2.5 V/3.3 V ECL 1:2 Differential Fanout Buffer MC100ES6011 DATASHEET Product Discontinuance Notice - Last Time Buy Expires on (12/19/2013) The MC100ES6011 is a differential 1:2 fanout buffer. The ES6011 is ideal for applications requiring lower voltage. The 100ES Series contains temperature compensation. MC100ES6011 Features * * * * * * * * * 270 ps Typical Propagation Delay Maximum Frequency > 3 GHz Typical PECL Mode Operating Range: VCC = 2.375 V to 3.8 V with VEE = 0 V ECL Mode Operating Range: VCC = 0 V with VEE = -2.375 V to -3.8 V Open Input Default State Q Output Will Default LOW with Inputs Open or at VEE LVDS Input Compatible 8-Lead SOIC and TSSOP Pb-Free Packages Available Use replacement part: 853S011 D SUFFIX 8-LEAD SOIC PACKAGE CASE 751-07 EF SUFFIX 8-LEAD SOIC PACKAGE Pb-FREE PACKAGE CASE 751-07 DT SUFFIX 8-LEAD TSSOP PACKAGE CASE 1640-01 EJ SUFFIX 8-LEAD TSSOP PACKAGE Pb-FREE PACKAGE CASE 1640-01 Q0 1 8 VCC ORDERING INFORMATION Q0 Q1 Q1 2 3 4 Device 7 6 5 D D VEE Package MC100ES6011D SO-8 MC100ES6011DR2 SO-8 MC100ES6011EF SO-8 (Pb-Free) MC100ES6011EFR2 SO-8 (Pb-Free) MC100ES6011DT TSSOP-8 MC100ES6011DTR2 TSSOP-8 MC100ES6011EJ TSSOP-8 (Pb-Free) MC100ES6011EJR2 TSSOP-8 (Pb-Free) PIN DESCRIPTION Pin Figure 1. 8-Lead Pinout (Top View) and Logic Diagram D(1), D(2) Function ECL Data Inputs Q0, Q0 Q1, Q1 ECL Data Outputs VCC Positive Supply VEE Negative Supply 1. Pins will default LOW when left open. 2. Pins will default to 0.572 VCC/2 when left open. MC100ES6011 REVISION 6 OCTOBER 4, 2013 1 (c)2013 Integrated Device Technology, Inc. ICS843N001I Data Sheet 2.5 V/3.3 V ECL 1:2 DIFFERENTIAL FANOUT BUFFER Table 1. Attributes Characteristics Value Internal Input Pulldown Resistor 75 k Internal Input Pullup Resistor 56 k ESD Protection Human Body Model Machine Model Charged Device Model > 4000 V > 200 V > 1500 V JA Thermal Resistance (Junction to Ambient) 0 LFPM, 8 SOIC 500 LFPM, 8 SOIC 190C/W 130C/W Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Table 2. Maximum Ratings(1) Symbol VSUPPLY Parameter Conditions Power Supply Voltage Difference between VCC & VEE VIN Input Voltage VCC-VEE < 3.6 V IOUT Output Current Continuous Surge Rating Units 3.9 V VCC +0.3 VEE -0.3 V V 50 100 mA mA TA Operating Temperature Range -40 to +85 C Tstg Storage Temperature Range -65 to +150 C 1. Absolute maximum continuous ratings are those maximum values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation at absolute-maximum-rated conditions is not implied. Table 3. DC Characteristics (VCC = 0 V; VEE = -2.5 V 5% or VCC = 2.5 V 5%; VEE = 0 V)(1) Symbol IEE Characteristic -40C Min Power Supply Current 0C to 85C Typ Max 12 25 Min Unit Typ Max 12 25 mA VOH (2) Output HIGH Voltage VCC-1135 VCC-760 VCC-1070 VCC-760 mV VOL Output LOW Voltage(2) VCC-1950 VCC-1350 VCC-1950 VCC-1520 mV VOUTPP Output Peak-to-Peak Voltage 200 200 mV VIH Input HIGH Voltage (Single Ended) VCC-1165 VCC-880 VCC-1165 VCC-880 mV VIL Input LOW Voltage (Single Ended) VCC-1810 VCC-1475 VCC-1810 VCC-1475 mV VPP VCMR IIN (3) Differential Input Voltage Differential Cross Point Voltage(4) 0.12 1.3 0.12 1.3 V VEE +1.0 VCC -0.8 VEE +1.0 VCC-0.8 V 150 A 150 Input Current 1. ES6011 circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow > 500 LFPM is maintained. 2. Output termination voltage VTT = 0 V for VCC = 2.5 V operation is supported but the power consumption of the device will increase. 3. VPP (DC) is the minimum differential input voltage swing required to maintain device functionality. 4. VCMR (DC) is the crosspoint of the differential input signal. Functional operation is obtained when the crosspoint is within the VCMR (DC) range and the input swing lies within the VPP (DC) specification. MC100ES6011 REVISION 6 OCTOBER 4, 2013 2 (c)2013 Integrated Device Technology, Inc. ICS843N001I Data Sheet 2.5 V/3.3 V ECL 1:2 DIFFERENTIAL FANOUT BUFFER Table 4. DC Characteristics (VCC = 0 V; VEE = -3.8 to -3.135 or VCC = 3.8 to 3.135 V; VEE = 0 V)(1) -40C Symbol 0C to 85C Characteristic Unit Min Typ Max Typ IEE Power Supply Current 25 mA Output HIGH Voltage(2) VCC -1135 VCC -760 VCC -1070 VCC -760 mV VOL Voltage(2) VCC -1950 VCC -1500 VCC -1950 VCC -1520 mV VOUTPP Output Peak-to-Peak Voltage 25 Max VOH Output LOW 12 Min 12 200 200 mV VIH Input HIGH Voltage (Single Ended) VCC -1165 VCC -880 VCC -1165 VCC -880 mV VIL Input LOW Voltage (Single Ended) VCC -1810 VCC -1475 VCC -1810 VCC -1475 mV 0.12 1.3 0.12 1.3 V VEE +1.0 VCC -0.8 VEE +1.0 VCC -0.8 V 150 A VPP VCMR IIN Differential Input Voltage(3) Differential Cross Point Voltage(4) 150 Input Current 1. ES6011 circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow > 500 LFPM is maintained. 2. Output termination voltage VTT = 0 V for VCC = 2.5 V operation is supported but the power consumption of the device will increase. 3. VPP (DC) is the minimum differential input voltage swing required to maintain device functionality. 4. VCMR (DC) is the crosspoint of the differential input signal. Functional operation is obtained when the crosspoint is within the VCMR (DC) range and the input swing lies within the VPP (DC) specification. Table 5. AC Characteristics (VCC = 0 V; VEE = -3.8 to -2.375 or VCC = 2.375 to 3.8 V; VEE = 0 V)(1) -40C Symbol fMAX Maximum Frequency tPLH, tPHL Propagation Delay (Differential) CLK to Q, Q tSKEW Within Device Skew Q, Q Device-to-Device Skew(2) tJITTER Cycle-to-Cycle Jitter RMS (1) VCMR tr tf 0C to 85C Unit Min VPP 25C Characteristic Input Voltage Swing (Differential) Max Min Typ >3 170 150 70 Max Min >3 260 300 9 20 130 180 Typ Max >3 270 310 9 20 130 1 Differential Cross Point Voltage VEE +1.2 Output Rise/Fall Times (20% - 80%) Typ 210 GHz 285 360 ps 9 20 150 ps 1 ps 1200 mV VCC -1.1 V 220 ps 1 1200 150 1200 VCC-1.1 VEE +1.2 220 150 VCC -1.1 VEE +1.2 70 220 70 1. Measured using a 750 mV source 50% Duty Cycle clock source. All loading with 50 to VCC-2.0 V. 2. Skew is measured between outputs under identical transitions. Q D Receiver Device Driver Device Qb Db 50 50 VTT VTT = VCC - 2.0 V Figure 2. VOUTPP versus Frequency MC100ES6011 REVISION 6 OCTOBER 4, 2013 Figure 3. Typical Termination for Output Driver and Device Evaluation 3 (c)2013 Integrated Device Technology, Inc. ICS843N001I Data Sheet 2.5 V/3.3 V ECL 1:2 DIFFERENTIAL FANOUT BUFFER PACKAGE DIMENSIONS CASE 751-07 ISSUE U 8-LEAD SOIC PACKAGE MC100ES6011 REVISION 6 OCTOBER 4, 2013 4 PAGE 1 OF 2 (c)2013 Integrated Device Technology, Inc. ICS843N001I Data Sheet 2.5 V/3.3 V ECL 1:2 DIFFERENTIAL FANOUT BUFFER PACKAGE DIMENSIONS CASE 751-07 ISSUE U 8-LEAD SOIC PACKAGE MC100ES6011 REVISION 6 OCTOBER 4, 2013 5 PAGE 2 OF 2 (c)2013 Integrated Device Technology, Inc. ICS843N001I Data Sheet 2.5 V/3.3 V ECL 1:2 DIFFERENTIAL FANOUT BUFFER PACKAGE DIMENSIONS 2X 3 0.20 C 3.00 1.95 1.5 A D 8 2 0.60 1 0.60 2.45 B 1.5 3 3.00 H 4.90 B 2X SEE VIEW C 0.20 C D VIEW A-A 0.65 0.325 B 8X 0.18 0.13 8 0.38 0.25 0.13 0.23 0.13 BASE METAL C A-B D M 0.48 MAX TOP VIEW DETAIL "B" A 0.38 0.25 0.33 0.25 0.25 C 8 SECTION B-B SEE NOTE 6 DAMBAR PROTRUSION DETAIL "B" 0.95 0.75 8X 0.10 C 1.10 MAX SEATING PLANE 0.15 0.05 C A SIDE VIEW 4X 15 5 0.07 MIN 0.25 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT DATUM H, MOLD FLASH OR PROTRUSIONS, SHALL NOT EXCEED 0.15mm PER SIDE. 4. DIMENSION IS THE LENGTH OF TERMINAL FOR SOLDERING TO A SUBSTRATE. 5. THE LEAD WIDTH DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08mm TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE LEAD FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.14mm SEE DETAIL "B" AND SECTION B-B. 6. SECTION B-B TO BE DETERMINED AT 0.10 TO 0.25mm FROM THE LEAD TIP. 7. THIS PART IS COMPLIANT WITH JEDEC REGISTRATION MO-187 AA. 8. DATUMS A AND B TO BE DETERMINED DATUM PLANE H. GAUGE PLANE SEATING PLANE 6 0 0.70 0.40 4 4X 15 5 C (0.95) VIEW C MC100ES6011 REVISION 6 OCTOBER 4, 2013 CASE 1640-01 ISSUE O 8-LEAD TSSOP PACKAGE 6 (c)2013 Integrated Device Technology, Inc. ICS843N001I Data Sheet 2.5 V/3.3 V ECL 1:2 DIFFERENTIAL FANOUT BUFFER Revision History Sheet Rev Table Page Description of Change Date 5 1 Product Discontinuance Notice - Last Time Buy Expires on (12/19/2013) 2/5/2013 6 1 PDN# N-12-29 - Added - Use replacement part 853S011 10/4/13 MC100ES6011 REVISION 6 OCTOBER 4, 2013 7 (c)2013 Integrated Device Technology, Inc. ICS843N001I Data Sheet 2.5 V/3.3 V ECL 1:2 DIFFERENTIAL FANOUT BUFFER We've Got Your Timing Solution 6024 Silver Creek Valley Road San Jose, California 95138 Sales 800-345-7015 (inside USA) +408-284-8200 (outside USA) Fax: 408-284-2775 www.IDT.com/go/contactIDT Technical Support netcom@idt.com +480-763-2056 DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT's sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. 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