED M1_ACTIVE_LED ZL50118/19/20 B16 CPU_DATA[27] CPU_DATA[27] CPU_DATA[27] CPU_DATA[27] CPU_DATA[27] CPU_DATA[27] All B17 CPU_DATA[22] CPU_DATA[22] CPU_DATA[22] CPU_DATA[22] CPU_DATA[22] CPU_DATA[22] All B18 CPU_DATA[20] CPU_DATA[20] CPU_DATA[20] CPU_DATA[20] CPU_DATA[20] CPU_DATA[20] All B19 CPU_DATA[13] CPU_DATA[13] CPU_DATA[13] CPU_DATA[13] CPU_DATA[13] CPU_DATA[13] All B20 GND GND GND GND GND GND All B21 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All B22 CPU_TA CPU_TA CPU_TA CPU_TA CPU_TA CPU_TA All B2 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All B3 GND GND GND GND GND GND All B4 NC NC NC M1_TXD[0] M1_TXD[0] M1_TXD[0] ZL50118/19/20 B5 NC NC NC M1_TXD[1] M1_TXD[1] M1_TXD[1] ZL50118/19/20 B6 M0_CRS M0_CRS M0_CRS M0_CRS M0_CRS M0_CRS All B7 M0_RXD[0] M0_RXD[0] M0_RXD[0] M0_RXD[0] M0_RXD[0] M0_RXD[0] All B8 M0_RBC1 M0_RBC1 M0_RBC1 M0_RBC1 M0_RBC1 M0_RBC1 All Table 2 - ZL50115/16/17/18/19/20 Ball Signal Assignment 19 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Ball # ZL50115 Signal Name ZL50116 Signal Name ZL50117 Signal Name ZL50118 Signal Name ZL50119 Signal Name Data Sheet ZL50120 Signal Name Variant B9 M0_RBC0 M0_RBC0 M0_RBC0 M0_RBC0 M0_RBC0 M0_RBC0 All C1 NC NC NC M1_TXD[3] M1_TXD[3] M1_TXD[3] ZL50118/19/20 C10 M0_RXCLK M0_RXCLK M0_RXCLK M0_RXCLK M0_RXCLK M0_RXCLK All C11 M0_TXD[7] M0_TXD[7] M0_TXD[7] M0_TXD[7] M0_TXD[7] M0_TXD[7] All C12 M0_TXD[4] M0_TXD[4] M0_TXD[4] M0_TXD[4] M0_TXD[4] M0_TXD[4] All C13 M0_TXD[0] M0_TXD[0] M0_TXD[0] M0_TXD[0] M0_TXD[0] M0_TXD[0] All C14 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All C15 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All C16 CPU_DATA[31] CPU_DATA[31] CPU_DATA[31] CPU_DATA[31] CPU_DATA[31] CPU_DATA[31] All C17 NC NC NC M1_LINKUP_LED M1_LINKUP_LED M1_LINKUP_LED ZL50118/19/20 C18 CPU_DATA[29] CPU_DATA[29] CPU_DATA[29] CPU_DATA[29] CPU_DATA[29] CPU_DATA[29] All C19 CPU_DATA[26] CPU_DATA[26] CPU_DATA[26] CPU_DATA[26] CPU_DATA[26] CPU_DATA[26] All C20 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All C21 GND GND GND GND GND GND All C22 CPU_DREQ1 CPU_DREQ1 CPU_DREQ1 CPU_DREQ1 CPU_DREQ1 CPU_DREQ1 All C2 GND GND GND GND GND GND All C3 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All C4 NC NC NC M1_RXCLK M1_RXCLK M1_RXCLK ZL50118/19/20 C5 NC NC NC M1_COL M1_COL M1_COL ZL50118/19/20 C6 NC NC NC M1_TXER M1_TXER M1_TXER ZL50118/19/20 C7 M0_RXDV M0_RXDV M0_RXDV M0_RXDV M0_RXDV M0_RXDV All C8 M0_RXD[3] M0_RXD[3] M0_RXD[3] M0_RXD[3] M0_RXD[3] M0_RXD[3] All C9 M0_RXD[1] M0_RXD[1] M0_RXD[1] M0_RXD[1] M0_RXD[1] M0_RXD[1] All D1 NC NC NC M1_RXD[1] M1_RXD[1] M1_RXD[1] ZL50118/19/20 D10 M0_RXD[2] M0_RXD[2] M0_RXD[2] M0_RXD[2] M0_RXD[2] M0_RXD[2] All D11 M0_REFCLK M0_REFCLK M0_REFCLK M0_REFCLK M0_REFCLK M0_REFCLK All D12 M0_TXD[6] M0_TXD[6] M0_TXD[6] M0_TXD[6] M0_TXD[6] M0_TXD[6] All D13 M0_TXD[1] M0_TXD[1] M0_TXD[1] M0_TXD[1] M0_TXD[1] M0_TXD[1] All D14 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All D15 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All D16 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All D17 M0_ACTIVE_LED M0_ACTIVE_LED M0_ACTIVE_LED M0_ACTIVE_LED M0_ACTIVE_LED M0_ACTIVE_LED All D18 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All D19 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All All D20 CPU_DATA[25] CPU_DATA[25] CPU_DATA[25] CPU_DATA[25] CPU_DATA[25] CPU_DATA[25] D21 CPU_ADDR[23] CPU_ADDR[23] CPU_ADDR[23] CPU_ADDR[23] CPU_ADDR[23] CPU_ADDR[23] All D22 CPU_DATA[6] CPU_DATA[6] CPU_DATA[6] CPU_DATA[6] CPU_DATA[6] CPU_DATA[6] All D2 NC NC NC M1_RXD[0] M1_RXD[0] M1_RXD[0] ZL50118/19/20 D3 NC NC NC M1_RXD[2] M1_RXD[2] M1_RXD[2] ZL50118/19/20 D4 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All D5 NC NC NC M1_RXDV M1_RXDV M1_RXDV ZL50118/19/20 D6 M0_RXER M0_RXER M0_RXER M0_RXER M0_RXER M0_RXER All D7 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All Table 2 - ZL50115/16/17/18/19/20 Ball Signal Assignment (continued) 20 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Ball # ZL50115 Signal Name ZL50116 Signal Name ZL50117 Signal Name ZL50118 Signal Name ZL50119 Signal Name Data Sheet ZL50120 Signal Name Variant D8 M0_RXD[5] M0_RXD[5] M0_RXD[5] M0_RXD[5] M0_RXD[5] M0_RXD[5] All D9 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All E1 NC NC NC M1_RXD[3] M1_RXD[3] M1_RXD[3] ZL50118/19/20 E19 CPU_DATA[30] CPU_DATA[30] CPU_DATA[30] CPU_DATA[30] CPU_DATA[30] CPU_DATA[30] All E20 CPU_DATA[21] CPU_DATA[21] CPU_DATA[21] CPU_DATA[21] CPU_DATA[21] CPU_DATA[21] All E21 CPU_DATA[15] CPU_DATA[15] CPU_DATA[15] CPU_DATA[15] CPU_DATA[15] CPU_DATA[15] All E22 CPU_DATA[14] CPU_DATA[14] CPU_DATA[14] CPU_DATA[14] CPU_DATA[14] CPU_DATA[14] All E2 M0_GIGABIT_LED M0_GIGABIT_LED M0_GIGABIT_LED M0_GIGABIT_LED M0_GIGABIT_LED M0_GIGABIT_LED All E3 NC NC NC M1_TXCLK M1_TXCLK M1_TXCLK ZL50118/19/20 E4 NC NC NC M1_RXER M1_RXER M1_RXER ZL50118/19/20 F1 NC NC NC NC NC NC All F19 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All F20 CPU_DATA[18] CPU_DATA[18] CPU_DATA[18] CPU_DATA[18] CPU_DATA[18] CPU_DATA[18] All F21 CPU_DATA[17] CPU_DATA[17] CPU_DATA[17] CPU_DATA[17] CPU_DATA[17] CPU_DATA[17] All F22 CPU_DATA[16] CPU_DATA[16] CPU_DATA[16] CPU_DATA[16] CPU_DATA[16] CPU_DATA[16] All F2 NC NC NC M1_CRS M1_CRS M1_CRS ZL50118/19/20 F3 DEVICE_ID[1] DEVICE_ID[1] DEVICE_ID[1] DEVICE_ID[1] DEVICE_ID[1] DEVICE_ID[1] All F4 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All G1 M_MDIO M_MDIO M_MDIO M_MDIO M_MDIO M_MDIO All G19 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All G20 CPU_IREQ1 CPU_IREQ1 CPU_IREQ1 CPU_IREQ1 CPU_IREQ1 CPU_IREQ1 All G21 CPU_DATA[11] CPU_DATA[11] CPU_DATA[11] CPU_DATA[11] CPU_DATA[11] CPU_DATA[11] All G22 CPU_DATA[0] CPU_DATA[0] CPU_DATA[0] CPU_DATA[0] CPU_DATA[0] CPU_DATA[0] All G2 DEVICE_ID[0] DEVICE_ID[0] DEVICE_ID[0] DEVICE_ID[0] DEVICE_ID[0] DEVICE_ID[0] All G3 M0_LINKUP_LED M0_LINKUP_LED M0_LINKUP_LED M0_LINKUP_LED M0_LINKUP_LED M0_LINKUP_LED All G4 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All H1 M_MDC M_MDC M_MDC M_MDC M_MDC M_MDC All H19 CPU_DATA[10] CPU_DATA[10] CPU_DATA[10] CPU_DATA[10] CPU_DATA[10] CPU_DATA[10] All H20 CPU_DATA[1] CPU_DATA[1] CPU_DATA[1] CPU_DATA[1] CPU_DATA[1] CPU_DATA[1] All H21 CPU_DATA[4] CPU_DATA[4] CPU_DATA[4] CPU_DATA[4] CPU_DATA[4] CPU_DATA[4] All H22 IC IC IC IC IC IC All H2 GND GND GND GND GND GND All H3 NC NC NC NC NC NC All H4 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All All J1 NC NC NC NC NC NC J10 GND GND GND GND GND GND All J11 GND GND GND GND GND GND All J12 GND GND GND GND GND GND All J13 GND GND GND GND GND GND All J14 GND GND GND GND GND GND All J19 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All J20 CPU_DATA[5] CPU_DATA[5] CPU_DATA[5] CPU_DATA[5] CPU_DATA[5] CPU_DATA[5] All J21 CPU_DATA[3] CPU_DATA[3] CPU_DATA[3] CPU_DATA[3] CPU_DATA[3] CPU_DATA[3] All Table 2 - ZL50115/16/17/18/19/20 Ball Signal Assignment (continued) 21 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Ball # ZL50115 Signal Name ZL50116 Signal Name ZL50117 Signal Name ZL50118 Signal Name ZL50119 Signal Name Data Sheet ZL50120 Signal Name Variant J22 CPU_IREQ0 CPU_IREQ0 CPU_IREQ0 CPU_IREQ0 CPU_IREQ0 CPU_IREQ0 All J2 NC NC NC NC NC NC All J3 NC NC NC NC NC NC All J4 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All J9 GND GND GND GND GND GND All K1 NC NC NC NC NC NC All K10 GND GND GND GND GND GND All K11 GND GND GND GND GND GND All K12 GND GND GND GND GND GND All K13 GND GND GND GND GND GND All K14 GND GND GND GND GND GND All K19 GND GND GND GND GND GND All K20 CPU_DATA[2] CPU_DATA[2] CPU_DATA[2] CPU_DATA[2] CPU_DATA[2] CPU_DATA[2] All K21 IC IC IC IC IC IC All K22 CPU_DREQ0 CPU_DREQ0 CPU_DREQ0 CPU_DREQ0 CPU_DREQ0 CPU_DREQ0 All K2 NC NC NC NC NC NC All K3 NC NC NC NC NC NC All K4 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All K9 GND GND GND GND GND GND All L1 GND GND GND GND GND GND All L10 GND GND GND GND GND GND All L11 GND GND GND GND GND GND All L12 GND GND GND GND GND GND All L13 GND GND GND GND GND GND All L14 GND GND GND GND GND GND All L19 CPU_CLK CPU_CLK CPU_CLK CPU_CLK CPU_CLK CPU_CLK All L20 GND GND GND GND GND GND All L21 CPU_SDACK2 CPU_SDACK2 CPU_SDACK2 CPU_SDACK2 CPU_SDACK2 CPU_SDACK2 All L22 IC_VDD_IO IC_VDD_IO IC_VDD_IO IC_VDD_IO IC_VDD_IO IC_VDD_IO All L2 AUX_CLKO AUX_CLKO AUX_CLKO AUX_CLKO AUX_CLKO AUX_CLKO All L3 AUX_CLKI AUX_CLKI AUX_CLKI AUX_CLKI AUX_CLKI AUX_CLKI All L4 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All L9 GND GND GND GND GND GND All M1 NC NC TDM_CLKI[3] NC NC TDM_CLKI[3] ZL50117/20 M10 GND GND GND GND GND GND All M11 GND GND GND GND GND GND All M12 GND GND GND GND GND GND All M13 GND GND GND GND GND GND All M14 GND GND GND GND GND GND All M19 GND GND GND GND GND GND All M20 CPU_TS_ALE CPU_TS_ALE CPU_TS_ALE CPU_TS_ALE CPU_TS_ALE CPU_TS_ALE All M21 CPU_WE CPU_WE CPU_WE CPU_WE CPU_WE CPU_WE All M22 CPU_OE CPU_OE CPU_OE CPU_OE CPU_OE CPU_OE All Table 2 - ZL50115/16/17/18/19/20 Ball Signal Assignment (continued) 22 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Ball # ZL50115 Signal Name ZL50116 Signal Name ZL50117 Signal Name ZL50118 Signal Name ZL50119 Signal Name Data Sheet ZL50120 Signal Name Variant M2 NC NC TDM_STO[3] NC NC TDM_STO[3] ZL50117/20 M3 NC NC TDM_STI[3] NC NC TDM_STI[3] ZL50117/20 M4 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All M9 GND GND GND GND GND GND All ZL50117/20 N1 NC NC TDM_STO[2] NC NC TDM_STO[2] N10 GND GND GND GND GND GND All N11 GND GND GND GND GND GND All N12 GND GND GND GND GND GND All N13 GND GND GND GND GND GND All N14 GND GND GND GND GND GND All N19 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All N20 CPU_ADDR[22] CPU_ADDR[22] CPU_ADDR[22] CPU_ADDR[22] CPU_ADDR[22] CPU_ADDR[22] All N21 CPU_CS CPU_CS CPU_CS CPU_CS CPU_CS CPU_CS All N22 CPU_ADDR[19] CPU_ADDR[19] CPU_ADDR[19] CPU_ADDR[19] CPU_ADDR[19] CPU_ADDR[19] All N2 NC NC TDM_CLKO[3] NC NC TDM_CLKO[3] ZL50117/20 N3 NC NC TDM_STI[2] NC NC TDM_STI[2] ZL50117/20 N4 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All N9 GND GND GND GND GND GND All P1 NC NC TDM_CLKI[2] NC NC TDM_CLKI[2] ZL50117/20 P10 GND GND GND GND GND GND All P11 GND GND GND GND GND GND All P12 GND GND GND GND GND GND All P13 GND GND GND GND GND GND All P14 GND GND GND GND GND GND All P19 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All P20 CPU_ADDR[17] CPU_ADDR[17] CPU_ADDR[17] CPU_ADDR[17] CPU_ADDR[17] CPU_ADDR[17] All P21 CPU_ADDR[18] CPU_ADDR[18] CPU_ADDR[18] CPU_ADDR[18] CPU_ADDR[18] CPU_ADDR[18] All P22 CPU_ADDR[21] CPU_ADDR[21] CPU_ADDR[21] CPU_ADDR[21] CPU_ADDR[21] CPU_ADDR[21] All P2 GND GND GND GND GND GND All P3 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All P4 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All P9 GND GND GND GND GND GND All R1 NC NC TDM_CLKO[2] NC NC TDM_CLKO[2] ZL50117/20 R19 GND GND GND GND GND GND All R20 CPU_ADDR[11] CPU_ADDR[11] CPU_ADDR[11] CPU_ADDR[11] CPU_ADDR[11] CPU_ADDR[11] All R21 CPU_ADDR[13] CPU_ADDR[13] CPU_ADDR[13] CPU_ADDR[13] CPU_ADDR[13] CPU_ADDR[13] All R22 CPU_ADDR[20] CPU_ADDR[20] CPU_ADDR[20] CPU_ADDR[20] CPU_ADDR[20] CPU_ADDR[20] All R2 NC TDM_STI[1] TDM_STI[1] NC TDM_STI[1] TDM_STI[1] ZL50116/17/19/20 R3 TDM_CLKI[0] TDM_CLKI[0] TDM_CLKI[0] TDM_CLKI[0] TDM_CLKI[0] TDM_CLKI[0] All R4 NC TDM_STO[1] TDM_STO[1] NC TDM_STO[1] TDM_STO[1] ZL50116/17/19/20 T1 NC TDM_CLKI[1] TDM_CLKI[1] NC TDM_CLKI[1] TDM_CLKI[1] ZL50116/17/19/20 T19 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All T20 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All Table 2 - ZL50115/16/17/18/19/20 Ball Signal Assignment (continued) 23 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Ball # ZL50115 Signal Name ZL50116 Signal Name ZL50117 Signal Name ZL50118 Signal Name ZL50119 Signal Name Data Sheet ZL50120 Signal Name Variant T21 CPU_ADDR[14] CPU_ADDR[14] CPU_ADDR[14] CPU_ADDR[14] CPU_ADDR[14] CPU_ADDR[14] All T22 CPU_ADDR[16] CPU_ADDR[16] CPU_ADDR[16] CPU_ADDR[16] CPU_ADDR[16] CPU_ADDR[16] All T2 NC TDM_CLKO[1] TDM_CLKO[1] NC TDM_CLKO[1] TDM_CLKO[1] ZL50116/17/19/20 T3 TDM_FRMI_REF TDM_FRMI_REF TDM_FRMI_REF TDM_FRMI_REF TDM_FRMI_REF TDM_FRMI_REF All All T4 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO U1 TDM_STI[0] TDM_STI[0] TDM_STI[0] TDM_STI[0] TDM_STI[0] TDM_STI[0] All U19 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All U20 JTAG_TMS JTAG_TMS JTAG_TMS JTAG_TMS JTAG_TMS JTAG_TMS All U21 CPU_ADDR[15] CPU_ADDR[15] CPU_ADDR[15] CPU_ADDR[15] CPU_ADDR[15] CPU_ADDR[15] All U22 CPU_ADDR[12] CPU_ADDR[12] CPU_ADDR[12] CPU_ADDR[12] CPU_ADDR[12] CPU_ADDR[12] All U2 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All U3 GND GND GND GND GND GND All U4 TDM_CLKiS TDM_CLKiS TDM_CLKiS TDM_CLKiS TDM_CLKiS TDM_CLKiS All V1 TDM_STO[0] TDM_STO[0] TDM_STO[0] TDM_STO[0] TDM_STO[0] TDM_STO[0] All V19 DEVICE_ID[3] DEVICE_ID[3] DEVICE_ID[3] DEVICE_ID[3] DEVICE_ID[3] DEVICE_ID[3] All V20 JTAG_TCK JTAG_TCK JTAG_TCK JTAG_TCK JTAG_TCK JTAG_TCK All V21 CPU_ADDR[10] CPU_ADDR[10] CPU_ADDR[10] CPU_ADDR[10] CPU_ADDR[10] CPU_ADDR[10] All V22 CPU_ADDR[9] CPU_ADDR[9] CPU_ADDR[9] CPU_ADDR[9] CPU_ADDR[9] CPU_ADDR[9] All V2 TDM_CLKO[0] TDM_CLKO[0] TDM_CLKO[0] TDM_CLKO[0] TDM_CLKO[0] TDM_CLKO[0] All V3 TDM_CLKO_REF TDM_CLKO_REF TDM_CLKO_REF TDM_CLKO_REF TDM_CLKO_REF TDM_CLKO_REF All V4 TDM_CLKiP TDM_CLKiP TDM_CLKiP TDM_CLKiP TDM_CLKiP TDM_CLKiP All W1 IC IC IC IC IC IC All W10 PLL_SEC PLL_SEC PLL_SEC PLL_SEC PLL_SEC PLL_SEC All W11 IC_GND IC_GND IC_GND IC_GND IC_GND IC_GND All W12 GND GND GND GND GND GND All W13 SYSTEM_CLK SYSTEM_CLK SYSTEM_CLK SYSTEM_CLK SYSTEM_CLK SYSTEM_CLK All W14 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All W15 GPIO[9] GPIO[9] GPIO[9] GPIO[9] GPIO[9] GPIO[9] All W16 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All W17 GPIO[15] GPIO[15] GPIO[15] GPIO[15] GPIO[15] GPIO[15] All W18 DEVICE_ID[2] DEVICE_ID[2] DEVICE_ID[2] DEVICE_ID[2] DEVICE_ID[2] DEVICE_ID[2] All W19 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All W20 JTAG_TDO JTAG_TDO JTAG_TDO JTAG_TDO JTAG_TDO JTAG_TDO All W21 CPU_ADDR[4] CPU_ADDR[4] CPU_ADDR[4] CPU_ADDR[4] CPU_ADDR[4] CPU_ADDR[4] All W22 CPU_ADDR[8] CPU_ADDR[8] CPU_ADDR[8] CPU_ADDR[8] CPU_ADDR[8] CPU_ADDR[8] All W2 TDM_CLKI_REF TDM_CLKI_REF TDM_CLKI_REF TDM_CLKI_REF TDM_CLKI_REF TDM_CLKI_REF All W3 TDM_FRMO_REF TDM_FRMO_REF TDM_FRMO_REF TDM_FRMO_REF TDM_FRMO_REF TDM_FRMO_REF All W4 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All W5 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All W6 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All W7 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All W8 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All W9 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All Table 2 - ZL50115/16/17/18/19/20 Ball Signal Assignment (continued) 24 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Ball # ZL50115 Signal Name ZL50116 Signal Name ZL50117 Signal Name ZL50118 Signal Name ZL50119 Signal Name Data Sheet ZL50120 Signal Name Variant Y1 IC IC IC IC IC IC All Y10 IC IC IC IC IC IC All Y11 IC_GND IC_GND IC_GND IC_GND IC_GND IC_GND All Y12 IC IC IC IC IC IC All Y13 GND GND GND GND GND GND All Y14 GND GND GND GND GND GND All Y15 GPIO[8] GPIO[8] GPIO[8] GPIO[8] GPIO[8] GPIO[8] All Y16 GPIO[14] GPIO[14] GPIO[14] GPIO[14] GPIO[14] GPIO[14] All Y17 TEST_MODE[1] TEST_MODE[1] TEST_MODE[1] TEST_MODE[1] TEST_MODE[1] TEST_MODE[1] All Y18 JTAG_TRST JTAG_TRST JTAG_TRST JTAG_TRST JTAG_TRST JTAG_TRST All Y19 IC_GND IC_GND IC_GND IC_GND IC_GND IC_GND All Y20 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All Y21 GND GND GND GND GND GND All Y22 CPU_ADDR[7] CPU_ADDR[7] CPU_ADDR[7] CPU_ADDR[7] CPU_ADDR[7] CPU_ADDR[7] All Y2 GND GND GND GND GND GND All Y3 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All Y4 IC IC IC IC IC IC All Y5 IC IC IC IC IC IC All Y6 VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE VDD_CORE All Y7 IC IC IC IC IC IC All Y8 IC IC IC IC IC IC All Y9 PLL_PRI PLL_PRI PLL_PRI PLL_PRI PLL_PRI PLL_PRI All AA1 IC IC IC IC IC IC All AA10 IC IC IC IC IC IC All AA11 SYSTEM_DEBUG SYSTEM_DEBUG SYSTEM_DEBUG SYSTEM_DEBUG SYSTEM_DEBUG SYSTEM_DEBUG All AA12 SYSTEM_RST SYSTEM_RST SYSTEM_RST SYSTEM_RST SYSTEM_RST SYSTEM_RST All AA13 GPIO[1] GPIO[1] GPIO[1] GPIO[1] GPIO[1] GPIO[1] All AA14 GPIO[2] GPIO[2] GPIO[2] GPIO[2] GPIO[2] GPIO[2] All AA15 GPIO[7] GPIO[7] GPIO[7] GPIO[7] GPIO[7] GPIO[7] All AA16 GPIO[12] GPIO[12] GPIO[12] GPIO[12] GPIO[12] GPIO[12] All AA17 TEST_MODE[0] TEST_MODE[0] TEST_MODE[0] TEST_MODE[0] TEST_MODE[0] TEST_MODE[0] All AA18 JTAG_TDI JTAG_TDI JTAG_TDI JTAG_TDI JTAG_TDI JTAG_TDI All AA19 IC_GND IC_GND IC_GND IC_GND IC_GND IC_GND All AA20 GND GND GND GND GND GND All AA21 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All AA22 CPU_ADDR[6] CPU_ADDR[6] CPU_ADDR[6] CPU_ADDR[6] CPU_ADDR[6] CPU_ADDR[6] All AA2 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All AA3 GND GND GND GND GND GND All AA4 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All AA5 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All AA6 IC IC IC IC IC IC All AA7 GND GND GND GND GND GND All AA8 A1VDD_PLL1 A1VDD_PLL1 A1VDD_PLL1 A1VDD_PLL1 A1VDD_PLL1 A1VDD_PLL1 All Table 2 - ZL50115/16/17/18/19/20 Ball Signal Assignment (continued) 25 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Ball # ZL50115 Signal Name ZL50116 Signal Name ZL50117 Signal Name ZL50118 Signal Name ZL50119 Signal Name Data Sheet ZL50120 Signal Name Variant AA9 IC IC IC IC IC IC All AB1 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All AB10 GPIO[3] GPIO[3] GPIO[3] GPIO[3] GPIO[3] GPIO[3] All AB11 GPIO[4] GPIO[4] GPIO[4] GPIO[4] GPIO[4] GPIO[4] All AB12 GPIO[5] GPIO[5] GPIO[5] GPIO[5] GPIO[5] GPIO[5] All AB13 GPIO[6] GPIO[6] GPIO[6] GPIO[6] GPIO[6] GPIO[6] All AB14 GPIO[10] GPIO[10] GPIO[10] GPIO[10] GPIO[10] GPIO[10] All AB15 GPIO[11] GPIO[11] GPIO[11] GPIO[11] GPIO[11] GPIO[11] All AB16 GPIO[13] GPIO[13] GPIO[13] GPIO[13] GPIO[13] GPIO[13] All AB17 TEST_MODE[2] TEST_MODE[2] TEST_MODE[2] TEST_MODE[2] TEST_MODE[2] TEST_MODE[2] All AB18 IC_GND IC_GND IC_GND IC_GND IC_GND IC_GND All AB19 CPU_ADDR[2] CPU_ADDR[2] CPU_ADDR[2] CPU_ADDR[2] CPU_ADDR[2] CPU_ADDR[2] All AB20 CPU_ADDR[3] CPU_ADDR[3] CPU_ADDR[3] CPU_ADDR[3] CPU_ADDR[3] CPU_ADDR[3] All AB21 CPU_ADDR[5] CPU_ADDR[5] CPU_ADDR[5] CPU_ADDR[5] CPU_ADDR[5] CPU_ADDR[5] All AB22 VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO VDD_IO All AB2 IC IC IC IC IC IC All AB3 IC IC IC IC IC IC All AB4 IC IC IC IC IC IC All AB5 GND GND GND GND GND GND All AB6 IC IC IC IC IC IC All AB7 IC IC IC IC IC IC All AB8 IC IC IC IC IC IC All AB9 GPIO[0] GPIO[0] GPIO[0] GPIO[0] GPIO[0] GPIO[0] All Table 2 - ZL50115/16/17/18/19/20 Ball Signal Assignment (continued) NC - Not Connected - leave open circuit. IC - Internally Connected - leave open circuit. IC_GND - Internally Connected - tie to ground IC_VDD_IO - Internally Connected - tie to VDD_IO 26 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 4.0 Data Sheet External Interface Description The following key applies to all tables: 4.1 I Input O Output D Internal 100 k pull-down resistor present U Internal 100 k pull-up resistor present T Tri-state Output TDM Interface All TDM Interface signals are 5 V tolerant. All TDM Interface inputs (including data, clock and frame pulse) have internal pull-down resistors so they can be safely left unconnected if not used. 4.1.1 TDM Stream Connections There are three interfaces possible among the ZL5011x. The ZL50117/20 supports four TDM ports [3:0] at 2 Mbps, or one TDM port [0] at 8 Mbps or one unstructured TDM port [0] for J2/E3/T3. The ZL50116/19 supports two TDM ports [1:0] at 2 Mbps, or one TDM port [0] at 8 Mbps (up to 64 DS0). The ZL50115/18 supports one TDM port [0] at 2 Mbps, or one TDM port [0] at 8 Mbps (up to 32 DS0) Signal I/O TDM_STi[3:0] ID Package Balls [3] [2] [1] [0] Description TDM port serial data input streams. For different standards these pins are given different identities: ST-BUS: TDM_STi[3:0] H.110: TDM_D[3:0] H-MVIP: TDM_HDS[3:0] Triggered on rising edge or falling edge depending on standard. At 8.192 Mbps only stream [0] is used. Stream [0] is used for unstructured J2 or T3/E3 on the ZL50117/20. M3 N3 R2 U1 Table 3 - TDM Interface Stream Pin Definition 27 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Signal I/O Package Balls Data Sheet Description TDM_STo[3:0] OT [3] [2] [1] [0] M2 N1 R4 V1 TDM port serial data output streams. For different standards these pins are given different identities: ST-BUS: TDM_STo[3:0] H.110: TDM_D[3:0] H-MVIP: TDM_HDS[3:0] Triggered on rising edge or falling edge depending on standard. At 8.192 Mbps only stream [0] is used. Stream [0] is used for unstructured J2 or T3/E3 on the ZL50117/20. TDM_CLKi[3:0] ID [3] [2] [1] [0] M1 P1 T1 R3 TDM port clock inputs programmable as active high or low. Can accept frequencies of 1.544 MHz, 2.048 MHz, 4.096 MHz, 8.192 MHz, 6.312 MHz or 16.384 MHz depending on standard used. At 8.192 Mbps only stream [0] is used. Stream [0] is used for unstructured J2 or T3/E3 on the ZL50117/20. TDM_CLKo[3:0] O [3] [2] [1] [0] N2 R1 T2 V2 TDM port clock outputs. Will generate 1.544 MHz, 2.048 MHz, 4.096 MHz, 6.312 MHz, 8.192 MHz or 16.384 MHz depending on standard used. At 8.192 Mbps only stream [0] is used. Stream [0] is used for unstructured J2 or T3/E3 on the ZL50117/20. Table 3 - TDM Interface Stream Pin Definition Note: Speed modes: 2.048 Mbps - 32 channels per stream. 8.192 Mbps - 128 channels per stream. J2 - 98 channels per stream E3 - 537 channels per stream T3 - 699 channels per stream Note: All TDM Interface inputs (including data, clock and frame pulse) have internal pull-down resistors so they can be safely left unconnected if not used. 4.1.2 TDM Signals common to ZL50115/16/17/18/19/20 Signal I/O Package Balls Description TDM_CLKi_REF ID W2 TDM port reference clock input for backplane operation TDM_CLKo_REF O V3 TDM port reference clock output for backplane operation Table 4 - TDM Interface Common Pin Definition 28 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Signal I/O Package Balls Data Sheet Description TDM_FRMi_REF ID T3 TDM port reference frame input. For different standards this pin is given a different identity: ST-BUS: TDM_F0i H.110: TDM_FRAME H-MVIP: TDM_F0 Signal is normally active low, but can be active high depending on standard. Indicates the start of a TDM frame by pulsing every 125 s. Normally will straddle rising edge or falling edge of clock pulse, depending on standard and clock frequency. TDM_FRMo_REF O W3 TDM port reference frame output. For different standards this pin is given a different identity: ST-BUS: TDM_F0o H.110: TDM_FRAME H-MVIP: TDM_F0 Signal is normally active low, but can be active high depending on standard. Indicates the start of a TDM frame by pulsing every 125 s. Normally will straddle rising edge or falling edge of clock pulse, depending on standard and clock frequency. AUX_CLKI ID L3 Auxiliary clock input. Typically connected to AUX_CLKO. AUX_CLKO OT L2 Auxiliary clock output. Typically connected to AUX_CLKI. Table 4 - TDM Interface Common Pin Definition 29 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 4.2 Data Sheet PAC Interface All PAC Interface signals are 5 V tolerant. All PAC Interface outputs are high impedance while System Reset is LOW. Signal I/O Package Balls Description TDM_CLKiP ID V4 Primary reference clock input. Should be driven by external clock source to provide locking reference to internal / optional external DPLL in TDM master mode. Also provides PRS clock for RTP timestamps in synchronous modes. Acceptable frequency range: 8 kHz 34.368 MHz (generally should be between 10 MHz and 25 MHz as per ITU-T Y.1413). TDM_CLKiS ID U4 Secondary reference clock input. Backup external reference for automatic switch-over in case of failure of TDM_CLKiP source. PLL_PRI OT Y9 Primary reference output to optional external DPLL. Multiplexed & frequency divided reference output for support of optional external DPLL. Expected frequency range: 8 kHz - 16.384 MHz. PLL_SEC OT W10 Secondary reference output to optional external DPLL Multiplexed & frequency divided reference output for support of optional external DPLL. Expected frequency range: 8 kHz - 16.384 MHz. Table 5 - PAC Interface Package Ball Definition 30 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 4.3 Data Sheet Packet Interfaces For the ZL50118/19/20 variants the packet interface is capable of either 2 MII interfaces, or 1 MII and 1 GMII interfaces, or 1 MII and 1 TBI (1000 Mbps) interfaces. The TBI interface is a PCS interface supported by an integrated 1000BASE-X PCS module. When the packet interface is programmed for PCS/TBI mode, by default the hardware will not enable auto-negotiation. The TBI auto-negotiation must be done by application software. The ZL50118/19/20 supports Port 0 and Port 1. For the ZL50115/16/17 variants the packet interface is capable of 1 MII or 1 GMII or 1 TBI (1000 Mbps) interface. The TBI interface is a PCS interface supported by an integrated 1000BASE-X PCS module. The ZL50115/16/17 supports Port 0. Data for all three types of packet switching is based on Specification IEEE Std. 802.3 - 2000. Only Port 0 has the 1000 Mbps capability necessary for the GMII/TBI interface. The ZL5011x will not take action when receiving a PAUSE frame. It will not pause the transmission of traffic. It is normally not required to stop CESoP traffic because it is generally constant bit rate and time sensitive. If necessary, the limiting of egress non-CESoP traffic may be done external to the ZL5011x (e.g., in an Ethernet switch). Table 6 maps the signal pins used in the MII interface to those used in the GMII and TBI interface. Table 7 shows MII Management Interface Package Ball Definition. Table 8 and Table 9 show respectively the MII Port 0 and Port 1 Interface Package Ball Definition. All Packet Interface signals are 5 V tolerant, and all outputs are high impedance while System Reset is LOW. MII GMII TBI (PCS) Mn_LINKUP_LED Mn_LINKUP_LED Mn_LINKUP_LED Mn_ACTIVE_LED Mn_ACTIVE_LED Mn_ACTIVE_LED - Mn_GIGABIT_LED Mn_GIGABIT_LED - Mn_REFCLK Mn_REFCLK Mn_RXCLK Mn_RXCLK Mn_RBC0 Mn_COL Mn_COL Mn_RBC1 Mn_RXD[3:0] Mn_RXD[7:0] Mn_RXD[7:0] Mn_RXDV Mn_RXDV Mn_RXD[8] Mn_RXER Mn_RXER Mn_RXD[9] Mn_CRS Mn_CRS Mn_Signal_Detect Mn_TXCLK - - Mn_TXD[3:0] Mn_TXD[7:0] Mn_TXD[7:0] Mn_TXEN Mn_TXEN Mn_TXD[8] Mn_TXER Mn_TXER Mn_TXD[9] - Mn_GTX_CLK Mn_GTX_CLK Table 6 - Packet Interface Signal Mapping - MII to GMII/TBI Note: Mn can be either M0 or M1 for ZL5011x variants. 31 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Signal I/O Package Balls Data Sheet Description M_MDC O H1 MII management data clock. Common for all four MII ports. It has a minimum period of 400 ns (maximum freq. 2.5 MHz), and is independent of the TXCLK and RXCLK. M_MDIO ID/ OT G1 MII management data I/O. Common for all four MII ports at up to 2.5 MHz. It is bi-directional between the ZL5011x and the Ethernet station management entity. Data is passed synchronously with respect to M_MDC. Table 7 - MII Management Interface Package Ball Definition MII Port 0 Signal I/O Package Balls Description M0_LINKUP_LED O G3 LED drive for MAC 0 to indicate port is linked up. Logic 0 output = LED on Logic 1 output = LED off M0_ACTIVE_LED O D17 LED drive for MAC 0 to indicate port is transmitting or receiving packet data. Logic 0 output = LED on Logic 1 output = LED off M0_GIGABIT_LED O E2 LED drive for MAC 0 to indicate operation at Gbps. Logic 0 output = LED on Logic 1 output = LED off M0_REFCLK ID D11 GMII/TBI - Reference Clock input at 125 MHz. Can be used to lock receive circuitry (RX) to M0_GTXCLK rather than recovering the RXCLK (or RBC0 and RBC1). Useful, for example, in the absence of valid serial data. NOTE: In MII mode this pin must be driven with the same clock as M0_RXCLK. M0_RXCLK IU C10 GMII/MII - M0_RXCLK. Accepts the following frequencies: 25.0 MHz MII 100 Mbps 125.0 MHz GMII 1 Gbps Table 8 - MII Port 0 Interface Package Ball Definition 32 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet MII Port 0 Signal I/O Package Balls Description M0_RBC0 IU B9 TBI - M0_RBC0. Used as a clock when in TBI mode. Accepts 62.5 MHz and is 180 out of phase with M0_RBC1. Receive data is clocked at each rising edge of M0_RBC1 and M0_RBC0, resulting in 125 MHz sample rate. M0_RBC1 IU B8 TBI - M0_RBC1 Used as a clock when in TBI mode. Accepts 62.5 MHz, and is 180 out of phase with M0_RBC0. Receive data is clocked at each rising edge of M0_RBC1 and M0_RBC0, resulting in 125 MHz sample rate. M0_COL ID A7 GMII/MII - M0_COL. Collision Detection. This signal is independent of M0_TXCLK and M0_RXCLK, and is asserted when a collision is detected on an attempted transmission. It is active high, and only specified for half-duplex operation. M0_RXD[7:0] IU [7] [6] [5] [4] M0_RXDV / M0_RXD[8] ID C7 GMII/MII - M0_RXDV Receive Data Valid. Active high. This signal is clocked on the rising edge of M0_RXCLK. It is asserted when valid data is on the M0_RXD bus. TBI - M0_RXD[8] Receive Data. Clocked on the rising edges of M0_RBC0 and M0_RBC1. M0_RXER / M0_RXD[9] ID D6 GMII/MII - M0_RXER Receive Error. Active high signal indicating an error has been detected. Normally valid when M0_RXDV is asserted. Can be used in conjunction with M0_RXD when M0_RXDV signal is de-asserted to indicate a False Carrier. TBI - M0_RXD[9] Receive Data. Clocked on the rising edges of M0_RBC0 and M0_RBC1. A4 A5 D8 A6 [3] [2] [1] [0] C8 D10 C9 B7 Receive Data. Only half the bus (bits [3:0]) are used in MII mode. Clocked on rising edge of M0_RXCLK (GMII/MII) or the rising edges of M0_RBC0 and M0_RBC1 (TBI). Table 8 - MII Port 0 Interface Package Ball Definition (continued) 33 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet MII Port 0 Signal I/O Package Balls M0_CRS / M0_Signal_Detect ID B6 GMII/MII - M0_CRS Carrier Sense. This asynchronous signal is asserted when either the transmission or reception device is non-idle. It is active high. TBI - M0_Signal Detect Similar function to M0_CRS. M0_TXCLK IU A3 MII only - Transmit Clock Accepts the following frequencies: 25.0 MHz MII 100 Mbps M0_TXD[7:0] O [7] [6] [5] [4] M0_TXEN / M0_TXD[8] O A9 GMII/MII - M0_TXEN Transmit Enable. Asserted when the MAC has data to transmit, synchronously to M0_TXCLK with the first pre-amble of the packet to be sent. Remains asserted until the end of the packet transmission. Active high. TBI - M0_TXD[8] Transmit Data. Clocked on rising edge of M0_GTXCLK. M0_TXER / M0_TXD[9] O B10 GMII/MII - M0_TXER Transmit Error. Transmitted synchronously with respect to M0_TXCLK, and active high. When asserted (with M0_TXEN also asserted) the ZL5011x will transmit a non-valid symbol, somewhere in the transmitted frame. TBI - M0_TXD[9] Transmit Data. Clocked on rising edge of M0_GTXCLK. M0_GTX_CLK O A8 GMII/TBI only - Gigabit Transmit Clock Output of a clock for Gigabit operation at 125 MHz. C11 D12 B12 C12 [3] [2] [1] [0] B13 B14 D13 C13 Description Transmit Data. Only half the bus (bits [3:0]) are used in MII mode. Clocked on rising edge of M0_TXCLK (MII) or the rising edge of M0_GTXCLK (GMII/TBI). Table 8 - MII Port 0 Interface Package Ball Definition (continued) 34 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet MII Port 1 (ZL50118/19/20 only) Signal I/O Package Balls Description M1_LINKUP_LED O C17 LED drive for MAC 1 to indicate port is linked up. Logic 0 output = LED on Logic 1 output = LED off M1_ACTIVE_LED O B15 LED drive for MAC 1 to indicate port is transmitting or receiving packet data. Logic 0 output = LED on Logic 1 output = LED off M1_RXCLK IU C4 MII only - Receive Clock. Accepts the following frequencies: 25.0 MHz MII 100 Mbps M1_COL ID C5 Collision Detection. This signal is independent of M1_TXCLK and M1_RXCLK, and is asserted when a collision is detected on an attempted transmission. It is active high, and only specified for half-duplex operation. M1_RXD[3:0] IU [3] [2] M1_RXDV ID D5 Receive Data Valid. Active high. This signal is clocked on the rising edge of M1_RXCLK. It is asserted when valid data is on the M1_RXD bus. M1_RXER ID E4 Receive Error. Active high signal indicating an error has been detected. Normally valid when M1_RXDV is asserted. Can be used in conjunction with M1_RXD when M1_RXDV signal is de-asserted to indicate a False Carrier. M1_CRS ID F2 Carrier Sense. This asynchronous signal is asserted when either the transmission or reception device is non-idle. It is active high. M1_TXCLK IU E3 MII only - Transmit Clock Accepts the following frequencies: 25.0 MHz MII 100 Mbps M1_TXD[3:0] O [3] [2] M1_TXEN O A2 E1 D3 C1 B1 [1] [0] [1] [0] D1 D2 B5 B4 Receive Data. Clocked on rising edge of M1_RXCLK. Transmit Data. Clocked on rising edge of M1_TXCLK. Transmit Enable. Asserted when the MAC has data to transmit, synchronously to M1_TXCLK with the first pre-amble of the packet to be sent. Remains asserted until the end of the packet transmission. Active high. Table 9 - MII Port 1 Interface Package Ball Definition 35 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet MII Port 1 (ZL50118/19/20 only) Signal I/O M1_TXER O Package Balls Description C6 Transmit Error. Transmitted synchronously with respect to M1_TXCLK, and active high. When asserted (with M1_TXEN also asserted) the ZL5011x will transmit a non-valid symbol, somewhere in the transmitted frame. Table 9 - MII Port 1 Interface Package Ball Definition (continued) 4.4 CPU Interface All CPU Interface signals are 5 V tolerant. All CPU Interface outputs are high impedance while System Reset is LOW. Signal CPU_DATA[31:0] CPU_ADDR[23:2] I/O I/ OT I Package Balls Description [31] [30] [29] [28] [27] [26] [25] [24] [23] [22] [21] [20] [19] [18] [17] [16] C16 E19 C18 A11 B16 C19 D20 A12 A14 B17 E20 B18 A16 F20 F21 F22 [15] [14] [13] [12] [11] [10] [9] [8] [7] [6] [5] [4] [3] [2] [1] [0] E21 E22 B19 A17 G21 H19 A18 A19 A20 D22 J20 H21 J21 K20 H20 G22 CPU Data Bus. Bi-directional data bus, synchronously transmitted with CPU_CLK rising edge. [23] [22] [21] [20] [19] [18] [17] [16] [15] [14] [13] [12] D21 N20 P22 R22 N22 P21 P20 T22 U21 T21 R21 U22 [11] [10] [9] [8] [7] [6] [5] [4] [3] [2] R20 V21 V22 W22 Y22 AA22 AB21 W21 AB20 AB19 CPU Address Bus. Address input from processor to ZL5011x, synchronously transmitted with CPU_CLK rising edge. NOTE: as with all ports in the ZL5011x device, CPU_DATA[0] is the least significant bit (lsb). NOTE: as with all ports in the ZL5011x device, CPU_ADDR[2] is the least significant bit (lsb). Table 10 - CPU Interface Package Ball Definition 36 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Signal I/O Package Balls Data Sheet Description CPU_CS IU N21 CPU Chip Select. Synchronous to rising edge of CPU_CLK and active low. Is asserted with CPU_TS_ALE. Must be asserted with CPU_OE to asynchronously enable the CPU_DATA output during a read, including DMA read. CPU_WE I M21 CPU Write Enable. Synchronously asserted with respect to CPU_CLK rising edge, and active low. Used for CPU writes from the processor to registers within the ZL5011x. Asserted one clock cycle after CPU_TS_ALE. CPU_OE I M22 CPU Output Enable. Synchronously asserted with respect to CPU_CLK rising edge, and active low. Used for CPU reads from the processor to registers within the ZL5011x. Asserted one clock cycle after CPU_TS_ALE. Must be asserted with CPU_CS to asynchronously enable the CPU_DATA output during a read, including DMA read. CPU_TS_ALE I M20 Synchronous input with rising edge of CPU_CLK. Latch Enable (ALE), active high signal. Asserted with CPU_CS, for a single clock cycle. CPU_SDACK1 I A21 CPU/DMA 1 Acknowledge Input. Active low synchronous to CPU_CLK rising edge. Used to acknowledge request from ZL5011x for a DMA write transaction. Only used for DMA transfers, not for normal register access. CPU_SDACK2 I L21 CPU/DMA 2 Acknowledge Input Active low synchronous to CPU_CLK rising edge. Used to acknowledge request from ZL5011x for a DMA read transaction. Only used for DMA transfers, not for normal register access. CPU_CLK I L19 CPU PowerQUICCTM II Bus Interface clock input. 66 MHz clock, with minimum of 6 ns high/low time. Used to time all host interface signals into and out of ZL5011x device. Table 10 - CPU Interface Package Ball Definition (continued) 37 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Signal I/O Package Balls Data Sheet Description CPU_TA OT B22 CPU Transfer Acknowledge. Driven from tri-state condition on the negative clock edge of CPU_CLK following the assertion of CPU_CS. Active low, asserted from the rising edge of CPU_CLK. For a read, asserted when valid data is available at CPU_DATA. The data is then read by the host on the following rising edge of CPU_CLK. For a write, is asserted when the ZL5011x is ready to accept data from the host. The data is written on the rising edge of CPU_CLK following the assertion. Returns to tri-state from the negative clock edge of CPU_CLK following the de-assertion of CPU_CS. CPU_DREQ0 OT K22 CPU DMA 0 Request Output Active low synchronous to CPU_CLK rising edge. Asserted by ZL5011x to request the host initiates a DMA write. Only used for DMA transfers, not for normal register access. CPU_DREQ1 OT C22 CPU DMA 1 Request Active low synchronous to CPU_CLK rising edge. Asserted by ZL5011x to indicate packet data is ready for transmission to the CPU, and request the host initiates a DMA read. Only used for DMA transfers, not for normal register access. CPU_IREQO O J22 CPU Interrupt 0 Request (Active Low) CPU_IREQ1 O G20 CPU Interrupt 1 Request (Active Low) Table 10 - CPU Interface Package Ball Definition (continued) 38 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 4.5 Data Sheet System Function Interface All System Function Interface signals are 5 V tolerant. The core of the chip will be held in reset for 16383 SYSTEM_CLK cycles after SYSTEM_RST has gone HIGH to allow the PLL's to lock. No chip access should occur at this time. Signal I/O Package Balls Description SYSTEM_CLK I W13 System Clock Input. The system clock frequency is 100 MHz. The quality of SYSTEM_CLK, or the oscillator that drives SYSTEM_CLK directly impacts the adaptive clock recovery performance. See Section 6.3. SYSTEM_RST I AA12 System Reset Input. Active low. The system reset is asynchronous, and causes all registers within the ZL5011x to be reset to their default state. Recommend external pull-up. SYSTEM_DEBUG I AA11 System Debug Enable. This is an asynchronous signal that, when de-asserted, prevents the software assertion of the debug-freeze command, regardless of the internal state of registers, or any error conditions. Active high. Recommend external pull-down. Table 11 - System Function Interface Package Ball Definition 4.6 4.6.1 Test Facilities Administration, Control and Test Interface All Administration, Control and Test Interface signals are 5 V tolerant. Signal GPIO[15:0] I/O ID/ OT Package Balls [15] [14] [13] [12] [11] [10] [9] [8] W17 Y16 AB16 AA16 AB15 AB14 W15 Y15 [7] [6] [5] [4] [3] [2] [1] [0] AA15 AB13 AB12 AB11 AB10 AA14 AA13 AB9 Description General Purpose I/O pins. Connected to an internal register, so customer can set user-defined parameters. Bits [4:0] reserved at start-up or reset for memory TDL setup. See the ZL50115/16/17/18/19/20 Programmers Model for more details. Recommend 5 kohm pulldown on these signals. Table 12 - Administration/Control Interface Package Ball Definition 39 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Signal TEST_MODE[2:0] I/O ID Data Sheet Package Balls [2] [1] [0] Description AB17 Y17 AA17 Test Mode input - ensure these pins are tied to ground for normal operation. 000 SYS_NORMAL_MODE 001-010 RESERVED 011 SYS_TRISTATE_MODE 100-111 RESERVED Table 12 - Administration/Control Interface Package Ball Definition 4.6.2 JTAG Interface All JTAG Interface signals are 5 V tolerant, and conform to the requirements of IEEE1149.1 (2001). Signal I/O Package Balls Description JTAG_TRST IU Y18 JTAG Reset. Asynchronous reset. In normal operation this pin should be pulled low. Recommend external pull-down. JTAG_TCK I V20 JTAG Clock - maximum frequency is 25 MHz, typically run at 10 MHz. In normal operation this pin should be pulled either high or low. Recommend external pull-down. JTAG_TMS IU U20 JTAG test mode select. Synchronous to JTAG_TCK rising edge. Used by the Test Access Port controller to set certain test modes. JTAG_TDI IU AA18 JTAG test data input. Synchronous to JTAG_TCK. JTAG_TDO O W20 JTAG test data output. Synchronous to JTAG_TCK. Table 13 - JTAG Interface Package Ball Definition 4.7 Miscellaneous Inputs The following unused inputs must be tied low or high as appropriate. Signal Package Balls Description IC_GND W11, Y11, Y19, AA19, AB18 Internally connected. Tie to GND. IC_VDD_IO L22 Internally connected. Tie to VDD_IO. Table 14 - Miscellaneous Inputs Package Ball Definitions 40 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 4.8 Data Sheet Power and Ground Connections Signal Package Balls Description VDD_IO A1 AA4 B2 C20 D4 K4 T19 W16 W7 A22 AA5 B21 C3 D7 M4 T20 W19 W8 AA2 AB1 C14 D16 G19 N19 T4 W4 Y20 AA21 AB22 C15 D19 G4 P3 U2 W5 Y3 3.3 V VDD Power Supply for IO Ring GND A13 AA7 B3 J10 J14 K12 K9 L12 L9 M13 N10 N14 P12 P9 Y13 A15 AB5 C2 J11 J9 K13 L1 L13 M10 M14 N11 N9 P13 R19 Y14 AA20 B11 C21 J12 K10 K14 L10 L14 M11 M19 N12 P10 P14 U3 Y2 AA3 B20 H2 J13 K11 K19 L11 L20 M12 M9 N13 P11 P2 W12 Y21 0 V Ground Supply VDD_CORE D14 F19 J4 P4 W9 D15 F4 L4 U19 Y6 D18 H4 N4 W14 D9 J19 P19 W6 1.8 V VDD Power Supply for Core Region A1VDD AA8 1.8 V PLL Power Supply Table 15 - Power and Ground Package Ball Definition 4.9 Internal Connections The following pins are connected internally, and must be left open circuit. Signal IC Package Balls AA1 AB2 AB7 W1 Y4 AA10 AB3 AB8 Y1 Y5 Description AA6 AB4 H22 Y10 Y7 AA9 AB6 K21 Y12 Y8 Internally connected. Leave open circuit Table 16 - Internal Connections Package Ball Definitions 41 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 4.10 Data Sheet No Connections The following pins are not connected internally, and should be left open circuit. Signal NC Package Balls F1 J3 H3 K1 Description J1 K2 J2 K3 No connection. Leave open circuit. Table 17 - Miscellaneous Inputs Package Ball Definitions 4.11 Device ID Signal I/O DEVICE_ID[4:0] O Package Balls [4] [3] [2] [1] [0] Description Device ID. ZL50115 = 00000 ZL50116 = 00001 ZL50117 = 00010 ZL50118 = 00011 ZL50119 = 00100 ZL50120 = 00101 A10 V19 W18 F3 G2 Table 18 - Device ID Ball Definition 42 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 5.0 Typical Applications 5.1 Leased Line Provision Data Sheet Circuit emulation is typically used to support the provision of leased line services to customers using legacy TDM equipment. For example, Figure 8 shows a leased line TDM service being carried across a packet network. The advantages are that a carrier can upgrade to a packet switched network, whilst still maintaining their existing TDM business. The ZL5011x is capable of handling circuit emulation of both structured T1, E1, and J2 links (e.g., for support of fractional circuits) and unstructured (or clear channel) T1, E1, J2, T3 and E3 links. The device handles the data-plane requirements of the provider edge inter-working function (with the exception of the physical interfaces and line interface units). Control plane functions are forwarded to the host processor controlling the ZL5011x device. The ZL5011x provides a per-stream clock recovery function, in unstructured mode, to reproduce the TDM service frequency at the egress of the packet network. This is required otherwise the queue at the egress of the packet network will either fill up or empty, depending on whether the regenerated clock is slower or faster than the original. Carrier Network TDM Packet Network TDM to packet Customer Premises queue TDM fservice ~ ~ fservice fservice Extract Clock Provider Edge Interworking Function Provider Edge Interworking Function Figure 8 - Leased Line Services Over a Circuit Emulation Link 43 Zarlink Semiconductor Inc. Customer data Customer data Customer Premises ZL50115/16/17/18/19/20 5.2 Data Sheet Remote Concentrator Unit The remote concentrator application, shown in Figure 9, consists of a remote concentrators connected to the Central Office (CO) by a dedicated fiber link running Gigabit Ethernet (GE) or Ethernet over SONET (EoS) rather than by NxT1/E1 or DS3/E3. The remote concentrators provide both TDM service and native Ethernet service to the Multi-Tenet Unit or Multi-Dwelling Unit (MTU/MDU). The ZL5011x is used to emulate TDM circuits over Ethernet by establishing CESoP connections between the remote concentrator and the CO. The native IP or Ethernet traffic is multiplexed with the CESoP traffic inside the remote concentrator and sent across the same GE connection to the CO. At the CO the native IP or Ethernet traffic is split from the CESoP connections at sent towards the packet network. Multiple T1/E1 CESoP connections from several remote concentrators are aggregated in the CO using a larger ZL5011x variant, converted back to TDM circuits, and connected to the PSTN through a higher bandwidth TDM circuit such as OC-3 or STM-1. The use of CESoP here allows the convergence of voice and data on a single access network based on Ethernet. This convergence on Ethernet, a packet technology, rather than SONET/SDH, a switched circuit technology, provides cost and operational savings. Figure 9 - Remote Concentrator Unit using CESoP 44 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 5.3 Data Sheet FTTP The Fiber to the Premise (FTTP) application, shown in Figure 10, consists of an Ethernet Passive Optical Network (EPON) deployed in the Wide Area Network (WAN). The Optical Network Units (ONU) sit at the curb while the Optical Line Terminals (OLT) are located at the Central Office (CO). The ONUs are traditionally equipped with Ethernet interfaces to provide video and data service to the customer premise. The ONU includes a ZL5011x which enables the box to provide T1/E1 service to the customer. The ZL5011x is used to establish CESoP connections between the ONU and the OLT to transparently carry TDM circuits across the EPON. The ONU would use a smaller variant of the ZL5011x and the OLT would use a larger variant to aggregate CESoP traffic from many ONUs and connect them at the CO to the PSTN. The native IP or Ethernet traffic from the ONU would be split off at the OLT and connected to the packet network. Customer Premises Ethernet Fiber Links T1/E1 ONU Ethernet IP GIGE Over Fiber Ethernet T1/E1 ONU Optical Splitter OLT T1/E1 Ethernet T1/E1 ONU CESoP Figure 10 - EPON using CESoP 45 Zarlink Semiconductor Inc. PSTN ZL50115/16/17/18/19/20 5.4 Data Sheet Wireless - WiFi or WiMAX The wireless application, shown in Figure 11, may either be in the form of WiMAX for broadband access or Wi-Fi for smaller-scale Loans. Both technologies carry Ethernet over radio links between sites or pieces of equipment. An application for CESoP technology over a WiMAX network is to enable the service provider to sell T1/E1 service in addition to video and data services that are natively carried across the WiMAX connection. A ZL5011x is used at the customer premise to packetize the T1/E1, fractional T1/E1 or TDM circuit into Ethernet packets, which are transported back to the Central Office (CO). At the CO the TDM circuit is re-assembled from the Ethernet packets and send to the PSTN. The CESoP traffic is converged onto the same WiMAX connection as the native Ethernet traffic for video and data. An application for CESoP technology over a Wi-Fi network is to enable a distributed PBX system in either a single building or between buildings in a campus environment. In this application the T1/E1 connection from a PBX is connected using a CESoP to another PBX. A wireless site-to-site CESoP connection between buildings in a campus would allow for deployment savings against having to run dedicated copper cables between buildings. Wireless LAN Access Point WiMAX (802.16) Wireless LAN Access Point T1/E1 CESoP WiMAX MAC WiMAX MAC CESoP T1/E1 70 Mbps Up to 48 Km CESoP Wireless LAN Access Point Wi-Fi (802.11) Wireless LAN Access Point T1/E1 CESoP Wi-Fi MAC 54 Mbps Up to 100 m Wi-Fi MAC CESoP T1/E1 CESoP Figure 11 - Wi-Fi and WiMAX using CESoP 46 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 5.5 Data Sheet Digital Loop Carrier The Broadband Digital Loop Carrier (BBDLC) application, shown in Figure 12, consists of a BBDLC connected to the Central Office (CO) by a dedicated fiber link running Gigabit Ethernet (GE) rather than by NxT1/E1 or DS3/E3. The ZL5011x is used to emulate TDM circuits over Ethernet by establishing CESoP connections between the BBDLC and the CO. At the CO the native IP or Ethernet traffic is split from the CESoP connections at sent towards the packet network. Multiple T1/E1 CESoP connections from several BBDLC are aggregated in the CO using a larger ZL5011x variant, converted back to TDM circuits, and connected to a class 5 switch destined towards the PSTN. In this configuration T3/E3 services can also be provided. Using CESoP allows voice and data traffic to be converged onto a single link. IP Edge Router or Multi-Service Switching Platform POTS Digital Loop Carrier GIGE Over Fiber N x GIGE IP Dedicated Fiber Links Central Office T1/E1 Broadband DLC GIGE Over Fiber Central Office Switch (Class 5) N x T1/E1 PSTN CESoP Figure 12 - Digital Loop Carrier using CESoP 47 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 5.6 Data Sheet Integrated Access Device The Integrated Access Device (IAD) application consists of an IAD located at the curb or customer premise with an Ethernet connection to an TDM aggregation box sitting in the access area of the network. The ZL5011x in the IAD modem packetizes the T1/E1 or fractional T1/E1 TDM circuit into Ethernet CESoP packets. The CESoP traffic is multiplexed with the native Ethernet data traffic from the IAD's Ethernet ports onto the Ethernet link to the aggregation equipment. The aggregator will split off the native Ethernet traffic from multiple IADs and send the traffic on to packet network. The aggregator will contain a larger ZL5011x that will terminate multiple CESoP connections from multiple IADs and send the TDM circuits to the PSTN, perhaps over a higher bandwidth TDM pipe such as DS3. The use of CESoP in this application allows the IAD to support both native Ethernet service as well as T1/E1 service in the same box, while converging both types of traffic onto a single Ethernet connection back towards the provider. Small business IP Edge Router or Multi-Service Switching Platform Ethernet T1/E1 N x GIGE Ethernet link IAD IP TDM Aggregation Small business Central Office Switch (Class 5) Ethernet T1/E1 N x T1/E1 Ethernet link IAD PSTN CESoP Figure 13 - Integrated Access Device Using CESoP 6.0 Functional Description The ZL5011x family provides the data-plane processing to enable constant bit rate TDM services to be carried over a packet switched network, such as an Ethernet, IP or MPLS network. The device segments the TDM data into user-defined packets, and passes it transparently over the packet network to be reconstructed at the far end. This has a number of applications, including emulation of TDM circuits and packet backplanes for TDM-based equipment. Transparent data flow between TDM equipment TDM equipment constant bit rate TDM link CESoP TDM-Packet conversion packet switched network interworking function CESoP TDM-Packet conversion TDM equipment constant bit rate TDM link interworking function Figure 14 - ZL50115/16/17/18/19/20 Family Operation 48 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet Note: The ZL5011x does not support the transmission or reception of jumbo packets, or packet sizes larger than 1522 bytes. 6.1 Block Diagram A diagram of the ZL5011x device is given in Figure 15, which shows the major data flows between functional components. DMA Control TM Compatible Host Interface Admin. Payload Assembly Central Task Manager Packet Transmit TDM Formatter Protocol Engine Packet Receive TDM Interface Memory Management Unit Clock Recovery On-chip RAM Controller Data Flows Control Flows Dual Packet Interface MAC JTAG Test Controller Single 100 Mbps MII Fast Ethernet and/or Single 1000 Mbps (G)MII/TBI Gigabit Ethernet 4 T1, 4 E1, 1 J2, 1 T3 or 1 E3 ports H.110, H-MVIP, ST-BUS backplanes Motorola PowerQUICC JTAG Interface Figure 15 - ZL50115/16/17/18/19/20 Data and Control Flows 6.2 Data and Control Flows There are numerous combinations that can be implemented to pass data through the ZL5011x device depending on the application requirements. The Task Manager can be considered the central pivot, through which all flows must operate. The Task Manager acts as a "router" in the centre of the chip, directing packets to the appropriate blocks for further processing. The task message contains a pointer to the relevant data, instructions as to what to do with the data, and ancillary information about the packet. Effectively this means the flow of data through the device can be programmed, by setting the task message contents appropriately. Flow Number Flow Through Device 1 TDM to (TM) to PE to (TM) to PKT 2 PKT to (TM) to PE to (TM) to TDM 3 TDM to (TM) to PKT 4 PKT to (TM) to TDM 5 TDM to (TM) to CPU 6 TDM to (TM) to PE to (TM) to CPU 7 CPU to (TM) to TDM 8 PKT to (TM) to CPU 9 CPU to (TM) to PKT Table 19 - Standard Device Flows 49 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet Flow Number Flow Through Device 101 TDM to (TM) to TDM 1 PKT to (TM) to PKT 11 Table 19 - Standard Device Flows (continued) 1. This flow is for loopback and may be helpful for test purposes Each of the 11 data flows uses the Task Manager to route packet information to the next block or interface for onward transmission. The flow is determined by the Type field in the Task Message (see ZL50115/16/17/18/19/20 Programmers Model). 6.3 SYSTEM_CLK Considerations The quality of the 100 MHz SYSTEM_CLK or the oscillator that drives SYSTEM_CLK directly impacts the adaptive clock recovery performance. Zarlink has a recommended oscillator and guidelines for the selection of an oscillator. Please refer to ZL5011x Design Manual section "3.6 System Clock Block" before choosing an oscillator. 6.4 TDM Interface The ZL5011x family offers the following types of TDM service across the packet network: Service type TDM interface Interface type Interfaces to Unstructured asynchronous T1, E1, J2, E3 and T3 Bit clock in and out Data in and out Line interface unit Structured synchronous (N x 64 Kbps) T1, E1 and J2 Framed TDM data streams at 2.048 and 8.192 Mbps Bit clock out Frame pulse out Data in and out Framers TDM backplane (master) Bit clock in Frame in Data in and out Framers TDM backplane (slave) Table 20 - TDM Services Offered by the ZL50115/16/17/18/19/20 Family Unstructured services are fully asynchronous, and include full support for clock recovery on a per stream basis. Both adaptive and differential clock recovery mechanisms can be used. Structured services are synchronous, with all streams driven by a common clock and frame reference. These services can be offered in two ways: * Synchronous master mode - the ZL5011x provides a common clock and frame pulse to all streams, which may be locked to an incoming clock or frame reference * Synchronous slave mode - the ZL5011x accepts a common external clock and frame pulse to be used by all streams In either structured mode, N x 64 Kbps trunking is supported as detailed in "Payload Order" on page 54. The ZL5011x supports structured mode or unstructured mode, however it does not support structured mode and unstructured mode at the same time, all ports are either structured or unstructured. In structured mode, all TDM inputs must be synchronous. 50 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 6.4.1 Data Sheet TDM Interface Block The TDM Interface contains two basic types of interface: unstructured clock and data, for interfacing directly to a line interface unit; or structured, framed data, for interfacing to a framer or TDM backplane. Unstructured data is treated asynchronously, with every stream using its own clock. Clock recovery is provided on each output stream, to reproduce the TDM service frequency at the egress of the packet network. Structured data is treated synchronously, i.e., all data streams are timed by the same clock and frame references. These can either be supplied from an external source (slave mode) or generated internally using the on-chip stratum 4/4E PLL (master mode). 6.4.2 Structured TDM Port Data Formats The ZL5011x is programmable such that the frame/clock polarity and clock alignment can be set to any desired combination. Table 21 shows a brief summary of four different TDM formats; ST-BUS, H.110, H-MVIP, and Generic (synchronous mode only), for more information see the relevant specifications shown. There are many additional formats for TDM transmission not depicted in Table 21, but the flexibility of the port will cover almost any scenario. The overall data format is set for the entire TDM Interface device, rather than on a per stream basis. It is possible to control the polarity of the master clock and frame pulse outputs, independent of the chosen data format (used when operating in synchronous master mode). Data Format Data Rate (Mbps) ST-bus Number of channels per frame Clock Freq. Nominal Frame Pulse Width (MHz) Frame Pulse Polarity Frame Boundary Alignment Standard clock frame pulse (ns) 2.048 32 2.048 244 Negative Rising Edge Straddles boundary 2.048 32 4.096 244 Negative Falling Edge Straddles boundary 8.192 128 16.384 61 Negative Falling Edge Straddles boundary H.110 8.192 128 8.192 122 Negative Rising edge Straddles boundary ECTF H.110 H-MVIP 2.048 32 2.048 244 Negative Rising Edge Straddles boundary 2.048 32 4.096 244 Negative Falling Edge Straddles boundary H-MVIP Release 1.1a 8.192 128 16.384 244 Negative Falling Edge Straddles boundary 2.048 32 2.048 488 Positive Rising Edge Rising edge of clock 8.192 128 8.192 122 Positive Rising Edge Rising edge of clock Generic MSAN-126 Rev B (Issue 4) Zarlink Table 21 - Some of the TDM Port Formats Accepted by the ZL50115/16/17/18/19/20 Family 51 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 6.4.3 Data Sheet TDM Clock Structure The TDM interface can operate in two modes, synchronous for structured TDM data, and asynchronous for unstructured TDM data. The ZL5011x is capable of providing the TDM clock for either of the modes. The ZL5011x supports clock recovery in both synchronous and asynchronous modes of operation. In asynchronous operation each stream may have independent clock recovery. 6.4.3.1 Synchronous TDM Clock Generation In synchronous mode all 4 streams will be driven by a common clock source. When the ZL5011x is acting as a master device, the source can either be the internal DPLL or an external PLL. In both cases, the primary and secondary reference clocks are taken from either two TDM input clocks, or two external clock sources driven to the chip. The input clocks are then divided down where necessary and sent either to the internal DPLL or to the output pins for connection to an external DPLL. The DPLL then provides the common clock and frame pulse required to drive the TDM streams. See "DPLL Specification" on page 62 for further details. TDM_CLKi[3:0] PRS PRD PLL_PRI DIV PLL_SE C TDM_CLKiP SRS SRD DIV TDM_CLKiS CLOCK Internal DPLL FRAME Figure 16 - Synchronous TDM Clock Generation When the ZL5011x is acting as a slave device, the common clock and frame pulse signals are taken from an external device providing the TDM master function. 6.4.3.2 Asynchronous TDM Clock Generation Each stream uses a separate internal DCO to provide an asynchronous TDM clock output. The DCO can be controlled to recover the clock from the original TDM source depending on the timing algorithm used. 6.5 Payload Assembly Data traffic received on the TDM Interface is sampled in the TDM Interface block, and synchronized to the internal clock. It is then forwarded to the payload assembly process. The ZL5011x Payload Assembler can handle up to 128 active packet streams or "contexts" simultaneously. Each context generates a single stream of packets identified by a label in the packet header known as the "context ID". Packet payloads are assembled in the format shown in Figure 17 - on page 53 in structured operation. This meets the requirements of the IETF CESoPSN standard (RFC 5086). Alternatively, packet payloads are assembled in the format shown in Figure 19 - on page 55. This format meets the requirements of the IETF SAToP standard (RFC 4553). The Packet Transmit (PTX) circuit adds Layer 2 and Layer 3 protocol headers. The chosen protocol header combination for addition by the PTX must not exceed 64 bytes. The exception is context 127 (the 128th context), which must not exceed 56 bytes. 52 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet Contexts in the TDM to PKT direction are placed in the UPDATE state when they are opened, pending the local clock source generation. If there is no local clock source to generate packets, the context will remain in the UPDATE state and cannot be closed. ZL5011x Design Manual section "13.1 Understanding forceDelete" describes the procedure to close transmit contexts in the UPDATE state. When the payload has been assembled it is written into the centrally managed memory, and a task message is passed to the Task Manager. 6.5.1 Structured Payload Operation In structured mode a context may contain any number of 64 kbps channels. These channels need not be contiguous and they may be selected from any input stream. Channels may be added or deleted dynamically from a context. This feature can be used to optimize bandwidth utilisation. Modifications to the context are synchronised with the start of a new packet. The fixed header at the start of each packet is added by the Packet Transmit block. This consists of up to 64 bytes, containing the Ethernet header, any upper layer protocol headers, and the two byte context descriptor field (see section below). The header is entirely user programmable, enabling the use of any protocol. The payload header and size must be chosen so that the overall packet size is not less than 64 bytes, the Ethernet standard minimum packet size. Where this is likely to be the case, the header or data must be padded (as shown in Figure 17 and Figure 19) to ensure the packet is large enough. This padding is added by the ZL5011x for most applications. Header Ethernet Header may include VLAN tagging Network Layers e.g. IPv4, IPv6, MPLS (added by Packet Transmit) Upper layers (added by Protocol Engine) e.g. UDP, L2TP, RTP, CESoPSN, SAToP Channel 1 Channel 2 Data for TDM Frame 1 Channel x Channel 1 Channel 2 Data for TDM Frame 2 TDM Payload Channel x (constructed by Payload Assembler) Channel 1 Channel 2 Data for TDM Frame n Channel x Static Padding (if required to meet minimum payload size) may also be placed in the packet header Ethernet FCS Figure 17 - ZL50115/16/17/18/19/20 Packet Format - Structured Mode 53 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet In applications where large payloads are being used, the payload size must be chosen such that the overall packet size does not exceed the maximum Ethernet packet size of 1518 bytes (1522 bytes with VLAN tags). Figure 17 shows the packet format for structured TDM data, where the payload is split into frames, and each frame concatenated to form the packet. 6.5.1.1 Payload Order Packets are assembled sequentially, with each channel placed into the packet as it arrives at the TDM Interface. A fixed order of channels is maintained (see Figure 18), with channel 0 placed before channel 1, which is placed before channel 2. It is this order that allows the packet to be correctly disassembled at the far end. A context must contain only unique channel numbers. As such a context that contains the same channel from different streams, for example channel 1 from stream 2 and channel 1 from stream 3, would not be permitted. S tre a m 0 C hannel 0 C hannel 1 C hannel 2 C hannel 31 S tre a m 1 C hannel 0 C hannel 1 C hannel 2 C hannel 31 S tre a m 2 C hannel 0 C hannel 1 C hannel 2 C hannel 31 S tre a m 3 C hannel 0 C hannel 1 C hannel 2 C hannel 31 C h a n n e l A s se m b ly O rd e r Figure 18 - Channel Order for Packet Formation Each packet contains one or more frames of TDM data, in sequential order. This groups the selected channels for the first frame, followed by the same set of channels for the subsequent frame, and so on. 6.5.2 Unstructured Payload Operation In unstructured mode, the payload is not split by defined frames or timeslots, so the packet consists of a continuous stream of data. Each packet consists of a number of octets, as shown in Figure 19. The number of octets in a packet need not be an integer number of frames. A typical value for N may be 192, as defined in the IETF PWE3 RFC. For example, consider mapping the unstructured data of a 25 timeslot DS0 stream. The data for each T1 frame would normally consist of 193 bits, 192 data bits and 1 framing bit. If the payload consists of 24 octets it will be 1 bit short of a complete frames worth of data, if the payload consists of 25 octets it will be 7 bits over a complete frames worth of data. NOTE: No alignment of the octets with the T1 framing structure can be assumed. 54 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Ethernet Header Network Layers Header (added by Packet Transmit) Upper layers Data Sheet may include VLAN tagging e.g. IPv4, IPv6, MPLS e.g. UDP, L2TP, RTP, CESoPSN, SAToP (added by Protocol Engine) N octets of data from unstructured stream NOTE: No frame or channel alignment Octet 1 Octet 2 Octet N Static Padding TDM Payload (constructed by Payload Assembler) 46 to 1500 bytes may also be placed in the (if required to meet minimum payload size) packet header Ethernet FCS Figure 19 - ZL50115/16/17/18/19/20 Packet Format - Unstructured Mode Note: To change the packet size of a context, first close the context and then re-open the context with a new packet size. 6.6 Protocol Engine In general, the next processing block for TDM packets is the Protocol Engine. This handles the data-plane requirements of the main higher level protocols (layers 4 and 5) expected to be used in typical applications of the ZL5011x family: UDP, RTP, L2TP, CESoPSN, SAToP and CDP. The Protocol Engine can add a header to the datagram containing up to 24 bytes. This header is largely static information, and is programmed directly by the CPU. It may contain a number of dynamic fields, including a length field, checksum, sequence number and a timestamp. The location, and in some cases the length of these fields is also programmable, allowing the various protocols to be placed at variable locations within the header. 6.7 Packet Transmission Packets ready for transmission are queued to the switch fabric interface by the Queue Manager. Four classes of service are provided, allowing some packet streams to be prioritized over others. On transmission, the Packet Transmit block appends a programmable header, which has been set up in advance by the control processor. Typically this contains the data-link and network layer headers (layers 2 and 3), such as Ethernet, IP (versions 4 and 6) and MPLS. 6.8 Packet Reception Incoming data traffic on the packet interface is received by the MACs. The well-formed packets are forwarded to a packet classifier to determine the destination. When a packet is successfully classified the destination can be the TDM interface, the LAN interface or the host interface. TDM traffic is then further classified to determine the context it is intended for. Each TDM interface context has an individual queue, and the TDM re-formatting process re-creates the TDM streams from the incoming packet streams. This queue is used as a jitter buffer, to absorb variation in packet delay across the network. The size of the jitter buffer can be programmed in units of TDM frames (i.e., steps of 125 s). There is also a queue to the host interface, allowing a traffic flow to the host CPU for processing. The host's DMA controller can be used to retrieve packet data and write it out into the CPU's own memory. 55 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 6.9 Data Sheet TDM Formatter At the receiving end of the packet network, the original TDM data must be re-constructed from the packets received. This is known as re-formatting, and follows the reverse process from the Payload Assembler. The TDM Formatter plays out the packets in the correct sequence, directing each octet to the selected timeslot on the output TDM interface. When lost or late packets are detected, the TDM Formatter plays out underrun data for the same number of TDM frames as were included in the missing packet. Underrun data can either be the last value played out on that timeslot, or a pre-programmed value (e.g., 0xFF). If the packet subsequently turns up it is discarded. In this way, the end-to-end latency through the system is maintained at a constant value. Contexts in the Packet to TDM direction are placed in the UPDATE state when they are opened, pending first packet arrival. If a packet never arrives the context will remain in the UDPATE state. ZL5011x Design Manual section "13.1 Understanding forceDelete" describes the procedure to close receive contexts in the UPDATE state. 6.10 Ethernet Traffic Aggregation (ZL50118/19/20 only) The ZL5011x allows native Ethernet traffic received on the customer side Fast Ethernet port to be aggregated with the CESoP traffic from the TDM interface to the provider side Gigabit Ethernet port. Likewise, traffic from the provider side Gigabit Ethernet port may be split between CESoP traffic destined towards the TDM interface and native Ethernet traffic destined towards the customer side Fast Ethernet port. This functionality is achieved by correctly programming the task manager and packet classifiers for flow 11. From the provider side Gigabit Ethernet port to the customer side TDM and Fast Ethernet interfaces there is sufficient internal bandwidth to avoid any prioritization issues. From the customer side TDM and Fast Ethernet interfaces towards the Gigabit Ethernet ports the TDM CESoP traffic may be sent to a higher priority output queue (there are four output queues total) than the native Fast Ethernet traffic. In this way the access to the provider side Gigabit Ethernet port is prioritized for TDM traffic over native Ethernet traffic. 56 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 7.0 Data Sheet Clock Recovery One of the main issues with circuit emulation is that the clock used to drive the TDM link is not necessarily linked into the central office reference clock, and hence may be any value within the tolerance defined for that service. The reverse link may also be independently timed, and operating at a slightly different frequency. In the plesiochronous digital hierarchy the difference in clock frequencies between TDM links is compensated for using bit stuffing techniques, allowing the clock to be accurately regenerated at the remote end of the carrier network. With a packet network, that connection between the ingress and egress frequency is broken, since packets are discontinuous in time. From Figure 8, the TDM service frequency fservice at the customer premises must be exactly reproduced at the egress of the packet network. The consequence of a long-term mismatch in frequency is that the queue at the egress of the packet network will either fill up or empty, depending on whether the regenerated clock is slower or faster than the original. This will cause loss of data and degradation of the service. The ZL5011x provides a per-stream clock recovery function to reproduce the TDM service frequency at the egress of the packet network. There are two schemes are employed, depending on the availability of a common reference clock at each provider edge unit, within the ZL5011x - differential and adaptive. The adaptive and differential algorithms assume that there are no bit errors in the received packet header sequence number or timestamp fields. If there are bit errors in the sequence number or timestamp fields, especially in the most significant bits, then it is likely to cause a temporary degradation of the recovered clock performance. It is advised to protect packets end-to-end (e.g., by using Ethernet FCS) such that packets with bit errors are discarded and do not impact the recovered clock performance. The clock recovery itself is performed by software in the host processor, with support from on-chip hardware to gather the required statistics. 7.1 Differential Clock Recovery For applications where the wander characteristics of the recovered clock are very important, such as when the emulated circuit must be connected into the plesiochronous digital hierarchy (PDH), the ZL5011x also offers a differential clock recovery technique. This relies on having a common reference clock available at each provider edge point. Figure 20 illustrates this concept with a common Primary Reference Source (PRS) clock being present at both the source and destination equipment. The differential algorithm assumes that the common clock is always present. There is no internal holdover capability for the common clock source (e.g., TDM_CLKiP). If the availability of the common clock can not be guaranteed, then it is recommended to use an external DPLL with holdover capability to provide a clock source at all times. The external DPLL may enter holdover while the common clock is absent to maintain a relatively close frequency to the original common clock. In a differential technique, the timing of the TDM service clock is sent relative to the common reference clock. Since the same reference is available at the packet egress point and the packet size is fixed, the original service clock frequency can be recovered. This technique is unaffected by any low frequency components in the packet delay variation. The disadvantage is the requirement for a common reference clock at each end of the packet network, which could either be the central office TDM clock, or provided by a global position system (GPS) receiver. 57 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet PRS clock Data LIU ZL5011x source node ZL5011x destination node Packets Source Clock Packets Network Timestamp generation Data Timestamp extraction Dest'n Clock LIU DCO Host CPU Timing recovery Figure 20 - Differential Clock Recovery 7.2 Adaptive Clock Recovery For applications where there is no common reference clock between provider edge units, an adaptive clock recovery technique is provided. The Adaptive clock recovery solution provided in the Zarlink CESoP products is a combination hardware and software. The chip contains a DCO per TDM port in unstructured mode, that enables the recovery of up to 32 independent clocks. The timing algorithm resides in the API and runs out of the host processor. The basic information is transmitted using timestamps. Current CES standards allow for using of timestamps. Timestamps may be implied by the value of the sequence numbers, or it can be formatted as RTP timestamps. When a packet containing TDM data is sent, an RTP timestamp and/or sequence number is placed into the packet header. On arrival at the receiving device, the arrival time is noted in the form of a local timestamp, driven by the output clock of the TDM port it is destined for. The recovered clock at the egress point of the ZL5011x is based on non-linear filtering of the timestamps that are carried in the CESoP packets. The performance of the clock recovery is greatly improved by applying these non-liner filtering techniques. The adaptive clock recovery performance is dependent on the network configuration and operation, if the loading of the network is constrained, then the wander of the recovered clock will not exceed the specified limits. ZL5011x source node ZL5011x destination node Packets Source Clock Packets Network Queue Dest'n Clock DCO Time Stamp Host CPU Queue monitor Figure 21 - Adaptive Clock Recovery 58 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 8.0 System Features 8.1 Latency Data Sheet The following lists the intrinsic processing latency of the ZL5011x. The intrinsic processing latency is dependent on the number of channels in a context for structured operation, as detailed below. However, the intrinsic processing latency is not dependent on the total number of contexts opened or the total number of channels being processed by the device. * TDM to Packet transmission processing latency less than 125 s * Packet to TDM transmission processing latency less than 250 s (unstructured) * Packet to TDM transmission processing latency less than 250 s (structured, more than 16 channels in context) * Packet to TDM transmission processing latency less than 375 s (structured, 16 or less channels in context) End-to-end latency may be estimated as the transmit latency + packet network latency + receive latency. The transmit latency is the sum of the transmit processing and the number of frames per packet x 125 s. The receive latency is the sum of the receive processing and the delay through the jitter buffer which is programmed to compensate for packet network PDV. The ZL5011x is capable of creating an extremely low latency connection, with end to end delays of less than 0.5 ms, depending on user configuration. 8.2 Loopback Modes The ZL5011x devices support loopback of the TDM circuits and the circuit emulation packets. TDM loopback is achieved by first packetizing the TDM circuit as normal via the TDM Interface and Payload Assembly blocks. The packetized data is then routed by the Task Manager back to the same TDM port via the TDM Formatter and TDM Interface. Loopback of the emulated services is achieved by redirecting classified packets from the Packet Receive blocks, back to the packet network. The Packet Transmit blocks are setup to strip the original header and add a new header directing the packets back to the source. 8.3 Host Packet Generation The control processor can generate packets directly, allowing it to use the network for out-of-band communications. This can be used for transmission of control data or network setup information, e.g., routing information. The host interface can also be used by a local resource for network transmission of processed data. The device supports dual address DMA transfers of packets to and from the CPU memory, using the host's own DMA controller. Table 22 illustrates the maximum bandwidths achievable by an external DMA master. DMA Path Packet Size Max Bandwidth Mbps1 ZL5011x to CPU only >1000 bytes 50 ZL5011x to CPU only 60 bytes 6.7 CPU to ZL5011x only >1000 bytes 60 CPU to ZL5011x only 60 bytes 43 Combined2 >1000 bytes 58 (29 each way) Combined2 60 bytes 11 (5.5 each way) Table 22 - DMA Maximum Bandwidths Note 1: Maximum bandwidths are the maximum the ZL5011x devices can transfer under host control, and assumes only minimal packet processing by the host. Note 2: Combined figures assume the same amount of data is to be transferred each way. 59 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 8.4 Data Sheet Loss of Service (LOS) During normal operation, a situation may arise where a Loss of Service occurs. This may be caused by a disruption in the transmission line due to engineering works or cable disconnection, for example. The locally detected LOS should be transferred across the emulated T1/E1 to the far end. The far end, in turn, should propagate AIS downstream. The handling of LOS over a CESoP connection is typically performed using (setting/clearing) the L bit in the CESoPSN or SAToP control word of the packet header. Refer to ZL5011x Design Manual section "3.1.1 Connection to LIU" for details on a variety of different ways that LOS may be handled in an application. 8.5 Power Up Sequence To power up the ZL5011x the following procedure must be used: * The I/O supply should lead the Core supply, or both can be brought up together * The I/O supply must never exceed the Core supply by more than 2.0VDC * The Core supply must never exceed the I/O supply by more than 0.5VDC Both the Core supply and the I/O supply must be brought up together * * The System Reset and, if used, the JTAG Reset must remain low until at least 100 s after the 100 MHz system clock has stabilised. Note that if JTAG Reset is not used it must be tied low This is illustrated in the diagram shown in Figure 22. I/O supply (3.3 V) VDD <0.5 VDC Core supply (1.8 V) t RST t > 100 s SCLK t 10 ns Figure 22 - Powering Up the ZL5011x 8.6 JTAG Interface and Board Level Test Features The JTAG interface is used to access the boundary scan logic for board level production testing. 60 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 8.7 Data Sheet External Component Requirements * Direct connection to PowerQUICCTM II (MPC8260) host processor and associated memory, but can support other processors with appropriate interface logic * TDM Framers and/or Line Interface Units * Ethernet PHY for each MAC port 8.8 Miscellaneous Features * System clock speed of 100 MHz * Host clock speed of up to 66 MHz * Debug option to freeze all internal state machines * JTAG (IEEE1149) Test Access Port * Fully compatible with MT90880/1/2/3 and ZL50110/11/12/14 Zarlink products 8.9 Test Modes Operation 8.9.1 Overview The ZL5011x family supports the following modes of operation. 8.9.1.1 System Normal Mode This mode is the device's normal operating mode. Boundary scan testing of the peripheral ring is accessible in this mode via the dedicated JTAG pins. The JTAG interface is compliant with the IEEE Std. 1149.1-2001; Test Access Port and Boundary Scan Architecture. Each variant has it's own dedicated.bsdl file which fully describes it's boundary scan architecture. 8.9.1.2 System Tri-State Mode All output and I/O output drivers are tri-stated allowing the device to be isolated when testing or debugging the development board. 8.9.2 Test Mode Control The System Test Mode is selected using the dedicated device input bus TEST_MODE[2:0] as follows in Table 23. System Test Mode test_mode[2:0] SYS_NORMAL_MODE 3'b000 SYS_TRI_STATE_MODE 3'b011 Table 23 - Test Mode Control 61 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 8.9.3 Data Sheet System Normal Mode Selected by TEST_MODE[2:0] = 3'b000. As the test_mode[2:0] inputs have internal pull-downs this is the default mode of operation if no external pull-up/downs are connected. The GPIO[15:0] bus is captured on the rising edge of the external reset to provide internal bootstrap options. After the internal reset has been de-asserted the GPIO pins may be configured by the ADM module as either inputs or outputs. 8.9.4 System Tri-state Mode Selected by TEST_MODE[2:0] = 3'b011. All device output and I/O output drivers are tri-stated. 9.0 DPLL Specification The ZL5011x family incorporates an internal DPLL that meets Telcordia GR-1244-CORE Stratum 4/4E requirements, assuming an appropriate clock oscillator is connected to the system clock pin. It will meet the jitter/wander tolerance, jitter/wander transfer, intrinsic jitter/wander, frequency accuracy, capture range, phase change slope, holdover frequency and MTIE requirements for these specifications. In structured mode with the ZL5011x device operating as a master the DPLL is used to provide clock and frame reference signals to the internal and external TDM infrastructure. In structured mode, with the ZL5011x device operating as a slave, the DPLL is not used. All TDM clock generation is performed externally and the input streams are synchronised to the system clock by the TDM interface. The DPLL is not required in unstructured mode, hence it is not available, because TDM clocks and frame signals are generated by internal DCO's assigned to each individual stream. 9.1 Modes of Operation It can be set into one of four operating modes: Locking mode, Holdover mode, Freerun mode and Powerdown mode. 9.1.1 Locking Mode (normal operation) The DPLL accepts a reference signal from either a primary or secondary source, providing redundancy in the event of a failure. These references should have the same nominal frequencies but do not need to be identical as long as their frequency offsets meet the appropriate Stratum requirements. Each source is selected from any one of the available TDM input stream clocks (up to 4 on the ZL50117/20 variants), or from the external TDM_CLKiP (primary) or TDM_CLKiS (secondary) input pins, as illustrated in Figure 16 - on page 52. It is possible to supply a range of input frequencies as the DPLL reference source, depicted in Table 24. The PRD register Value is the number (in hexadecimal) that must be programmed into the PRD register within the DPLL to obtain the divided down frequency at PLL_PRI or PLL_SEC. Frequency at PLL_PRI or PLL_SEC (MHz) Maximum Acceptable Input Wander tolerance (UI) (Note 2) Source Input Frequency (MHz) Tolerance (ppm) Divider Ratio PRD/SRD Register Value (Hex) (Note 1) 0.008 30 1 1 0.008 1 1.544 130 1 1 1.544 1023 2.048 50 1 1 2.048 1023 4.096 50 1 1 4.096 1023 8.192 50 1 1 8.192 1023 Table 24 - DPLL Input Reference Frequencies 62 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet Divider Ratio PRD/SRD Register Value (Hex) (Note 1) Frequency at PLL_PRI or PLL_SEC (MHz) Maximum Acceptable Input Wander tolerance (UI) (Note 2) 50 1 1 16.384 1023 6.312 30 1 1 6.312 1023 22.368 20 2796 AEC 0.008 1 (on 64k Hz) 34.368 20 537 219 0.064 1 (on 64 kHz) 44.736 (Note 3) 20 699 2BB 0.064 1 (on 64 kHz) Source Input Frequency (MHz) Tolerance (ppm) 16.384 Table 24 - DPLL Input Reference Frequencies Note 1: A PRD/SRD value of 0 will suppress the clock, and prevent it from reaching the DPLL. Note 2: UI means Unit Interval - in this case periods of the time signal. So 1UI on a 64 kHz signal means 15.625 s, the period of the reference frequency. Similarly 1023UI on a 4.096 MHz signal means 250 s. Note 3: This input frequency is supported with the use of an external divide by 2. The maximum lock-in range can be programmed up to 372 ppm regardless of the input frequency. The DPLL will fail to lock if the source input frequency is absent, if it is not of approximately the correct frequency or if it is too jittery. See Section 9.7 for further details. The Application Program Interface (API) software that accompanies the ZL5011x family can be used to automatically set up the DPLL for the appropriate standard requirement. The DPLL lock-in range can be programmed using the Lock Range register (see ZL50115/16/17/18/19/20 Programmers Model document) in order to extend or reduce the capture envelope. The DPLL provides bit-error-free reference switching, meeting the specification limits in the Telcordia GR-1244-CORE standard. If Stratum 4/4E accuracy is not required, it is possible to use a more relaxed system clock tolerance. The DPLL output consists of three signals; a common clock (comclk), a double-rate common clock (comclkx2) and a frame reference (8 kHz). These are used to time the internal TDM Interface, and hence the corresponding TDM infrastructure attached to the interface. The output clock options are either 2.048 Mbps (comclkx2 at 4.096 Mbps) or 8.192 Mbps (comclkx2 at 16.384 Mbps), determined by setup in the DPLL control register. The frame pulse is programmable for polarity and width. 9.1.2 Holdover Mode In the event of a reference failure resulting in an absence of both the primary and secondary source, the DPLL automatically reverts to Holdover mode. The last valid frequency value recorded before failure can be maintained within the Stratum 3 limits of 0.05 ppm. The hold value is wholly dependent on the drift and temperature performance of the system clock. For example, a 32 ppm oscillator may have a temperature coefficient of 0.1 ppm/C. Thus a 10C ambient change since the DPLL was last in the Locking mode will change the holdover frequency by an additional 1 ppm, which is much greater than the 0.05 ppm Stratum 3 specification. If the strict target of Stratum 3 holdover accuracy is not required, a less restrictive oscillator can be used for the system clock. Holdover mode is typically used for a short period of time until network synchronisation is re-established. 9.1.3 Freerun Mode In freerun mode the DPLL is programmed with a centre frequency, and can output that frequency within the Stratum 3 limits of 4.6 ppm. To achieve this the 100 MHz system clock must have an absolute frequency accuracy of 4.6 ppm. The centre frequency is programmed as a fraction of the system clock frequency. 63 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 9.1.4 Data Sheet Powerdown Mode It is possible to "power down" the DPLL when it is not in use. For example, an unstructured TDM system, or use of an external DPLL would mean the internal DPLL could be switched off, saving power. The internal registers can still be accessed while the DPLL is powered down. 9.2 Reference Monitor Circuit There are two identical reference monitor circuits, one for the primary and one for the secondary source. Each circuit will continually monitor its reference, and report the references validity. The validity criteria depends on the frequency programmed for the reference. A reference must meet all the following criteria to maintain validity: * The "period in specified range" check is performed regardless of the programmed frequency. Each period must be within a range, which is programmable for the application. Refer to the ZL50115/16/17/18/19/20 Programmers Model for details. * If the programmed frequency is 1.544 MHz or 2.048 MHz, the "n periods in specified range" check will be performed. The time taken for n cycles must be within a programmed range, typically with n at 64, the time taken for consecutive cycles must be between 62 and 66 periods of the programmed frequency. The fail flags are independent of the preferred option for primary or secondary operation, will be asserted in the event of an invalid signal regardless of mode. 9.3 Locking Mode Reference Switching When the reference source the DPLL is currently locking to becomes invalid, the DPLL's response depends on which one of the failure detect modes has been chosen: autodetect, forced primary, or forced secondary. One of these failure detect modes must be chosen via the FDM1:0 bits of the DOM register. After a device reset via the SYSTEM_RESET pin, the autodetect mode is selected. In autodetect mode (automatic reference switching) if both references are valid the DPLL will synchronise to the preferred reference. If the preferred reference becomes unreliable, the DPLL continues driving its output clock in a stable holdover state until it makes a switch to the backup reference. If the preferred reference recovers, the DPLL makes a switch back to the preferred reference. If necessary, the switch back can be prevented by changing the preferred reference using the REFSEL bit in the DOM register, after the switch to the backup reference has occurred. If both references are unreliable, the DPLL will drive its output clock using the stable holdover values until one of the references becomes valid. In forced primary mode, the DPLL will synchronise to the primary reference only. The DPLL will not switch to the secondary reference under any circumstances including the loss of the primary reference. In this condition, the DPLL remains in holdover mode until the primary reference recovers. Similarly in forced secondary mode, the DPLL will synchronise to the secondary reference only, and will not switch to the primary reference. Again, a failure of the secondary reference will cause the DPLL to enter holdover mode, until such time as the secondary reference recovers. The choice of preferred reference has no effect in these modes. When a conventional PLL is locked to its reference, there is no phase difference between the input reference and the PLL output. For the DPLL, the input references can have any phase relationship between them. During a reference switch, if the DPLL output follows the phase of the new reference, a large phase jump could occur. The phase jump would be transferred to the TDM outputs. The DPLL's MTIE (Maximum Time Interval Error) feature preserves the continuity of the DPLL output so that it appears no reference switch had occurred. The MTIE circuit is not perfect however, and a small Time Interval Error is still incurred per reference switch. To align the DPLL output clock to the nearest edge of the selected input reference, the MTIE reset bit (MRST bit in the DOM register) can be used. Unlike some designs, switching between references which are at different nominal frequencies do not require intervention such as a system reset. 64 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 9.4 Data Sheet Locking Range The locking range is the input frequency range over which the DPLL must be able to pull into synchronization and to maintain the synchronization. The locking range is programmable up to 372 ppm. Note that the locking range relates to the system clock frequency. If the external oscillator has a tolerance of -100 ppm, and the locking range is programmed to 200 ppm, the actual locking range is the programmed value shifted by the system clock tolerance to become -300 ppm to +100 ppm. 9.5 Locking Time The Locking Time is the time it takes the synchroniser to phase lock to the input signal. Phase lock occurs when the input and output signals are not changing in phase with respect to each other (not including jitter). Locking time is very difficult to determine because it is affected by many factors including: * initial input to output phase difference * initial input to output frequency difference * DPLL Loop Filter * DPLL Limiter (phase slope) Although a short phase lock time is desirable, it is not always achievable due to other synchroniser requirements. For instance, better jitter transfer performance is obtained with a lower frequency loop filter which increases locking time; and a better (smaller) phase slope performance will increase locking time. Additionally, the locking time is dependent on the p_shift value. The DPLL Loop Filter and Limiter have been optimised to meet the Telcordia GR-1244-CORE jitter transfer and phase alignment speed requirements. The phase lock time is guaranteed to be no greater than 30 seconds when using the recommended Stratum 3 and Stratum 4/4E register settings. 9.6 Lock Status The DPLL has a Lock Status Indicator and a corresponding Lock Change Interrupt. The response of the Lock Status Indicator is a function of the programmed Lock Detect Interval (LDI) and Lock Detect Threshold (LDT) values in the dpll_ldetect register. The LDT register can be programmed to set the jitter tolerance level of the Lock Status Indicator. To determine if the DPLL has achieved lock the Lock Status Indicator must be high for a period of at least 30 seconds. When the DPLL loses lock the Lock Status Indicator will go low after LDI x 125 s. 9.7 Jitter The DPLL is designed to withstand, and improve inherent jitter in the TDM clock domain. 9.7.1 Acceptance of Input Wander For T1(1.544 MHz), E1(2.048 MHz) and J2(6.312 MHz) input frequencies, the DPLL will accept a wander of up to 1023UIpp at 0.1 Hz to conform with the relevant specifications. For the 8 kHz (frame rate) and 64 kHz (the divided down output for T3/E3) input frequencies, the wander acceptance is limited to 1 UI (0.1 Hz). This principle is illustrated in Table 24. 65 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 9.7.2 Data Sheet Intrinsic Jitter Intrinsic jitter is the jitter produced by a synchronizer and measured at its output. It is measured by applying a jitter free reference signal to the input of the device, and measuring its output jitter. Intrinsic jitter may also be measured when the device is in a non synchronizing mode such as free running or holdover, by measuring the output jitter of the device. Intrinsic jitter is usually measured with various band-limiting filters, depending on the applicable standards. The intrinsic jitter in the DPLL is reduced to less than 1 ns p-p1 by an internal Tapped Delay Line (TDL). 9.7.3 Jitter Tolerance Jitter tolerance is a measure of the ability of a PLL to operate properly without cycle slips (i.e., remain in lock and/or regain lock in the presence of large jitter magnitudes at various jitter frequencies) when jitter is applied to its reference. The applied jitter magnitude and the jitter frequency depends on the applicable standards. The DPLL's jitter tolerance can be programmed to meet Telcordia GR-1244-CORE DS1 reference input jitter tolerance requirements. 9.7.4 Jitter Transfer Jitter transfer or jitter attenuation refers to the magnitude of jitter at the output of a device for a given amount of jitter at the input of the device. Input jitter is applied at various amplitudes and frequencies, and output jitter is measured with various filters depending on the applicable standards. Since intrinsic jitter is always present, jitter attenuation will appear to be lower for small input jitter signals than larger ones. Consequently, accurate jitter transfer function measurements are usually made with large input jitter signals (e.g., 75% of the specified maximum jitter tolerance). The internal DPLL is a first order type 2 component, so a frequency offset doesn't result in a phase offset. Stratum 3 requires a -3 dB frequency of less than 3 Hz. The nature of the filter results in some peaking, resulting in a -3 dB frequency of 1.9 Hz and a 0.08 dB peak with a system clock frequency of 100 MHz assuming a p_shift value of 2. The transfer function is illustrated in Figure 23 and in more detail in Figure 24. Increasing the p_shift value increases the speed the DPLL will lock to the required frequency and reduces the peak, but also reduces the tolerance to jitter - so the p_shift value must be programmed correctly to meet Stratum 3 or Stratum 4/4E jitter transfer characteristics. This is done automatically in the API. 9.8 Maximum Time Interval Error (MTIE) In order to meet several standards requirements, the phase shift of the DPLL output must be controlled. A potential phase shift occurs every time the DPLL is re-arranged by changing reference source signal, or the mode. In order to meet the requirements of Stratum 3, the DPLL will shift phase by no more than 20 ns per re-arrangement. Additionally the speed at which the change occurs is also critical. A large step change in output frequency is undesirable. The rate of change is programmable using the skew register, up to a maximum of 15.4 ns / 125 s (124 ppm). 1. There are 2 exceptions to this. a) When reference is 8 kHz, and reference frequency offset relative to the master is small, jitter up to 1 master clock period is possible, i.e. 10 ns p-p. b) In holdover mode, if a huge amount of jitter had been present prior to entering holdover, then an additional 2 ns p-p is possible. 66 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Figure 23 - Jitter Transfer Function Figure 24 - Jitter Transfer Function - Detail 67 Zarlink Semiconductor Inc. Data Sheet ZL50115/16/17/18/19/20 10.0 Data Sheet Memory Map and Register Definitions All memory map and register definitions are included in the ZL50115/16/17/18/19/20 Programmers Model document. 11.0 DC Characteristics Absolute Maximum Ratings* Parameter Symbol Min. Max. Units VDD_IO -0.5 5.0 V Core Supply Voltage VDD_CORE -0.5 2.5 V PLL Supply Voltage VDD_PLL -0.5 2.5 V VI -0.5 VDD + 0.5 V Input Voltage (5 V tolerant inputs) VI_5V -0.5 7.0 V Continuous current at digital inputs IIN - 10 mA Continuous current at digital outputs IO - 15 mA Package power dissipation PD - 2.38 W Storage Temperature TS -55 +125 C I/O Supply Voltage Input Voltage * Exceeding these figures may cause permanent damage. Functional operation under these conditions is not guaranteed. Voltage measurements are with respect to ground (VSS) unless otherwise stated. * The core and PLL supply voltages must never be allowed to exceed the I/O supply voltage by more than 0.5 V during power-up. Failure to observe this rule could lead to a high-current latch-up state, possibly leading to chip failure, if sufficient cross-supply current is available. To be safe ensure the I/O supply voltage supply always rises earlier than the core and PLL supply voltages. Recommended Operating Conditions Characteristics Symbol Min. Typ. Max. Units TOP -40 25 +85 C TJ -40 - 125 C VDD_IO 3.0 3.3 3.6 V Positive Supply Voltage, Core VDD_CORE 1.65 1.8 1.95 V Positive Supply Voltage, Core VDD_PLL 1.65 1.8 1.95 V Input Voltage Low - all inputs VIL - - 0.8 V Input Voltage High VIH 2.0 - VDD_IO V VIH_5V 2.0 - 5.5 V Operating Temperature Junction temperature Positive Supply Voltage, I/O Input Voltage High, 5 V tolerant inputs Test Condition Typical figures are at 25C and are for design aid only, they are not guaranteed and not subject to production testing. Voltage measurements are with respect to ground (VSS) unless otherwise stated. 68 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet DC Electrical Characteristics - Typical characteristics are at 1.8 V core, 3.3 V I/O, 25C and typical processing. The min. and max. values are defined over all process conditions, from -40 to 125C junction temperature, core voltage 1.65 to 1.95 V and I/O voltage 3.0 and 3.6 V unless otherwise stated. Characteristics Symbol Min. Typ. Max. Units. Test Condition Input Leakage ILEIP 1 A No pull up/down VDD_IO = 3.6 V Output (High impedance) Leakage ILEOP 2 A No pull up/down VDD_IO = 3.6 V Input Capacitance CIP 1 pF Output Capacitance COP 4 pF Pullup Current IPU -27 A Input at 0 V IPU_5V -110 A Input at 0 V IPD 27 A Input at VDD_IO IPD_5V 110 A Input at VDD_IO Note 1,2 Pullup Current, 5 V tolerant inputs Pulldown Current Pulldown Current, 5 V tolerant inputs Core 1.8 V supply current IDD_CORE 950 mA PLL 1.8 V supply current IDD_PLL 1.30 mA I/O 3.3 V supply current IDD_IO 120 mA Note 1,2 Note 1: The IO and Core supply current worst case figures apply to different scenarios and can not simply be summed for a total figure. For a clearer indication of power consumption, please refer to Section 13.0. Note 2: Worst case assumes the maximum number of active contexts and channels. Figures are for the ZL50120. For an indication of typical power consumption, please refer to Section 13.0. Input Levels Characteristics Symbol Min. Typ. Max. Units 0.8 V Input Low Voltage VIL Input High Voltage VIH Positive Schmitt Threshold VT+ 1.6 V Negative Schmitt Threshold VT- 1.2 V 2.0 Test Condition V Output Levels Characteristics Symbol Output Low Voltage VOL Output High Voltage VOH Min. Typ. Max. Units Test Condition 0.4 V IOL = 6 mA. IOL = 12 mA for packet interface (m*) pins and GPIO pins. IOL = 24 mA for LED pins. V IOH = 6 mA. IOH = 12 mA for packet interface (m*) pins and GPIO pins. IOH = 24 mA for LED pins. 2.4 69 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 12.0 AC Characteristics 12.1 TDM Interface Timing - ST-BUS Data Sheet The TDM Bus either operates in Slave mode, where the TDM clocks for each stream are provided by the device sourcing the data, or Master mode, where the TDM clocks are generated from the ZL5011x. 12.1.1 ST-BUS Slave Clock Mode TDM ST-BUS Slave Timing Specification Data Format ST-BUS 8.192 Mbps mode ST-BUS 2.048 Mbps mode All Modes Parameter Symbol Min. Typ. Max. Units Notes TDM_CLKi Period tC16IP 54 60 66 ns TDM_CLKi High tC16IH 27 - 33 ns TDM_CLKi Low tC16IL 27 - 33 ns TDM_CLKi Period tC4IP - 244.1 - ns TDM_CLKi High tC4IH 110 - 134 ns TDM_CLKi Low tC4IL 110 - 134 ns TDM_F0i Width 8.192 Mbps 2.048 Mbps tFOIW 50 200 - 300 TDM_F0i Setup Time tFOIS 5 - - ns With respect to TDM_CLKi falling edge TDM_F0i Hold Time tFOIH 5 - - ns With respect to TDM_CLKi falling edge TDM_STo Delay tSTOD 1 - 20 ns With respect to TDM_CLKi Load CL = 50 pF TDM_STi Setup Time tSTIS 5 - - ns With respect to TDM_CLKi TDM_STi Hold Time tSTIH 5 - - ns With respect to TDM_CLKi ns 70 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet In synchronous mode the clock must be within the locking range of the DPLL to function correctly ( 245 ppm). In asynchronous mode, the clock may be any frequency. Channel 127 bit 1 Channel 127 bit 0 Channel 0 bit 7 Channel 0 bit 6 tC16IP TDM_CKLI tFOIH tFOIS TDM_F0i tSTIH tSTIH tSTIS tSTIH tSTIS tSTIS TDM_STi Ch0 bit7 tSTOD Channel 127 bit 1 TDM_STo tSTOD Channel 127 bit 0 tSTOD Channel 0 bit 7 Figure 25 - TDM ST-BUS Slave Mode Timing at 8.192 Mbps Channel 31 Bit 0 Channel 0 Bit 7 Channel 0 Bit 6 tC2IP TDM_CLKI (2.048 MHz) tC4IP TDM_CLKI (4.096 MHz) tFOIH tFOIS tFOIW TDM_F0i tSTIH tSTIS TDM_STi tSTOD tSTOD TDM_STo Ch 31 Bit 0 Ch 0 Bit 7 Ch 0 Bit 6 Figure 26 - TDM ST-BUS Slave Mode Timing at 2.048 Mbps 71 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 12.1.2 Data Sheet ST-BUS Master Clock Mode Data Format ST-BUS 8.192 Mbps mode ST-BUS 2.048 Mbps mode All Modes Parameter Symbol Min. Typ. Max. Units Notes TDM_CLKo Period tC16OP 54.0 61.0 68.0 ns TDM_CLKo High tC16OH 23.0 - 37.0 ns TDM_CLKo Low tC16OL 23.0 - 37.0 ns TDM_CLKo Period tC4OP 237.0 244.1 251.0 ns TDM_CLKo High tC4OH 115.0 - 129.0 ns TDM_CLKo Low tC4OL 115.0 - 129.0 ns TDM_F0o Delay tFOD - - 25 ns With respect to TDM_CLKo falling edge TDM_STo Delay Active-Active tSTOD - - 5 ns With respect to TDM_CLKo falling edge TDM_STo Delay Active to HiZ and HiZ to Active tDZ, tZD - - 33 ns With respect to TDM_CLKo falling edge TDM_STi Setup Time tSTIS 5 - - ns With respect to TDM_CLKo TDM_STi Hold Time tSTIH 5 - - ns With respect to TDM_CLKo Table 25 - TDM ST-BUS Master Timing Specification Channel 127 Bit 0 Channel 0 Bit 7 Channel 0 Bit 6 tC16OP TDM_CLKO tFOD tFOD TDM_F0o tSTIH tSTIH tSTIS TDM_STi tSTIS B0 B7 tSTOD TDM_STo Ch 127 Bit 0 B6 tSTOD Ch 0 Bit 7 Figure 27 - TDM Bus Master Mode Timing at 8.192 Mbps 72 Zarlink Semiconductor Inc. Ch 0 Bit 6 ZL50115/16/17/18/19/20 Channel 31 Bit 0 Data Sheet Channel 0 Bit 7 Channel 0 Bit 6 tC2OP TDM_CLKO (2.048 MHz) tC4OP TDM_CLKO (4.096 MHz) tFOD tFOD TDM_F0o tSTIH tSTIS TDM_STi tSTOD TDM_STo Ch 31 Bit 0 tSTOD Ch 0 Bit 7 Ch 0 Bit 6 Figure 28 - TDM Bus Master Mode Timing at 2.048 Mbps 12.2 TDM Interface Timing - H.110 Mode These parameters are based on the H.110 Specification from the Enterprise Computer Telephony Forum (ECTF) 1997. Parameter Symbol Min. Typ. Max. Units TDM_C8 Period tC8P 122.066- 122 122.074+ ns TDM_C8 High tC8H 63- - 69+ ns TDM_C8 Low tC8L 63- - 69+ ns TDM_D Output Delay tDOD 0 - 11 ns Load - 12 pF TDM_D Output to HiZ tDOZ - - 33 ns Load - 12 pF Note 3 TDM_D HiZ to Output tZDO 0 - 11 ns Load - 12 pF Note 3 TDM_D Input Delay to Valid tDV 0 - 83 ns Note 4 TDM_D Input Delay to Invalid tDIV 102 - 112 ns Note 4 TDM_FRAME width tFP 90 122 180 ns Note 5 TDM_FRAME setup tFS 45 - 90 ns TDM_FRAME hold tFH 45 - 90 ns F 0 - 10 ns Phase Correction Notes Note 1 Note 2 Note 6 Table 26 - TDM H.110 Timing Specification Note Note Note Note Note 1: 2: 3: 4: 5: Note 6: TDM_C8 and TDM_FRAME signals are required to meet the same timing standards and so are not defined independently. TDM_C8 corresponds to pin TDM_CLKi. tDOZ and t ZDO apply at every time-slot boundary. Refer to H.110 Standard from Enterprise Computer Telephony Forum (ECTF) for the source of these numbers. The TDM_FRAME signal is centred on the rising edge of TDM_C8. All timing measurements are based on this rising edge point; TDM_FRAME corresponds to pin TDM_F0i. Phase correction ( ) results from DPLL timing corrections. 73 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Ts 127 Bit 8 Data Sheet Ts 0 Bit 1 tC8H Ts 0 Bit 2 tC8L tC8P TDM_C8 tFS tFH tFP TDM_FRAME tDIV tDV TDM_D Input tZDO tDOZ TDM_D Output tDOD Ts 127 Bit 8 Ts 0 Bit 1 Ts 0 Bit 2 Figure 29 - H.110 Timing Diagram 12.3 TDM Interface Timing - H-MVIP These parameters are based on the Multi-Vendor Integration Protocol (MVIP) specification for an H-MVIP Bus, Release 1.1a (1997). Positive transitions of TDM_C2 are synchronous with the falling edges of TDM_C4 and TDM_C16. The signals TDM_C2, TDM_C4 and TDM_C16 correspond with pins TDM_CLKi. The signals TDM_F0 correspond with pins TDM_F0i. The signals TDM_HDS correspond with pins TDM_STi and TDM_STo. Parameter Symbol Min. Typ. Max. Units TDM_C2 Period tC2P 487.8 488.3 488.8 ns TDM_C2 High tC2H 220 - 268 ns TDM_C2 Low tC2L 220 - 268 ns TDM_C4 Period tC4P 243.9 244.1 244.4 ns TDM_C4 High tC4H 110 - 134 ns TDM_C4 Low tC4L 110 - 134 ns TDM_C16 Period tC16P 60.9 61.0 61.1 ns TDM_C16 High tC16H 30 - 31 ns TDM_C16 Low tC16L 30 - 31 ns TDM_HDS Output Delay tPD - - 30 ns At 8.192 Mbps TDM_HDS Output Delay tPD - - 100 ns At 2.048 Mbps TDM_HDS Output to HiZ tHZD - - 30 ns TDM_HDS Input Setup tS 30 - 0 ns TDM_HDS Input Hold tH 30 - 0 ns tFW 200 244 300 ns TDM_F0 width Table 27 - TDM H-MVIP Timing Specification 74 Zarlink Semiconductor Inc. Notes ZL50115/16/17/18/19/20 Parameter Data Sheet Symbol Min. Typ. Max. Units TDM_F0 setup tFS 50 - 150 ns TDM_F0 hold tFH 50 - 150 ns Table 27 - TDM H-MVIP Timing Specification (continued) Ts 127 Bit 7 Ts 0 Bit 0 tC16P tC16L Ts 0 Bit 1 tC16H TDM_C16 tFS tFH tFW TDM_F0 tH tS TDM_HDS Input tPD tHZD TDM_HDS Output Ch 127 Bit 7 Ch 0 Bit 0 Figure 30 - TDM - H-MVIP Timing Diagram for 16 MHz Clock (8.192 Mbps) 75 Zarlink Semiconductor Inc. Notes ZL50115/16/17/18/19/20 12.4 Data Sheet TDM LIU Interface Timing The TDM Interface can be used to directly drive into a Line Interface Unit (LIU). The interface can work in this mode with E1, DS1, J2, E3 and DS3. The frame pulse is not present, just data and clock is transmitted and received. Table 28 shows timing for DS3, which would be the most stringent requirement. Parameter Symbol Min. Typ. Max. Units 22.353 ns TDM_TXCLK Period tCTP TDM_TXCLK High tCTH 6.7 ns TDM_TXCLK Low tCTL 6.7 ns TDM_RXCLK Period tCRP TDM_RXCLK High tCRH 9.0 ns TDM_RXCLK Low tCRL 9.0 ns TDM_TXDATA Output Delay tPD 3 TDM_RXDATA Input Setup tS 6 ns TDM_RXDATA Input Hold tH 3 ns 22.353 - ns 10 ns Table 28 - TDM - LIU Structured Transmission/Reception tCTP tCTH tCTL TDM_TXCLK tPD TDM_TXDATA tCRH tCRP tCRL TDM_RXCLK tS tH TDM_RXDATA Figure 31 - TDM-LIU Structured Transmission/Reception 76 Zarlink Semiconductor Inc. Notes DS3 clock DS3 clock ZL50115/16/17/18/19/20 12.5 Data Sheet PAC Interface Timing Parameter Symbol Min. Typ. Max. Units TDM_CLKiP High / Low Pulsewidth tCPP 10 - - ns TDM_CLKiS High / Low Pulsewidth tCSP 10 - - ns Notes Table 29 - PAC Timing Specification 12.6 Packet Interface Timing Data for the MII/GMII/TBI packet switching is based on Specification IEEE Std. 802.3 - 2000. 12.6.1 MII Transmit Timing 100 Mbps Parameter Symbol Units Min. Typ. Max. Notes TXCLK period tCC - 40 - ns TXCLK high time tCHI 14 - 26 ns TXCLK low time tCLO 14 - 26 ns TXCLK rise time tCR - - 5 ns TXCLK fall time tCF - - 5 ns TXCLK rise to TXD[3:0] active delay (TXCLK rising edge) tDV 1 - 25 ns Load = 25 pF TXCLK to TXEN active delay (TXCLK rising edge) tEV 1 - 25 ns Load = 25 pF TXCLK to TXER active delay (TXCLK rising edge) tER 1 - 25 ns Load = 25 pF Table 30 - MII Transmit Timing - 100 Mbps tCL tCC tCH TXCLK tEV tEV TXEN tDV TXD[3:0] tER tER TXER Figure 32 - MII Transmit Timing Diagram 77 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 12.6.2 Data Sheet MII Receive Timing 100 Mbps Parameter Symbol Units Min. Typ. Max. RXCLK period tCC - 40 - ns RXCLK high wide time tCH 14 20 26 ns RXCLK low wide time tCL 14 20 26 ns RXCLK rise time tCR - - 5 ns RXCLK fall time tCF - - 5 ns RXD[3:0] setup time (RXCLK rising edge) tDS 10 - - ns RXD[3:0] hold time (RXCLK rising edge) tDH 5 - - ns RXDV input setup time (RXCLK rising edge) tDVS 10 - - ns RXDV input hold time (RXCLK rising edge) tDVH 5 - - ns RXER input setup time (RXCL edge) tERS 10 - - ns RXER input hold time (RXCLK rising edge) tERH 5 - - ns Table 31 - MII Receive Timing - 100 Mbps tCC tCLO tCHI RXCLK tDVS tDVH RXDV tDH tDS RXD[3:0] tERH tERS RXER Figure 33 - MII Receive Timing Diagram 78 Zarlink Semiconductor Inc. Notes ZL50115/16/17/18/19/20 12.6.3 Data Sheet GMII Transmit Timing 1000 Mbps Parameter Symbol Units Min. Typ. Max. Notes GTXCLK period tGC 7.5 - 8.5 ns GTXCLK high time tGCH 2.5 - - ns GTXCLK low time tGCL 2.5 - - ns GTXCLK rise time tGCR - - 1 ns GTXCLK fall time tGCF - - 1 ns GTXCLK rise to TXD[7:0] active delay tDV 0.5 - 5 ns Load = 25 pF GTXCLK rise to TXEN active delay tEV 0.5 - 5 ns Load = 25 pF GTXCLK rise to TXER active delay tER 0.5 - 5 ns Load = 25 pF Table 32 - GMII Transmit Timing - 1000 Mbps tCC tCL tCH GTXCLK tEV tEV TXEN tDV TXD[3:0] tER tER TXER Figure 34 - GMII Transmit Timing Diagram 79 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 12.6.4 Data Sheet GMII Receive Timing 1000 Mbps Parameter Symbol Units Min. Typ. Max. RXCLK period tCC 7.5 - 8.5 ns RXCLK high wide time tCH 2.5 - - ns RXCLK low wide time tCL 2.5 - - ns RXCLK rise time tCR - - 1 ns RXCLK fall time tCF - - 1 ns RXD[7:0] setup time (RXCLK rising edge) tDS 2 - - ns RXD[7:0] hold time (RXCLK rising edge) tDH 1 - - ns RXDV setup time (RXCLK rising edge) tDVS 2 - - ns RXDV hold time (RXCLK rising edge) tDVH 1 - - ns RXER setup time (RXCLK rising edge) tERS 2 - - ns RXER hold time (RXCLK rising edge) tERH 1 - - ns Table 33 - GMII Receive Timing - 1000 Mbps tCC tCLO tCHI RXCLK tDVS tDVH RXDV tDH tDS RXD[7:0] tERH tERS RXER Figure 35 - GMII Receive Timing Diagram 80 Zarlink Semiconductor Inc. Notes ZL50115/16/17/18/19/20 12.6.5 Data Sheet TBI Interface Timing 1000 Mbps Parameter Symbol Units Min. Typ. Max. GTXCLK period tGC 7.5 - 8.5 ns GTXCLK high wide time tGH 2.5 - - ns GTXCLK low wide time tGL 2.5 - - ns TXD[9:0] Output Delay (GTXCLK rising edge) tDV 0.1 - 2.4 RCB0/RBC1 period tRC 15 16 17 ns RCB0/RBC1 high wide time tRH 5 - - ns RCB0/RBC1 low wide time tRL 5 - - ns Notes Load = 10 pF Note 1 RCB0/RBC1 rise time tRR - - 2 ns RCB0/RBC1 fall time tRF - - 2 ns RXD[9:0] setup time (RCB0 rising edge) tDS 2 - - ns RXD[9:0] hold time (RCB0 rising edge) tDH 1 - - ns REFCLK period tFC 7.5 - 8.5 ns REFCLK high wide time tFH 2.5 - - ns REFCLK low wide time tFL 2.5 - - ns Table 34 - TBI Timing - 1000 Mbps Note1: These measurements were obtained through simulation and lab measurement using a 10 pF load. See ZL5011x Design Manual section "7.1.3.1 TBI Interface Timing" for workaround when using the TBI interface. tGC GTXCLK TXD[9:0] /I/ tDV /S/ /D/ /D/ /D/ /D/ /D/ /D/ /D/ /D/ /D/ /D/ /D/ /D/ /D/ /D/ /D/ /T/ /R/ Signal_Detect Figure 36 - TBI Transmit Timing Diagram 81 Zarlink Semiconductor Inc. /I/ ZL50115/16/17/18/19/20 Data Sheet tRC RBC1 tRC RBC0 tDH /I/ RXD[9:0] /S/ /D/ /D/ /D/ tDS /D/ /D/ /D/ /D/ tDH /D/ tDS /D/ /D/ /D/ /D/ /T/ /R/ /I/ Signal_Detect Figure 37 - TBI Receive Timing Diagram 12.6.6 Management Interface Timing The management interface is common for all inputs and consists of a serial data I/O line and a clock line. Parameter M_MDC Clock Output period Symbol Min. Typ. Max. Units Notes tMP 1990 2000 2010 ns Note 1 M_MDC high tMHI 900 1000 1100 ns M_MDC low tMLO 900 1000 1100 ns M_MDC rise time tMR - - 5 ns M_MDC fall time tMF - - 5 ns M_MDIO setup time (MDC rising edge) tMS 10 - - ns Note 1 M_MDIO hold time (M_MDC rising edge) tMH 0 - - ns Note 1 M_MDIO Output Delay (M_MDC rising edge) tMD 1 - 300 ns Note 2 Table 35 - MAC Management Timing Specification Note 1: Refer to Clause 22 in IEEE802.3 (2000) Standard for input/output signal timing characteristics. Note 2: Refer to Clause 22C.4 in IEEE802.3 (2000) Standard for output load description of MDIO. tMHI tMLO M_MDC tMS tMH M_MDIO Figure 38 - Management Interface Timing for Ethernet Port - Read tMP Mn_MDC tMD Mn_MDIO Figure 39 - Management Interface Timing for Ethernet Port - Write 82 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 12.7 Data Sheet CPU Interface Timing Parameter Symbol Min. Typ. Max. 15.152 Units Notes ns CPU_CLK Period tCC CPU_CLK High Time tCCH 6 ns CPU_CLK Low Time tCCL 6 ns CPU_CLK Rise Time tCCR 4 ns CPU_CLK Fall Time tCCF 4 ns CPU_ADDR[23:2] Setup Time tCAS 4 ns CPU_ADDR[23:2] Hold Time tCAH 2 ns CPU_DATA[31:0] Setup Time tCDS 4 ns CPU_DATA[31:0] Hold Time tCDH 2 ns CPU_CS Setup Time tCSS 4 ns CPU_CS Hold Time tCSH 2 ns CPU_WE/CPU_OE Setup Time tCES 5 ns CPU_WE/CPU_OE Hold Time tCEH 2 ns CPU_TS_ALE Setup Time tCTS 4 ns CPU_TS_ALE Hold Time tCTH 2 ns CPU_SDACK1/CPU_SDACK2 Setup Time tCKS 2 ns CPU_SDACK1/CPU_SDACK2 Hold Time tCKH 2 ns Note 1 CPU_TA Output Valid Delay tCTV 2 11.3 ns Note 1, 2 CPU_DREQ0/CPU_DREQ1 Output Valid Delay tCWV 2 6 ns Note 1 CPU_IREQ0/CPU_IREQ1 Output Valid Delay tCRV 2 6 ns Note 1 CPU_DATA[31:0] Output Valid Delay tCDV 2 7 ns Note 1 CPU_CS to Output Data Valid tSDV 3.2 10.4 ns CPU_OE to Output Data Valid tODV 3.3 10.4 ns CPU_CLK(falling) to CPU_TA Valid tOTV 3.2 9.5 ns Table 36 - CPU Timing Specification Note 1: Note 2: Load = 50 pF maximum The maximum value of t CTV may cause setup violations if directly connected to the MPC8260. See Section 14.2 for details of how to accommodate this during board design. The actual point where read/write data is transferred occurs at the positive clock edge following the assertion of CPU_TA, not at the positive clock edge during the assertion of CPU_TA. The CPU_TA maximum assertion time is 4 s. 83 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet tCC 0 or more cycles CPU_CLK tCAH tCAS CPU_ADDR[23:2] tCSS tCSH CPU_CS tCES tCEH CPU_OE CPU_WE tCTS tCTH CPU_TS_ALE tODV tSDV tODV tSDV tCDV CPU_DATA[31:0] tOTV tCTV tCTV tOTV CPU_TA NOTE 1: CPU_DATA is valid when CPU_TA is asserted. CPU_DATA will remain valid while both CPU_CS and CPU_OE are asserted. CPU_TA will continue to be driven until CPU_CS is deasserted. CPU_CS and CPU_OE must BOTH be asserted to enable the CPU_DATA output. NOTE 2: CPU_TS_ALE is no more than one clock cycle width and it can be delayed by one clock cycle from CS assertion. NOTE 3: The CPU_TA maximum assertion time is 4 s. Figure 40 - CPU Read - MPC8260 tCC 0 or more cycles 0 or more cycles CPU_CLK tCAS tCAH CPU_ADDR[23:2] tCSS tCSH CPU_CS CPU_OE tCES tCEH CPU_WE tCTH tCTS CPU_TS_ALE tCDS tCDH CPU_DATA[31:0] tOTV tCTV tCTV tOTV CPU_TA NOTE 1: Following assertion of CPU_TA, CPU_CS may be deasserted. The MPC8260 will continue to assert CPU_CS until CPU_TA has been synchronized internally. CPU_TA will continue to be driven until CPU_CS is finally deasserted. During continued assertion of CPU_CS, CPU_WE and CPU_DATA may be removed. NOTE 2: CPU_TS_ALE is no more than one clock cycle width and it can be delayed by one clock cycle from CS assertion. NOTE 3: The CPU_TA maximum assertion time is 4 s. Figure 41 - CPU Write - MPC8260 84 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet tCC 0 or more cycles CPU_CLK tCWV tCWV CPU_DREQ1 tCKH tCKS CPU_SDACK2 tCSS tCSH CPU_CS tCES tCEH CPU_OE CPU_WE tCTH tCTS CPU_TS_ALE tODV tSDV tODV tSDV tCDV CPU_DATA[31:0] tCTV tOTV tCTV tOTV CPU_TA Note 1: CPU_SDACK2 must be asserted during the cycle shown. It may then be deasserted at any time. CPU_DATA is valid when CPU_TA is asserted (always timed as shown). CPU_DATA will remain valid while CPU_CS and CPU_OE are asserted. CPU_TA will continue to be driven until CPU_CS is deasserted. CPU_CS and CPU_OE must BOTH be asserted to enable the CPU_DATA output. Note 2: CPU_DREQ1 shown with positive polarity CPU_SDACK2 shown with negative polarity Figure 42 - CPU DMA Read - MPC8260 tCC 0 or more cycles CPU_CLK tCWV tCWV CPU_DREQ0 tCKH tCKS CPU_SDACK1 tCSS tCSH CPU_CS CPU_OE tCES tCEH CPU_WE tCTH tCTS CPU_TS_ALE tCDS tCDH CPU_DATA[31:0] tOTV tCTV tCTV CPU_TA Note 1: CPU_SDACK1 must be asserted during the cycle shown. It may then be deasserted at any time. Following assertion of CPU_TA (always timed as shown), CPU_CS may be deasserted. The MPC8260 will continue to assert CPU_CS until CPU_TA has been synchronized internally. CPU_TA will continue to be driven until CPU_CS is finally deasserted. During continued assertion of CPU_CS, CPU_WE and CPU_DATA may be removed. Note 2: CPU_DREQ0 shown with positive polarity CPU_SDACK1 shown with negative polarity Figure 43 - CPU DMA Write - MPC8260 85 Zarlink Semiconductor Inc. tOTV ZL50115/16/17/18/19/20 12.8 Data Sheet System Function Port Parameter Symbol Min. Typ. Max. Units Notes SYSTEM_CLK Frequency CLKFR - 100 - MHz Note 1, Note 2 and Note 5 SYSTEM_CLK accuracy (synchronous master mode) CLKACS - - 30 ppm Note 3 SYSTEM_CLK accuracy (synchronous slave mode and asynchronous mode) CLKACA - - 200 ppm Note 4 Table 37 - System Clock Timing Note 1: The system clock frequency stability affects the holdover-operating mode of the DPLL. Holdover Mode is typically used for a short duration while network synchronisation is temporarily disrupted. Drift on the system clock directly affects the Holdover Mode accuracy. Note that the absolute system clock accuracy does not affect the Holdover accuracy, only the change in the system clock (SYSTEM_CLK) accuracy while in Holdover. For example, if the system clock oscillator has a temperature coefficient of 0.1 ppm/C, a 10C change in temperature while the DPLL is in will result in a frequency accuracy offset of 1 ppm. The intrinsic frequency accuracy of the DPLL Holdover Mode is 0.06 ppm, excluding the system clock drift. Note 2: The system clock frequency affects the operation of the DPLL in free-run mode. In this mode, the DPLL provides timing and synchronisation signals which are based on the frequency of the accuracy of the master clock (i.e., frequency of clock output equals 8.192 MHz SYSTEM_CLK accuracy 0.005 ppm). Note 3: The absolute SYSTEM_CLK accuracy must be controlled to 30 ppm in synchronous master mode to enable the internal DPLL to function correctly. Note 4: In asynchronous mode and in synchronous slave mode the DPLL is not used. Therefore the tolerance on SYSTEM_CLK may be relaxed slightly. Note 5: The quality of SYSTEM_CLK, or the oscillator that drives SYSTEM_CLK directly impacts the adaptive clock recovery performance. See Section 6.3. 86 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 12.9 Data Sheet JTAG Interface Timing Parameter Symbol Min. Typ. JTAG_CLK period tJCP 40 100 JTAG_CLK clock pulse width tLOW, tHIGH 20 - - ns JTAG_CLK rise and fall time tJRF 0 - 3 ns JTAG_TRST setup time tRSTSU 10 - - ns JTAG_TRST assert time tRST 10 - - ns Input data setup time tJSU 5 - - ns Note 2 Input Data hold time tJH 15 - - ns Note 2 JTAG_CLK to Output data valid tJDV 0 - 20 ns Note 3 JTAG_CLK to Output data high impedance tJZ 0 - 20 ns Note 3 JTAG_TMS, JTAG_TDI setup time tTPSU 5 - - ns JTAG_TMS, JTAG_TDI hold time tTPH 15 - - ns tTOPDV 0 - 15 ns tTPZ 0 - 15 ns JTAG_TDO delay JTAG_TDO delay to high impedance Max. Units Notes ns With respect to JTAG_CLK falling edge. Note 1 Table 38 - JTAG Interface Timing Note 1: JTAG_TRST is an asynchronous signal. The setup time is for test purposes only. Note 2: Non Test (other than JTAG_TDI and JTAG_TMS) signal input timing with respect to JTAG_CLK. Note 3: Non Test (other than JTAG_TDO) signal output with respect to JTAG_CLK. tLOW tHIGH tJCP JTAG_TCK tTPH tTPSU JTAG_TMS tTPSU JTAG_TDI Don't Care DC tTOPDV JTAG_TDO tTPH HiZ tTPZ HiZ Figure 44 - JTAG Signal Timing 87 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 tLOW Data Sheet tHIGH JTAG_TCK tRST tRSTSU JTAG_TRST Figure 45 - JTAG Clock and Reset Timing 13.0 Power Characteristics The following graph in Figure 46 illustrates typical power consumption figures for the ZL5011x family. Typical characteristics are at 1.8 V core, 3.3V I/O, 25C and typical processing. ZL50118/19/20 Power Consumption (Typical Conditions) 1.410 Power (W) 1.400 1.390 1.380 1.370 1.360 1.350 1 2 3 Number of Active E1 Unstructured Contexts Figure 46 - ZL50115/16/17/18/19/20 Power Consumption Plot 88 Zarlink Semiconductor Inc. 4 ZL50115/16/17/18/19/20 14.0 Data Sheet Design and Layout Guidelines This guide will provide information and guidance for PCB layouts when using the ZL5011x. Specific areas of guidance are: * High Speed Clock and Data, Outputs and Inputs * CPU_TA Output 14.1 High Speed Clock & Data Interfaces On the ZL5011x series of devices there are four high-speed data interfaces that need consideration when laying out a PCB to ensure correct termination of traces and the reduction of crosstalk noise. The interfaces being: * GMAC Interfaces * TDM Interface * CPU Interface It is recommended that the outputs are suitably terminated using a series termination through a resistor as close to the output pin as possible. The purpose of the series termination resistor is to reduce reflections on the line. The value of the series termination and the length of trace the output can drive will depend on the driver output impedance, the characteristic impedance of the PCB trace (recommend 50 ohm), the distributed trace capacitance and the load capacitance. As a general rule of thumb, if the trace length is less than 1/6th of the equivalent length of the rise and fall times, then a series termination may not be required. the equivalent length of rise time = rise time (ps) / delay (ps/mm) For example: Typical FR4 board delay = 6.8 ps/mm Typical rise/fall time for a ZL5011x output = 2.5 ns critical track length = (1/6) x (2500/6.8) = 61 mm Therefore tracks longer than 61 mm will require termination. As a signal travels along a trace it creates a magnetic field, which induces noise voltages in adjacent traces, this is crosstalk. If the crosstalk is of sufficiently strong amplitude, false data can be induced in the trace and therefore it should be minimized in the layout. The voltage that the external fields cause is proportional to the strength of the field and the length of the trace exposed to the field. Therefore to minimize the effect of crosstalk some basic guidelines should be followed. First, increase separation of sensitive signals, a rough rule of thumb is that doubling the separation reduces the coupling by a factor of four. Alternatively, shield the victim traces from the aggressor by either routing on another layer separated by a power plane (in a correctly decoupled design the power planes have the same AC potential) or by placing guard traces between the signals usually held ground potential. Particular effort should be made to minimize crosstalk from ZL5011x outputs and ensuring fast rise time to these inputs. 89 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 Data Sheet In Summary: * Place series termination resistors as close to the pins as possible * minimize output capacitance * Keep common interface traces close to the same length to avoid skew * Protect input clocks and signals from crosstalk 14.1.1 GMAC Interface - Special Considerations During Layout The GMII interface passes data to and from the ZL5011x with their related transmit and receive clocks. It is therefore recommended that the trace lengths for transmit related signals and their clock and the receive related signals and their clock are kept to the same length. By doing this the skew between individual signals and their related clock will be minimized. 14.1.2 TDM Interface - Special Considerations During Layout Although the data rate of this interface is low the outputs edge speeds share the characteristics of the higher data rate outputs and therefore must be treated with the same care extended to the other interfaces with particular reference to the lower stream numbers which support the higher data rates. The TDM interface has numerous clocking schemes and as a result of this the input clock traces to the ZL5011x devices should be treated with care. 14.1.3 Summary Particular effort should be made to minimize crosstalk from ZL5011x outputs and ensuring fast rise time to these inputs. In Summary: * Place series termination resistors as close to the pins as possible * minimize output capacitance * Keep common interface traces close to the same length to avoid skew * Protect input clocks and signals from crosstalk 90 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 14.2 Data Sheet CPU TA Output The CPU_TA output signal from the ZL5011x is a critical handshake signal to the CPU that ensures the correct completion of a bus transaction between the two devices. As the signal is critical, it is recommend that the circuit shown in Figure 46 is implemented in systems operating above 40 MHz bus frequency to ensure robust operation under all conditions. The following external logic is required to implement the circuit: * 74LCX74 dual D-type flip-flop (one section of two) * 74LCX08 quad AND gate (one section of four) * 74LCX125 quad tri-state buffer (one section of four) * 4K7 resistor x2 +3V3 +3V3 R1 4K7 R2 4K7 CPU_TA from ZL5011x CPU_TA to CPU D CPU_CLK to ZL5011x Q CPU_CS to ZL5011x Figure 47 - CPU_TA Board Circuit The function of the circuit is to extend the TA signal, to ensure the CPU correctly registers it. Resistor R2 must be fitted to ensure correct operation of the TA input to the processor. It is recommended that the logic is fitted close to the ZL5011x and that the clock to the 74LCX74 is derived from the same clock source as that input to the ZL5011x. 91 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 15.0 Reference Documents 15.1 External Standards/Specifications Data Sheet * IEEE Standard 1149.1-2001; Test Access Port and Boundary Scan Architecture * IEEE Standard 802.3-2000; Local and Metropolitan Networks CSMA/CD Access Method and Physical Layer * ECTF H.110 Revision 1.0; Hardware Compatibility Specification * H-MVIP (GO-MVIP) Standard Release 1.1a; Multi-Vendor Integration Protocol * MPC8260AEC/D Revision 0.7; Motorola MPC8260 Family Hardware Specification * RFC 768; UDP * RFC 791; IPv4 * RFC2460; IPv6 * RFC 1889; RTP * RFC 2661; L2TP * RFC 1213; MIB II * RFC 1757; Remote Network Monitoring MIB (for SMIv1) * RFC 2819; Remote Network Monitoring MIB (for SMIv2) * RFC 2863; Interfaces Group MIB * G.823; Control of Jitter/Wander with digital networks based on the 2.048 Mbps hierarchy * G.824; Control of Jitter/Wander with digital networks based on the 1.544 Mbps hierarchy * G.8261; Timing and Synchronization aspects in Packet Networks * ANSI T1.101 Stratum 3/4 * Telcordia GR-1244-CORE Stratum 3/4/4e * RFC5086; Structure-Aware Time Division Multiplexed (TDM) Circuit Emulation - Service over Packet Switched Network (CESoPSN) * RFC4553; Structure-Agnostic TDM over Packet (SAToP) * ITU-T Y.1413 TDM-MPLS Network Interworking 15.2 * Zarlink Standards MSAN-126 Revision B, Issue 4; ST-BUS Generic Device Specification 92 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 16.0 Data Sheet Glossary API Application Program Interface ATM Asynchronous Transfer Mode CDP Context Descriptor Protocol (the protocol used by Zarlink's MT9088x family of TDM-Packet devices) CESoP Circuit Emulation Services over Packet CESoPSN Circuit Emulation Services over Packet Switched Networks CONTEXT A programmed connection of a number of TDM timeslots assembled into a unique packet stream. CPU Central Processing Unit DMA Direct Memory Access DPLL Digital Phase Locked Loop DSP Digital Signal Processor GMII Gigabit Media Independent Interface H.100/H.110High capacity TDM backplane standards H-MVIP High-performance Multi-Vendor Integration Protocol (a TDM bus standard) IETF Internet Engineering Task Force IA Implementation Agreement IP Internet Protocol (version 4, RFC 791, version 6, RFC 2460) JTAG Joint Test Algorithms Group (generally used to refer to a standard way of providing a board-level test facility) L2TP Layer 2 Tunneling Protocol (RFC 2661) LAN Local Area Network LIU Line Interface Unit MAC Media Access Control MEF Metro Ethernet Forum MFA MPLS and Frame Relay Alliance MII Media Independent Interface MIB Management Information Base MPLS Multi Protocol Label Switching MTIE Maximum Time Interval Error MVIP Multi-Vendor Integration Protocol (a TDM bus standard) PDH Plesiochronous Digital Hierarchy PLL Phase Locked Loop PRS Primary Reference Source PRX Packet Receive PSTN Public Switched Telephone Circuit 93 Zarlink Semiconductor Inc. ZL50115/16/17/18/19/20 PTX Packet Transmit PWE3 Pseudo-Wire Emulation Edge to Edge (a working group of the IETF) QoS Quality of Service RTP Real Time Protocol (RFC 1889) PE Protocol Engine SAToP Structure-Agnostic TDM over Packet ST BUS Standard Telecom Bus, a standard interface for TDM data streams TDL Tapped Delay Line TDM Time Division Multiplexing UDP User Datagram Protocol (RFC 768) UI Unit Interval VLAN Virtual Local Area Network WFQ Weighted Fair Queuing 94 Zarlink Semiconductor Inc. Data Sheet For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. 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