MPXS4100A6T1 - Motorola / Freescale Semiconductor

1Motorola Sensor Device Data

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The Motorola MPXS4100A series Barometric Absolute Pressure (BAP) sensor for

engine control is designed to sense absolute air pressure.

Motorola’s BAP sensor integrates on–chip, bipolar op amp circuitry and thin film

resistor networks to provide a high output signal and temperature compensation. The

small form factor and high reliability of on–chip integration make the Motorola BAP

sensor a logical and economical choice for the automotive system designer.

Features

•1.8% Maximum Error Over 0° to 85°C

•Surface Mount Package

•Available Tape and Reeled or in Sleeves

•Ideally Suited for Direct Microprocessor Interfacing

•Patented Silicon Shear Stress Strain Gauge

•Temperature Compensated Over –40 to +125°C

•Ideal for Non–automotive applications

•Also Available in Unibody Package (see MPX4100A/D data sheet)

Application

•Barometric Absolute Pressure for Engine Control

Figure 1. Fully Integrated Pressure Sensor Schematic

X–ducer

SENSING

ELEMENT

4Vout

GND

THIN FILM

TEMPERATURE

COMPENSATION

AND

GAIN STAGE #1

GAIN STAGE #2

AND

GROUND

REFERENCE

SHIFT CIRCUITRY

PINS 1 AND 5 THROUGH 8 ARE NO CONNECTS

MAXIMUM RATINGS(1)

Rating Symbol Value Unit

Overpressure(2) Pmax 400 kPa

Burst Pressure(2) Pburst 1000 kPa

Storage Temperature Tstg –40 to +125 °C

Operating Temperature TA–40 to +125 °C

1. TC = 25°C unless otherwise noted.

2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Senseon and X–ducer are trademarks of Motorola, Inc.

Order this document

by MPXS4100A/D

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SEMICONDUCTOR TECHNICAL DATA

 Motorola, Inc. 1997

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INTEGRATED

PRESSURE SENSOR

20 to 105 kPa (2.9 to 15.2 psi)

0.3 to 4.9 V OUTPUT

PIN NUMBER

NOTE: Pins 1, 5, 6, 7 and 8 are

internal device connections. Do not

connect to external circuitry or

ground.

BASIC CHIP CARRIER

ELEMENT

CASE 471–01, STYLE 1

N/C

Gnd

N/C

out 8 N/C

REV 1

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2 Motorola Sensor Device Data

OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

Pressure Range POP 20 — 105 kPa

Supply Voltage(1) VS4.85 5.1 5.35 Vdc

Supply Current Io— 7.0 10 mAdc

Minimum Pressure Offset(2) (0 to 85°C) Voff 0.225 0.306 0.388 Vdc

Full Scale Output(3) (0 to 85°C) VFSO 4.816 4.897 4.978 Vdc

Full Scale Span(4) (0 to 85°C) VFSS —4.591 — Vdc

Accuracy(5) (0 to 85°C) — — — ±1.8 %VFSS

Sensitivity ∆V/∆P — 54 — mV/kPa

Response T ime (6) tR—1.0 — ms

Output Source Current at Full Scale Output Io+ —0.1 — mAdc

W arm–up Time(7) — — 20 — ms

Offset Stability(8) — — ±

0.65 — %VFSS

MECHANICAL CHARACTERISTICS

Characteristic Symbol Min Typ Max Unit

Weight, Basic Element (Case 432) — — 1.5 — Grams

NOTES:

1. Device is ratiometric within this specified excitation range.

2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.

3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.

4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

minimum rated pressure.

5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span

at 25°C due to all sources of error including the following:

•Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.

•Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is

cycled to and from the minimum or maximum operating temperature points, with minimum specified

pressure applied.

•Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from

minimum or maximum rated pressure at 25°C.

•TcSpan: Span deviation per °C over the temperature range of 0° to 85°C, as a percent of span at 25°C.

•TcOffset: Output deviation per °C with minimum pressure applied, over the temperature range of 0° to 85°C.

6. Response T ime is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to

a specified step change in pressure.

7. W arm–up Time is defined as the time required for the product to meet the specified output voltage.

8. Offset Stability is the product’ s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

9. Decoupling circuit shown in Figure 2 required to meet specification.

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3Motorola Sensor Device Data

PROCESSOR

A/D

51 k

50 pF

MPXS4100A

SENSOR

OUTPUT

(PIN 4)

Figure 2. Recommended Decoupling Filter for

Sensor to Microprocessor Interface

The MPXS4100A series piezoresistive transducer is a

state–of–the–art, monolithic, signal conditioned, silicon

pressure sensor. This sensor, with its patented X–ducer,

combines advanced micromachining techniques, thin film

metallization and bipolar semiconductor processing to

provide an accurate, high level analog output signal that is

proportional to applied pressure. A vacuum is sealed behind

the sensor diaphragm providing a reliable pressure

reference.

This surface mount package (Case 471) is an absolute

sensing configuration package. A fluorosilicone gel isolates

the die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm. The MPXS4100A series pressure sensor oper-

ating characteristics, internal reliability and qualification tests

are based on use of dry air as the pressure media. Media

other than dry air may have adverse effects on sensor perfor-

mance and long–term reliability. Contact the factory for in-

formation regarding media compatibility in your application.

Figure 2 shows the recommended decoupling circuit for in-

terfacing the output of the integrated BAP sensor to the A/D

input of a microprocessor (see Note 9).

Figure 3 shows the sensor output signal relative to pres-

sure input. T ypical minimum and maximum output curves are

shown for operation over 0 to 85°C temperature range. (Out-

put will saturate outside of the rated pressure range.)

OUTPUT (Volts)

5.0

4.5

4.0

3.5

3.0

Pressure (ref: to sealed vacuum) in kPa

TYP

MAX

MIN

100

105

2.5

2.0

1.5

1.0

0.5

110

Figure 3. Output versus Absolute Pressure

TEMP = 0 to 85

20 kPA TO 105 kPA

MPXS4100A

TRANSFER FUNCTION:

Vout = Vs* (.01059*P–.152)

Error

VS = 5.1 Vdc

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4 Motorola Sensor Device Data

Transfer Function (MPXS4100A)

Nominal Transfer Value: Vout = VS (P x 0.01059 – 0.1518)

+/– (Pressure Error x Temp. Factor x 0.01059 x VS)

VS = 5.1 V ± 0.25 Vdc

Temperature Error Band MPXS4100A Series

Break Points

Temp Multiplier

– 40 3

0 to 85 1

125 3

Temperature in C

4.0

3.0

2.0

0.0

1.0

–40 –20 0 20 40 60 14012010080

Temperature

Error

Factor

NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C

Pressure Error Band

Error Limits for Pressure

3.0

2.0

1.0

–1.0

– 2.0

– 3.0

0.0 20 40 60 80 100 120 Pressure (in kPa)

Pressure Error (kPa)

Pressure Error (Max)

20 to 105 (kPa)

1.5 (kPa)

ORDERING INFORMATION

The MPXS4100A series BAP silicon pressure sensors are available shipped in sleeves or tape and reeled.

Device Type Options

Case No

MPX Series Order No

Marking

ype

ons

ase

MPX

Sleeve Pack 471–01 MPXS4100A6U MPXS4100A

Tape and Reel 471–01 MPXS4100A6T1 MPXS4100A

Device

Reel Size

Tape Width

Quantity

ape

Width

uan

tit

MPXS4100A6T1 13” dia. 44 mm 250

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5Motorola Sensor Device Data

INFORMATION FOR USING THE SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

pad geometry, the packages will self align when subjected to

a solder reflow process.

0.835

0.060 TYP 8X

0.080 TYP 8X

0.100 TYP

0.300

NOT TO SCALE

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of this device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device damage and/or failure.

Therefore, the following items should always be observed in

order to minimize the thermal stress to which the devices are

subjected.

•Always preheat the device.

•The delta temperature between the preheat and soldering

zones should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case, including the port, must not exceed

the maximum temperature ratings as shown on the data

sheet. When using infrared heating with the reflow

soldering method, the difference between the leads and

the case shall be a maximum of 10°C.

•Wave soldering is not recommended for the pressure

sensor surface mount package due to the exposure of

the die to the environment.

•The soldering temperature and time shall not exceed

240°C for more than 5 seconds.

•When shifting from preheating to soldering zones, the

maximum temperature gradient or rise rate shall be

2°C/second or less.

•After soldering has been completed, the device should be

allowed to cool naturally for at least three minutes.

Gradual cooling should be used since the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied during

cooling.

•Recommend usage of a no–clean solder paste to avoid

circuit board cleaning.

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

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6 Motorola Sensor Device Data

PACKAGE DIMENSIONS

CASE 471–01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5

TYPICAL DRAFT.

DIM

AMIN MAX MIN MAX

MILLIMETERS

0.658 0.668 16.71 16.97

INCHES

B0.541 0.551 13.74 13.99

C0.209 0.231 5.31 5.87

D0.046 0.054 1.17 1.37

F0.037 0.053 0.94 1.34

G0.100 BSC 2.54 BSC

J0.009 0.011 0.23 0.28

Y0.002 0.010 0.05 0.25

P0.856 0.880 21.74 22.35

R0.503 0.523 12.78 13.28

0 7 0 7

____

A0.25 (0.010) MTBSS

SEATING

PLANE

–A–

–B–

–T–

D8 PL

STYLE 1:

PIN 1. NC

2. VSUPPLY

3. GROUND

4. VOUT

5. NC

6. NC

7. NC

8. NC

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola

data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”

must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of

others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury

or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal

Opportunity/Af firmative Action Employer.

Mfax is a trademark of Motorola, Inc.

How to reach us:

USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,

P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315

Mfax: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,

– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

INTERNET: http://motorola.com/sps

MPXS4100A/D

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